Circuit board and electronic equipment

By designing circuit boards of multiple motherboard units, adapting to chassis of different sizes, and decoupling through connectors and expansion modules, the problem of circuit boards and chassis in the prior art is solved, reducing costs and improving the economicality of electronic devices.

CN222839877UActive Publication Date: 2025-05-06INSPUR SUZHOU INTELLIGENT TECH CO LTD
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Patent Information

Application Number
CN202520569096.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-28
Publication Date
2025-05-06
Estimated Expiration
2035-03-28

AI Technical Summary

Technical Problem

In the prior art, the circuit board of electronic equipment cannot be decoupled from the chassis, resulting in the chassis being unable to be reused in generations, increasing the cost of development and production.

Method used

A circuit board is designed, including multiple motherboard units, each motherboard unit has a width and length within a specific range, and can be selectively adapted to chassis of different sizes, and decoupling of the motherboard unit from the chassis and expansion modules through multiple connectors and expansion modules.

Benefits of technology

The circuit board and the chassis are decoupled, the dependence on motherboard units of specific sizes is reduced, the development and production costs are reduced, and the economicality of electronic equipment is improved.

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Abstract

The utility model discloses a circuit board and electronic equipment, and relates to the technical field of computers, a plurality of mainboard units of the circuit board at least comprise a first model mainboard unit, a second model mainboard unit, a third model mainboard unit and a fourth model mainboard unit, and the value range of the first width w1 of the first model mainboard unit is 200-215mm; and / or, the value range of the second width w2 of the second type mainboard unit is 250-265 mm; and / or, the value range of the third width w3 of the third type mainboard unit is 415-431 mm; and / or, the value range of the fourth width w4 of the fourth type mainboard unit is 510-532mm; and / or the value ranges of the lengths of the first model mainboard unit, the second model mainboard unit, the third model mainboard unit and the fourth model mainboard unit are all 270-320mm. The technical problem that decoupling cannot be achieved between a circuit board and a case of an existing electronic device is solved, and the technical effect of decoupling of the case and the mainboard unit is achieved.
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Description

Technical Field

[0001] The present application relates to the field of computer technology, and in particular to circuit boards and electronic devices. Background Art

[0002] In the prior art, the circuit board of the electronic device is only compatible with one chassis or one generation of chassis, and the decoupling of the circuit board and the chassis cannot be achieved, resulting in the chassis being unable to be reused from generation to generation. That is, when targeting motherboard units with completely different architectures or sizes, a new electronic device chassis needs to be developed for adaptation and installation, resulting in a high cost for the mold of the electronic device chassis, which is not conducive to the economy of the electronic equipment. Utility Model Content

[0003] The present application provides a circuit board and an electronic device, so as to at least solve the problem in the related art that the circuit board and the chassis of the electronic device cannot be decoupled.

[0004] The present application provides a circuit board, which is applied to electronic equipment. The circuit board includes multiple mainboard units, and the multiple mainboard units include at least a first-type mainboard unit, a second-type mainboard unit, a third-type mainboard unit and a fourth-type mainboard unit, wherein a first width w1 of the first-type mainboard unit has a value range of 200-215 mm; and / or a second width w2 of the second-type mainboard unit has a value range of 250-265 mm; and / or a third width w3 of the third-type mainboard unit has a value range of 415-431 mm; and / or a fourth width w4 of the fourth-type mainboard unit has a value range of 510-532 mm; and / or a length of the first-type mainboard unit, the second-type mainboard unit, the third-type mainboard unit and the fourth-type mainboard unit has a value range of 270-320 mm.

[0005] In an exemplary embodiment, the first width w1 of the first model motherboard unit is 210 mm; and / or, the second width w2 of the second model motherboard unit is 258 mm; and / or, the third width w3 of the third model motherboard unit is 425 mm; and / or, the fourth width w4 of the fourth model motherboard unit is 518 mm.

[0006] In an exemplary embodiment, the lengths of the first-type motherboard unit, the second-type motherboard unit, the third-type motherboard unit, and the fourth-type motherboard unit are all 310 mm.

[0007] In an exemplary embodiment, in the length direction of the first-type motherboard unit, the first-type motherboard unit has a main bearing area and at least one auxiliary bearing area, and the length of the main bearing area does not exceed 310 mm, and the length of the auxiliary bearing area ranges from 15 to 30 mm; and / or, in the length direction of the second-type motherboard unit, the second-type motherboard unit has a main bearing area and at least one auxiliary bearing area, and the length of the main bearing area does not exceed 310 mm, and the length of the auxiliary bearing area ranges from 15 to 30 mm; and / or, in the length direction of the third-type motherboard unit, the third-type motherboard unit has a main bearing area and at least one auxiliary bearing area, and the length of the main bearing area does not exceed 310 mm, and the length of the auxiliary bearing area ranges from 15 to 30 mm; and / or, in the length direction of the fourth-type motherboard unit, the fourth-type motherboard unit has a main bearing area and at least one auxiliary bearing area, and the length of the main bearing area does not exceed 310 mm, and the length of the auxiliary bearing area ranges from 15 to 30 mm.

[0008] In an exemplary embodiment, the circuit board also includes multiple connectors, and the multiple connectors include at least a first connector, a second connector, a third connector and a fourth connector, wherein the first connector is used to connect to the chassis, the first model motherboard unit is arranged on the first connector, and the first connector can be used to carry at least one first model motherboard unit; and / or, the second connector is used to connect to the chassis, the second model motherboard unit is arranged on the second connector, and the second connector can be used to carry at least one second model motherboard unit; and / or, the third connector is used to connect to the chassis, the third model motherboard unit is arranged on the third connector, and the outer contour line of the third connector coincides with the outer contour line of the third model motherboard unit, or the outer contour line of the third connector is located on the outer peripheral side of the outer contour line of the third model motherboard unit; and / or, the fourth connector is used to connect to the chassis, the fourth model motherboard unit is arranged on the fourth connector, and the outer contour line of the fourth connector coincides with the outer contour line of the fourth model motherboard unit, or the outer contour line of the fourth connector is located on the outer peripheral side of the outer contour line of the fourth model motherboard unit.

[0009] The present application also provides an electronic device, including a chassis, a circuit board, multiple expansion modules and multiple connectors, wherein the chassis has a first installation area and a second installation area; multiple mainboard units of the circuit board can be selectively adapted to the first installation area so that the chassis can adapt to mainboard units of different widths, and the circuit board is the above-mentioned circuit board; multiple expansion modules are arranged at intervals in the second installation area; multiple connectors are arranged at intervals on the same mainboard unit and are all electrically connected to the mainboard unit, multiple connectors correspond one-to-one to multiple expansion modules, and each connector is electrically connected to the corresponding expansion modules through a cable.

[0010] In an exemplary embodiment, at least one connector among the multiple connectors of the circuit board can be adapted to two mainboard units; there is a first installation gap L1 between the two mainboard units, and the value range of the first installation gap L1 is: 0.5~2mm; and / or, there is a protection distance L2 between each mainboard unit and the inner wall surface on the same side of the chassis, and the value range of the protection distance L2 is: 0.5~2mm; and / or, there is a second installation gap L3 between each connector and the inner wall surface on the same side of the chassis, and the value range of the second installation gap L3 is: 0.5~2mm.

[0011] In an exemplary embodiment, each motherboard unit has an auxiliary bearing area, a main bearing area, and an auxiliary bearing area in sequence in its length direction; the electronic device also includes a processor module and a memory module, the processor module and the memory module are arranged side by side in the main bearing area along the width direction of the motherboard unit, and there are at least two memory modules, and at least two memory modules are respectively located on both sides of the processor module; wherein, there is a gap between the processor module and the memory module.

[0012] In an exemplary embodiment, the main bearing area has a first sub-area, a second sub-area, and a third sub-area in sequence in the length direction of the motherboard unit, and the processor module and the memory module are arranged side by side in the second sub-area along the width direction of the motherboard unit; the first sub-area includes a first partition and a second partition in the width direction of the motherboard unit, the first partition is at least used to set a high-speed connector, and the second partition is at least used to set a power connector.

[0013] In an exemplary embodiment, the electronic device further includes a first management connector, which is disposed at the main bearing area and located on one side of the memory module. The first management connector extends along the length direction of the motherboard unit and is offset from the memory module.

[0014] In an exemplary embodiment, when there are two processor modules, there are at least four memory modules, and at least two memory modules are arranged on both sides of a processor module; the electronic device also includes a first management connector, which is arranged at the main bearing area and located between two adjacent memory modules. The first management connector extends along the length direction of the motherboard unit and is staggered with the memory module.

[0015] In an exemplary embodiment, the main bearing area has a first sub-area, a second sub-area, and a third sub-area in sequence in the length direction of the motherboard unit, and the processor module and the memory module are arranged side by side in the second sub-area along the width direction of the motherboard unit; a portion of the first management connector is located in the second sub-area, and another portion of the first management connector is located in the third sub-area.

[0016] In an exemplary embodiment, the electronic device further includes a second management connection member, which is disposed at the auxiliary bearing area and extends along a width direction of the mainboard unit.

[0017] In an exemplary embodiment, the first installation area has N1 first connectors and N2 first guide slides; multiple connectors of the circuit board can be selectively arranged at the first installation area, each connector has N1 avoidance vias, N2 second guide slides, and N3 second connectors, and the N1 avoidance vias correspond one-to-one to the N1 first connectors, and the N2 second guide slides correspond one-to-one to the N2 first guide slides, and they are slidably matched; each mainboard unit is correspondingly arranged on each connector, each mainboard unit has N1+N3 assembly holes, and the mainboard unit also has N1+N3 third connectors; wherein, the N1 third connectors on the same mainboard unit correspond one-to-one to the N1 assembly holes, and each third connector passes through the corresponding assembly holes and avoidance vias and is connected to the corresponding first connectors; the N3 third connectors correspond one-to-one to the N3 second connectors, and each third connector passes through the corresponding assembly holes and is connected to the corresponding second connectors.

[0018] In an exemplary embodiment, N1 first connecting members are all nuts set on the base of the chassis, and the N1 nuts are spaced apart along the length direction of the chassis; N3 second connecting members are all studs set on the connector, and the N3 studs are spaced apart along the length direction and width direction of the connector; N1+N3 third connecting members are all hand screws set on the motherboard unit, N1 hand screws cooperate with corresponding N1 nuts, and N3 hand screws cooperate with corresponding N3 studs.

[0019] In an exemplary embodiment, the N2 first guide slides are all I-shaped nails set on the base of the chassis, and the N2 I-shaped nails are set at intervals along at least two diagonals of the chassis; the N2 second guide slides are all gourd holes set on the circuit board, and each gourd hole slides in cooperation with the corresponding I-shaped nail.

[0020] In an exemplary embodiment, when the same connector is adapted to multiple motherboard units, the multiple motherboard units are arranged at intervals along the width direction of the connector, and the connector has n×N3 second connectors, where n is the number of motherboard units.

[0021] In an exemplary embodiment, the electronic device is a server or a switch.

[0022] Through the present application, a circuit board including multiple mainboard units is provided, and the multiple mainboard units include at least a first model mainboard unit, a second model mainboard unit, a third model mainboard unit and a fourth model mainboard unit. The widths of the four mainboard units are different, and at the same time, it is ensured that the value ranges of the lengths of the four mainboard units are within the same range. In this way, when assembling electronic equipment, it can be selectively adapted to the first installation area of ​​the chassis of the electronic equipment, thereby ensuring the decoupling of the mainboard unit and the chassis. There is no need to open a separate mold to make a chassis for a mainboard unit of a specific size, which is beneficial to the economy of the electronic equipment.

[0023] In addition, by setting multiple expansion modules at intervals in the second installation area, and at the same time, multiple connectors are set at intervals on the same mainboard unit and are electrically connected to the mainboard unit, multiple connectors correspond one-to-one to multiple expansion modules, and each connector is electrically connected to the corresponding expansion modules through a cable, thereby achieving decoupling of the mainboard unit and multiple expansion modules. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0025] Figure 1 A partial structural diagram of a first embodiment of a chassis of an electronic device provided in an embodiment of the present application;

[0026] Figure 2 A partial structural diagram of a second embodiment of a chassis of an electronic device provided in an embodiment of the present application;

[0027] Figure 3 A partial structural diagram of a third embodiment of a chassis of an electronic device provided in an embodiment of the present application;

[0028] Figure 4 A partial structural diagram of a third embodiment of a chassis of an electronic device provided in an embodiment of the present application;

[0029] Figure 5 A schematic diagram of the gap structure of Example 1 provided in the embodiments of the present application;

[0030] Figure 6 A schematic diagram of the gap structure of Example 3 provided in the embodiments of the present application;

[0031] Figure 7 A schematic diagram of the structure of a first type of mainboard unit of a circuit board provided in an embodiment of the present application;

[0032] Figure 8 A schematic diagram of the structure of a second type of mainboard unit of a circuit board provided in an embodiment of the present application;

[0033] Fig. 9 A schematic diagram of the structure of a third type mainboard unit of a circuit board provided in an embodiment of the present application;

[0034] Fig.10 A schematic structural diagram of a fourth type of mainboard unit of a circuit board provided in an embodiment of the present application;

[0035] Fig.11 for Figure 8 A schematic diagram of the layout size allocation of the first model motherboard unit;

[0036] Fig.12 for Fig. 9 A schematic diagram of the layout size allocation of the second model motherboard unit;

[0037] Fig.13 for Fig.10 A schematic diagram of the layout size allocation of the third model motherboard unit;

[0038] Fig.14 for Fig.11 A schematic diagram of the layout size allocation of the fourth model motherboard unit;

[0039] Fig.15 for Figure 8 Schematic diagram of assembly hole allocation of the first model motherboard unit;

[0040] Fig.16 for Fig. 9 Schematic diagram of assembly hole allocation of the second model motherboard unit;

[0041] Fig.17 for Fig.10 Schematic diagram of assembly hole allocation of the third model motherboard unit;

[0042] Fig.18 for Fig.11 Schematic diagram of assembly hole allocation of the fourth model motherboard unit;

[0043] Fig.19 A schematic diagram of the structure of a first connector of a circuit board provided in an embodiment of the present application;

[0044] Fig. 20 A schematic diagram of the structure of a second connector of a circuit board provided in an embodiment of the present application;

[0045] Fig.21 A schematic diagram of the structure of a third connector of a circuit board provided in an embodiment of the present application;

[0046] Fig. 22A schematic diagram of the structure of a fourth connector of a circuit board provided in an embodiment of the present application;

[0047] Fig.23 A schematic diagram of the structure of a 19-inch chassis of an electronic device provided in an embodiment of the present application;

[0048] Fig.24 A schematic structural diagram of a 21-inch chassis of an electronic device provided in an embodiment of the present application.

[0049] The above drawings include the following reference numerals:

[0050] 10. chassis; 11. first installation area;

[0051] 20. Circuit board; 21. First model motherboard unit; 22. Second model motherboard unit; 23. Third model motherboard unit; 24. Fourth model motherboard unit; 25. First connector; 26. Second connector; 27. Third connector; 28. Fourth connector;

[0052] 214, assembly hole;

[0053] 221, avoidance hole; 222, second guide slide member; 223, second connecting member;

[0054] 30. Processor module; 40. Memory module; 70. First management connector; 80. Second management connector; 90. First connector;

[0055] 100, main bearing area; 101, first sub-area; 1010, first partition; 1011, second partition; 102, second sub-area; 103, third sub-area;

[0056] 200, auxiliary bearing area;

[0057] 300. A first guide slide. DETAILED DESCRIPTION

[0058] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0059] It should be noted that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. The terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. The terms "parallel", "perpendicular" and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within the acceptable deviation range, where the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement being discussed and the errors associated with the measurement of a specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equalities is less than or equal to 5% of either one. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0060] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0061] The embodiments of the present application provide a circuit board and an electronic device, and describe the circuit board and the electronic device in detail in combination with their structures and working principles.

[0062] It should be noted that in the present application, the above-mentioned and below-mentioned motherboard units are electronic device motherboards, which are system control boards specially developed to meet the application of electronic devices, and provide the necessary electrical connections, interfaces and system-level functions for the processors, memory, storage devices, network interfaces and other key components of the electronic devices.

[0063] It should be noted that, in the present application, the electronic device is a server or a switch.

[0064] like Figures 1 to 10As shown, the circuit board is applied to electronic equipment, and the circuit board includes multiple mainboard units, and the multiple mainboard units include at least a first-type mainboard unit 21, a second-type mainboard unit 22, a third-type mainboard unit 23 and a fourth-type mainboard unit 24, and the first width w1 of the first-type mainboard unit 21 has a value range of 200-215 mm; and / or, the second width w2 of the second-type mainboard unit 22 has a value range of 250-265 mm; and / or, the third width w3 of the third-type mainboard unit 23 has a value range of 415-431 mm; and / or, the fourth width w4 of the fourth-type mainboard unit 24 has a value range of 510-532 mm; and / or, wherein the lengths of the first-type mainboard unit 21, the second-type mainboard unit 22, the third-type mainboard unit 23 and the fourth-type mainboard unit 24 are all in the value range of 270-320 mm.

[0065] Through the present application, a circuit board including multiple mainboard units is provided, and the multiple mainboard units include at least a first-type mainboard unit 21, a second-type mainboard unit 22, a third-type mainboard unit 23 and a fourth-type mainboard unit 24. The widths of the four mainboard units are different, and at the same time, the length ranges of the four mainboard units are ensured to be within the same range. In this way, when assembling electronic equipment, it can be selectively adapted to the first installation area 11 of the chassis 10 of the electronic equipment, thereby ensuring the decoupling of the mainboard unit and the chassis 10, and there is no need to separately open a mold to make the chassis 10 for a mainboard unit of a specific size, which is beneficial to the economy of the electronic equipment.

[0066] In addition, by setting multiple expansion modules at intervals in the second installation area, and at the same time, multiple connectors are set at intervals on the same mainboard unit and are electrically connected to the mainboard unit, multiple connectors correspond one-to-one to multiple expansion modules, and each connector is electrically connected to the corresponding expansion modules through a cable, thereby achieving decoupling of the mainboard unit and multiple expansion modules.

[0067] Preferably, the first width w1 of the first model motherboard unit 21 is 210 mm; and / or, the second width w2 of the second model motherboard unit 22 is 258 mm; and / or, the third width w3 of the third model motherboard unit 23 is 425 mm; and / or, the fourth width w4 of the fourth model motherboard unit 24 is 518 mm. In this way, the first model motherboard unit 21 and the third model motherboard unit 23 can be adapted to a 19-inch chassis 10, and the second model motherboard unit 22 and the fourth model motherboard unit 24 can be adapted to a 21-inch chassis 10.

[0068] Preferably, the lengths of the first model motherboard unit 21, the second model motherboard unit 22, the third model motherboard unit 23, and the fourth model motherboard unit 24 are all 310 mm. In this way, by reasonably optimizing the lengths of the first model motherboard unit 21, the second model motherboard unit 22, the third model motherboard unit 23, and the fourth model motherboard unit 24, the lengths of the first model motherboard unit 21, the second model motherboard unit 22, the third model motherboard unit 23, and the fourth model motherboard unit 24 are all sufficiently reduced, thereby improving the space utilization of the chassis 10 and facilitating the decoupling between the motherboard unit and the chassis 10 or the expansion module.

[0069] like Figures 7 to 14 As shown, in the length direction of the first model motherboard unit 21, the first model motherboard unit 21 has a main bearing area 100 and at least one auxiliary bearing area 200, and the length of the main bearing area 100 does not exceed 310 mm, and the length of the auxiliary bearing area 200 ranges from 15 to 30 mm; and / or, in the length direction of the second model motherboard unit 22, the second model motherboard unit 22 has a main bearing area 100 and at least one auxiliary bearing area 200, and the length of the main bearing area 100 does not exceed 310 mm, and the length of the auxiliary bearing area 200 ranges from 15 to 30 mm; And / or, in the length direction of the third model motherboard unit 23, the third model motherboard unit 23 has a main bearing area 100 and at least one auxiliary bearing area 200, and the length of the main bearing area 100 does not exceed 310 mm, and the length of the auxiliary bearing area 200 ranges from 15 to 30 mm; and / or, in the length direction of the fourth model motherboard unit 24, the fourth model motherboard unit 24 has a main bearing area 100 and at least one auxiliary bearing area 200, and the length of the main bearing area 100 does not exceed 310 mm, and the length of the auxiliary bearing area 200 ranges from 15 to 30 mm. In this way, the distance between AB in the figure is the length of the main bearing area 100, the length of the auxiliary bearing area 200 has a value range of 15 to 30 mm, and at the same time, the length of the auxiliary bearing area 200 has a value range of 15 to 30 mm.

[0070] Preferably, the length of the main bearing area 100 is 280 mm.

[0071] Preferably, the value of M in the length of the auxiliary bearing area 200 is 30 mm.

[0072] like Figures 1 to 4 , Figures 19 to 22As shown, the circuit board also includes a plurality of connectors, and the plurality of connectors include at least a first connector 25, a second connector 26, a third connector 27 and a fourth connector 28, wherein the first connector 25 is used to connect to the chassis 10, the first type motherboard unit 21 is arranged on the first connector 25, and the first connector 25 can be used to carry at least one first type motherboard unit 21; and / or, the second connector 26 is used to connect to the chassis 10, the second type motherboard unit 22 is arranged on the second connector 26, and the second connector 26 can be used to carry at least one second type motherboard unit 22; and / or, the third connector 27 is used to Connected to the chassis 10, the third model motherboard unit 23 is arranged on the third connector 27, and the outer contour line of the third connector 27 coincides with the outer contour line of the third model motherboard unit 23, or the outer contour line of the third connector 27 is located on the outer peripheral side of the outer contour line of the third model motherboard unit 23; and / or, the fourth connector 28 is used to connect to the chassis 10, the fourth model motherboard unit 24 is arranged on the fourth connector 28, and the outer contour line of the fourth connector 28 coincides with the outer contour line of the fourth model motherboard unit 24, or the outer contour line of the fourth connector 28 is located on the outer peripheral side of the outer contour line of the fourth model motherboard unit 24. In this way, it is ensured that each connector can be adapted to the corresponding motherboard unit, thereby ensuring the connection reliability between the motherboard unit and the chassis 10.

[0073] It should be noted that in an embodiment not shown in the figure of the present application, the electronic device includes a chassis 10, a circuit board 20, multiple expansion modules, and multiple connectors, wherein the chassis 10 has a first installation area 11 and a second installation area; multiple mainboard units of the circuit board 20 can be selectively adapted to the first installation area 11 so that the chassis 10 can adapt to mainboard units of different widths, and the circuit board 20 is the above-mentioned and following circuit boards; multiple expansion modules are arranged at intervals in the second installation area; multiple connectors are arranged at intervals on the same mainboard unit and are all electrically connected to the mainboard unit, multiple connectors correspond one-to-one to multiple expansion modules, and each connector is electrically connected to the corresponding expansion modules through a cable.

[0074] Through the present application, a circuit board including multiple mainboard units is provided, and the multiple mainboard units include at least a first-type mainboard unit 21, a second-type mainboard unit 22, a third-type mainboard unit 23 and a fourth-type mainboard unit 24. The widths of the four mainboard units are different, and at the same time, the length ranges of the four mainboard units are ensured to be within the same range. In this way, when assembling electronic equipment, it can be selectively adapted to the first installation area 11 of the chassis 10 of the electronic equipment, thereby ensuring the decoupling of the mainboard unit and the chassis 10, and there is no need to separately open a mold to make the chassis 10 for a mainboard unit of a specific size, which is beneficial to the economy of the electronic equipment.

[0075] In addition, by setting multiple expansion modules at intervals in the second installation area, and at the same time, multiple connectors are set at intervals on the same mainboard unit and are electrically connected to the mainboard unit, multiple connectors correspond one-to-one to multiple expansion modules, and each connector is electrically connected to the corresponding expansion modules through a cable, thereby achieving decoupling of the mainboard unit and multiple expansion modules.

[0076] Optionally, the multiple expansion modules include a power supply module, a fan module, a management module, a storage module, and an IO module; the multiple connectors include corresponding power supply connectors, fan connectors, management connectors, storage connectors, and IO connectors.

[0077] like Figure 5 and Figure 6 As shown, at least one of the multiple connectors of the circuit board 20 can be adapted to two mainboard units; there is a first installation gap L1 between the two mainboard units, and the value range of the first installation gap L1 is: 0.5~2mm; and / or, there is a protection distance L2 between each mainboard unit and the inner wall surface on the same side of the chassis 10, and the value range of the protection distance L2 is: 0.5~2mm; and / or, there is a second installation gap L3 between each connector and the inner wall surface on the same side of the chassis 10, and the value range of the second installation gap L3 is: 0.5~2mm. The calculation formula of the width of each mainboard unit is introduced below:

[0078] ;

[0079] ;

[0080] ;

[0081] ;

[0082] Note: The units of w1, w2, w3, and w4 are all mm, a is the wall thickness of the chassis 10, and the first installation gap L1, the protection distance L2, and the second installation gap L3 are selected within the range of 0.5 to 2 mm based on empirical values.

[0083] like Figures 7 to 10As shown, each motherboard unit has an auxiliary bearing area 200, a main bearing area 100, and an auxiliary bearing area 200 in sequence in its length direction; the electronic device also includes a processor module 30 and a memory module 40, the processor module 30 and the memory module 40 are arranged side by side in the main bearing area 100 along the width direction of the motherboard unit, and there are at least two memory modules 40, and at least two memory modules 40 are respectively located on both sides of the processor module 30; wherein, there is a gap between the processor module 30 and the memory module 40. In this way, by rationally arranging each motherboard unit, while making full use of the installation space on the motherboard unit, the motherboard unit can also be effectively decoupled from the chassis 10 and multiple expansion modules. It should be noted that in the present application, a 19-inch chassis 10 can horizontally place one or two first-model motherboard units 21, the maximum number of processor modules 30 (central processing unit (Central Processing Unit)) is 1, and the maximum number of memory modules 40 (dual inline memory modules (Dual Inline Memory Module)) is 16.

[0084] It should be noted that, in the present application, a 19-inch chassis 10 can horizontally place a third-model motherboard unit 23, the maximum number of processor modules 30 (central processing units) is 2, and the maximum number of memory modules 40 (dual inline memory modules) is 32.

[0085] It should be noted that, in the present application, a 21-inch chassis 10 can horizontally place one or two second-model motherboard units 22, the maximum number of processor modules 30 (central processing unit) is 1, and the maximum number of memory modules 40 (dual inline memory modules) is 16.

[0086] It should be noted that, in the present application, a 21-inch chassis 10 can horizontally place a fourth-model motherboard unit 24, the maximum number of processor modules 30 (central processing units) is 2, and the maximum number of memory modules 40 (dual inline memory modules) is 32.

[0087] like Figures 7 to 10As shown, the main bearing area 100 has a first sub-area 101, a second sub-area 102, and a third sub-area 103 in the length direction of the motherboard unit, and the processor module 30 and the memory module 40 are arranged side by side in the second sub-area 102 along the width direction of the motherboard unit; the first sub-area 101 includes a first partition 1010 and a second partition 1011 in the width direction of the motherboard unit, and the first partition 1010 is at least used to set the high-speed connector, and the second partition 1011 is at least used to set the power connector. In this way, the area on the motherboard unit is further effectively subdivided.

[0088] like Figure 7 and Figure 8 As shown, the electronic device further includes a first management connector 70, which is disposed at the main bearing area 100 and is located on one side of the memory module 40. The first management connector 70 is extended along the length direction of the motherboard unit and is staggered with the memory module 40. In this way, the installation reliability of the first management connector 70 on the motherboard unit is ensured and no interference with other modules is generated.

[0089] like Fig. 9 and Fig.10 As shown, when there are two processor modules 30, there are at least four memory modules 40, and at least two memory modules 40 are correspondingly arranged on both sides of one processor module 30; the electronic device further comprises a first management connector 70, which is arranged at the main bearing area 100 and between two adjacent memory modules 40, and the first management connector 70 is extended along the length direction of the motherboard unit and is staggered with the memory module 40. In this way, the installation reliability of the first management connector 70 on the motherboard unit is ensured and no interference with other modules is generated.

[0090] like Figures 7 to 10 As shown, the main bearing area 100 has a first sub-area 101, a second sub-area 102, and a third sub-area 103 in the length direction of the motherboard unit, the processor module 30 and the memory module 40 are arranged side by side in the second sub-area 102 along the width direction of the motherboard unit; part of the first management connector 70 is located in the second sub-area 102, and another part of the first management connector 70 is located in the third sub-area 103. In this way, the reliability of the installation of the first management connector 70 on the motherboard unit is ensured and no interference with other modules is generated.

[0091] like Figures 7 to 10 As shown, the electronic device further includes a second management connector 80, which is disposed at the auxiliary bearing area 200 and extends along the width direction of the motherboard unit. In this way, the second management connector 80 makes full use of the auxiliary bearing area 200, thereby ensuring the regularity and compactness of the layout of the motherboard unit.

[0092] It should be noted that, in the present application, the first management connector 70 is a UDIMM connector (Unbuffered Dual In-Line Memory Modules), and the second management connector 80 is a GenZ 4C+ connector, wherein the current carrying capacity of the UDIMM connector is preferably to provide a current of 1A for each pin, and the current carrying capacity of the GenZ 4C+ connector is preferably to provide a current of 1.1A for each pin.

[0093] like Figures 11 to 14 The specific size divisions of different areas are given in .

[0094] like Figures 15 to 24 As shown, the first installation area 11 has N1 first connectors 90 and N2 first guide slides 300; multiple connectors of the circuit board 20 can be selectively arranged at the first installation area 11, each connector has N1 avoidance holes 221, N2 second guide slides 222, and N3 second connectors 223, and the N1 avoidance holes 221 correspond to the N1 first connectors 90 one by one, and the N2 second guide slides 222 correspond to the N2 first guide slides 300 one by one, and they are slidably matched; each motherboard unit is correspondingly arranged at On each connector, each motherboard unit has N1+N3 assembly holes 214, and the motherboard unit also has N1+N3 third connectors; wherein, N1 third connectors on the same motherboard unit correspond one-to-one with N1 assembly holes 214, and each third connector passes through the corresponding assembly holes 214, avoidance holes 221, and is connected to the corresponding first connectors 90; N3 third connectors correspond one-to-one with N3 second connectors 223, and each third connector passes through the corresponding assembly holes 214 and is connected to the corresponding second connectors 223. In this way, the reliability of each motherboard unit being installed on the chassis 10 through the corresponding connectors is ensured.

[0095] like Fig.15 and Fig.16 As shown, N1 assembly holes 214 include assembly holes 214 corresponding to letters H4, H5, H6, and H7. Fig.19 and Fig. 20 As shown, N3 second connecting members 223 include the second connecting member 223 corresponding to the letter h1, and the assembly holes 214 corresponding to the letters H4, H5, H6, and H7 are matched with the second connecting member 223 corresponding to the letter h1. Fig.15 and Fig.16 As shown, the N1 assembly holes 214 also include assembly holes 214 corresponding to letters H1, H2, H3, H8, H9, and H10, such as Fig.19 and Fig. 20As shown, N3 second connecting members 223 include the second connecting member 223 corresponding to the letter h2, and the assembly holes 214 corresponding to the letters H1, H2, H3, H8, H9, and H10 correspond to the second connecting members 223 corresponding to the letter h2 at the corresponding positions.

[0096] like Fig.17 and Fig.18 As shown, N1 assembly holes 214 include assembly holes 214 corresponding to letters H4, H7, H8, and H11. Fig.21 and Fig. 22 As shown, N3 second connecting members 223 include the second connecting member 223 corresponding to the letter h1, and the assembly holes 214 corresponding to the letters H4, H7, H8, and H11 are matched with the second connecting member 223 corresponding to the letter h1. Fig.17 and Fig.18 As shown, the N1 assembly holes 214 also include assembly holes 214 corresponding to letters H1, H2, H3, H5, H6, H9, H10, H12, H13, and H14, as shown in FIG. Fig.21 and Fig. 22 As shown, N3 second connecting parts 223 include a second connecting part 223 corresponding to the letter h2, and the assembly holes 214 corresponding to the letters H1, H2, H3, H5, H6, H9, H10, H12, H13, and H14 correspond to the second connecting parts 223 corresponding to the letter h2 at the corresponding positions.

[0097] Further, N1 first connectors 90 are nuts arranged on the base of the chassis 10, and N1 nuts are arranged at intervals along the length direction of the chassis 10; N3 second connectors 223 are studs arranged on the connector, and N3 studs are arranged at intervals along the length direction and width direction of the connector; N1+N3 third connectors are hand screws arranged on the motherboard unit, N1 hand screws cooperate with corresponding N1 nuts, and N3 hand screws cooperate with corresponding N3 studs. In this way, the connection reliability between the motherboard unit and the chassis is ensured.

[0098] Furthermore, the N2 first guide slides 300 are all I-shaped nails arranged on the base of the chassis 10, and the N2 I-shaped nails are arranged at intervals along at least two diagonal lines of the chassis 10; the N2 second guide slides 222 are all calabash holes arranged on the circuit board 20, and each calabash hole is slidably matched with a corresponding I-shaped nail. In this way, the connection reliability and assembly convenience of the connector and the chassis 10 are ensured.

[0099] Furthermore, when the same connector is adapted to multiple motherboard units, the multiple motherboard units are spaced apart along the width direction of the connector, and the connector has n×N3 second connectors 223, where n is the number of motherboard units. In this way, the reliability of mounting multiple motherboard units on the chassis 10 through the same connector is ensured.

[0100] The above is a detailed introduction to a circuit board and an electronic device provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application, and the description of the above embodiments is only used to help understand the method and its core idea of ​​the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A circuit board, characterized in that: Applied to electronic equipment, the circuit board comprises: A plurality of mainboard units, wherein the plurality of mainboard units at least comprises: A first type mainboard unit (21), wherein a first width w1 of the first type mainboard unit (21) has a value range of 200 to 215 mm; and / or A second type mainboard unit (22), wherein a second width w2 of the second type mainboard unit (22) has a value range of 250 to 265 mm; and / or A third type mainboard unit (23), wherein a third width w3 of the third type mainboard unit (23) has a value range of 415-431 mm; and / or A fourth type mainboard unit (24), wherein a fourth width w4 of the fourth type mainboard unit (24) has a value range of 510-532 mm; and / or, The lengths of the first-type motherboard unit (21), the second-type motherboard unit (22), the third-type motherboard unit (23), and the fourth-type motherboard unit (24) are all in the range of 270 to 320 mm.

2. The circuit board according to claim 1, characterized in that: The first width w1 of the first model mainboard unit (21) is 210 mm; and / or The second width w2 of the second type mainboard unit (22) is 258 mm; and / or The third width w3 of the third type mainboard unit (23) is 425 mm; and / or The fourth width w4 of the fourth model mainboard unit (24) is 518 mm.

3. The circuit board according to claim 1, characterized in that: The lengths of the first-type motherboard unit (21), the second-type motherboard unit (22), the third-type motherboard unit (23), and the fourth-type motherboard unit (24) are all 310 mm.

4. The circuit board according to claim 1, characterized in that: In the length direction of the first-model motherboard unit (21), the first-model motherboard unit (21) has a main bearing area (100) and at least one auxiliary bearing area (200), and the length of the main bearing area (100) does not exceed 310 mm, and the length of the auxiliary bearing area (200) is in the range of 15 to 30 mm; and / or, In the length direction of the second-type motherboard unit (22), the second-type motherboard unit (22) has a main bearing area (100) and at least one auxiliary bearing area (200), and the length of the main bearing area (100) does not exceed 310 mm, and the length of the auxiliary bearing area (200) is in the range of 15 to 30 mm; and / or, In the length direction of the third-type motherboard unit (23), the third-type motherboard unit (23) has a main bearing area (100) and at least one auxiliary bearing area (200), and the length of the main bearing area (100) does not exceed 310 mm, and the length of the auxiliary bearing area (200) is in the range of 15 to 30 mm; and / or, In the length direction of the fourth-type mainboard unit (24), the fourth-type mainboard unit (24) has a main bearing area (100) and at least one auxiliary bearing area (200), and the length of the main bearing area (100) does not exceed 310 mm, and the length of the auxiliary bearing area (200) ranges from 15 to 30 mm.

5. The circuit board according to claim 1, characterized in that: The circuit board also includes: A plurality of connectors, wherein the plurality of connectors at least comprises: a first connector (25), the first connector (25) being used to connect to the chassis (10), the first-model motherboard unit (21) being arranged on the first connector (25), and the first connector (25) being used to carry at least one first-model motherboard unit (21); and / or, a second connector (26), the second connector (26) being used to connect to the chassis (10), the second-model motherboard unit (22) being arranged on the second connector (26), and the second connector (26) being used to carry at least one second-model motherboard unit (22); and / or, a third connector (27), the third connector (27) being used to connect to the chassis (10), the third-model motherboard unit (23) being arranged on the third connector (27), and the outer contour line of the third connector (27) coincides with the outer contour line of the third-model motherboard unit (23), or the outer contour line of the third connector (27) is located on the outer peripheral side of the outer contour line of the third-model motherboard unit (23); and / or, A fourth connector (28), the fourth connector (28) being used to connect to the chassis (10), the fourth-model motherboard unit (24) being arranged on the fourth connector (28), and the outer contour line of the fourth connector (28) coincides with the outer contour line of the fourth-model motherboard unit (24), or the outer contour line of the fourth connector (28) is located on the outer peripheral side of the outer contour line of the fourth-model motherboard unit (24).

6. An electronic device, characterized in that: include: A chassis (10), the chassis (10) having a first installation area (11) and a second installation area; A circuit board (20), wherein a plurality of mainboard units of the circuit board (20) can be selectively adapted to the first installation area (11), so that the chassis (10) can be adapted to mainboard units of different widths, and the circuit board (20) is the circuit board according to any one of claims 1 to 5; A plurality of expansion modules, wherein the plurality of expansion modules are arranged at intervals in the second installation area; Multiple connectors are arranged at intervals on the same mainboard unit and are electrically connected to the mainboard unit. Multiple connectors correspond to multiple expansion modules one by one, and each connector is electrically connected to the corresponding expansion modules through a cable.

7. The electronic device according to claim 6, characterized in that: At least one of the multiple connectors of the circuit board (20) can be adapted to two mainboard units; There is a first installation gap L1 between the two mainboard units, and the value range of the first installation gap L1 is: 0.5~2mm; and / or, There is a protective distance L2 between each of the mainboard units and the inner wall surface on the same side of the chassis (10), and the value range of the protective distance L2 is: 0.5~2mm; and / or, A second installation gap L3 is provided between each of the connectors and the inner wall surface on the same side of the chassis (10), and the value range of the second installation gap L3 is: 0.5-2 mm.

8. The electronic device according to claim 6, characterized in that: Each of the mainboard units has, in sequence in its length direction, an auxiliary bearing area (200), a main bearing area (100), and an auxiliary bearing area (200); The electronic device further comprises a processor module (30) and a memory module (40), wherein the processor module (30) and the memory module (40) are arranged side by side in the main bearing area (100) along the width direction of the mainboard unit, and there are at least two memory modules (40), and at least two memory modules (40) are respectively located on both sides of the processor module (30); Wherein, the processor module (30) and the memory module (40) are arranged with a gap therebetween.

9. The electronic device according to claim 8, characterized in that: The main bearing area (100) has a first sub-area (101), a second sub-area (102), and a third sub-area (103) in sequence in the length direction of the mainboard unit, and the processor module (30) and the memory module (40) are arranged side by side in the second sub-area (102) along the width direction of the mainboard unit; The first sub-area (101) comprises a first partition (1010) and a second partition (1011) in the width direction of the mainboard unit, the first partition (1010) being at least used for arranging a high-speed connector, and the second partition (1011) being at least used for arranging a power connector.

10. The electronic device according to claim 8, characterized in that: The electronic device further comprises: A first management connection piece (70), the first management connection piece (70) is arranged at the main bearing area (100) and is located on one side of the memory module (40), the first management connection piece (70) is extended along the length direction of the motherboard unit and is staggered with respect to the memory module (40).

11. The electronic device according to claim 8, characterized in that: When there are two processor modules (30), there are at least four memory modules (40), and at least two memory modules (40) are correspondingly arranged on both sides of one processor module (30); The electronic device further comprises: A first management connection member (70), the first management connection member (70) is arranged at the main bearing area (100) and is located between two adjacent memory modules (40), the first management connection member (70) is extended along the length direction of the motherboard unit and is staggered with respect to the memory module (40).

12. The electronic device according to claim 10 or 11, characterized in that: The main bearing area (100) has a first sub-area (101), a second sub-area (102), and a third sub-area (103) in sequence in the length direction of the mainboard unit, and the processor module (30) and the memory module (40) are arranged side by side in the second sub-area (102) along the width direction of the mainboard unit; Part of the first management connection piece (70) is located in the second sub-region (102), and another part of the first management connection piece (70) is located in the third sub-region (103).

13. The electronic device according to claim 8, characterized in that: The electronic device further comprises: A second management connection piece (80), wherein the second management connection piece (80) is arranged at the auxiliary bearing area (200), and the second management connection piece (80) is extended along the width direction of the mainboard unit.

14. The electronic device according to claim 6, characterized in that: The first installation area (11) has N1 first connecting members (90) and N2 first guiding sliding members (300); A plurality of connectors of the circuit board (20) can be selectively arranged at the first mounting area (11), each of the connectors having N1 avoidance holes (221), N2 second guide slides (222), and N3 second connecting members (223), and N1 avoidance holes (221) correspond one-to-one to N1 first connecting members (90), and N2 second guide slides (222) correspond one-to-one to N2 first guide slides (300), and are slidably matched; Each of the mainboard units is correspondingly arranged on each of the connectors, each of the mainboard units has N1+N3 assembly holes (214), and the mainboard unit also has N1+N3 third connecting pieces; Wherein, N1 third connecting members on the same mainboard unit correspond one to one with N1 assembly holes (214), and each of the third connecting members passes through the corresponding assembly holes (214), the avoidance holes (221), and is connected to the corresponding first connecting members (90); N3 of the third connecting members correspond to N3 of the second connecting members (223) one by one, and each of the third connecting members passes through a corresponding assembly hole (214) and is connected to a corresponding second connecting member (223).

15. The electronic device according to claim 14, characterized in that: N1 of the first connecting members (90) are nuts arranged on the base of the chassis (10), and the N1 of the nuts are arranged at intervals along the length direction of the chassis (10); N3 of the second connecting members (223) are all studs arranged on the connector, and the N3 of the studs are arranged at intervals along the length direction and the width direction of the connector; N1+N3 of the third connecting parts are all hand screws arranged on the mainboard unit, N1 of the hand screws cooperate with the corresponding N1 of the nuts, and N3 of the hand screws cooperate with the corresponding N3 of the studs.

16. The electronic device according to claim 14, characterized in that: N2 of the first guide slide members (300) are all I-shaped nails arranged on the base of the chassis (10), and the N2 I-shaped nails are arranged at intervals along at least two diagonals of the chassis (10); N2 of the second guide slide members (222) are calabash holes arranged on the circuit board (20), and each of the calabash holes is slidably matched with a corresponding one of the I-shaped nails.

17. The electronic device according to claim 14, characterized in that: When the same connector is adapted to multiple mainboard units, the multiple mainboard units are arranged at intervals along the width direction of the connector, and the connector has n×N3 second connecting members (223), wherein n is the number of the mainboard units.

18. The electronic device according to claim 6, characterized in that: The electronic device is a server or a switch.