Diamond panel heat dissipation module for liquid crystal on silicon (LCOS) chip

Abstract

The utility model discloses a diamond panel heat radiation module used for an LCOS chip, comprising a main radiator, a metal auxiliary heat radiation assembly and an LCOS chip, the LCOS chip and the metal auxiliary heat radiation assembly are both arranged on the main radiator; the LCOS chip comprises a hard substrate, a flexible circuit board, a semiconductor silicon layer, a liquid crystal layer and a diamond panel which are sequentially arranged from bottom to top, one end of the metal auxiliary heat dissipation assembly is connected to the diamond panel, and the other end of the metal auxiliary heat dissipation assembly is connected to the main heat dissipation device; the lower surface of the hard substrate is attached to the main radiator; and through the hard substrate and the metal auxiliary heat dissipation assembly, upper and lower double-channel heat dissipation is realized, so that the output brightness and the service life of the LCOS are remarkably improved.

Description

Technical Field

[0001] The utility model is applied to the technical field of LCOS imaging equipment, and in particular relates to a diamond panel heat dissipation module for an LCOS chip. Background Art

[0002] LCOS can also be considered a type of LCD. Traditional LCDs are made on glass substrates, while LCOS is made on silicon wafers.

[0003] The structure of the LCOS panel is somewhat similar to that of a TFT LCD. It also has two layers of substrates, the upper and lower, with support gaskets placed between them to isolate them. Liquid crystal is then filled between the substrates to form an image. The rotation of the liquid crystal molecules is driven by the switching of the circuit to determine the brightness of the image.

[0004] During the operation of LCOS, the light source is converted into polarized light after passing through the PBS-type polarizing component and projected into the LCOS, passing through the liquid crystal layer -> aluminum reflector -> and then passing through the liquid crystal layer to be emitted. In this process, the polarization direction of the light is changed and then passed through the PBS-type polarizing component to obtain an image. In the process of light passing through the LCOS, since each component cannot achieve 100% transmission, it generally causes about 20% of the light flux loss. The 20% loss of light will be completely converted into heat and deposited on the glass, liquid crystal and single crystal silicon layers of the LCOS, and rely on the single crystal silicon layer to conduct to the oxygen-free copper heat sink.

[0005] The upper substrate of the LCOS panel is I TO conductive glass, and the lower substrate is a CMOS substrate coated with liquid crystal silicon. The biggest feature of the LCOS panel is that the material of the lower substrate is single crystal silicon.

[0006] like Figure 1 The schematic diagram of the structure of the LCOS chip of the prior art is shown, and there is an FPC (flexible circuit board) under the single crystal silicon for leading out the control related circuit, and the single crystal silicon, FPC and oxygen-free copper heat sink are combined by two layers of glue. The FPC and glue are both high thermal resistance materials.

[0007] Due to the presence of glue and FPC, heat cannot be quickly transferred to the heat sink and external radiator. Excessive incident light flux will cause the temperature of the LCOS component to rise to a temperature where the liquid crystal cannot work normally, thus limiting the upper limit of the output light.

[0008] In LCOS projectors, the core bottleneck that restricts the brightness output of the whole machine is the heat dissipation capacity of the imaging components. In the current traditional projectors using LCOS for imaging, the silicon modules in LCOS are bonded to the oxygen-free copper heat sink by glue and FPC, and the glue and FPC have very high thermal resistance. Since the heat sources in LCOS are all in the reflective layer and liquid crystal layer above the single crystal silicon, it is difficult for the heat to be transferred to the oxygen-free copper heat sink, which greatly limits the improvement of the LCOS output brightness.

[0009] The utility model replaces the glass panel with a diamond panel and adds a metal auxiliary heat dissipation component to conduct heat from the diamond panel to the metal heat sink, thereby adding a new heat dissipation channel to the LCOS in addition to the original silicon substrate heat dissipation channel, thereby significantly improving the output brightness and life of the LCOS. Utility Model Content

[0010] The utility model provides a diamond panel heat dissipation module for an LCOS chip, aiming to solve the above technical problems.

[0011] A diamond panel heat dissipation module for an LCOS chip provided in an embodiment of the present application includes: a main heat sink, a metal auxiliary heat dissipation component and an LCOS chip, wherein the LCOS chip and the metal auxiliary heat dissipation component are both arranged on the main heat sink; the LCOS chip includes a hard substrate, a flexible circuit board, a semiconductor silicon layer, a liquid crystal layer and a diamond panel arranged in sequence from bottom to top, one end of the metal auxiliary heat dissipation component is connected to the diamond panel, and the other end of the metal auxiliary heat dissipation component is connected to the main heat sink; the lower surface of the hard substrate is attached to the main heat sink; upper and lower dual-channel heat dissipation is achieved through the hard substrate and the metal auxiliary heat dissipation component.

[0012] In the diamond panel heat dissipation module for LCOS chips of the utility model, the cross-section of the metal auxiliary heat dissipation component is L-shaped, which includes a first wall and a second wall connected to each other, the first wall is pressed at the edge position of the diamond panel, and the end of the second wall is connected to the main heat sink.

[0013] In the diamond panel heat dissipation module for LCOS chips of the utility model, the first wall and the diamond panel are connected by thermally conductive silicone grease.

[0014] In the diamond panel heat dissipation module for LCOS chips of the utility model, the second wall is connected to the main heat sink by thermal conductive silicone grease.

[0015] In the diamond panel heat dissipation module for LCOS chip of the utility model, a circle of silicone grease protection ring is also arranged on the diamond panel, and the silicone grease protection ring is arranged at the end of the first wall.

[0016] In the diamond panel heat dissipation module for LCOS chip of the utility model, the silicone grease protection ring and the diamond panel are connected by adhesive.

[0017] In the diamond panel heat dissipation module for LCOS chip of the utility model, the LCOS chip also includes a protective glue and a sealing gasket, the sealing gasket is arranged above the flexible circuit board and is located outside the liquid crystal layer; the protective glue is arranged above the flexible circuit board, and the protective glue is surrounded by the outside of the sealing gasket, and the protective glue is used to seal the diamond panel and the liquid crystal layer.

[0018] In the diamond panel heat dissipation module for LCOS chips of the utility model, an extension portion is provided at the end of the diamond panel, and the extension portion extends out of the sealing gasket.

[0019] The technical solution provided by the embodiments of the present application may include the following beneficial effects: The present application designs a diamond panel heat dissipation module for LCOS chips, replaces the glass panel with a diamond panel, and adds a metal auxiliary heat dissipation component to conduct heat from the diamond panel to the metal radiator, thereby adding a new heat dissipation channel to the LCOS in addition to the original silicon substrate heat dissipation channel, thereby significantly improving the output brightness and life of the LCOS. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 It is a structural schematic diagram of a prior art LCOS chip;

[0022] Figure 2 It is a structural schematic diagram of a diamond panel heat dissipation module for LCOS chips according to an embodiment of the utility model.

[0023] Description of the label:

[0024] 10. Main heat sink; 11. Glass panel; 12. Monocrystalline silicon; 20. LCOS chip; 21. Hard substrate; 22. Flexible circuit board; 23. Semiconductor silicon layer; 24. Liquid crystal layer; 25. Diamond panel; 251. Extension part; 26. Protective glue; 27. Sealing gasket; 28. Support gasket; 29. ​​Front electrode; 291. Orientation film; 292. Aluminum reflector; 293. Bonding wire; 30. Metal auxiliary heat dissipation component; 31. First wall; 32. Second wall; 40. Silicone grease protective ring. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] It should also be understood that the terms used in this utility model specification are only for the purpose of describing specific embodiments and are not intended to limit the utility model. As used in this utility model specification and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0027] It should be further understood that the term “and / or” used in the present specification and the appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0028] Please refer to Figure 2As shown, the utility model discloses a diamond panel heat dissipation module for LCOS chip, including a main heat sink 10, an LCOS chip 20 and a metal auxiliary heat dissipation component 30. The LCOS chip 20 and the metal auxiliary heat dissipation component 30 are both mounted on the main heat sink 10. The LCOS chip 20 includes a hard substrate 21, a flexible circuit board 22, a semiconductor silicon layer 23, a liquid crystal layer 24 and a diamond panel 25 arranged in sequence from bottom to top, one end of the metal auxiliary heat dissipation component 30 is connected to the diamond panel 25, and the other end of the metal auxiliary heat dissipation component 30 is connected to the main heat sink 10. The cross section of the metal auxiliary heat dissipation component 30 is L-shaped, which includes a first wall 31 and a second wall 32 connected to each other, the first wall 31 is horizontally arranged, the first wall 31 is pressed at the edge of the diamond panel 25, the second wall 32 extends toward the main heat sink 10, and the end of the second wall 32 is connected to the main heat sink 10. The present application adopts a diamond panel 25 to replace the commonly used optical glass or quartz glass panel, and the heat of the diamond panel 25 can be conducted to the main heat sink 10 through the metal auxiliary heat sink component 30. The metal auxiliary heat sink component 30 and the LCOS chip 20 share a main heat sink 10, and can simultaneously realize heat dissipation through the upper and lower heat conduction channels of the silicon substrate and the diamond panel 25, thereby reducing the overall thermal resistance between the LCOS heat source and the external heat sink, so that the LCOS module has a higher light energy carrying capacity, thereby achieving the purpose of improving the output brightness of the LCOS projection equipment; it also saves the material cost and assembly space of the radiator.

[0029] In an optional embodiment, the first wall 31 is connected to the diamond panel 25 by thermal grease, and the second wall 32 is also connected to the main heat sink 10 by thermal grease. Thermal grease is used to increase the thermal conductivity of the metal auxiliary heat sink assembly 30, the diamond panel 25 and the main heat sink 10, thereby improving the heat dissipation effect.

[0030] In this embodiment, a circle of silicone grease protection ring 40 is also provided on the diamond panel 25, and the silicone grease protection ring 40 is provided at the end position of the first wall 31. Since thermal grease is coated between the diamond panel 25 and the metal auxiliary heat dissipation component 30, and the oily material in the thermal grease has a climbing phenomenon, it is necessary to provide a silicone grease protection ring 40 between the thermal grease and the imaging area to prevent the thermal grease from contaminating the imaging area. In this embodiment, the silicone grease protection ring 40 is connected to the diamond panel 25 by adhesive to position the silicone grease protection ring 40.

[0031] In this embodiment, the LCOS chip 20 further includes a protective glue 26 and a sealing gasket 27. The sealing gasket 27 is disposed above the hard substrate and surrounds the outside of the liquid crystal layer 24. The protective glue 26 is disposed above the hard substrate and surrounds the outside of the sealing glue. The protective glue 26 is used to seal the diamond panel 25 and the liquid crystal layer 24, and is used to protect the devices inside the LCOS chip 20.

[0032] The end of the diamond panel 25 has an extended portion 251, which extends out of the position of the sealing gasket 27. Therefore, the diamond panel 25 of the present application will be larger than the original glass panel 11 so that it can contact the metal auxiliary heat dissipation component 30 through the extended portion, and then transfer the heat to the main heat sink 10; and it will not affect the original imaging area.

[0033] It should be noted that the LCOS chip 20 of the present application also includes a supporting gasket 28, a front electrode 29, an orientation film 291, an aluminum reflector 292, a bonding wire 293, etc. These features are common features of the LCOS chip 20 and will not be elaborated in this article.

[0034] The core part of the utility model is a structural design method for performing auxiliary heat dissipation through a diamond panel 25 and a metal auxiliary heat dissipation component 30 .

[0035] The thermal conductivity of diamond is between 1200 and 2200 W / (m·K), which is the material with the highest thermal conductivity among known materials. In addition, pure diamond has lower scattering and lower absorption characteristics than optical glass in optics, which can ensure low loss of high-power light. High-purity single crystal diamond has many uses in the ultraviolet, visible and near-infrared bands. The utility model uses a diamond panel 25 that is larger than the original glass panel 11, and conducts heat through the extended part of the diamond panel 25 that is in contact with the metal auxiliary heat dissipation component 30. The utility model only adjusts the liquid crystal orientation, box sealing, infusion, sealing and other processes of LCOS manufacturing. The corresponding process adjustments can be completed only in the liquid crystal factory, and do not involve modifications related to the semiconductor process.

[0036] The utility model can minimize the impact on the original production process, reduce R&D and manufacturing investment, and has a high cost-benefit ratio.

[0037] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the utility model, and these modifications or replacements should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A diamond panel heat dissipation module for LCOS chip, characterized in that: include: A main heat sink (10), a metal auxiliary heat sink component (30) and an LCOS chip (20), wherein the LCOS chip (20) and the metal auxiliary heat sink component (30) are both arranged on the main heat sink (10); the LCOS chip (20) comprises a hard substrate (21), a flexible circuit board (22), a semiconductor silicon layer (23), a liquid crystal layer (24) and a diamond panel (25) arranged in sequence from bottom to top; one end of the metal auxiliary heat sink component (30) is connected to the diamond panel (25), and the other end of the metal auxiliary heat sink component (30) is connected to the main heat sink (10); the lower surface of the hard substrate (21) is attached to the main heat sink (10); and upper and lower dual-channel heat dissipation is achieved through the hard substrate (21) and the metal auxiliary heat sink component (30).

2. The diamond panel heat dissipation module for LCOS chip according to claim 1, characterized in that: The metal auxiliary heat dissipation component (30) has an L-shaped cross section and comprises a first wall (31) and a second wall (32) connected to each other, wherein the first wall (31) is pressed at an edge of the diamond panel (25), and an end of the second wall (32) is connected to the main heat sink (10).

3. The diamond panel heat dissipation module for LCOS chip according to claim 2, characterized in that: Thermal conductive silicone grease is provided between the first wall (31) and the diamond panel (25).

4. The diamond panel heat dissipation module for LCOS chip according to claim 2, characterized in that: Thermal conductive silicone grease is provided between the second wall (32) and the main heat sink (10).

5. The diamond panel heat dissipation module for LCOS chip according to claim 4, characterized in that: The diamond panel (25) is also provided with a circle of silicone grease protection ring (40), and the silicone grease protection ring (40) is arranged at the end of the first wall (31).

6. The diamond panel heat dissipation module for LCOS chip according to claim 5, characterized in that: The silicone grease protection ring (40) is connected to the diamond panel (25) via adhesive.

7. The diamond panel heat dissipation module for LCOS chip according to claim 2, characterized in that: The LCOS chip (20) further comprises a protective glue (26) and a sealing gasket (27); the sealing gasket (27) is arranged above the flexible circuit board (22) and is located outside the liquid crystal layer (24); the protective glue (26) is arranged above the flexible circuit board (22), and the protective glue (26) is arranged around the outside of the sealing gasket (27), and the protective glue (26) is used to seal the diamond panel (25) and the liquid crystal layer (24).

8. The diamond panel heat dissipation module for LCOS chip according to claim 7, characterized in that: An extension portion (251) is provided at the end of the diamond panel (25), and the extension portion (251) extends out of the sealing gasket (27).

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