Heating control circuit suitable for direct coupling direct current SQUID

Abstract

The utility model relates to a heating control circuit suitable for a direct coupling direct current SQUID, which comprises an MCU unit, a switch driving unit and a switching unit, the control output end of the MCU unit is connected with the input end of the switch driving unit, the HEAT + end of the MCU unit is connected with the input end of the switch driving unit, and the HEAT + end of the MCU unit is connected with the input end of the switch driving unit. The HEAT-end of the MCU unit is connected with the input end of the switch driving unit, and the output end of the switch driving unit is connected with the input end of the switching unit. According to the utility model, instant heating can be realized, so that probe signal debugging of equipment is more convenient.

Description

Technical Field

[0001] The utility model relates to a heating control circuit suitable for a directly coupled direct current SQUID. Background Art

[0002] Magnetic sensors based on superconducting quantum interference devices (SQUIDs) are the most sensitive magnetic sensors known to date, with low-temperature superconducting SQUIDs having a sensitivity better than 10 femtoseconds and high-temperature superconducting SQUIDs having a sensitivity better than 100 femtoseconds. SQUID magnetic sensors are important high-end application sensors, widely used in weak magnetic field detection fields such as biomagnetism, geophysical detection, and extremely low-field nuclear magnetic resonance, with high scientific research and application value. For high levels of white noise, excess noise is usually due to external interference or magnetic flux captured in the junction suppressing the VF transfer coefficient, causing I0 to change, making the SQUID no longer optimized or symmetrical, for DC SQUIDs. Excess low-frequency noise may be telegraph noise caused by trapped magnetic flux moving in the device. If this noise is significant at very low frequencies, flux jumps will be seen directly at the output, and a large 1 / f noise will be observed in the FFT spectrum. If the flux jump is too fast to be resolved in the time domain, the FFT spectrum will exhibit a characteristic Lorentzian form. There are several ways to deal with excess noise: using embedded heaters on the SQUID chip to heat the SQUID to above Tc and then recooling to drain the captured flux

[0003] After searching, the patent: A single-channel DC SQUID signal collection device (CN202223119330.1), a feedback coil is set in the superconducting quantum interference device in the liquid nitrogen environment, and a changing magnetic field is generated through the test circuit to find the working point; a heating resistor is set in the superconducting quantum interference device in the liquid nitrogen environment, and the environment of the superconducting quantum interference device is heated by controlling the switch SW3; a signal processing circuit is connected to the superconducting quantum interference device; a reset switch is set to control the superconducting quantum interference device to restore the normal working state; a main controller is set to connect the switch controller of the reset switch, the signal processing circuit, the heating circuit and the test circuit. Although the above device also uses a heating circuit, the above circuit only performs heating and has no deployment functions, and cannot realize remote control and deployment, resulting in inconvenient operation.

[0004] In view of the above-mentioned defects, the designers have actively carried out research and innovation in order to create a new structure of heating control circuit suitable for direct-coupled DC SQUID, making it more valuable for industrial use. Utility Model Content

[0005] In order to solve the above technical problems, the purpose of the utility model is to provide a heating control circuit suitable for a directly coupled DC SQUID.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A heating control circuit suitable for a direct-coupled DC SQUID, comprising an MCU unit, a switch drive unit and a switching unit, wherein the control output end of the MCU unit is connected to the input end of the switch drive unit, the HEAT+ end of the MCU unit is connected to the input end of the switch drive unit, and the HEAT- end of the MCU unit is connected to the input end of the switch drive unit;

[0008] The switch driving unit includes an identical and independent first switch driving module and a second switch driving module, the HEAT+ end of the MCU unit is connected to the first switch driving module, and the HEAT- end of the MCU unit is connected to the second switch driving module, wherein the output ends of the first switch driving module and the second switch driving module are respectively connected to the product.

[0009] Preferably, the heating control circuit suitable for directly coupled DC SQUID, the first switch driving module includes chip U2A and chip U2B, the sixteenth pin of chip U2B is connected to the control output end of the MCU unit, the fourteenth pin of chip U2B is grounded through resistor R41, the fifteenth pin of chip U2B is connected to the second pin of chip U2A, the third pin of chip U2A is connected to the product through parallel resistor R36 and resistor R13, the first pin of chip U2A is connected to the control output end of the MCU unit, and the HEAT+ end of the MCU unit is connected between the fifteenth pin of chip U2B and the second pin of chip U2A.

[0010] Preferably, in the heating control circuit suitable for directly coupled DC SQUID, the model of the MCU unit is R5F211B4SP.

[0011] Preferably, in the heating control circuit suitable for directly coupled DC SQUID, the model of the chip U2A is ADG1634L.

[0012] Preferably, in the heating control circuit suitable for directly coupled DC SQUID, the output end of the MCU unit is connected to the switch driving unit through a switching unit.

[0013] By means of the above solution, the utility model has at least the following advantages:

[0014] The utility model can remotely control the instant heating of the probe compartment heating sheet, making it more convenient for the equipment to debug the probe signal.

[0015] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the utility model in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 It is a principle block diagram of the utility model;

[0018] Figure 2 It is the actual circuit diagram of the utility model;

[0019] Figure 3 It is a circuit diagram of the switching unit of the utility model. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0022] Example

[0023] like Figure 1 , Figure 2 and Figure 3 As shown, a heating control circuit suitable for directly coupled DC SQUID includes an MCU unit 1 and a switch drive unit 2, wherein the control output end of the MCU unit 1 is connected to the input end of the switch drive unit 2, the HEAT+ end of the MCU unit 1 is connected to the input end of the switch drive unit 2, and the HEAT- end of the MCU unit 1 is connected to the input end of the switch drive unit 2;

[0024] The switch driving unit 2 includes an identical and independent first switch driving module and a second switch driving module, the HEAT+ end of the MCU unit 1 is connected to the first switch driving module, and the HEAT- end of the MCU unit 1 is connected to the second switch driving module, wherein the output ends of the first switch driving module and the second switch driving module are respectively connected to the product.

[0025] In the utility model, the first switch driving module includes a chip U2A and a chip U2B, the sixteenth pin of the chip U2B is connected to the control output end of the MCU unit 1, the fourteenth pin of the chip U2B is grounded through a resistor R41, the fifteenth pin of the chip U2B is connected to the second pin of the chip U2A, the third pin of the chip U2A is connected to the product through a parallel resistor R36 and a resistor R13, the first pin of the chip U2A is connected to the control output end of the MCU unit 1, and the HEAT+ end of the MCU unit 1 is connected between the fifteenth pin of the chip U2B and the second pin of the chip U2A.

[0026] The circuit of the second switch driving module in the present invention is the same as that of the first switch driving module, and will not be described in detail. Figure 2 shown.

[0027] The output end of the MCU unit 1 in the utility model is connected to the switch driving unit 2 through the adapter unit 3.

[0028] The model of the MCU unit 1 in the present utility model is R5F211B4SP.

[0029] The model of the chip U2A described in the present invention is ADG1634L.

[0030] The MCU unit controls the MCU through the communication interface and then controls the HEATER_1 signal, thereby controlling the heating when needed.

[0031] Switch driving unit: controls the driving switch and adjusts the current to the required size through the driving circuit, that is, the required heating power.

[0032] Transfer end: Increase the inductance to smooth the current changes.

[0033] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0034] In the description of this application, it should be noted that the terms "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0035] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or vertical, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0036] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0037] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the technical principle of the present invention, and these improvements and modifications should also be regarded as within the protection scope of the present invention.

Claims

1. A heating control circuit suitable for a directly coupled DC SQUID, characterized in that: It comprises an MCU unit (1) and a switch drive unit (2), wherein the control output end of the MCU unit (1) is connected to the input end of the switch drive unit (2), the HEAT+ end of the MCU unit (1) is connected to the input end of the switch drive unit (2), and the HEAT- end of the MCU unit (1) is connected to the input end of the switch drive unit (2); The switch driving unit (2) comprises an identical and independent first switch driving module and a second switch driving module, the HEAT+ terminal of the MCU unit (1) is connected to the first switch driving module, and the HEAT- terminal of the MCU unit (1) is connected to the second switch driving module, wherein the output terminals of the first switch driving module and the second switch driving module are respectively connected to the product.

2. A heating control circuit suitable for a directly coupled DC SQUID according to claim 1, characterized in that: The first switch driving module comprises a chip U2A and a chip U2B, wherein the sixteenth pin of the chip U2B is connected to the control output end of the MCU unit (1), the fourteenth pin of the chip U2B is grounded via a resistor R41, the fifteenth pin of the chip U2B is connected to the second pin of the chip U2A, the third pin of the chip U2A is connected to the product via a parallel resistor R36 and a resistor R13, the first pin of the chip U2A is connected to the control output end of the MCU unit (1), and the HEAT+ end of the MCU unit (1) is connected between the fifteenth pin of the chip U2B and the second pin of the chip U2A.

3. A heating control circuit suitable for a directly coupled DC SQUID according to claim 1, characterized in that: The model of the MCU unit (1) is R5F211B4SP.

4. A heating control circuit suitable for a directly coupled DC SQUID according to claim 2, characterized in that: The model of the chip U2A is ADG1634L.

5. A heating control circuit suitable for a directly coupled DC SQUID according to claim 1, characterized in that: The output end of the MCU unit (1) is connected to the switch drive unit (2) via a switching unit (3).

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