Heat dissipation design structure of high-speed data acquisition VPX board card

Abstract

The utility model discloses a high-speed data acquisition VPX board card heat radiation design structure, which comprises a heat radiation fin and a baseband board mother board, the heat radiation fin is detachably connected with the baseband board mother board, the front surface of the heat radiation fin is provided with heat radiation fins, the back surface of the heat radiation fin is provided with a copper pipe, the front surface of the baseband board mother board is provided with a core FPGA chip, and the core FPGA chip is provided with a plurality of heat radiation fins. Heat conduction cotton is arranged between the copper pipe and the core FPGA chip, heat generated by the core FPGA chip is conducted to the copper pipe through the heat conduction cotton, the heat is conducted to the cooling fins through the copper pipe, and the heat is taken away by the cooling fins through convection heat exchange of air and the cooling fins. The structure is beneficial to ideal design of the core FPGA chip, and meanwhile is beneficial to high integration and miniaturization design of the board card, so that the board card has a good heat dissipation effect.

Description

Technical Field

[0001] The utility model belongs to the technical field of heat dissipation of high-integration high-heat board cards, and in particular relates to a heat dissipation design structure of a high-speed data acquisition VPX board card. Background Art

[0002] With the continuous breakthroughs and innovations in information technology and electronic technology, the functional performance of electronic components and modules has been continuously improved, and the integration of components and modules has become increasingly higher. The corresponding electronic board modules have also shown the characteristics of standardization, modularization and integration. The VPX high-speed data acquisition board with standardized interface has been widely used due to its convenience for quick plug-in and excellent interchangeability. With the continuous improvement of functional performance and integration, the power consumption of board modules has also increased. Since the high temperature environment has a great impact on the stability of board modules, the heat dissipation problem of board modules has become increasingly prominent.

[0003] The high-speed data acquisition VPX board is based on the standard 6U VPX architecture and provides two standard FMC slots, which are suitable for high-performance acquisition, playback and related processing in the fields of electronic countermeasures or radar signals. By connecting different data interface FMC daughter cards, the functional modules of acquisition, playback and processing with different sampling frequencies, different quantization bits, different number of channels and different signal forms can be realized. The signal processing board of the high-speed data acquisition VPX board mainly includes large-scale FPGA, FMC slot, expansion IO, onboard clock, etc.

[0004] The heat dissipation method of the high-speed data acquisition VPX board currently used uses thermal conductive cotton and heat dissipation cold plates to build an efficient heat dissipation path, fits the main power device FPGA with the thermal conductive cotton, and quickly conducts the heat of the FPGA to the heat dissipation fins, achieving balanced heat distribution and efficient heat dissipation, which can ensure the stable operation of the electronic equipment therein.

[0005] The heat of the high-speed data acquisition VPX board is mainly concentrated above the FPGA, but the heat conduction capacity of the heat sink is limited, resulting in the huge heat of the board cannot be effectively dissipated when it is working. If the local heat of the board is high and the heat cannot be dissipated in time, the FPGA will be in a high-temperature working state for a long time, which will increase the failure rate of the equipment and even cause damage. Therefore, it is very necessary to improve the heat dissipation capacity of the board and enhance the heat dissipation effect.

[0006] During the board design process, the heat dissipation distribution of the high-speed data acquisition VPX board is adjusted, and high thermal conductivity, lightweight, and structural materials are used to provide a fixed foundation for the internal electronic components and circuit boards. At the same time, the working heat of the electrical components is exported through the heat dissipation fins. In order to improve the heat dissipation efficiency of the board, the structural design improves the heat dissipation efficiency of the board by increasing the height of the heat dissipation fins and laying copper pipes, so as to achieve the purpose of fast heat dissipation of the board.

[0007] The patent document "A Method and Process for Reinforced VPX Module Heat Dissipation" (201810585217.1) proposes a reinforced VPX module heat dissipation design. Its main technical solution is to use a structure in which the heat dissipation cold plate substrate is processed as a whole with a boss and welded together with the upper heat dissipation buckle teeth. In order to ensure the heat dissipation area and heat dissipation efficiency, the buckle teeth are processed by molds to ensure dimensional accuracy, and the buckle teeth are brazed to weld the boss heat dissipation cold plate substrate together. In order to effectively dissipate heat, the heat dissipation cold plate substrate is designed to be a hollow structure, and the hollow part of the heat dissipation cold plate is filled with liquid and capillary structure, and phase change is used for heat conduction. The above scheme dissipates heat by mold processing, welding and filling the hollow part of the heat dissipation cold plate substrate with liquid. The precision errors of processing and welding in this scheme are not conducive to the ideal design of the core FPGA. At the same time, the hollow structure of the heat dissipation cold plate substrate increases the thickness of the board, which is not conducive to the high integration and miniaturization design of the board. Utility Model Content

[0008] The utility model aims to provide a high-speed data acquisition VPX board heat dissipation design structure, which is conducive to the ideal design of the core FPGA chip, and is also conducive to the high integration and miniaturization design of the board, so that the board has a good heat dissipation effect.

[0009] In order to achieve the above purpose, the technical solution adopted by the utility model is as follows:

[0010] A high-speed data acquisition VPX board heat dissipation design structure includes a heat sink and a baseband board motherboard, the heat sink is detachably connected to the baseband board motherboard, the front of the heat sink is provided with heat dissipation fins, the back of the heat sink is provided with a copper tube, the front of the baseband board motherboard is provided with a core FPGA chip, heat conductive cotton is provided between the copper tube and the core FPGA chip, the heat generated by the core FPGA chip is conducted to the copper tube through the heat conductive cotton, the copper tube is conducted to the heat sink, and the heat sink removes the heat through convection exchange between air and the heat dissipation fins.

[0011] Preferably, the heat sink is made of a metal material with high thermal conductivity.

[0012] Preferably, the porous layer on the inner wall of the copper tube adopts a hot slag structure.

[0013] Preferably, the copper tube is combined with the heat sink by a brazing process.

[0014] The beneficial effect of the utility model is that the structure is conducive to the ideal design of the core FPGA chip, and is also conducive to the high integration and miniaturization design of the board, so that the board has a good heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1It is a hot slag structure.

[0016] Figure 2 The front side of the heat sink.

[0017] Figure 3 The back side of the heat sink.

[0018] Figure 4 This is the front side of the board assembly diagram.

[0019] Figure 5 This is the back of the board assembly diagram.

[0020] Among them, 1 is the heat sink; 2 is the heat sink fin; 3 is the copper tube; 4 is the thermal conductive cotton; 5 is the baseband motherboard; 6 is the screw. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution of the utility model will be clearly and completely described below in conjunction with the accompanying drawings.

[0022] The utility model discloses a heat dissipation design structure of a high-speed data acquisition VPX board. The board adopts a standard VPX module structure. The core FPGA chip of the board mainly includes high-power devices such as FPGA1 and FPGA2. The typical power consumption of the whole board is expected to be 100W, and the maximum power consumption is expected to reach 130W. It has the characteristics of high overall power consumption, many power devices, and dense device arrangement. It is a typical high-heat and high-density board.

[0023] like Figures 1 to 5 As shown, a high-speed data acquisition VPX board heat dissipation design structure includes a heat sink 1, a heat sink fin 2, a copper tube 3, a thermal conductive cotton 4, a baseband motherboard 5, and a screw 6.

[0024] Considering the performance of the board and the requirements of the use environment, in order to better meet the thermal environment conditions, the components are selected as industrial-grade or above standard products as much as possible, with a junction temperature of at least 85°C, and the junction temperature of some high-power devices is at least 100°C. In order to reduce the overall temperature rise of the board and increase reliability, the device layout of the baseband motherboard 5 needs to be studied in depth, and the heat source is evenly distributed. The following solution is adopted:

[0025] (1) High-power devices such as FPGA1 and FPGA2 are placed separately in a specific area of ​​the baseband board motherboard 5 and as close to the heat conduction surface of the board and the chassis as possible.

[0026] (2) Common power devices such as Flash and power supply are evenly distributed on the front and back sides of the baseband board motherboard 5, effectively utilizing the area of ​​the baseband board motherboard 5.

[0027] (3) Heat-sensitive devices such as power modules should be placed away from high-power devices as much as possible.

[0028] (4) Consider the length and diameter of the heat pipe, the contact length of the evaporation zone, and the contact length of the compensation zone.

[0029] The heat sink 1 and the baseband board motherboard 5 are connected by screws 6 to form a complete heat dissipation structure. In order to increase the heat dissipation effect of the heat sink, a heat dissipation fin 2 is designed on the front of the heat sink 1. The copper tube 3 is laid on the back of the heat sink 1 through a brazing process. The core FPGA chip is placed on the front of the baseband board motherboard 5. Thermal conductive cotton 4 is laid between the copper tube 3 and the core FPGA chip. The heat generated by the core FPGA chip is conducted to the copper tube 3 through the thermal conductive cotton 4, and the copper tube 3 is conducted to the heat sink 1. The heat sink 1 removes the heat through convection exchange between the air and the heat dissipation fin 2.

[0030] In some examples, in order to improve the heat radiation capacity of the board and increase the heat dissipation of the device itself, the heat sink 1 is usually made of a metal material with high thermal conductivity, such as aluminum alloy, copper or silver, and heat dissipation is assisted by adding heat dissipation fins 2.

[0031] The heat sink 1 of the board is made of heat dissipation fins 2 on the outside, and a copper tube 3 with high thermal conductivity is laid inside. The inner wall of the copper tube 3 is provided with a porous layer, and the porous layer is a hot slag structure. The hot slag structure is in the form of sintered metal powder. The material is heated at high temperature through the hot slag structure, so after they cool down, they restore the original hard texture of the metal and are very strong.

[0032] The copper tube 3 is combined with the heat sink 1 through a brazing process. This brazing process allows the use of thinner heat sink and heat pipe materials, so that a light, efficient, sturdy and compact heat exchanger can be manufactured. At the same time, this process eliminates the degreasing process, does not require cleaning, does not produce wastewater, toxic gases and other harmful substances, is environmentally friendly, and has the advantages of fast welding speed, high welding quality and low cost. The heat generated by the core device during operation is transferred to the copper tube 3 through the thermal conductive cotton 4, and the copper tube 3 is transferred to the heat sink 1. The heat sink 1 serves as the main heat dissipation component of the board module. The main power devices on the board transfer heat to the heat dissipation copper tube 3 and the heat sink 1, and the heat is removed by the cold air flowing through the board for heat dissipation.

[0033] The heat dissipation method of the board is conduction cooling. The high-power devices on the board transfer heat to the copper tube through the thermal conductive cotton, and the copper tube transfers heat to the heat sink. Then the heat of the board is removed through the convection heat exchange between the air and the heat sink. The board is installed in the user's standard VPX rack.

[0034] Through the heat dissipation design of the board recorded in the utility model, after analyzing and monitoring the operating temperature of the core chip, it is found that the normal operating temperature of the core chip is 50°C to 60°C, which shows that the design enables the board to have a good heat dissipation effect.

Claims

1. A high-speed data acquisition VPX board heat dissipation design structure, characterized in that: It includes a heat sink and a baseband board motherboard, the heat sink is detachably connected to the baseband board motherboard, a copper tube is arranged on the back of the heat sink, a core FPGA chip is arranged on the front of the baseband board motherboard, thermal conductive cotton is arranged between the copper tube and the core FPGA chip, the heat generated by the core FPGA chip is transferred to the copper tube through the thermal conductive cotton, and the copper tube is transferred to the heat sink.

2. The high-speed data acquisition VPX board heat dissipation design structure according to claim 1 is characterized in that: The front side of the heat sink is provided with heat dissipation fins, and the heat sink removes heat through convection heat exchange between air and the heat dissipation fins.

3. The high-speed data acquisition VPX board heat dissipation design structure according to claim 1 is characterized in that: The heat sink is made of a metal material with high thermal conductivity.

4. The high-speed data acquisition VPX board heat dissipation design structure according to claim 1 is characterized in that: The inner wall of the copper tube is provided with a porous layer.

5. The high-speed data acquisition VPX board heat dissipation design structure according to claim 4 is characterized in that: The porous layer is a hot slag structure.

6. The high-speed data acquisition VPX board heat dissipation design structure according to claim 1, characterized in that: The copper tube is combined with the heat sink through a brazing process.

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