Multi-layer double-sided flexible circuit board
By setting up a thermal structure, including thermal blocks and thermal sheets, the heat accumulation problem caused by the multi-layer structure is solved, effective heat dissipation is achieved, service life is extended and the risk of burning is avoided.
Patent Information
- Application Number
- CN202421586400.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-05
- Publication Date
- 2025-05-13
- Estimated Expiration
- 2034-07-05
AI Technical Summary
Due to its multi-layered double-sided flexible circuit board, the internal heat accumulation caused by its multi-layer structure, cannot be dissipated in time, affecting its service life and may lead to burning.
A thermal conductivity structure is arranged inside the flexible circuit board, including a thermal conduction block, a plug-in and a thermal conduction block. The thermal conduction block guides the internal heat to the thermal conduction block and exchanges heat with the external environment through the thermal conduction block to achieve heat dissipation.
Through the setting of the thermally conductive structure, the internal heat is effectively exported, which reduces the temperature of the circuit board, extends the service life and avoids the risk of burning.
Smart Images

Figure CN222869122U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of double-sided flexible circuit boards, in particular to a multi-layer double-sided flexible circuit board. Background Art
[0002] A multi-layer double-sided flexible circuit board is a single-sided flexible circuit board or a double-sided flexible circuit board with three or more layers laminated together. Metallized holes are formed by drilling and electroplating to form conductive paths between different layers.
[0003] After searching, a double-sided flexible circuit board structure is mentioned in the application number CN202320170070.6, including an insulating base film, a grounding circuit and an anti-crack bending part, a first separation functional area is arranged in the middle position of the insulating base film, a second separation functional area is arranged on both sides of the first separation functional area, a third separation functional area is arranged on the top and bottom of the insulating base film, and the grounding circuit is installed on the third separation functional area. The utility model optimizes the structure of the flexible circuit board by installing an anti-crack bending part and a metal reinforcement wire, etc., and improves the anti-fracture effect at the bending part by arranging an anti-crack bending part in the second separation functional area at the gooseneck used for bending, and by setting the anti-crack bending part as a double flexible reinforcement structure composed of a flexible anti-crack sheet made of silicone and a metal reinforcement wire made of tin-lead alloy, compared with a single reinforcement structure, its anti-crack performance is better, which is conducive to extending the service life of the flexible circuit board.
[0004] Although the above scheme solves the problems mentioned in the background technology, it still has the following shortcomings: the above double-sided flexible circuit board has a multi-layer structure, which causes it to generate more heat during operation. This heat will accumulate inside the multiple layers and cannot be dissipated in time, affecting the service life of the circuit board and even causing the risk of burning the flexible circuit board. Utility Model Content
[0005] The purpose of the utility model is to provide a multi-layer double-sided flexible circuit board to solve the problems raised in the above background technology.
[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0007] A multi-layer double-sided flexible circuit board comprises a flexible circuit board body, the first and second ends of the flexible circuit board body are respectively fixedly connected with a first circuit connector and a second circuit connector, the interior of the flexible circuit board body is respectively provided with a protective layer, a multi-layer soft board, a hard substrate and a heat dissipation cavity from top to bottom, and a heat conduction structure is provided inside the heat dissipation cavity and extends to the outside of the flexible circuit board body.
[0008] As a preferred solution of the utility model, the heat-conducting structure includes heat-conducting blocks installed on the left and right sides of the flexible circuit board body, the heat-conducting blocks are located inside the heat dissipation cavity and are connected to a plug-in sheet, an installation notch is opened inside the plug-in sheet, and a heat-conducting sheet is fixedly installed inside the installation notch.
[0009] As a preferred solution of the utility model, the thickness of the heat conductive block is consistent with the thickness of the flexible circuit board body, and the edges of both sides of the flexible circuit board body are adhered and connected to one side of the heat conductive block by special glue.
[0010] As a preferred solution of the utility model, the outer surfaces of the upper and lower ends of the plug-in piece are coated with thermally conductive glue, and the plug-in piece is fixedly connected to the inner wall of the heat dissipation cavity by bonding with the thermally conductive glue.
[0011] As a preferred solution of the utility model, the plug-in sheet and the heat-conducting block itself can be made of a flexible metal composite material or a flexible graphite sheet.
[0012] As a preferred solution of the utility model, connecting sleeves are fixedly connected at the connecting corners of the two heat-conducting blocks, and the connecting sleeves are tightly plugged into the outer surfaces of the heat-conducting blocks.
[0013] Compared with the prior art, the beneficial effects of the utility model are:
[0014] In the utility model, a multi-layer double-sided flexible circuit board is provided. When the double-sided flexible circuit board is used, the heat accumulated inside the circuit board can be guided to the end of the heat conductive block by using the heat conductive sheet provided inside the flexible circuit board, and the heat conductive block and the air in the external environment are used for heat exchange, thereby achieving the purpose of heat conduction and heat dissipation of the double-sided flexible circuit board. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the utility model;
[0016] Figure 2 for Figure 1 Schematic diagram of the three-dimensional structure after the heat conduction structure is disassembled;
[0017] Figure 3 It is a schematic diagram of the three-dimensional structure of the heat-conducting structure of the utility model;
[0018] Figure 4 for Figure 2 Schematic diagram of the enlarged structure at point A.
[0019] In the figure: 1. flexible circuit board body; 2. first circuit connector; 3. second circuit connector; 4. protective layer; 5. top cover; 6. hard substrate; 7. heat dissipation cavity; 8. heat conduction structure; 81. heat conduction block; 82. plug-in piece; 83. installation notch; 84. heat conduction sheet; 9. connecting sleeve. DETAILED DESCRIPTION
[0020] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.
[0021] In order to facilitate the understanding of the utility model, the utility model will be described more comprehensively with reference to the relevant drawings below. Several embodiments of the utility model are given. However, the utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the utility model more thorough and comprehensive.
[0022] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.
[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.
[0024] For examples, see Figure 1-4 , the utility model provides a technical solution:
[0025] A multi-layer double-sided flexible circuit board includes a flexible circuit board body 1, the first and second ends of the flexible circuit board body 1 are respectively fixedly connected with a first circuit connector 2 and a second circuit connector 3, the interior of the flexible circuit board body 1 is respectively provided with a protective layer 4, a multi-layer soft board 5, a hard substrate 6 and a heat dissipation cavity 7 from top to bottom, and a heat conduction structure 8 is provided inside the heat dissipation cavity 7 and extends to the outside of the flexible circuit board body 1.
[0026] Specifically, the heat-conducting structure 8 includes heat-conducting blocks 81 installed on the left and right sides of the flexible circuit board body 1. The heat-conducting blocks 81 are located inside the heat dissipation cavity 7 and are connected with a plug-in sheet 82. An installation notch 83 is opened inside the plug-in sheet 82, and a heat-conducting sheet 84 is fixedly installed inside the installation notch 83. The thickness of the heat-conducting block 81 is consistent with the thickness of the flexible circuit board body 1, and the edges of the two sides of the flexible circuit board body 1 are adhered and connected to one side of the heat-conducting block 81 by special glue. The outer surfaces of the upper and lower ends of the plug-in sheet 82 are coated with heat-conducting glue, and the plug-in sheet 82 is fixedly connected to the inner wall of the heat dissipation cavity 7 by bonding with the heat-conducting glue. The plug-in sheet 82 and the heat-conducting block 81 themselves can be made of flexible metal composite materials or flexible graphite sheets. The connecting corners of the two heat-conducting blocks 81 are fixedly connected with connecting sleeves 9, and the connecting sleeves 9 and the outer surfaces of the heat-conducting blocks 81 are tightly plugged.
[0027] In this embodiment, since the plug-in sheet 82 and the heat-conducting sheet 84 on the heat-conducting structure 8 are arranged in the cavity of the double-sided flexible circuit board, during the operation of the flexible circuit board body 1, the heat accumulated inside the circuit board is guided to the end of the heat-conducting block 81 by using the heat-conducting sheet 84 arranged inside the flexible circuit board, and the heat is exchanged between the heat-conducting block 81 and the air in the external environment, thereby achieving the purpose of heat conduction and heat dissipation of the double-sided flexible circuit board.
[0028] The working process of the utility model is as follows: when using the multi-layer double-sided flexible circuit board, since the edges on both sides of the flexible circuit board body 1 are adhered and connected to one side of the heat-conducting block 81 by special glue, the upper and lower outer surfaces of the plug-in piece 82 are coated with heat-conducting glue, and the plug-in piece 82 is adhered and fixedly connected to the inner wall of the heat dissipation cavity 7 by the heat-conducting glue, so that the heat-conducting structure 8 is arranged on the side of the flexible circuit board body 1. During the operation of the flexible circuit board body 1, the heat-conducting sheet 84 arranged inside the flexible circuit board is used to guide the heat accumulated inside the circuit board to the end of the heat-conducting block 81, and the heat-conducting block 81 is used to exchange heat with the air in the external environment, so as to achieve the purpose of heat conduction and heat dissipation of the double-sided flexible circuit board.
[0029] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A multi-layer double-sided flexible circuit board, comprising a flexible circuit board body (1), characterized in that: The first and second circuit connectors (2) and (3) are fixedly connected at both ends of the flexible circuit board body (1), respectively; a protective layer (4), a multi-layer soft board (5), a hard substrate (6) and a heat dissipation cavity (7) are arranged inside the flexible circuit board body (1) from top to bottom, respectively; and a heat conduction structure (8) is arranged inside the heat dissipation cavity (7) and extends to the outside of the flexible circuit board body (1).
2. A multi-layer double-sided flexible circuit board according to claim 1, characterized in that: The heat-conducting structure (8) comprises heat-conducting blocks (81) mounted on the left and right sides of the flexible circuit board body (1); the heat-conducting blocks (81) are located inside the heat dissipation cavity (7) and are connected to a plug-in sheet (82); a mounting notch (83) is provided inside the plug-in sheet (82); and a heat-conducting sheet (84) is fixedly mounted inside the mounting notch (83).
3. A multi-layer double-sided flexible circuit board according to claim 2, characterized in that: The thickness of the heat-conducting block (81) is consistent with the thickness of the flexible circuit board body (1), and the edges on both sides of the flexible circuit board body (1) are adhered and connected to one side of the heat-conducting block (81) by special glue.
4. A multi-layer double-sided flexible circuit board according to claim 2, characterized in that: The outer surfaces of both upper and lower ends of the plug-in piece (82) are coated with heat-conducting glue, and the plug-in piece (82) is bonded and fixedly connected to the inner wall of the heat dissipation cavity (7) by the heat-conducting glue.
5. The multi-layer double-sided flexible circuit board according to claim 2, characterized in that: The plug-in sheet (82) and the heat-conducting block (81) themselves can be made of a flexible metal composite material or a flexible graphite sheet.
6. A multi-layer double-sided flexible circuit board according to claim 2, characterized in that: A connecting sleeve (9) is fixedly connected to the connecting corners of the two heat-conducting blocks (81), and the connecting sleeve (9) and the outer surface of the heat-conducting block (81) are tightly plugged.
Citation Information
Patent Citations
Double-sided flexible circuit board structure
CN219612116U