Miniature semiconductor refrigeration structure of reagent bin

Abstract

The utility model relates to the technical field of in-vitro detectors, in particular to a miniature semiconductor refrigeration structure of a reagent bin. Comprising a refrigeration box body with an opening in the front end, a refrigeration guide plate arranged on the inner wall of the bottom of the refrigeration box body, a refrigeration window formed in the lower end of the refrigeration box body, a refrigeration notch formed in the refrigeration guide plate and corresponding to the refrigeration window, a heat dissipation groove body formed in the lower end of the refrigeration box body, and refrigeration pressing blocks sequentially arranged in the heat dissipation groove body from top to bottom. The upper end of the semiconductor chilling plate is fixedly attached to the lower end of the refrigeration pressing block, the lower end of the semiconductor chilling plate is fixedly attached to the cooling fin, and the upper end of the refrigeration pressing block penetrates through the refrigeration window to be embedded in the refrigeration notch and fixed. The front end openings and the rear end openings of the cooling fan, the cooling fins and the cooling groove body correspond to one another. According to the design, the semiconductor chilling plate is adopted, the structure is simplified, and the advantages of small size and good refrigeration and heat dissipation effects are achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of in vitro detectors, in particular to a micro semiconductor refrigeration structure of a reagent bin. Background Art

[0002] With the continuous emergence of infectious diseases and the worsening aging population in today's market, the development of in vitro diagnostic instruments for disease discovery and companion diagnosis is crucial; the fully automatic fluorescent immunoassay analyzer is an instrument that can perform immunological quantitative analysis on patient sample fluids, assisting hospitals or doctors in real-time prevention and diagnosis of patient symptoms; it can test Alzheimer's disease, anemia, cardiovascular disease, congenital diseases, sex hormones, infectious diseases, metabolic function, tumor markers, therapeutic drug monitoring, thyroid and other disease syndromes.

[0003] Fully automatic fluorescent immunoassay analyzers generally include a reagent loading mechanism, which is used to store reagents. In order to ensure the activity of the reagents and prevent them from becoming invariant, the temperature of the reagent compartment must be kept at 2-8°C. Currently, the main refrigeration method is compressor refrigeration, which has the problems of high noise, large volume, and easy pollution caused by the use of Freon refrigerants. In addition, the overall refrigeration structure is relatively complex and the cost is high. Utility Model Content

[0004] In order to solve the above problems, the utility model provides a micro semiconductor refrigeration structure for a reagent bin, which adopts semiconductor refrigeration sheets to simplify the structure and has the advantages of small size, good refrigeration and heat dissipation effects, and convenient production and assembly.

[0005] The technical solution adopted by the utility model is to provide a micro-semiconductor refrigeration structure of a reagent bin, comprising a refrigeration box body with an opening at the front end, a refrigeration guide plate arranged on the inner wall of the bottom of the refrigeration box body, a refrigeration window arranged at the lower end of the refrigeration box body, a refrigeration notch arranged on the refrigeration guide plate and corresponding to the refrigeration window, a heat dissipation tank body arranged at the lower end of the refrigeration box body, a refrigeration pressing block, a semiconductor refrigeration sheet and a heat sink arranged in the heat dissipation tank body from top to bottom, and a heat dissipation fan arranged in the heat dissipation tank body, the upper end of the semiconductor refrigeration sheet is fitted and fixed to the lower end of the refrigeration pressing block, and the lower end is fitted and fixed to the heat sink, the upper end of the refrigeration pressing block passes through the refrigeration window, is embedded in the refrigeration notch and is fixed, and the heat dissipation fan corresponds to the openings at the front and rear ends of the heat sink and the heat dissipation tank body.

[0006] It also includes a sink groove arranged on the upper end surface of the cooling guide plate, a water guide groove arranged on the bottom of the sink groove, and a water leakage hole arranged in the water guide groove, and the cooling groove opening is located in the sink groove.

[0007] The water guide groove is L-shaped and is located on one side of the bottom of the sink, between the rear end and the adjacent side wall.

[0008] It also includes a positioning frame arranged at the lower end of the refrigeration box and protruding downward, a positioning groove arranged on the inner side of the upper end of the side wall of the heat dissipation groove and corresponding to the positioning frame, the lower end of the positioning frame is embedded in the positioning groove, and the refrigeration window is located in the positioning frame.

[0009] A plurality of pinholes are arranged on the upper end of the refrigeration box.

[0010] The beneficial effect of the utility model is that it provides a micro-semiconductor refrigeration structure for a reagent bin, the refrigeration box body and the heat dissipation trough body are made of thermal insulation foam material, the refrigeration guide plate and the refrigeration pressure block are made of metal material with good low-temperature conduction effect, and semiconductor refrigeration sheets are used for refrigeration. The upper end of the semiconductor refrigeration sheet conducts the low temperature into the refrigeration box body through the refrigeration pressure block, and the heat at the lower end of the semiconductor refrigeration sheet is conducted to the heat sink. The heat dissipation fan improves the air flow in the heat dissipation trough body, takes away the heat from the heat sink, and improves the heat dissipation effect. The design simplifies and miniaturizes the structure of the refrigeration mechanism, reduces the occupied space, avoids noise, and at the same time improves the refrigeration and heat dissipation effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a structural schematic diagram of the utility model;

[0012] Figure 2 It is a structural schematic diagram of the heat dissipation tank body of the utility model;

[0013] Figure 3 It is a structural schematic diagram of the semiconductor refrigeration sheet of the utility model;

[0014] Figure 4 It is a structural schematic diagram of the refrigeration guide plate of the utility model;

[0015] Figure 5 It is a structural schematic diagram of a positioning frame of the utility model.

[0016] In the attached drawings, 1, refrigeration box body, 2, refrigeration guide plate, 3, heat dissipation trough body, 4, refrigeration pressing block, 5, semiconductor refrigeration sheet, 6, heat sink, 7, cooling fan, 8, sink, 9, water guide trough, 10, positioning frame, 11, positioning groove, 12, pinhole. DETAILED DESCRIPTION

[0017] like Figure 1-5As shown, the utility model provides a micro semiconductor refrigeration structure for a reagent chamber, comprising a refrigeration box body 1 with an opening at the front end, a refrigeration guide plate 2 arranged on the inner wall of the bottom of the refrigeration box body 1, a refrigeration window arranged at the lower end of the refrigeration box body 1, a refrigeration notch arranged on the refrigeration guide plate 2 and corresponding to the refrigeration window, a heat dissipation tank body 3 arranged at the lower end of the refrigeration box body 1, a refrigeration pressing block 4, a semiconductor refrigeration sheet 5 and a heat sink 6 arranged in the heat dissipation tank body 3 from top to bottom, and a heat dissipation fan 7 arranged in the heat dissipation tank body 3, the upper end of the semiconductor refrigeration sheet 5 is fitted and fixed to the lower end of the refrigeration pressing block 4, and the lower end is fitted and fixed to the heat sink 6, the upper end of the refrigeration pressing block 4 passes through the refrigeration window, is embedded in the refrigeration notch and is fixed, and the front and rear end openings of the heat dissipation fan 7, the heat sink 6, and the heat dissipation tank body 3 correspond to each other.

[0018] The front end of the refrigeration box 1 is open, which is convenient for placing the required reagents. The refrigeration box 1 and the heat dissipation tank 3 are both made of thermal insulation foam material for thermal insulation. The refrigeration guide plate 2 and the refrigeration pressure block 4 are made of metal material with good low-temperature conduction effect. After the semiconductor refrigeration plate 5 is energized, the upper end is cooled and the lower end is heated. The upper end of the semiconductor refrigeration plate 5 conducts the low temperature to the refrigeration box 1 through the refrigeration pressure block 4, and because the refrigeration pressure block 4 is embedded in and fixed in the refrigeration notch of the refrigeration guide plate 2 and is tightly pressed against the refrigeration guide plate 2, the low temperature will be conducted to the refrigeration guide plate 2, increasing the low-temperature conduction area and improving the refrigeration effect. The heat at the lower end of the semiconductor refrigeration plate 5 is conducted to the heat sink 6, and the heat dissipation fan 7 increases the air flow in the heat dissipation tank 3, takes away the heat of the heat sink 6, and improves the heat dissipation effect. This design simplifies and miniaturizes the structure of the refrigeration mechanism, reduces the occupied space, avoids noise, and at the same time improves the refrigeration and heat dissipation effects.

[0019] like Figure 3 As shown, it also includes a sink 8 arranged on the upper end surface of the cooling guide plate 2, a water guide groove 9 arranged on the bottom of the sink 8, and a water leakage hole arranged in the water guide groove 9, and the cooling groove opening is located in the sink 8.

[0020] The trough 8 can gather the cold air and condensed water in the refrigeration box 1, reducing the loss of cold air when taking and placing reagents. After the condensed water is generated, it is guided by the water guide groove 9 and discharged from the leakage hole, effectively avoiding water accumulation, which is very convenient to use.

[0021] like Figure 3 As shown, the water guide groove 9 is L-shaped and is located on one side of the bottom of the trough 8 and between the rear end and the adjacent side wall.

[0022] The position of the water guide groove 9 is limited. The long groove on one side of the bottom of the trough 8 and the rear end long groove on the bottom of the trough 8 are connected at adjacent positions to form an L-shaped water guide groove 9. The bottom depth of the water guide groove 9 at the head and tail ends gradually increases to form a slope, which is more convenient for guiding and gathering condensed water.

[0023] like Figure 3 and Figure 5 As shown, it also includes a positioning frame 10 arranged at the lower end of the refrigeration box body 1 and protruding downward, and a positioning groove 11 arranged on the inner side of the upper end of the side wall of the heat dissipation groove body 3 and corresponding to the positioning frame 10, the lower end of the positioning frame 10 is embedded in the positioning groove 11, and the refrigeration window is located in the positioning frame 10.

[0024] The positioning frame 10 and the positioning groove 11 play a role of positioning during assembly, making production and assembly more convenient, and play a role of enclosure for the refrigeration pressing block 4 to prevent cold air from flowing downward.

[0025] like Figure 1 As shown, a plurality of pinholes 12 are provided at the upper end of the refrigeration box body 1 .

[0026] The needle hole 12 is for facilitating the insertion of a reagent needle into a reagent tube placed in the refrigeration box 1 to extract reagent.

Claims

1. A micro semiconductor refrigeration structure for a reagent chamber, characterized in that: The invention comprises a refrigeration box (1) with a front opening, a refrigeration guide plate (2) arranged on the inner wall of the bottom of the refrigeration box (1), a refrigeration window arranged at the lower end of the refrigeration box (1), a refrigeration notch arranged on the refrigeration guide plate (2) and corresponding to the refrigeration window, a heat dissipation tank (3) arranged at the lower end of the refrigeration box (1), a refrigeration pressing block (4), a semiconductor refrigeration plate (5) and a heat sink (6) arranged in sequence from top to bottom in the heat dissipation tank (3), and a heat dissipation fan (7) arranged in the heat dissipation tank (3), wherein the upper end of the semiconductor refrigeration plate (5) is fitted and fixed to the lower end of the refrigeration pressing block (4), and the lower end is fitted and fixed to the heat sink (6), the upper end of the refrigeration pressing block (4) passes through the refrigeration window, is embedded in the refrigeration notch and is fixed, and the heat dissipation fan (7) corresponds to the heat sink (6) and the openings at the front and rear ends of the heat dissipation tank (3).

2. A micro semiconductor refrigeration structure for a reagent chamber according to claim 1, characterized in that: It also includes a trough (8) arranged on the upper end surface of the cooling guide plate (2), a water guide groove (9) arranged on the bottom of the trough (8), and a water leakage hole arranged in the water guide groove (9), wherein the cooling groove opening is located in the trough (8).

3. A micro semiconductor refrigeration structure for a reagent chamber according to claim 2, characterized in that: The water guide groove (9) is L-shaped and is located on one side of the bottom of the trough (8) and between the rear end and the adjacent side wall.

4. The micro semiconductor refrigeration structure of a reagent chamber according to claim 1, characterized in that: It also includes a positioning frame (10) arranged at the lower end of the refrigeration box body (1) and protruding downward, and a positioning groove (11) arranged on the inner side of the upper end of the side wall of the heat dissipation slot body (3) and corresponding to the positioning frame (10), the lower end of the positioning frame (10) is embedded in the positioning groove (11), and the refrigeration window is located in the positioning frame (10).

5. The micro semiconductor refrigeration structure of a reagent chamber according to claim 1, characterized in that: The upper end of the refrigeration box (1) is provided with a plurality of pinholes (12).

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