Semiconductor automation equipment

Abstract

The utility model belongs to the technical field of semiconductor processing equipment, and particularly relates to semiconductor automation equipment which comprises a lower support, an upper support, two conveying assemblies, a first transmission assembly, a first U-shaped plate, a second U-shaped plate, a hollow cylinder, a plurality of hollow plates, a hollow shaft, a sealing column, a supporting shaft, a pressing assembly, a second transmission assembly and a driving assembly. The lower support is fixedly installed on the upper support, the two conveying assemblies are arranged on the upper support and the lower support respectively, the two conveying assemblies are connected through the first transmission assembly, and the second U-shaped plate and the first U-shaped plate are both fixedly installed between the upper support and the lower support and located on the left side of the upper support. The device is reasonable in design, can realize the automatic installation operation of a semiconductor to be installed, reduces the overall cost of equipment, has good economical efficiency, has a good linkage effect, realizes the driving of different positions without installing a plurality of electric appliance driving elements, and is convenient to use. And the working efficiency of semiconductor processing can be effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing equipment, in particular to semiconductor automation equipment. Background Art

[0002] With the rapid development of the semiconductor industry, the requirements for semiconductor processing efficiency and quality are getting higher and higher. Semiconductor automation equipment is of great significance in improving production efficiency, reducing production costs, and improving product quality. However, existing semiconductor automation equipment has certain limitations, such as complex and precise equipment structure, high cost, and the need to install multiple electrical drive components to achieve drive at different positions, and poor overall linkage. Therefore, it is necessary to develop a semiconductor automation equipment with the characteristics of high efficiency, easy operation, and easy maintenance.

[0003] The information disclosed in this background technology section is only intended to increase the understanding of the overall background of the present invention, and should not be regarded as acknowledging or suggesting in any form that the information constitutes the prior art already known to a person skilled in the art. Utility Model Content

[0004] The purpose of the utility model is to solve the shortcomings mentioned in the above background technology and to propose a semiconductor automation equipment.

[0005] The above technical objectives of the utility model are achieved through the following technical solutions: a semiconductor automation device, comprising a lower bracket, an upper bracket, two conveying components, a transmission component 1, a U-shaped plate 1, a U-shaped plate 2, a hollow cylinder, a plurality of hollow plates, a hollow shaft, a sealing column, a support shaft, a clamping component, a transmission component 2 and a drive component;

[0006] The lower bracket is fixedly mounted on the upper bracket, and the two conveying assemblies are respectively arranged on the upper bracket and the lower bracket, and the two conveying assemblies are connected by a transmission assembly 1, and the U-shaped plate 2 and the U-shaped plate 1 are both fixedly mounted on the lower space and located on the left side of the upper bracket, and the hollow shaft is rotatably mounted on the U-shaped plate 1, and an exhaust fan is fixedly mounted on the rear side of the U-shaped plate 1, and an air inlet of the exhaust fan is sealingly and rotatably connected to the rear end of the hollow shaft, and a plurality of hollow plates are connected to the hollow shaft and are radially fixedly mounted on the hollow shaft, the hollow cylinder is fixedly mounted on a plurality of hollow plates and arranged coaxially with the hollow shaft, a plurality of independent cavities are arranged in the hollow cylinder, and the number of cavities is the same as that of the hollow plates and is connected to the corresponding hollow plates, a sealing column is sealingly and rotatably mounted in the hollow shaft, the support shaft is axially fixedly mounted on the sealing column and fixedly connected to the U-shaped plate 1, the clamping assembly is arranged on the U-shaped plate 2, and the conveying assembly, the hollow shaft and the clamping assembly on the upper bracket are connected by a transmission assembly 2, and the driving assembly is arranged on the front side of the U-shaped plate 1 and connected to the hollow shaft;

[0007] The hollow cylinder is arranged in a regular polygonal shape and corresponds to the number of the hollow plates, and a breathable plate connected to the corresponding cavity is fixedly installed on the outer circumference of the hollow cylinder;

[0008] The longitudinal section of the sealing column is arranged in a 1 / 5 circle.

[0009] Preferably, the conveying assembly includes two lower rotating shafts, two upper rotating shafts, four conveying rollers and two conveying belts. The two lower rotating shafts and the two upper rotating shafts are rotatably installed between the lower bracket and the upper bracket respectively. Conveying rollers are fixedly sleeved on the two upper rotating shafts and the two lower rotating shafts. The two conveying rollers located on the same horizontal plane are transmission-connected to the same conveying belt.

[0010] Preferably, the transmission assembly 1 includes two pulleys 1 and a belt 1, the lower rotating shaft located on the right side and the upper rotating shaft located on the right side are both fixedly sleeved with pulleys 1, and the two pulleys 1 are transmission-connected with the same belt 1.

[0011] Preferably, the clamping assembly includes a tooth plate, a pressure plate and multiple damping springs, a tooth plate is vertically slidably installed on the U-shaped plate 2, a pressure plate is fixedly installed on the bottom end of the tooth plate, and multiple damping springs are fixedly installed on the top side of the tooth plate and the top inner wall of the U-shaped plate 2.

[0012] Preferably, the transmission component 2 includes three pulleys 2, a left rotating shaft, a toothless gear and a belt 2. The left rotating shaft is rotatably installed on the U-shaped plate 2, and a toothless gear is fixedly sleeved on the left rotating shaft. The toothless gear is adapted to the toothed plate. The hollow shaft, the left rotating shaft and the upper rotating shaft on the left side are all fixedly sleeved with pulleys 2, and the three pulleys 2 are connected to the same belt 2 for transmission.

[0013] Preferably, the driving assembly includes a driving motor, a driving gear and a driven gear. The driving motor is fixedly installed on the front side of the U-shaped plate. The driving gear is fixedly sleeved on the output shaft of the driving motor, and the driven gear is fixedly sleeved on the hollow shaft. The driving gear is meshed with the driven gear.

[0014] Preferably, an L-shaped plate is fixedly mounted on the front side of the U-shaped plate 1, and the front end of the support shaft extends to the front side of the hollow shaft and is fixedly connected to the L-shaped plate.

[0015] Preferably, a support plate is fixedly mounted on the lower bracket in a horizontal state, and the top side of the support plate is in contact with the conveyor belt below.

[0016] The beneficial effects of the utility model are as follows: through the setting of the conveying component and the transmission component, the conveying operation of two semiconductor components that need to be pressed and installed can be carried out synchronously, and at the same time, the driving component can provide drive for the hollow shaft and control the rotation of the hollow cylinder, and through the cooperation of the exhaust fan, hollow plate, sealing column and support shaft, the semiconductor component to be installed conveyed by the upper conveyor belt can be stably transferred to the top of the semiconductor component to be installed conveyed on the lower conveyor belt and keep it in a docking state, and the clamping component can quickly press and install two semiconductor components that are already in a docking installation state, thereby completing the automated installation operation of the semiconductor components.

[0017] By cooperating with the transmission component one and the transmission component two, the driving of the conveying component one and the conveying component two can be realized when the driving component controls the rotation of the hollow shaft, and the linkage of the clamping component can be realized at the same time. There is no need to set up multiple motors for driving, which greatly improves the linkage synchronization of the semiconductor automation equipment, not only effectively reduces the cost of the semiconductor automation equipment, but also can effectively improve the working efficiency of the semiconductor automation equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 This is a three-dimensional structural diagram of a semiconductor automation device proposed by the utility model;

[0020] Figure 2 This is a schematic cross-sectional view of a semiconductor automation device proposed by the utility model;

[0021] Figure 3 This is a partial three-dimensional structural diagram of a semiconductor automation device proposed by the utility model;

[0022] Figure 4 It is a three-dimensional structural schematic diagram of a U-shaped plate 2, a clamping assembly, a left rotating shaft, a pulley 2 and a toothless gear part in a semiconductor automation device proposed by the utility model;

[0023] Figure 5 This is a three-dimensional structural schematic diagram of the support shaft and sealing column part proposed by the utility model.

[0024] In the figure: 1. lower bracket; 11. upper bracket; 12. support plate; 2. lower rotating shaft; 21. upper rotating shaft; 22. conveying roller; 23. conveying belt; 24. pulley one; 25. belt one; 3. U-shaped plate one; 31. hollow shaft; 311. supporting shaft; 312. sealing column; 32. hollow plate; 33. hollow cylinder; 34. exhaust fan; 4. U-shaped plate two; 41. tooth plate; 42. pressure plate; 43. damping spring; 5. left rotating shaft; 51. toothless gear; 52. pulley two; 53. belt two; 6. driving motor; 61. driving gear; 62. driven gear. DETAILED DESCRIPTION

[0025] The technical solution of the utility model will be described clearly and completely below in conjunction with specific embodiments. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] Reference Figure 1-5A semiconductor automation device comprises a lower bracket 1, an upper bracket 11, a U-shaped plate 13, a U-shaped plate 24, a hollow cylinder 33, a plurality of hollow plates 32, a hollow shaft 31, a sealing column 312, and a support shaft 311. The lower bracket 1 is fixedly mounted on the upper bracket 11. Two lower rotating shafts 2 and two upper rotating shafts 21 are rotatably mounted between the lower bracket 1 and the upper bracket. Conveying rollers 22 are fixedly sleeved on the two upper rotating shafts 21 and the two lower rotating shafts 2. The two conveying rollers 22 located on the same horizontal plane are connected to the same conveying belt 23 in a transmission manner. The semiconductor components to be installed can be conveyed respectively by the two conveying belts 23. The lower rotating shaft 2 located on the right side and the upper rotating shaft 21 located on the right side are fixedly sleeved with pulleys 24. The two pulleys 24 are The transmission connection is connected with the same belt 25, which can ensure that the two conveyor belts 23 work synchronously. The U-shaped plate 24 and the U-shaped plate 3 are fixedly installed on the lower space and are located on the left side of the upper bracket 11. The hollow shaft 31 is rotatably installed on the U-shaped plate 3. An exhaust fan 34 is fixedly installed on the rear side of the U-shaped plate 3, and the air inlet of the exhaust fan 34 is sealed and rotatably connected to the rear end of the hollow shaft 31. Multiple hollow plates 32 are connected to the hollow shaft 31 and are radially fixedly installed on the hollow shaft 31. The hollow cylinder 33 is fixedly installed on multiple hollow plates 32 and is coaxially arranged with the hollow shaft 31. Multiple independent cavities are arranged in the hollow cylinder 33. The number of cavities is the same as that of the hollow plate 32 and is connected to the corresponding hollow plate 32. A sealing column is sealed and rotatably installed in the hollow shaft 31. 312, a support shaft 311 is axially fixedly installed on the sealing column 312 and fixedly connected to the U-shaped plate 1 3, a toothed plate 41 is vertically slidably installed on the U-shaped plate 2 4, a pressure plate 42 is fixedly installed on the bottom end of the toothed plate 41, and a plurality of damping springs 43 are fixedly installed on the top side of the toothed plate 41 and the top inner wall of the U-shaped plate 2 4, which can press two semiconductor components to be installed in a docking state on the conveyor belt 23 below when the toothed plate 41 controls the pressure plate 42 to move downward, a left rotating shaft 5 is rotatably installed on the U-shaped plate 2 4, a toothless gear 51 is fixedly sleeved on the left rotating shaft 5, and the toothless gear 51 is adapted to the toothed plate 41, and a pulley 2 52 is fixedly sleeved on the hollow shaft 31, the left rotating shaft 5 and the upper rotating shaft 21 on the left side. The three pulleys 2 52 are uploaded The U-shaped plate 1 is dynamically connected with the same belt 2 53, which can realize the transmission of the hollow shaft 31, the left upper rotating shaft 21 and the left rotating shaft 5. A driving motor 6 is fixedly installed on the front side of the U-shaped plate 1 3. A driving gear 61 is fixedly sleeved on the output shaft of the driving motor 6. A driven gear 62 is fixedly sleeved on the hollow shaft 31. The driving gear 61 is meshed with the driven gear 62, and can provide drive for the hollow shaft 31. The hollow cylinder 33 is arranged in a regular polygon and corresponds to the number of hollow plates 32, and a breathable plate connected to the corresponding cavity is fixedly installed on the outer circumference of the hollow cylinder 33, which can ensure that the semiconductor component transported on the upper conveyor belt 23 is adsorbed by the mounting cylinder 33 and placed on the semiconductor component transported on the lower conveyor belt 23 as the mounting cylinder 33 rotates and realizes docking.The longitudinal section of the sealing column 312 is set in a 1 / 5 circle, which can seal the hollow plate 32 in the fan-shaped area surrounded by the axis of the hollow shaft 3, the upper left conveying roller 22 and the vertical plane where the hollow shaft 3 is located, so that the semiconductor component transported by the installation cylinder 33 can be released when it moves to the upper part of the corresponding semiconductor component to be installed on the lower conveying belt 23, so as to complete the preliminary docking operation of the semiconductor component.

[0027] In this embodiment, in order to ensure that the sealing column 312 does not rotate with the rotation of the hollow shaft 31, an L-shaped plate is fixedly installed on the front side of the U-shaped plate 3, and the front end of the support shaft 311 extends to the front side of the hollow shaft 31 and is fixedly connected to the L-shaped plate, so that when the semiconductor components to be installed on the upper conveyor belt 23 arrive at the position of the hollow cylinder 33, they can be adsorbed on the outer peripheral surface of the hollow cylinder 33 with the cooperation of the exhaust fan 34, the hollow shaft 31 and the hollow plate 32 and transferred to the position just above the semiconductor components transported on the lower conveyor belt 23.

[0028] In this embodiment, in order to provide stable support for the conveyor belt 23 below, a support plate 12 is fixedly installed horizontally on the lower bracket 1, and the top side of the support plate 12 is in contact with the conveyor belt 23 below, thereby ensuring stable pressing operation of the semiconductor components through the pressing plate 42.

[0029] The circuits, electronic components and module structures involved all adopt existing technologies, which can be fully implemented by those skilled in the art. Needless to say, the content protected by this application does not involve improvements to software, circuits and methods. At the same time, the components described in the drawings of this application, such as toothless gears, are only for illustration, and the specific number of missing teeth will be determined by technical personnel after actual measurement.

[0030] Working principle: When in use, first turn on the power supply, start the drive motor 6 and the exhaust fan 34, the drive motor 6 controls the rotation of the hollow shaft 31 through the drive gear 61 and the driven gear 62, and at the same time, with the cooperation of the pulley 2 52 and the belt 2 53, the left rotating shaft 5 and the left upper rotating shaft 21 can be controlled to rotate, and with the cooperation of the pulley 1 24 and the belt 1 25, the lower conveyor belt 23 and the upper conveyor belt 23 can be kept in a conveying state, the exhaust fan 34 extracts the air in the corresponding cavity in the hollow cylinder 33 through the hollow shaft 31 and the hollow plate 32, and as the upper conveyor belt 23 conveys the semiconductor component, it can be adsorbed on the installation cylinder with the cooperation of the installation cylinder and the breathable plate and move with the installation cylinder. Since the upper and lower conveyor belts 23 are used to respectively convey the semiconductor components that need to be pressed and installed, with the rotation of the hollow shaft 31, with the cooperation of the sealing column 312, the L-shaped plate and the support shaft 311, the axis of the hollow shaft 31 and the upper left can be always closed. The hollow plate 32 in the sector-shaped area enclosed by the vertical plane where the conveying roller 22 and the hollow shaft 31 are located is connected to the position of the hollow plate 32 and the hollow shaft 31 (the closed area does not include the air intake of the hollow plate 32 in the vertical plane where the hollow shaft 31 is located), so as to prevent the air in the corresponding cavity in the hollow cylinder 33 in this area from being extracted, so that the semiconductor component adsorbed on the mounting cylinder is released when it moves to the lowest position of the mounting cylinder and is directly above the semiconductor component transported by the lower conveyor belt 23, so that the semiconductor component transported by the upper conveyor belt 23 and the semiconductor component transported by the lower conveyor belt 23 can be preliminarily docked, and with the continuous transportation of the lower conveyor belt 23, the semiconductor component in the preliminary docking state can pass under the pressure plate 42, and the left rotating shaft 5 controls the toothed plate 41 through the toothless gear 51 to make the pressure plate 42 press it downward, and after the pressing is completed, the pressure plate 42 is reset upward under the action of the damping spring 43 as the left rotating shaft 5 continues to rotate.

[0031] The semiconductor automation equipment provided by the utility model is introduced in detail above. The principle and implementation method of the utility model are explained in this article using specific embodiments. The description of the above embodiments is only used to help understand the method and core idea of ​​the utility model. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the utility model, the utility model can also be improved and modified, and these improvements and modifications also fall within the scope of protection of the claims of the utility model.

Claims

1. A semiconductor automation device, characterized in that: It comprises a lower bracket (1), an upper bracket (11), two conveying components, a transmission component 1, a U-shaped plate 1 (3), a U-shaped plate 2 (4), a hollow cylinder (33), a plurality of hollow plates (32), a hollow shaft (31), a sealing column (312), a supporting shaft (311), a pressing component, a transmission component 2 and a driving component; The lower bracket (1) is fixedly mounted on the upper bracket (11), and the two conveying assemblies are respectively arranged on the upper bracket (11) and the lower bracket (1), and the two conveying assemblies are connected via a transmission assembly (1). The U-shaped plate (2) (4) and the U-shaped plate (1) (3) are both fixedly mounted on the lower bracket and located on the left side of the upper bracket (11). The hollow shaft (31) is rotatably mounted on the U-shaped plate (3). An exhaust fan (34) is fixedly mounted on the rear side of the U-shaped plate (3), and an air inlet of the exhaust fan (34) is rotatably connected to the rear end of the hollow shaft (31). A plurality of hollow plates (32) are all connected to the hollow shaft (31) and are radially fixedly mounted on the hollow shaft (31). The hollow cylinder (33) is fixedly mounted on the hollow shaft (31). The hollow cylinder (33) is fixedly mounted on a plurality of hollow plates (32) and is coaxially arranged with the hollow shaft (31); a plurality of independent cavities are arranged in the hollow cylinder (33); the number of the cavities is the same as that of the hollow plates (32) and is in communication with the corresponding hollow plates (32); a sealing column (312) is sealed and rotatably mounted in the hollow shaft (31); the support shaft (311) is axially fixedly mounted on the sealing column (312) and is fixedly connected to the U-shaped plate one (3); the clamping assembly is arranged on the U-shaped plate two (4); the conveying assembly, the hollow shaft (31) and the clamping assembly on the upper bracket (11) are connected via a transmission assembly two; the driving assembly is arranged on the front side of the U-shaped plate one (3) and is connected to the hollow shaft (31); The hollow cylinder (33) is arranged in a regular polygonal shape and corresponds to the number of the hollow plates (32), and a breathable plate connected to the corresponding cavity is fixedly mounted on the outer peripheral surface of the hollow cylinder (33); The longitudinal section of the sealing column (312) is arranged in the shape of a 1 / 5 circle.

2. A semiconductor automation device according to claim 1, characterized in that: The conveying assembly comprises two lower rotating shafts (2), two upper rotating shafts (21), four conveying rollers (22) and two conveying belts (23); the two lower rotating shafts (2) and the two upper rotating shafts (21) are rotatably mounted between the lower bracket (1) and the upper bracket; the two upper rotating shafts (21) and the two lower rotating shafts (2) are both fixedly sleeved with conveying rollers (22); and the two conveying rollers (22) located on the same horizontal plane are drivingly connected to the same conveying belt (23).

3. A semiconductor automation device according to claim 2, characterized in that: The transmission assembly 1 comprises two pulleys 1 (24) and a belt 1 (25). The lower rotating shaft (2) located on the right side and the upper rotating shaft (21) located on the right side are both fixedly sleeved with pulleys 1 (24), and the two pulleys 1 (24) are transmission-connected with the same belt 1 (25).

4. The semiconductor automation equipment according to claim 1, characterized in that: The clamping assembly comprises a tooth plate (41), a pressure plate (42) and a plurality of damping springs (43); the tooth plate (41) is vertically slidably mounted on the U-shaped plate (4), the pressure plate (42) is fixedly mounted on the bottom end of the tooth plate (41), and a plurality of damping springs (43) are fixedly mounted on the top side of the tooth plate (41) and the top inner wall of the U-shaped plate (4).

5. A semiconductor automation device according to claim 4, characterized in that: The transmission assembly 2 comprises three pulleys 2 (52), a left rotating shaft (5), a toothless gear (51) and a belt 2 (53). The left rotating shaft (5) is rotatably mounted on the U-shaped plate 2 (4). The toothless gear (51) is fixedly sleeved on the left rotating shaft (5). The toothless gear (51) is matched with the tooth plate (41). The hollow shaft (31), the left rotating shaft (5) and the upper rotating shaft (21) located on the left are all fixedly sleeved with pulleys 2 (52). The three pulleys 2 (52) are connected to the same belt 2 (53) for transmission.

6. The semiconductor automation equipment according to claim 1, characterized in that: The driving assembly comprises a driving motor (6), a driving gear (61) and a driven gear (62); the driving motor (6) is fixedly mounted on the front side of the U-shaped plate (3); the driving gear (61) is fixedly sleeved on the output shaft of the driving motor (6); the driven gear (62) is fixedly sleeved on the hollow shaft (31); and the driving gear (61) is meshed with the driven gear (62).

7. The semiconductor automation equipment according to claim 1, characterized in that: An L-shaped plate is fixedly mounted on the front side of the U-shaped plate 1 (3), and the front end of the support shaft (311) extends to the front side of the hollow shaft (31) and is fixedly connected to the L-shaped plate.

8. The semiconductor automation equipment according to claim 2, characterized in that: A support plate (12) is fixedly mounted on the lower bracket (1) in a horizontal shape, and the top side of the support plate (12) is in contact with the conveyor belt (23) below.

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