Durable metal box dam ceramic packaging substrate

Abstract

The utility model discloses a durable ceramic packaging substrate with a metal box dam. The durable ceramic packaging substrate comprises a ceramic body and the metal box dam, the upper surface of the ceramic body is concavely provided with an accommodating groove for embedding an electronic device, the inner wall of the accommodating groove is coated to form a heat dissipation layer, the periphery of the accommodating groove is provided with an upper circuit layer, the lower surface of the ceramic body is provided with a heat dissipation groove, the heat dissipation groove is filled with a heat dissipation part, and the periphery of the heat dissipation groove is provided with a lower circuit layer; the metal box dam is arranged on the upper surface of the ceramic body. The grooves are formed in the two sides of the ceramic body, the buffering pieces are arranged in the grooves, the ceramic substrate is not prone to being damaged due to collision, the anticorrosive layer and the heat insulation layer are coated on the surface of the metal box dam in a matched mode, the anticorrosive layer prevents the metal box dam from being corroded by acid and alkali, and the heat insulation layer can prevent the anticorrosive layer from being heated for a long time to be aged due to heating of an electronic device. The anti-corrosion layer is prevented from losing the anti-corrosion function, and the service life of the ceramic substrate is effectively prolonged.

Description

Technical Field

[0001] The utility model relates to the field of ceramic substrate technology, in particular to a durable metal dam ceramic packaging substrate. Background Art

[0002] Ceramic substrate refers to a special process board in which copper foil is directly bonded to the surface of alumina or aluminum nitride ceramic substrate at high temperature. The ultra-thin composite substrate has excellent electrical insulation performance, high thermal conductivity, excellent soft solderability and high adhesion strength, and can be etched with various patterns like PCB boards, and has a large current carrying capacity. Therefore, ceramic substrates have become the basic materials for high-power power electronic circuit structure technology and interconnection technology. Ceramic substrates generally have a structure including a ceramic base layer and a metal dam, and a packaging cavity is formed by the metal dam. After the UV chip is packaged, a transparent cover is set to seal the opening of the packaging cavity.

[0003] The use environment of ceramic substrates is relatively complex, and the metal dam is easily corroded by acids and alkalis in complex environments, which makes the metal dam easily damaged, reducing the service life of the ceramic substrate; at the same time, the ceramic substrate is easily hit during transportation and handling, resulting in damage to the ceramic substrate. Therefore, it is necessary to improve the existing ceramic substrate. Utility Model Content

[0004] In view of this, the present invention aims to address the deficiencies in the prior art, and its main purpose is to provide a durable metal dam ceramic packaging substrate, which can effectively solve the problems that the existing ceramic substrates are easily damaged by collisions and the metal dams of the ceramic substrates are corroded, thereby reducing the service life of the ceramic substrates.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A durable metal dam ceramic packaging substrate comprises a ceramic body and a metal dam;

[0007] The upper surface of the ceramic body is concavely provided with a receiving groove for embedding the electronic device, the inner wall of the receiving groove is coated with a heat dissipation layer, the periphery of the receiving groove is provided with an upper circuit layer, the lower surface of the ceramic body is provided with a heat dissipation groove, the heat dissipation groove is communicated with the receiving groove, a heat dissipation portion is filled in the heat dissipation groove, the periphery of the heat dissipation groove is provided with a lower circuit layer, and a through hole is formed through the surface of the ceramic body, a conducting column is embedded in the through hole, one end of the conducting column is conductively connected to the upper circuit layer, and the other end of the conducting column is conductively connected to the lower circuit layer;

[0008] The metal dam is arranged on the upper surface of the ceramic body and is located at the periphery of the upper circuit layer, and the metal dam is surrounded to form a packaging cavity;

[0009] Grooves are provided on both sides of the ceramic body, and buffer pieces are provided in the grooves; the surface of the metal dam is coated with an anti-corrosion layer, and the surface of the anti-corrosion layer is coated with a heat insulation layer.

[0010] As a preferred solution, the heat dissipation layer and the heat dissipation part are both made of graphene.

[0011] As a preferred solution, the ceramic body is provided with an annular waterproof groove, and the annular waterproof groove is located at the periphery of the upper circuit layer.

[0012] As a preferred solution, there are two annular waterproof grooves, one of which is located outside the other annular waterproof groove, so as to further improve the waterproof capability.

[0013] As a preferred solution, the buffer is made of rubber material, the buffer has a buffer air cavity inside, and a buffer bracket is arranged inside the buffer air cavity.

[0014] As a preferred solution, the outer end of the buffer extends outward from the groove, and the lower end surface of the buffer is located below the surface of the lower circuit layer. This design is more conducive to protecting the ceramic substrate.

[0015] As a preferred solution, the anti-corrosion layer is made of fluorinated polypropylene resin.

[0016] As a preferred solution, the heat insulation layer is made of thermoplastic polyurethane elastomer rubber material.

[0017] As a preferred solution, the outer side surface of the metal dam is an inclined surface. When the metal dam is impacted, the impact force is affected by the inclined surface, so that the impact force is dispersed along the inclined direction of the inclined surface.

[0018] Compared with the prior art, the utility model has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical solution that:

[0019] By opening grooves on both sides of the ceramic body and arranging the buffer parts in the grooves, the ceramic substrate is not easily damaged by collision. The surface of the metal dam is coated with an anti-corrosion layer and a heat-insulating layer. The anti-corrosion layer prevents the metal dam from being corroded by acids and alkalis, and the heat-insulating layer can prevent the anti-corrosion layer from aging due to long-term heat caused by the heat of electronic devices, and prevents the anti-corrosion layer from losing its anti-corrosion function, thereby effectively extending the service life of the ceramic substrate.

[0020] In order to more clearly illustrate the structural features and functions of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments: BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a cross-sectional view of a preferred embodiment of the utility model.

[0022] Description of the accompanying drawings:

[0023] 10. Ceramic body 101. Receiving groove

[0024] 102, heat dissipation slot 103, through hole

[0025] 104, groove 105, annular waterproof groove

[0026] 11. Heat dissipation layer 12. Front pad

[0027] 13. Heat dissipation unit 14. Back side pad

[0028] 15. Conductive column 20. Metal dam

[0029] 201, packaging cavity 21, anti-corrosion layer

[0030] 22. Insulation layer 30. Buffer

[0031] 31. Buffer air cavity 32. Buffer bracket. DETAILED DESCRIPTION

[0032] Please refer to Figure 1 As shown, it shows the specific structure of a preferred embodiment of the utility model, including a ceramic body 10 and a metal dam 20.

[0033] The upper surface of the ceramic body 10 is concavely provided with a receiving groove 101 for embedding electronic devices, the inner wall of the receiving groove 101 is coated with a heat dissipation layer 11, the periphery of the receiving groove 101 is provided with an upper circuit layer 12, the lower surface of the ceramic body 10 is provided with a heat dissipation groove 102, the heat dissipation groove 102 is communicated with the receiving groove 101, the heat dissipation portion 13 is filled in the heat dissipation groove 102, the periphery of the heat dissipation groove 13 is provided with a lower circuit layer 14, and a through hole 103 is formed through the surface of the ceramic body 10, a conductive column 15 is embedded in the through hole 103, one end of the conductive column 15 is conductively connected to the upper circuit layer 12, and the other end of the conductive column 15 is conductively connected to the lower circuit layer 14, and grooves 104 are provided on both sides of the ceramic body 10. A buffer member 30 is provided in the groove 104; in the present embodiment, the heat dissipation layer 11 and the heat dissipation portion 13 are both made of graphene; and the ceramic body 10 is provided with an annular waterproof groove 105, which is located at the periphery of the upper circuit layer 12. Specifically, there are two annular waterproof grooves 105, one of which is located at the periphery of the other annular waterproof groove 105, so as to further improve the waterproof capability; in addition, the buffer member 30 is made of rubber material, and has a buffer air cavity 31 inside the buffer member 30, and a buffer bracket 32 ​​is provided inside the buffer air cavity 31; the outer end of the buffer member 30 extends outward from the groove 104, and the lower end surface of the buffer member 30 is located below the surface of the lower circuit layer 14. This design is more conducive to the protection of the ceramic substrate.

[0034] The metal dam 20 is arranged on the upper surface of the ceramic body 10 and is located at the periphery of the upper circuit layer 12, and the metal dam 20 is structured to form a packaging cavity 201. The surface of the metal dam 20 is coated with an anti-corrosion layer 21, and the surface of the anti-corrosion layer 21 is coated with a thermal insulation layer 22. In the present embodiment, the anti-corrosion layer 21 is made of fluorinated polypropylene resin, and the thermal insulation layer 22 is made of poly-thermoplastic polyurethane elastomer rubber. Moreover, the outer side surface of the metal dam 20 is an inclined surface. When the metal dam 20 is impacted, the impact force will be affected by the inclined surface, so that the impact force is dispersed along the inclination direction of the inclined surface.

[0035] The design focus of the utility model is: by providing grooves on both sides of the ceramic body and arranging the buffer parts in the grooves, the ceramic substrate is not easily damaged by collision, and the surface of the metal dam is coated with an anti-corrosion layer and a heat-insulating layer. The anti-corrosion layer prevents the metal dam from being corroded by acids and alkalis, and the heat-insulating layer can prevent the anti-corrosion layer from aging due to long-term heat caused by the heat of electronic devices, and prevents the anti-corrosion layer from losing its anti-corrosion function, thereby effectively extending the service life of the ceramic substrate.

[0036] The above description is only a preferred embodiment of the present invention and does not limit the technical scope of the present invention. Therefore, any slight modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A durable metal dam ceramic package substrate, comprising a ceramic body and a metal dam; The upper surface of the ceramic body is concavely provided with a receiving groove for embedding the electronic device, the inner wall of the receiving groove is coated with a heat dissipation layer, the periphery of the receiving groove is provided with an upper circuit layer, the lower surface of the ceramic body is provided with a heat dissipation groove, the heat dissipation groove is communicated with the receiving groove, a heat dissipation portion is filled in the heat dissipation groove, the periphery of the heat dissipation groove is provided with a lower circuit layer, and a through hole is formed through the surface of the ceramic body, a conducting column is embedded in the through hole, one end of the conducting column is conductively connected to the upper circuit layer, and the other end of the conducting column is conductively connected to the lower circuit layer; The metal dam is arranged on the upper surface of the ceramic body and is located at the periphery of the upper circuit layer, and the metal dam is structured to form a packaging cavity; Features: Grooves are provided on both sides of the ceramic body, and buffer pieces are provided in the grooves; the surface of the metal dam is coated with an anti-corrosion layer, and the surface of the anti-corrosion layer is coated with a heat insulation layer.

2. The durable metal dam ceramic package substrate according to claim 1, characterized in that: The heat dissipation layer and the heat dissipation part are both made of graphene.

3. The durable metal dam ceramic package substrate according to claim 1, characterized in that: The ceramic body is provided with an annular waterproof groove, and the annular waterproof groove is located at the periphery of the upper circuit layer.

4. The durable metal dam ceramic package substrate according to claim 3, characterized in that: There are two annular waterproof grooves, one of which is located outside the other annular waterproof groove.

5. The durable metal dam ceramic package substrate according to claim 1, characterized in that: The buffer is made of rubber material, and has a buffer air cavity inside. A buffer bracket is arranged inside the buffer air cavity.

6. The durable metal dam ceramic package substrate according to claim 1, characterized in that: The outer end of the buffer extends outwardly from the groove, and the lower end surface of the buffer is located below the surface of the lower circuit layer.

7. The durable metal dam ceramic package substrate according to claim 1, characterized in that: The anti-corrosion layer is made of fluorinated polypropylene resin.

8. The durable metal dam ceramic package substrate according to claim 1, characterized in that: The heat insulation layer is made of thermoplastic polyurethane elastomer rubber material.

9. The durable metal dam ceramic package substrate according to claim 1, characterized in that: The outer side surface of the metal dam is an inclined surface.

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