PCB assembly

Abstract

The utility model provides a PCB assembly. The PCB assembly comprises a PCB substrate, an adhesive tape, a copper foil and a pasted part. One surface of the copper foil is provided with a hollow part, the other surface of the copper foil is fixedly connected with the PCB substrate, and the copper foil is used as a conductor of the PCB substrate; the adhesive tape is embedded into the hollow part of the copper foil, one surface of the adhesive tape is bonded with the PCB substrate, and the other surface of the adhesive tape is bonded with a bonded component. According to the utility model, the adhesive tape is embedded into the hollow part of the copper foil on the PCB substrate to bond the PCB substrate and the pasted part, so that the direct contact conduction of the pasted part and the copper foil is realized, the overall thickness of the PCB assembly is reduced, the processing cost is reduced, the thermal resistance of the pasted part is smaller, and the heat dissipation capability is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB boards, and in particular to a PCB board assembly. Background Art

[0002] PCB (Printed Circuit Board) is the core component of electronic devices, responsible for connecting and supporting electronic components and realizing the transmission of circuit signals. PCB is usually composed of an insulating substrate, such as glass fiber, a copper foil layer, an insulating layer and a conductive pattern part. The copper foil layer is formed into a circuit group through an etching process, and the substrate plays a supporting and insulating role. In the manufacturing process of PCB, the thickness of the copper foil, the material of the substrate and the processing accuracy directly affect the performance and quality of the PCB.

[0003] In order to fix the PCB board to the adherend, the existing technology generally adopts the soldering method, which achieves the connection by adding a layer of tin between the adherend and the copper foil, and uses the melting and solidification characteristics of tin to firmly combine the two. Soldering not only has good electrical and thermal conductivity, but also can provide a certain degree of connection and disconnection strength to ensure the stable operation of electronic components.

[0004] Although soldering technology is widely used in PCB board fixing, it will cause the overall thickness of the PCB board to be too large, thereby reducing the thermal conductivity of the PCB board, causing signal transmission delays, increased signal transmission losses, and increasing the complexity and cost of PCB board processing. Thicker PCB boards are also more prone to mechanical failures such as deformation or breakage when subjected to force, affecting the working efficiency of precision electronic equipment. Utility Model Content

[0005] In view of the defects in the prior art, the purpose of the utility model is to provide a PCB board assembly, by embedding an adhesive tape into the hollow part of the copper foil of the PCB substrate to bond the PCB substrate and the adhered component, so as to achieve direct contact and electrical conduction between the adhered component and the PCB substrate, reduce the overall thickness of the PCB board assembly, reduce the processing cost, and improve the heat dissipation capacity and the stability of electronic components.

[0006] According to one aspect of the utility model, there is provided a PCB board assembly, comprising: a PCB substrate, an adhesive tape, a copper foil and a component to be adhered;

[0007] A hollow portion is provided on the copper foil, one side of the copper foil is fixedly connected to the PCB substrate, and the copper foil is used as a conductor of the PCB substrate;

[0008] The adhesive tape is embedded in the hollow portion of the copper foil, one side of the adhesive tape is bonded to the PCB substrate, and the other side of the adhesive tape is bonded to the adhered component.

[0009] Optionally, when the other side of the adhesive tape is bonded to the adhered component, the copper foil is in direct contact with the adhered component to conduct electricity.

[0010] Optionally, the size of the hollow portion is larger than the size of the adhesive tape.

[0011] Optionally, the thickness of the adhesive tape is the same as the thickness of the copper foil.

[0012] Optionally, exhaust holes are provided on the PCB substrate, and the exhaust holes are used to exhaust air when the adhesive tape is pasted.

[0013] Optionally, when the adhesive tape is bonded to the PCB board, one side of the adhesive tape is also bonded to the exhaust hole.

[0014] Optionally, the adhesive tape comprises a substrate and an adhesive, and both sides of the substrate are covered with the adhesive.

[0015] Optionally, the substrate of the adhesive tape is made of plastic film.

[0016] Optionally, the PCB substrate is made of insulating material.

[0017] Optionally, the adhered component is made of metal.

[0018] Compared with the prior art, the utility model has the following beneficial effects:

[0019] Through the above technical solution, a hollow portion is provided on the copper foil, and an adhesive tape is embedded in the hollow portion of the copper foil, one side of the adhesive tape is bonded to the PCB substrate, and the other side of the adhesive tape is bonded to the adhered component, thereby achieving direct contact and electrical conduction between the adhered component and the copper foil, and effectively reducing the overall thickness of the PCB board assembly.

[0020] In the embodiment of the utility model, the vent hole is arranged on the PCB substrate to exhaust air when the adhesive tape is bonded, so as to prevent air bubbles from being retained between the bonded adhesive tape and the PCB substrate.

[0021] In the embodiment of the utility model, the adhered component is used to assist in heat dissipation. According to Fourier's law, the thermal resistance is small during heat conduction, which can improve the heat dissipation capacity, thereby reducing the temperature of the PCB substrate and improving the stability of the electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Other features, objects and advantages of the present invention will become more apparent by reading the detailed description of non-limiting embodiments with reference to the following drawings:

[0023] Figure 1 It is an exploded schematic diagram of a PCB board assembly provided by an exemplary embodiment of the utility model.

[0024] Figure 2 It is a front view of a PCB board assembly provided by an exemplary embodiment of the utility model.

[0025] Figure 3 It is a cross-sectional view of a PCB board assembly provided by an exemplary embodiment of the utility model.

[0026] Description of Reference Numerals

[0027] 100PCB board assembly

[0028] 10PCB substrate

[0029] 11 Exhaust holes

[0030] 20 Adhesive tape

[0031] 30 Copper Foil

[0032] 40 pasted parts DETAILED DESCRIPTION

[0033] The utility model is described in detail below in conjunction with specific embodiments. The following embodiments will help those skilled in the art to further understand the utility model, but do not limit the utility model in any form. It should be pointed out that for those of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the utility model. These all fall within the scope of protection of the utility model.

[0034] Figure 1 It is an exploded schematic diagram of a PCB board assembly provided by an exemplary embodiment of the utility model. Figure 2 It is a front view of a PCB board assembly provided by an exemplary embodiment of the utility model.

[0035] like Figure 1 , Figure 2 As shown, the utility model provides a PCB board assembly 100, including a PCB substrate 10, an adhesive tape 20, a copper foil 30 and a component to be adhered 40.

[0036] A hollow portion is provided on the copper foil 30 , and one side of the copper foil 30 is fixedly connected to the PCB substrate 10 . The copper foil 30 is used as a conductor of the PCB substrate 10 .

[0037] The adhesive tape 20 is embedded in the hollow portion of the copper foil 30 , one side of the adhesive tape 20 is bonded to the PCB substrate 10 , and the other side of the adhesive tape 20 is bonded to the adhered component 40 .

[0038] In a possible embodiment, when the other side of the adhesive tape 20 is bonded to the adhered component 40 , the copper foil 30 is in direct contact with the adhered component 40 for electrical conduction.

[0039] Through the above technical solution, a hollow portion is provided on the copper foil 30, and the adhesive tape 20 is embedded in the hollow portion of the copper foil 30, one side of the adhesive tape 20 is bonded to the PCB substrate 10, and the other side of the adhesive tape 20 is bonded to the adhered component 40, so that direct contact and conductivity between the adhered component 40 and the copper foil 30 is achieved, and the overall thickness of the PCB board assembly 100 is effectively reduced. According to Fourier's law, the direct contact between the adhered component 40 and the copper foil 30 has a small thermal resistance, which can improve the heat dissipation capacity and the stability of electronic components.

[0040] In a possible embodiment, the adhesive tape 20 includes a substrate and an adhesive, and both sides of the substrate are covered with the adhesive.

[0041] The base material of the adhesive tape 20 is made of plastic film, and the adhesive can be glue.

[0042] As an example, the adhesive tape 20 may be a double-sided tape, and the adhesive tape 20 is made of a non-air-permeable material.

[0043] Figure 3 It is a cross-sectional view of a PCB board assembly provided by an exemplary embodiment of the utility model.

[0044] In a possible embodiment, the size of the hollow portion is larger than the size of the adhesive tape 20 , and the thickness of the adhesive tape 20 is the same as the thickness of the copper foil 30 .

[0045] like Figure 3 As shown, the adhesive tape 20 is embedded in the hollow portion of the copper foil 30 and sandwiched between the adhered component 40 and the PCB substrate 10 as an intermediate layer.

[0046] Compared with conventional soldered PCB components, the PCB assembly 100 using the adhesive tape 20 provided by the present invention effectively reduces the overall thickness of the PCB assembly 100 .

[0047] like Figure 1 As shown, in a possible embodiment, a vent hole 11 is provided on the PCB substrate 10 , and the vent hole 11 is used to exhaust air when the adhesive tape 20 is bonded.

[0048] The vent hole 11 can be set in the middle of the PCB substrate 10. When the adhesive tape 20 is bonded, the adhesive tape 20 adheres to the vent hole 11 to exhaust air and discharge bubbles between one side of the adhesive tape 20 and the PCB substrate 10.

[0049] By adopting the above technical solution, the vent hole 11 is provided on the PCB substrate 10 for exhausting air when the adhesive tape 20 is bonded, so as to prevent air bubbles from being retained between the bonded adhesive tape 20 and the PCB substrate 10 .

[0050] In a possible embodiment, the PCB substrate 10 may be made of insulating material.

[0051] In a possible embodiment, the adhered component 40 may be made of metal. The size of the adhered component 40 may be larger than the size of the hollow portion of the copper foil 30 .

[0052] Through the above technical solution, the adhered component 40 can be used to assist in heat dissipation. During heat conduction, the thermal resistance is small, which can improve the heat dissipation capacity, thereby reducing the temperature of the PCB substrate 10 and improving the stability of electronic components.

[0053] The above describes the specific embodiments of the present invention. It should be understood that the present invention is not limited to the above specific embodiments, and those skilled in the art can make various modifications or variations within the scope of the claims, which does not affect the essence of the present invention.

Claims

1. A PCB board assembly, characterized in that: include: PCB substrate, adhesive tape, copper foil and adhered parts; A hollow portion is provided on the copper foil, one side of the copper foil is fixedly connected to the PCB substrate, and the copper foil is used as a conductor of the PCB substrate; The adhesive tape is embedded in the hollow portion of the copper foil, one side of the adhesive tape is bonded to the PCB substrate, and the other side of the adhesive tape is bonded to the adhered component.

2. The PCB board assembly according to claim 1, characterized in that: When the other side of the adhesive tape is bonded to the adhered member, the copper foil and the adhered member are in direct contact and conduct electricity.

3. The PCB board assembly according to claim 1, characterized in that: The size of the hollow portion is larger than that of the adhesive tape.

4. The PCB board assembly according to claim 1, characterized in that: The thickness of the adhesive tape is the same as the thickness of the copper foil.

5. The PCB board assembly according to claim 1, characterized in that: The PCB substrate is provided with exhaust holes, and the exhaust holes are used for exhausting air when the adhesive tape is pasted.

6. The PCB board assembly according to claim 5, characterized in that: When the adhesive tape is bonded to the PCB board, one side of the adhesive tape is also bonded to the exhaust hole.

7. The PCB board assembly according to claim 1, characterized in that: The adhesive tape comprises a substrate and an adhesive, and both sides of the substrate are covered with the adhesive.

8. The PCB board assembly according to claim 7, characterized in that: The base material of the adhesive tape is made of plastic film.

9. The PCB board assembly according to claim 1, characterized in that: The PCB substrate is made of insulating material.

10. The PCB board assembly according to claim 1, wherein the adhered component is made of metal.

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