MOS transistor crystal pressing block

Abstract

The utility model provides a metal oxide semiconductor (MOS) transistor crystal briquetting, which relates to the technical field of MOS transistor crystal briquetting, and comprises a crystal briquetting body, a cavity is arranged on the crystal briquetting body, four cushion blocks are fixedly connected on the inner wall of the crystal briquetting body, a U-shaped block is fixedly connected on the inner wall of the cavity, and the U-shaped block is fixedly connected on the inner wall of the cavity. An L-shaped block is arranged between the crystal pressing block body and the U-shaped block, and a buckling block is arranged on the side face, away from the L-shaped block, of the U-shaped block. According to the utility model, the MOS transistor can be fixed by arranging the crystal pressing block body, the design of the crystal pressing block body is exquisite, so that excessive space on a PCB (Printed Circuit Board) is not occupied, the MOS transistor is fixed in the cavity by the elastic sheet, the contact area between the elastic sheet and the MOS transistor is small, and the two ends of the crystal pressing block body are the same in a penetrating manner, so that the MOS transistor is fixed in the cavity. Therefore, the fixing mode does not affect the normal heat dissipation of the MOS tube.

Description

Technical Field

[0001] The utility model relates to the technical field of MOS tube crystal pressing blocks, in particular to a MOS tube crystal pressing block. Background Art

[0002] MOS tube is a semiconductor device whose function is to modulate and decode the signal to be transmitted, and then directly couple the signal to the output end through MOSFET. The function of MOS tube is to convert the input analog electrical signal into a digital electrical signal or convert the digital electrical signal back into an analog electrical signal.

[0003] The existing MOS tube is usually installed on a PCB board and needs to be equipped with a heat sink when used. The traditional MOS tube fixing block is usually fixed with bolts. When the bolts are loose, the fixation of the MOS tube by the block fails, which may cause the MOS tube to shift, resulting in the heat dissipation effect of the heat sink being not obvious enough, and the MOS tube may be unable to continue to operate due to excessive temperature. Therefore, the existing MOS fixing method is inconvenient. For this reason, we provide a MOS tube crystal block. Utility Model Content

[0004] The utility model aims to solve the defect that the MOS tube fixing pressing block in the prior art cannot be fixed continuously and effectively, and provides a MOS tube crystal pressing block.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a MOS tube crystal compression block, comprising: a crystal compression block body, a cavity is provided on the crystal compression block body, a cushion block is fixedly connected to the inner wall of the crystal compression block body, the number of the cushion blocks is four, a U-shaped block is fixedly connected to the inner wall of the cavity, an L-shaped block is provided between the crystal compression block body and the U-shaped block, a buckle block is provided on a side of the U-shaped block away from the L-shaped block, the number of the buckle blocks is two, the buckle block is fixedly connected to the U-shaped block, two inclined grooves are provided on the buckle block, one end of the L-shaped block is fixedly connected to a spring sheet, and the spring sheet is provided with an arc surface.

[0006] As a preferred implementation manner, the crystal compact body is provided with wiring grooves, and the number of the wiring grooves is four.

[0007] As a preferred embodiment, a fixing block is provided on one side of the U-shaped block, and the number of the fixing blocks is two.

[0008] As a preferred implementation, the fixing block is fixedly connected to the inner wall of the crystal press block body, and a bevel groove 1 is provided on the fixing block.

[0009] As a preferred implementation, the L-shaped block is provided with two slots.

[0010] As a preferred embodiment, the L-shaped block is provided with a cutting groove, and the cutting groove is provided on both sides of the groove.

[0011] As a preferred implementation, the L-shaped block is provided with a bolt through hole, and the crystal pressing block body is provided with a fixing hole.

[0012] Compared with the prior art, the advantages and positive effects of the utility model are:

[0013] The utility model can fix the MOS tube by setting a crystal pressing block body. Since the design of the crystal pressing block body is exquisite, it will not occupy too much space on the PCB board. At the same time, the MOS tube is fixed in the cavity by the spring sheet, and the contact area between the spring sheet and the MOS tube is small, and the two ends of the crystal pressing block body are the same, so this fixing method will not affect the normal heat dissipation of the MOS tube, ensuring that the MOS tube can maintain a stable operating state under the condition of conventional heat dissipation. In addition, the crystal pressing block body can be connected to the PCB board while fixing the MOS tube, and the snap-on connection with the PCB board is realized by using the snap-on block, which plays an important connecting role. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 The present invention provides a stereoscopic diagram of a MOS tube crystal pressing block.

[0015] Figure 2 The utility model provides a U-shaped block installation schematic diagram of a MOS tube crystal pressing block.

[0016] Figure 3 This is an enlarged view of region A of a MOS tube crystal compact provided by the utility model.

[0017] Figure 4 The utility model provides a schematic diagram of the installation of a spring piece of a MOS tube crystal pressing block.

[0018] Figure 5 The present invention provides a stereoscopic diagram of a MOS tube crystal pressing block.

[0019] Figure 6 The utility model provides a schematic diagram of the installation of a gasket block of a MOS tube crystal pressing block.

[0020] Legend:

[0021] 100, crystal pressing block body; 101, cavity; 102, cushion block; 103, U-shaped block; 104, buckle block; 105, wiring groove; 106, fixing block; 107, inclined groove 1; 108, fixing hole;

[0022] 109, inclined groove 2; 200, L-shaped block; 201, spring piece; 202, groove position; 203, cut groove; 204, bolt through hole; 205, arc surface. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] Example 1

[0025] like Figure 1-Figure 6 As shown, the utility model provides a technical solution: a MOS tube crystal compact, comprising: a crystal compact body 100, a cavity 101 is opened on the crystal compact body 100, a cushion block 102 is fixedly connected to the inner wall of the crystal compact body 100, the number of the cushion blocks 102 is four, a U-shaped block 103 is fixedly connected to the inner wall of the cavity 101, an L-shaped block 200 is arranged between the crystal compact body 100 and the U-shaped block 103, a snap block 104 is arranged on one side of the U-shaped block 103 away from the L-shaped block 200, the number of the snap blocks 104 is two, the snap block 104 is fixedly connected to the U-shaped block 103, a bevel groove 109 is opened on the snap block 104, a spring piece 201 is fixedly connected to one end of the L-shaped block 200, the spring piece 201 is opened with an arc surface 205, and a wiring groove 105 is opened on the crystal compact body 100.

[0026] In this embodiment, the MOS tube on the PCB board can be fixed by providing the crystal pressing block body 100. In addition, the MOS tube will be fixed between the four U-shaped blocks 103 and the spring 201. The MOS tube is fixed by compression using the elastic force generated by the deformation of the slot 202. In addition, the U-shaped block 103 is provided, which can not only accommodate the L-shaped block 200 and the spring 201, but also form a supporting effect on the side of the spring 201 away from the MOS tube when the spring 201 is deformed, thereby ensuring the continuity of the elastic force of the spring 201. The slot 202 and the cut groove 203 are provided on the L-shaped block 200, which can be engaged with the fixing block 106. Since the port of the fixing block 106 is slightly protruding, when the L-shaped block 200 is pressed and placed, it will not be easily displaced, thereby ensuring the stability of the fixation of the MOS tube.

[0027] Example 2

[0028] like Figure 1-Figure 6 As shown, there are four wiring grooves 105, a fixed block 106 is provided on one side of the U-shaped block 103, the number of the fixed blocks 106 is two, the fixed block 106 is fixedly connected to the inner wall of the crystal press block body 100, the fixed block 106 is provided with a bevel groove 107, the L-shaped block 200 is provided with a slot 202, the number of the slot 202 is two, the L-shaped block 200 is provided with a cut surface groove 203, the cut surface groove 203 is provided on both sides of the slot 202, the L-shaped block 200 is provided with a bolt through hole 204, and the crystal press block body 100 is provided with a fixing hole 108.

[0029] In this embodiment, by providing two snap blocks 104, the snap blocks 104 can be used to snap-connect with the PCB board, so that the crystal pressing block body 100 can be conveniently and firmly connected with the PCB board, and the second bevel groove 109 is provided on the snap block 104, and the second bevel groove 109 is used to prevent the snap block 104 from being unable to connect due to friction when it is pressed and contacted with the PCB board. In addition, a bolt through hole 204 is provided on the L-shaped block 200, through which the bolt can pass, so that it can be threadedly connected with the radiator for heat dissipation of the MOS tube. In addition, when the bolt is in use, the L-shaped block 200 and the spring sheet 201 as a whole will act as an elastic gasket of the bolt, so that it will not loosen due to vibration and other reasons. At the same time, the fixing hole 108 is provided on the crystal pressing block body 100, through which a larger bolt cap can pass, and the opening of the cavity 101 can provide a larger accommodating space for circuits and components on the PCB board.

[0030] Working principle:

[0031] like Figure 1-Figure 6As shown, when the utility model is in use, the L-shaped block 200 and the spring piece 201 can be installed first, and the spring piece 201 can be passed through a side of the U-shaped block 103 close to the fixed block 106, and then the L-shaped block 200 can be pressed downward, so that the two fixed blocks 106 can pass through the slot 202 and the cut surface slot 203 opened on the L-shaped block 200 under the action of the inclined groove 107, until the L-shaped block 200 and the spring piece 201 are installed and in a stable state. At this time, the spring piece 201 is slightly bent in a direction away from the U-shaped block 103, so that the spring piece 201 generates elastic force, and the MOS tube can be installed, and the MOS tube is inserted between the spring piece 201 and the U-shaped block 103. Due to the action of the curved surface 205, the insertion of the MOS tube will not be hindered by the spring piece 201, until The four corners of the MOC tube are placed at the top of the four U-shaped blocks 103. At this time, the spring clip 201 is loosened. Under the elastic force of the spring clip 201, the MOS tube will be in a stable state. Then the bolt is passed through the fixing hole 108 and then through the bolt through hole 204. The bolt is used to make the crystal pressing block body 100 threadably connected to the radiator to dissipate heat for the MOS tube. Finally, the whole is connected to the PCB board. The two snap blocks 104 fixedly connected on the U-shaped block 103 are aligned with the snap grooves reserved on the PCB board. Then the crystal pressing block body 100 is pressed hard, and under the action of the second bevel groove 109, the snap block 104 can be firmly snapped with the PCB board smoothly, and the excess connecting wires can be reasonably arranged through the cavity 101 and the wiring groove 105.

[0032] The above description is only a preferred embodiment of the present invention and does not limit the present invention in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. A MOS tube crystal block, characterized in that: include: A crystal compact body (100), a cavity (101) is provided on the crystal compact body (100), a pad (102) is fixedly connected to the inner wall of the crystal compact body (100), the number of the pads (102) is four, a U-shaped block (103) is fixedly connected to the inner wall of the cavity (101), an L-shaped block (200) is provided between the crystal compact body (100) and the U-shaped block (103), A buckle block (104) is provided on a side of the U-shaped block (103) away from the L-shaped block (200), the number of the buckle blocks (104) is two, the buckle blocks (104) are fixedly connected to the U-shaped block (103), the buckle block (104) is provided with a second inclined groove (109), one end of the L-shaped block (200) is fixedly connected with a spring sheet (201), and the spring sheet (201) is provided with an arc surface (205).

2. The MOS transistor crystal compact according to claim 1, characterized in that: The crystal compact body (100) is provided with wiring grooves (105), and the number of the wiring grooves (105) is four.

3. The MOS transistor crystal compact according to claim 2, characterized in that: A fixing block (106) is provided on one side of the U-shaped block (103), and the number of the fixing blocks (106) is two.

4. The MOS transistor crystal compact according to claim 3, characterized in that: The fixing block (106) is fixedly connected to the inner wall of the crystal pressing block body (100), and a bevel groove (107) is provided on the fixing block (106).

5. The MOS transistor crystal compact according to claim 1, characterized in that: The L-shaped block (200) is provided with slots (202), and the number of the slots (202) is two.

6. The MOS transistor crystal compact according to claim 1, characterized in that: The L-shaped block (200) is provided with a cut surface groove (203), and the cut surface groove (203) is provided on both sides of the groove position (202).

7. The MOS transistor crystal compact according to claim 1, characterized in that: The L-shaped block (200) is provided with a bolt through hole (204), and the crystal pressing block body (100) is provided with a fixing hole (108).

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