Water-cooled radiator substrate
By setting up a snake-shaped heat dissipation pipeline and zigzag heat dissipation fins inside the water-cooled radiator substrate, the problem of less contact between the coolant and the substrate in the prior art is solved, and a more efficient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202421661249.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-15
- Publication Date
- 2025-05-20
- Estimated Expiration
- 2034-07-15
AI Technical Summary
During the cooling process of cooling liquid, the existing water-cooled radiator substrate has less contact with the substrate, making it difficult to quickly dissipate heat.
By setting a serpentine heat dissipation pipe and zigzag heat dissipation fins inside the substrate main body, the contact area between the coolant and the substrate cavity is increased, and the heat exchange efficiency and heat dissipation area are improved.
It effectively improves the heat dissipation efficiency of the water-cooled radiator substrate, enhances the contact area between the coolant and the substrate, and improves the heat exchange efficiency.
Smart Images
Figure CN222888166U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of water-cooled heat dissipation, in particular to a water-cooled radiator substrate. Background Technique
[0002] The water-cooled radiator substrate is a key component in the water-cooled heat dissipation system. It is located between the heat source (such as CPU, GPU, etc.) and the cooling liquid, and plays a role in effectively transferring the heat generated by the heat source to the cooling liquid. The substrate is usually made of high thermal conductivity materials such as copper, aluminum or their alloys. These materials can quickly conduct heat from the heat source to the substrate surface and conduct heat exchange with the cooling liquid through the flow channels or micro-channels on the substrate.
[0003] In the existing radiator during heat dissipation, usually coolant is injected into the cavity of the substrate for cooling. Due to the pipeline arrangement inside the substrate, the contact between the coolant and the substrate is less during the flowing and cooling process of the coolant, making it difficult to quickly dissipate the heat of the substrate. Content of the Utility Model
[0004] The purpose of the utility model is to provide a water-cooled radiator substrate to solve the problem that usually coolant is injected into the cavity of the substrate for cooling. Due to the pipeline arrangement inside the substrate, the contact between the coolant and the substrate is less during the flowing and cooling process of the coolant, making it difficult to quickly dissipate the heat of the substrate. To achieve the above purpose, the utility model provides the following technical scheme: A water-cooled radiator substrate, including a substrate main body, the inside of the substrate main body is hollow and provided with a cavity, one end of the substrate main body is provided with a liquid inlet, the inside of the liquid inlet is fixedly communicated with a heat dissipation pipeline, the heat dissipation pipeline is distributed in a serpentine shape inside the cavity, the outer wall of the heat dissipation pipeline is sleeved with heat dissipation fins, the shape of the heat dissipation fins is serrated, both ends of the heat dissipation fins are respectively provided with holes, the inside of the holes is fixedly connected with fixing parts, a liquid discharge port is arranged on one side of the liquid inlet. By setting the serpentine heat dissipation pipeline and the serrated heat dissipation fins, during use, the coolant can enter the heat dissipation pipeline, and the coolant can be contacted through the shape of the serrated heat dissipation fins itself, guiding the coolant to flow inside the serpentine heat dissipation pipeline, increasing the contact area between the coolant and the substrate cavity, improving the heat exchange efficiency and the heat dissipation area, and further improving the heat dissipation efficiency of the substrate.
[0005] Further preferably, a heat dissipation fin is fixedly connected to the top of the substrate main body by screws, a discharge pipe is fixedly communicated with one side of the liquid discharge port, and sealing and fixing components are respectively arranged on one side of the heat dissipation pipeline and the discharge pipe. By installing the heat dissipation fin, the heat generated during the operation of the substrate can be dissipated more quickly by increasing the heat dissipation area. At the same time, after the coolant absorbs heat inside the substrate, it is discharged through the discharge pipe for cooling, thereby ensuring the smooth flow of the coolant.
[0006] Further preferably, the sealing and fixing assembly includes a sealing ring, the sealing ring is respectively connected to one side of the heat dissipation pipeline and the discharge pipe, one side of the sealing ring is fixedly connected with a connecting joint, the bottom of the connecting joint is fixedly connected with a connecting block, and one side of the connecting block is fixedly connected with a supporting block. By installing the sealing and fixing assembly, during use, the sealing ring can ensure the sealing between the heat dissipation pipeline and the discharge pipe and the substrate body. At the same time, the supporting block can support the connected pipelines to prevent the coolant from falling off during the flowing process, resulting in leakage.
[0007] Further preferably, one side of the connecting joint is fixedly connected with an electromagnetic valve, and the outer wall of the heat dissipation pipeline is fixedly connected with a temperature sensor, and the temperature sensor is electrically connected to the electromagnetic valve. By installing the temperature sensor, during use, the temperature of the coolant in the heat dissipation pipeline can be monitored in real time, and the temperature information is transmitted to the electromagnetic valve. When the temperature exceeds the set threshold, the electromagnetic valve can automatically adjust the coolant flow rate to quickly reduce the temperature.
[0008] Further preferably, one end of the discharge pipe is fixedly connected with a cooling box, one end of the heat dissipation pipeline is fixedly connected with a water pump, and the heat dissipation pipeline is connected to one side of the cooling box through the water pump. By installing the cooling box and the water pump, during use, the heated coolant continues to flow through the heat dissipation pipeline and finally reaches the liquid discharge port. The coolant enters the cooling box through the discharge pipe for cooling treatment. In the cooling box, the coolant reduces the temperature through natural heat dissipation. The cooled coolant is pumped back to the liquid inlet of the heat dissipation pipeline by the water pump to start a new round of circulation.
[0009] Further preferably, heat dissipation through holes are formed in the top of the substrate body, and the heat dissipation through holes are arranged at the bottom of the heat dissipation fins. By installing the heat dissipation through holes, the heat dissipation efficiency of the device can be further improved.
[0010] Compared with the prior art, the beneficial effects of the present utility model are:
[0011] In the present utility model, by arranging the serpentine heat dissipation pipeline and the serrated heat dissipation fins, during use, the coolant enters the heat dissipation pipeline, and the coolant is contacted through the shape of the serrated heat dissipation fins itself, guiding the coolant to flow in the serpentine heat dissipation pipeline, increasing the contact area between the coolant and the substrate cavity, improving the heat exchange efficiency and the heat dissipation area, and thus improving the heat dissipation efficiency of the substrate.
[0012] In the present utility model, by installing the sealing and fixing assembly, during use, the sealing ring can ensure the sealing between the heat dissipation pipeline and the discharge pipe and the substrate body. At the same time, the supporting block can support the connected pipelines to prevent the coolant from falling off during the flowing process, resulting in leakage.
[0013] In this utility model, a cooling box and a water pump are installed. During use, the heated coolant continues to flow through the heat dissipation pipeline and finally reaches the liquid discharge port. The coolant enters the cooling box through the discharge pipe for cooling treatment. In the cooling box, the coolant reduces its temperature through natural heat dissipation. The cooled coolant is pumped back to the liquid inlet of the heat dissipation pipeline by the water pump to start a new cycle. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 Schematic diagram of the three-dimensional structure of the present utility model Figure 1 ;
[0015] Figure 2 For the present utility model Figure 1 Schematic diagram of the enlarged three-dimensional structure at position A;
[0016] Figure 3 Schematic diagram of the three-dimensional structure of the present utility model Figure 2 ;
[0017] Figure 4 Schematic diagram of the partial three-dimensional structure of the present utility model;
[0018] Figure 5 For the present utility model Figure 4 Schematic diagram of the enlarged three-dimensional structure at position B.
[0019] In the figure: 1, substrate main body; 2, cavity; 3, liquid inlet; 4, heat dissipation pipeline; 5, heat dissipation fins; 6, holes; 7, fixing parts; 8, liquid discharge port; 9, heat dissipation sheet; 10, discharge pipe; 11, sealing and fixing assembly; 12, solenoid valve; 13, temperature sensor; 14, cooling box; 15, water pump; 16, heat dissipation through holes; 1101, sealing ring; 1102, connecting joint; 1103, connecting block; 1104, support block. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0020] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the protection scope of the present utility model.
[0021] Please refer to Figures 1 - 5, the present utility model provides a technical solution: a water-cooled radiator substrate, including a substrate main body 1. The interior of the substrate main body 1 is hollow and provided with a cavity 2. One end of the substrate main body 1 is provided with a liquid inlet 3. The interior of the liquid inlet 3 is fixedly communicated with a heat dissipation pipeline 4. The heat dissipation pipeline 4 is distributed in a serpentine shape inside the cavity 2. The outer wall of the heat dissipation pipeline 4 is sleeved with heat dissipation fins 5. The shape of the heat dissipation fins 5 is serrated. Both ends of the heat dissipation fins 5 are respectively provided with holes 6. A fixing member 7 is fixedly connected inside the holes 6. A liquid discharge port 8 is provided on one side of the liquid inlet 3. By setting the serpentine heat dissipation pipeline 4 and the serrated heat dissipation fins 5, during use, the coolant enters the heat dissipation pipeline 4 from the liquid inlet 3, contacts the coolant through the shape of its own serrated heat dissipation fins 5, and guides the coolant to flow inside the serpentine heat dissipation pipeline 4, increasing the contact area between the coolant and the substrate cavity 2.
[0022] In this embodiment, as Figure 1 and Figure 3 shown, a heat sink 9 is fixedly connected to the top of the substrate main body 1 by screws. A discharge pipe 10 is fixedly communicated with one side of the liquid discharge port 8. Sealing and fixing components 11 are respectively arranged on one side of the heat dissipation pipeline 4 and the discharge pipe 10. By installing the heat sink 9, during use, the heat sink 9 can accelerate the dissipation of the heat generated by the operation of the substrate main body 1 by increasing the heat dissipation area. At the same time, after the coolant absorbs heat inside the substrate main body 1, it is discharged through the discharge pipe 10 for cooling.
[0023] In this embodiment, as Figure 1 , Figure 2 and Figure 3 shown, the sealing and fixing component 11 includes a sealing ring 1101. The sealing ring 1101 is respectively connected to one side of the heat dissipation pipeline 4 and the discharge pipe 10. A connection joint 1102 is fixedly connected to one side of the sealing ring 1101. A connection block 1103 is fixedly connected to the bottom of the connection joint 1102. A support block 1104 is fixedly connected to one side of the connection block 1103. By installing the sealing and fixing component 11, during use, through the sealing ring 1101, the sealing between the heat dissipation pipeline 4 and the discharge pipe 10 and the substrate main body 1 is connected. At the same time, the support block 1104 can support the connected heat dissipation pipeline 4 and the discharge pipe 10 to prevent the coolant from falling off during the flowing process.
[0024] In this embodiment, as Figure 1 , Figure 2 and Figure 3As shown in the figure, one side of the connecting joint 1102 is fixedly connected with a solenoid valve 12, and the outer wall of the heat dissipation pipeline 4 is fixedly connected with a temperature sensor 13. The temperature sensor 13 is electrically connected to the solenoid valve 12. By installing the temperature sensor 13, during use, the temperature sensor 13 monitors the temperature of the coolant in the heat dissipation pipeline 4 in real time and transmits the temperature information to the solenoid valve 12. When the temperature exceeds the set threshold, the solenoid valve 12 can automatically adjust the coolant flow rate to quickly reduce the temperature.
[0025] In this embodiment, as Figure 1 and Figure 3 shown, one end of the discharge pipe 10 is fixedly connected with a cooling box 14, and one end of the heat dissipation pipeline 4 is fixedly connected with a water pump 15. The heat dissipation pipeline 4 is connected to one side of the cooling box 14 through the water pump 15. By installing the cooling box 14 and the water pump 15, during use, the heated coolant continues to flow through the heat dissipation pipeline 4 and finally reaches the drain port 8. The coolant enters the cooling box 14 through the discharge pipe 10 for cooling treatment. In the cooling box 14, the coolant reduces the temperature through natural heat dissipation, and the cooled coolant is pumped back into the interior of the heat dissipation pipeline 4 by the water pump 15 to start a new round of circulation.
[0026] In this embodiment, as Figure 1 and Figure 3 shown, a heat dissipation through hole 16 is formed in the top of the substrate body 1, and the heat dissipation through hole 16 is arranged at the bottom of the heat sink 9. By installing the heat dissipation through hole 16, the heat dissipation efficiency of the device can be further improved.
[0027] The usage method and advantages of the present utility model: When the water-cooled radiator substrate is in use, the working process is as follows:
[0028] As Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5As shown, during use, the liquid inlet 3 and the liquid outlet 8 are fixedly connected through a connecting joint 1102 to a heat dissipation pipeline 4 and a discharge pipe 10. When the heat source on the substrate main body 1 generates heat, the coolant enters the heat dissipation pipeline 4 from the liquid inlet 3. Through the shape of its serrated heat dissipation fins 5, the coolant is contacted, guiding the coolant to flow in the serpentine heat dissipation pipeline 4, increasing the contact area between the coolant and the substrate cavity 2. The heat is conducted from the substrate main body 1 to the coolant in the heat dissipation pipeline 4. After the coolant absorbs the heat, its temperature rises. The heated coolant continues to flow through the heat dissipation pipeline 4 and finally reaches the liquid outlet 8. The coolant enters the cooling tank 14 through the discharge pipe 10 for cooling treatment. In the cooling tank 14, the coolant is cooled by natural heat dissipation or by reducing the temperature. The cooled coolant is pumped back to the liquid inlet 3 of the heat dissipation pipeline 4 by the water pump 15 to start a new round of circulation. The temperature sensor 13 monitors the temperature of the coolant in the heat dissipation pipeline 4 in real time and transmits the temperature information to the solenoid valve 12. When the temperature exceeds the set threshold, the solenoid valve 12 can automatically adjust the coolant flow rate to quickly reduce the temperature. At the same time, the setting of the heat sink 9 and the heat dissipation through holes 16 further enhances the top heat dissipation effect.
[0029] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art of this industry should understand that the present invention is not limited by the above embodiments. The above embodiments and the descriptions in the specification are only preferred examples of the present invention and are not used to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.
Claims
1. A water-cooled radiator substrate, comprising a substrate body (1), characterized in that: The interior of the substrate body (1) is hollow and provided with a cavity (2). One end of the substrate body (1) is provided with a liquid inlet (3). The interior of the liquid inlet (3) is fixedly connected with a heat dissipation pipeline (4). The heat dissipation pipeline (4) is distributed in a serpentine shape inside the cavity (2). The outer wall of the heat dissipation pipeline (4) is sleeved with a heat dissipation fin (5). The heat dissipation fin (5) is in a sawtooth shape. Holes (6) are respectively provided at both ends of the heat dissipation fin (5). A fixing piece (7) is fixedly connected inside the hole (6). A liquid discharge port (8) is provided on one side of the liquid inlet (3).
2. The water-cooling radiator substrate according to claim 1, characterized in that: The top of the substrate body (1) is fixedly connected to a heat sink (9) by means of screws, one side of the liquid discharge port (8) is fixedly connected to a discharge pipe (10), and one side of the heat dissipation pipeline (4) and the discharge pipe (10) are respectively provided with a sealing fixing assembly (11).
3. The water-cooling radiator substrate according to claim 2, characterized in that: The sealing and fixing assembly (11) comprises a sealing ring (1101), wherein the sealing ring (1101) is respectively connected to one side of the heat dissipation pipeline (4) and the exhaust pipe (10), one side of the sealing ring (1101) is fixedly connected to a connecting joint (1102), the bottom of the connecting joint (1102) is fixedly connected to a connecting block (1103), and one side of the connecting block (1103) is fixedly connected to a supporting block (1104).
4. The water-cooling radiator substrate according to claim 3, characterized in that: A solenoid valve (12) is fixedly connected to one side of the connection joint (1102), a temperature sensor (13) is fixedly connected to the outer wall of the heat dissipation pipeline (4), and the temperature sensor (13) is electrically connected to the solenoid valve (12).
5. The water-cooling radiator substrate according to claim 2, characterized in that: One end of the discharge pipe (10) is fixedly connected to a cooling box (14), one end of the heat dissipation pipeline (4) is fixedly connected to a water pump (15), and the heat dissipation pipeline (4) is connected to one side of the cooling box (14) via the water pump (15).
6. The water-cooling radiator substrate according to claim 1, characterized in that: A heat dissipation through hole (16) is provided on the top of the substrate body (1), and the heat dissipation through hole (16) is arranged at the bottom of the heat sink (9).