Coil plate structure convenient to test

Abstract

The utility model relates to a coil plate structure convenient to test, which comprises a coil plate main body, one surface of the coil plate main body is provided with a ground wire shielding layer, one side of the ground wire shielding layer is provided with an opening, and the ground wire shielding layer forms two connecting ends at two sides of the opening. The side, close to the opening, of the coil plate body is connected with a technological edge, the face, close to the ground wire shielding layer, of the technological edge is provided with two testing ports, and each testing port is electrically connected with one connecting end. According to the invention, one side of the ground wire shielding layer is provided with the opening, so that the ground wire shielding layer is provided with the connecting end, the test port is arranged on the process edge, the inductance test is carried out on the ground wire shielding layer through the test port, a defective board with defects is effectively found out and prevented from flowing into the next process, and meanwhile, the process edge can be removed after the test is completed, so that the test efficiency is improved. On the premise that the original design structure of the coil plate is not affected, a test point is provided for the ground wire shielding layer, and the device is simple in overall structure, low in investment and easy to implement.

Description

Technical Field

[0001] The utility model relates to the field of circuit board production and manufacturing, in particular to a coil board structure which is convenient for testing. Background Art

[0002] There is a special filter coil board, whose top-layer circuit is designed with a coil and has an inductance requirement, and whose bottom-layer circuit is a ground shielding layer and has a filtering requirement. Among them, the gaps, protrusions, short circuits, and solder resist foreign objects on the ground shielding layer grid design circuit will affect the inductance value of the front inductor coil, resulting in product functional problems, and due to the special same network overall design of the ground shielding layer, conventional test equipment cannot directly detect the short circuit problem of the ground shielding layer. Therefore, the current mainstream control and screening methods in the industry for this type of filter coil board mainly include the following: improving the line AOI scanning accuracy; strict 7S control of the solder resist clean room to avoid the generation of solder resist foreign objects; since it is impossible to directly test the bottom overall ground shielding layer, use an inductance tester to perform inductance testing on the top inductor coil.

[0003] The above-mentioned traditional control method mainly has the following problems:

[0004] Regarding improving AOI scanning accuracy, when PCB board factories purchase AOI machines, they will choose the equipment recognition accuracy suitable for the factory. This leads to the inability of AOI equipment to effectively detect 100% of the line defects that exceed its recognition accuracy, unless the PCB board factory continues to invest in AOI equipment with higher recognition accuracy. This method is undoubtedly an infinite cycle, which cannot fundamentally solve the leakage problem and will greatly increase the cost investment; the solder mask 7S control is the same as the AOI leakage problem. When the PCB board factory builds the factory, it will select the dust content level of the solder mask clean room. After the construction is completed, it cannot be changed at any time, and the clean room can only control the dust level in the clean room within a certain range, not absolutely dust-free. Therefore, it is not realistic to completely eliminate solder mask foreign matter through the 7S control of the solder mask clean room; and when the top inductor coil is tested for inductance, due to the accuracy limitation of the inductance tester, it cannot distinguish the inductance fluctuations of different products in the same batch and the inductance fluctuations caused by the abnormality of the ground shielding layer, resulting in the inability to correctly judge whether the ground shielding layer has defects, and the reliability is poor.

[0005] Therefore, due to the special overall ground shielding layer design of the filter coil board, the prior art cannot use an inductance tester for direct testing, and can only perform inductance testing on the top layer inductor coil. However, due to the limited testing accuracy of the inductance tester, it is impossible to effectively distinguish between the inductance fluctuations of different products in the same batch and the inductance fluctuations caused by the abnormality of the ground shielding layer, resulting in the inability to effectively identify defective boards with defects in the ground shielding layer, and the inability to completely prevent the defective boards from flowing into the next process, resulting in poor reliability. Utility Model Content

[0006] In view of this, in order to solve the deficiencies and defects in the existing process technology, the utility model provides a coil plate structure that is easy to test, and the overall structure is simple, the investment is low, and it is easy to implement.

[0007] A coil plate structure that is easy to test includes a coil plate body, a ground wire shielding layer is provided on one side of the coil plate body, an opening is provided on one side of the ground wire shielding layer, the ground wire shielding layer forms two connection ends on both sides of the opening, a process edge is connected to one side of the coil plate body close to the opening, two test ports are provided on a side of the process edge close to the ground wire shielding layer, and each of the test ports is electrically connected to one of the connection ends.

[0008] In the above technical scheme, the ground wire shielding layer is used for filtering to ensure the normal function of the coil board, wherein the ground wire shielding layer is an integral line network and can be regarded as a coil for subsequent testing. An opening is provided on one side of the ground wire shielding layer, and the opening forms two connection ends in the ground wire shielding layer. The coil board body is provided with a process edge on one side of the opening, and the process edge is used to assist in the production and processing of the coil board, wherein two test ports are provided on the process edge, and the two test ports are respectively electrically connected to one of the connection ends to provide test points for the ground wire shielding layer. During the test, the inductance tester is connected to the two test ports, so that the ground wire shielding layer can be directly tested for inductance. By testing the inductance and changes of the ground wire shielding layer, it is convenient to identify defective and abnormal boards in the ground wire shielding layer, effectively preventing the defective boards from flowing into the next process, thereby improving reliability.

[0009] Among them, after the coil plate is formed, the process edge needs to be removed from the coil plate body. Therefore, the present application sets an opening on one side of the ground shielding layer to form a connection end of the ground shielding layer, and sets a test port electrically connected to the connection end on the process edge, thereby expanding the line network of the ground shielding layer to the process edge, so that the inductance test of the ground shielding layer as a whole can be performed through two test ports, so as to effectively find out defective boards. In addition, since the test port is set on the process edge, the process edge can be removed after the coil plate is tested, and the coil plate can be restored to the original design. Therefore, the present application can provide a test point for the ground shielding layer without affecting the original design structure of the coil plate. The overall structure is simple, the investment is low, and it is easy to implement.

[0010] As an optional technical solution of the present application, the test port is formed by opening a window on the solder resist layer.

[0011] In the above technical solution, the test port is formed by a solder mask window, which is convenient for processing the test port on the process edge when performing window processing on the coil board.

[0012] As an optional technical solution of the present application, a wire is provided between the test port and the connection end, and the test port and the connection end are electrically connected through the wire.

[0013] In the above technical solution, the test port is electrically connected to the connection end through a wire, and the inductance test of the ground wire shielding layer can be performed through the two test ports.

[0014] As an optional technical solution of the present application, a groove is provided at the connection between the coil plate body and the process edge, and the two test ports are provided on a side of the groove away from the coil plate body.

[0015] In the above technical solution, after the inductance test is completed, the process edge is cut off from the coil plate body along the cutting path. The provision of the cutting groove can more conveniently separate the process edge from the coil plate body.

[0016] As an optional technical solution of the present application, the two test ports are arranged tangent to the groove.

[0017] In the above technical solution, the test port is tangent to the groove, shortening the distance to the connection end and facilitating testing.

[0018] As an optional technical solution of the present application, the cross-section of the groove is V-shaped.

[0019] In the above technical solution, the cutting groove is a V-shaped groove, which is convenient for cutting. If necessary, the process edge can also be broken off from the cutting groove by manual operation.

[0020] As an optional technical solution of the present application, the ground wire shielding layer is a grid structure composed of multiple parallel grids.

[0021] In the above technical solution, the ground wire shielding layer is a grid structure, which is composed of a plurality of parallel and spaced grids. The grid structure can enhance the filtering effect and ensure the quality of signal transmission.

[0022] As an optional technical solution of the present application, the coil plate body includes a coil surface arranged opposite to the ground wire shielding layer.

[0023] In the above technical solution, the other side of the coil plate body opposite to the ground wire shielding layer is the coil surface, on which the inductor coil is arranged. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 It is a schematic structural diagram of one side of the shielding surface of a coil plate structure in one embodiment.

[0026] Figure 2 for Figure 1 A magnified image of position A in the figure (coloring is used to distinguish different areas).

[0027] Figure 3 for Figure 1 A magnified image of position B in the figure (coloring is used to distinguish different areas).

[0028] Figure 4 It is a schematic structural diagram of one side of the shielding surface of the coil plate body (after removing the process edge).

[0029] Figure 5 It is a schematic structural diagram of the coil surface side of the coil plate structure of one embodiment.

[0030] 1-coil board body; 11-ground wire shielding layer; 111-opening; 112-connection end; 12-coil surface; 2-process edge; 21-test port; 3-slot; 4-conductor. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0032] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0033] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0034] Please refer to Figures 1 to 5 In a preferred embodiment of the present application, a filter coil plate structure is provided, which includes a coil plate body, the top surface of the coil plate body is a coil surface, and an inductor coil (such as Figure 5 As shown), to meet the inductance requirements, the bottom surface of the coil plate body is a shielding surface, which is provided with a ground shielding layer to meet the filtering requirements, wherein an opening is provided on one side of the ground shielding layer, and the ground shielding layer forms two connection ends on both sides of the opening, and a process edge is connected to one side of the coil plate body close to the opening, and two test ports are provided on one side of the process edge close to the ground shielding layer, and each test port is electrically connected to a connection end.

[0035] In this embodiment, the ground shielding layer is an integral line network, which can be regarded as a special coil. An opening is provided on one side of the ground shielding layer, and the opening forms two connection ends in the ground shielding layer. The coil board body is provided with a process edge on one side of the opening, and the process edge is used to assist in the production and processing of the coil board. Two test ports are provided on the process edge, and the two test ports are respectively electrically connected to one of the connection ends, thereby providing a test point for the ground shielding layer. During the test, the inductance tester is connected to the two test ports, so that the ground shielding layer can be directly tested for inductance. By testing the inductance and changes of the ground shielding layer, it is convenient to identify defective and abnormal boards in the ground shielding layer to prevent them from flowing into the next process, thereby improving reliability.

[0036] like Figure 4 As shown, after the filter coil plate is formed, the auxiliary process edge needs to be removed from the coil plate body to obtain the final product. Therefore, the present application sets an opening on one side of the ground shielding layer to form a connection end of the ground shielding layer, and sets a test port electrically connected to the connection end on the process edge, thereby expanding the line network of the ground shielding layer to the process edge, so that the inductance test of the ground shielding layer as a whole can be performed through two test ports, and defective boards can be effectively found. In addition, since the test port is set on the process edge, the process edge can be removed after the coil plate is tested, and the coil plate can be restored to the original design. Therefore, the present application can provide a test point for the ground shielding layer without affecting the original design structure of the coil plate. The overall structure is simple, the investment is low, and it is easy to implement.

[0037] It should be noted that the specific length and width of the process edge are determined according to actual conditions. In this embodiment, the width of the process edge is the same as that of the coil plate body.

[0038] In some embodiments, the test port is formed by solder mask window processing. With this structure, the test port can be processed on the process edge when the coil plate body is subjected to window processing, so as to simplify the process and save time.

[0039] In some embodiments, a wire is provided between the test port and the connection end, and the test port and the connection end are electrically connected through the wire. The inductance tester can perform an inductance test on the ground wire shielding layer by connecting to the two test ports.

[0040] It is not limited that, in order to make the operation more convenient, in this embodiment, a wire is selected to realize the electrical connection between the test port and the connection end. In addition, other components can also be selected to realize the electrical connection between the test port and the connection end.

[0041] In some embodiments, a groove is provided at the connection between the coil plate body and the process edge, and two test ports are provided on the side of the groove away from the coil plate body. After the inductance test is completed, the process edge is cut off from the coil plate body along the groove path, and the groove can be provided to more conveniently separate the process edge from the coil plate body.

[0042] like Figure 2 As shown, in this embodiment, specifically, the wire passes through the groove. After the inductance test is completed, the wire can be removed and then the groove can be cut, or the wire can be directly cut together, and no specific limitation is made here.

[0043] In some embodiments, the two test ports are arranged tangent to the slots, which can shorten the distance between the test ports and the connection ends and facilitate the connection between the test ports and the ground wire shielding layer.

[0044] In some embodiments, the cross-section of the cut groove is V-shaped. The V-shaped structure facilitates cutting, and the process edge can be manually broken off from the cut groove when necessary.

[0045] like Figure 3 As shown, in some embodiments, the ground wire shielding layer is a grid structure, which is composed of a plurality of parallel and spaced grids. The grid structure can enhance the filtering effect of the ground wire shielding layer and ensure the quality of signal transmission. In addition to the above structure, other structures that meet the filtering requirements can also be selected. It is only necessary to ensure that the ground wire shielding layer is in the same network to form an integral circuit.

[0046] In the description of the present invention, it should be understood that terms such as "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0047] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0048] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0049] Although the utility model is described in conjunction with the above specific embodiments, it is obvious that those skilled in the art can make many substitutions, modifications and changes based on the above content. Therefore, all such substitutions, improvements and changes are included in the spirit and scope of the appended claims.

Claims

1. A coil plate structure that is easy to test, comprising a coil plate body, one side of the coil plate body is provided with a ground wire shielding layer, characterized in that: An opening is provided on one side of the ground wire shielding layer, and two connection ends are formed on both sides of the opening. A process edge is connected to the side of the coil plate body close to the opening, and two test ports are provided on a side of the process edge close to the ground wire shielding layer, and each of the test ports is electrically connected to one of the connection ends.

2. The coil plate structure for easy testing according to claim 1, characterized in that: The test port is formed by opening a window on the solder resist layer.

3. The coil plate structure for easy testing according to claim 1, characterized in that: A wire is provided between the test port and the connection end, and the test port and the connection end are electrically connected via the wire.

4. The coil plate structure for easy testing according to claim 1, characterized in that: A groove is provided at the connection between the coil plate body and the process edge, and the two test ports are arranged on a side of the groove away from the coil plate body.

5. The coil plate structure for easy testing according to claim 4, characterized in that: The two test ports are arranged tangent to the cutting groove.

6. The coil plate structure for easy testing according to claim 4, characterized in that: The cross section of the cut groove is V-shaped.

7. The coil plate structure for easy testing according to claim 1, characterized in that: The ground wire shielding layer is a grid structure composed of a plurality of parallel grids.

8. The coil plate structure for easy testing according to claim 1, characterized in that: The coil plate body includes a coil surface disposed opposite to the ground wire shielding layer.

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