IGBT module selective wave soldering device with efficient heat dissipation

Abstract

The utility model relates to the technical field of wave soldering, in particular to an efficient heat dissipation selective wave soldering device for an IGBT (Insulated Gate Bipolar Translator) module. The device comprises a base, a lifting frame is fixedly connected to the upper portion of the base, a pair of symmetrically-arranged limiting assemblies are arranged at the top of the base, a driving assembly is fixedly connected to the bottom of the lifting frame, a selective welding assembly is fixedly connected to one side of the driving assembly, and the driving assembly is used for driving the selective welding assembly to move. Selective welding is conducted on the to-be-welded IGBT module fixed between the limiting assemblies through the selective welding assembly; according to the IGBT module selective wave soldering device with the efficient heat dissipation function, the arranged driving assembly is used for driving the selective soldering assembly to move, selective soldering is conducted on the to-be-welded IGBT module fixed between the limiting assemblies through the selective soldering assembly, and meanwhile the limiting assemblies are used for fixing the to-be-welded IGBT module; and carrying out fixed-point welding on the IGBT module by selecting the welding assembly.

Description

Technical Field

[0001] The utility model relates to the technical field of wave soldering, and more specifically, to a selective wave soldering device for an IGBT module with efficient heat dissipation. Background Technique

[0002] The selective wave soldering device for an IGBT module with efficient heat dissipation is a device specifically designed to improve the heat dissipation performance of the IGBT module and ensure precise welding quality at the same time. The following are some key features and functions of such a device: selective wave soldering technology, efficient heat dissipation design, precise control, user-friendliness and automation, and quality assurance. By adopting selective wave soldering technology and efficient heat dissipation design, this device can significantly improve the heat dissipation performance and welding quality of the IGBT module, providing a more reliable and efficient solution for power electronic devices and systems.

[0003] Regarding selective wave soldering devices, there are many existing technologies, for example:

[0004] Chinese Patent Publication No. CN212577735U discloses a full-automatic selective wave soldering device, which includes a transportation guide rail, provided with a spraying fixed position, a preheating fixed position, and a welding fixed position, and is provided with a sliding tray that slides along the inlet plate guide rail and the outlet plate guide rail. The printed circuit board to be welded is placed on the sliding tray; a flux spraying mechanism, located at the spraying fixed position under the sliding tray, includes: a vertical double-axis moving table and a flux sprayer; a double-layer preheating mechanism, located at the preheating fixed position, includes: an upper preheater and a lower preheater; an upper preheater; a selective soldering mechanism, located at the welding fixed position under the sliding tray, includes: a vertical three-axis moving table and a welding tin furnace; a controller, connected to the transportation guide rail, the flux spraying mechanism, the double-layer preheating mechanism, and the selective soldering mechanism. The utility model can achieve flux saving, energy consumption reduction, and has an automatic wave soldering with strong consistency, repeatability, reliability, and traceability.

[0005] During the use of existing selective wave soldering devices, generally, only the driving mechanism can drive the welding mechanism to move along the set track, so as to perform selective soldering on the fixed integrated circuit board, and it is difficult to perform welding operations on certain specific parts of the IGBT module, and it is impossible to achieve "one machine with multiple functions". For example, a full-automatic selective wave soldering device proposed in the above patent moves along the transportation guide rail through the selective soldering mechanism to perform selective soldering on the printed circuit boards along the way, and it cannot meet the welding requirements of the IGBT module that requires both selective and fixed-point soldering methods at the same time.

[0006] In view of this, we propose a selective wave soldering device for an IGBT module with efficient heat dissipation to improve the deficiencies of the existing technology. Summary of the Utility Model

[0007] The purpose of the utility model is to provide a selective wave soldering device for IGBT modules with efficient heat dissipation, so as to solve the problems put forward in the above-mentioned background technology.

[0008] To achieve the above purpose, the utility model provides a selective wave soldering device for IGBT modules with efficient heat dissipation, including a base. A pick-up frame is fixedly connected above the base. A pair of symmetrically arranged limiting components are arranged on the top of the base. A driving component is fixedly connected to the bottom of the pick-up frame. A selective soldering component is fixedly connected to one side of the driving component. The driving component is used to drive the selective soldering component to move. The selective soldering component is used to selectively solder the IGBT module to be welded fixed between the limiting components. At the same time, the limiting component is used to fix the IGBT module to be welded, and the selective soldering component is used to perform fixed-point soldering on the IGBT module.

[0009] As a further improvement of this technical solution, the limiting component includes a pair of symmetrically arranged limiting seats in the vertical direction. The two limiting seats are on the side close to each other.

[0010] As a further improvement of this technical solution, a plurality of limiting rods are fixedly connected to the edge of the lower limiting seat. The upper limiting seat is slidably connected to the limiting rods. A spring is arranged between the two limiting seats around the limiting rods.

[0011] As a further improvement of this technical solution, the driving component includes a slide rail fixedly connected to the bottom of the pick-up frame. A sliding seat is slidably connected to the bottom of the slide rail. A plurality of pulleys are rotatably connected in the sliding seat. The pulleys are driven by a servo motor.

[0012] As a further improvement of this technical solution, the selective soldering component includes a mounting plate fixedly connected to one side of the sliding seat. A reciprocating ring is slidably connected to the side of the mounting plate away from the sliding seat. A single-sided driving wheel is meshed in the reciprocating ring. A welding torch is fixedly connected to the bottom of the reciprocating ring. The single-sided driving wheel is driven by a servo motor.

[0013] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0014] In this selective wave soldering device for IGBT modules with efficient heat dissipation, the driving component is provided to drive the selective soldering component to move. The selective soldering component is used to selectively solder the IGBT module to be welded fixed between the limiting components. At the same time, the limiting component is used to fix the IGBT module to be welded, and the selective soldering component is used to perform fixed-point soldering on the IGBT module. Description of the Drawings

[0015] Figure 1Schematic diagram of the overall structure of an embodiment of the present utility model;

[0016] Figure 2 Sectional view of the overall structure of an embodiment of the present utility model;

[0017] Figure 3 Structural diagram of the limit component of an embodiment of the present utility model;

[0018] Figure 4 Structural diagram of the selective welding component of an embodiment of the present utility model;

[0019] Figure 5 Of an embodiment of the present utility model Figure 4 Enlarged view of part A in

[0020] The meanings of each label in the figure are as follows:

[0021] 10, base; 11, pick-up frame;

[0022] 20, limit component; 21, limit seat; 22, limit wheel; 23, gear; 24, rack; 25, limit rod; 26, spring;

[0023] 30, drive component; 31, slide rail; 32, slide seat; 33, pulley;

[0024] 40, selective welding component; 41, reciprocating ring; 42, single-sided drive wheel; 43, welding torch. Detailed implementation manners

[0025] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0026] Embodiment

[0027] Please refer to Figures 1 - 5 As shown, this embodiment provides an IGBT module selective wave soldering device with efficient heat dissipation, including a base 10, a pick-up frame 11 is fixedly connected above the base 10, a pair of symmetrically arranged limit components 20 are provided on the top of the base 10, a drive component 30 is fixedly connected to the bottom of the pick-up frame 11, a selective welding component 40 is fixedly connected to one side of the drive component 30, the drive component 30 is used to drive the selective welding component 40 to move, and the selective welding component 40 is used to selectively weld the IGBT module to be welded fixed between the limit components 20. At the same time, the limit component 20 is used to fix the IGBT module to be welded, and the selective welding component 40 is used to perform spot welding on the IGBT module.

[0028] Working principle: When the IGBT module selective wave soldering device with efficient heat dissipation provided by the utility model is specifically used, the driving component 30 is set to drive the selective soldering component 40 to move. The selective soldering component 40 selectively solders the IGBT module to be soldered fixed between the limiting components 20. At the same time, the limiting component 20 is used to fix the IGBT module to be soldered, and the selective soldering component 40 performs fixed-point soldering on the IGBT module.

[0029] In order to drive the IGBT module to move while fixing the IGBT module to be soldered, therefore, the limiting component 20 includes a pair of symmetrically arranged limiting seats 21 in the vertical direction. On the side where the two limiting seats 21 are close to each other; several limiting rods 25 are fixedly connected to the edge of the lower limiting seat 21, and the upper limiting seat 21 is slidably connected to the limiting rods 25. A spring 26 is arranged between the two limiting seats 21 around the limiting rods 25; when selective wave soldering of the IGBT module to be soldered is required, the power supply of the limiting component 20 is turned off, and the IGBT module is placed between two rows of limiting wheels 22. Under the action of the self-weight of the upper limiting component 20, the position of the IGBT module is fixed. Then, the power supplies of the driving component 30 and the selective soldering component 40 are turned on, and the driving component 30 drives the selective soldering component 40 to perform selective wave soldering on the IGBT module. When fixed-point soldering of a batch of IGBT modules with the same specifications is required, the power supply of the driving component 30 is turned off, and the power supplies of the limiting component 20 and the selective soldering component 40 are turned on. The servo motor drives the limiting wheel 22 coaxially connected to its output shaft to rotate. The limiting wheel 22 drives the gear 23 coaxially connected to itself to rotate. This gear 23 drives the rack 24 outside it to rotate, and the rack 24 then drives the remaining gears 23 inside itself to rotate. The remaining gears 23 drive the limiting wheels 22 coaxially connected to themselves to rotate, thereby realizing the synchronous rotation of a row of limiting wheels 22 at the same horizontal height. Under the action of the friction force between the limiting wheels 22 and the IGBT module, the limiting wheels 22 drive the IGBT module to move forward, and then the selective soldering component 40 solders the same point on the IGBT module during its movement.

[0030] Considering that the selective soldering component 40 needs to be driven to move, therefore, the driving component 30 includes a slide rail 31 fixedly connected to the bottom of the pick-up frame 11. A slide seat 32 is slidably connected to the bottom of the slide rail 31. Several pulleys 33 are rotatably connected inside the slide seat 32, and the pulleys 33 are driven by a servo motor; after the power is turned on, the servo motor drives the pulley 33 coaxially connected to its output shaft to rotate. Under the action of the friction force between the pulley 33 and the slide rail 31, the slide seat 32 is driven to drive the selective soldering component 40 to move along the slide rail 31.

[0031] In order to perform selective soldering on the IGBT module to be soldered fixed between the limiting components 20, therefore, the selective soldering component 40 includes a mounting plate fixedly connected to one side of the sliding seat 32. A reciprocating ring 41 is slidably connected to the side of the mounting plate away from the sliding seat 32. A single-sided driving wheel 42 is meshed inside the reciprocating ring 41. A soldering gun 43 is fixedly connected to the bottom of the reciprocating ring 41. The single-sided driving wheel 42 is driven by a servo motor. After the power is turned on, the servo motor drives the single-sided driving wheel 42 coaxially connected to its output shaft to rotate. The single-sided driving wheel 42 drives the reciprocating ring 41 to perform up-and-down reciprocating motion. The reciprocating ring 41 then drives the soldering gun 43 to perform selective wave soldering on the IGBT module to be soldered.

[0032] When the selective wave soldering device for the IGBT module with efficient heat dissipation provided in the present utility model is specifically used, the driving component 30 is provided to drive the selective soldering component 40 to move. Specifically, after the power is turned on, the servo motor drives the pulley 33 coaxially connected to its output shaft to rotate. Under the action of the friction force between the pulley 33 and the slide rail 31, the sliding seat 32 is driven to drive the selective soldering component 40 to move along the slide rail 31. The selective soldering component 40 performs selective soldering on the IGBT module to be soldered fixed between the limiting components 20. Specifically, after the power is turned on, the servo motor drives the single-sided driving wheel 42 coaxially connected to its output shaft to rotate. The single-sided driving wheel 42 drives the reciprocating ring 41 to perform up-and-down reciprocating motion. The reciprocating ring 41 then drives the soldering gun 43 to perform selective wave soldering on the IGBT module to be soldered. At the same time, the limiting component 20 is used to fix the IGBT module to be soldered. Specifically, when selective wave soldering needs to be performed on the IGBT module to be soldered, the power of the limiting component 20 is turned off, and the IGBT module is placed between two rows of limiting wheels 22. Under the action of the self-gravity of the limiting component 20 located above, the position of the IGBT module is fixed. Then, the power of the driving component 30 and the selective soldering component 40 is turned on, and the driving component 30 drives the selective soldering component 40 to perform selective wave soldering on the IGBT module. When fixed-point soldering needs to be performed on a batch of IGBT modules with the same specifications, the power of the driving component 30 is turned off, and the power of the limiting component 20 and the selective soldering component 40 is turned on. The servo motor drives the limiting wheel 22 coaxially connected to its output shaft to rotate. The limiting wheel 22 drives the gear 23 coaxially connected to itself to rotate. This gear 23 drives the peripheral rack 24 to rotate. The rack 24 then drives the remaining gears 23 inside itself to rotate. The remaining gears 23 drive the limiting wheels 22 coaxially connected to themselves to rotate, thus realizing the synchronous rotation of a row of limiting wheels 22 at the same horizontal height. Under the action of the friction force between the limiting wheels 22 and the IGBT module, the limiting wheels 22 drive the IGBT module to move forward. Then, during its movement, the selective soldering component 40 solders the same point on the IGBT module. The selective soldering component 40 performs fixed-point soldering on the IGBT module.

[0033] The foregoing has shown and described the basic principles, main features and advantages of the present utility model. Those skilled in the art should understand that the present utility model is not limited by the above-mentioned embodiments, and the above-mentioned embodiments and the descriptions in the specification are only preferred examples of the present utility model, and are not used to limit the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will also have various changes and improvements, and these changes and improvements fall within the scope of the present utility model claimed. The scope of protection claimed by the present utility model is defined by the appended claims and their equivalents.

Claims

1. An IGBT module selective wave soldering device with high efficiency heat dissipation, characterized by: The invention comprises a base (10), wherein a cantilever frame (11) is fixedly connected to the top of the base (10), a pair of symmetrically arranged limit assemblies (20) are arranged on the top of the base (10), a driving assembly (30) is fixedly connected to the bottom of the cantilever frame (11), a selective welding assembly (40) is fixedly connected to one side of the driving assembly (30), the driving assembly (30) is used to drive the selective welding assembly (40) to move, and selective welding is performed on the IGBT module to be welded fixed between the limit assemblies (20) through the selective welding assembly (40), and at the same time, the limit assemblies (20) are used to fix the IGBT module to be welded, and the IGBT module is spot welded through the selective welding assembly (40).

2. The IGBT module selective wave soldering device with high efficiency heat dissipation according to claim 1 is characterized in that: The limiting assembly (20) comprises a pair of limiting seats (21) symmetrically arranged in a vertical direction, and the two limiting seats (21) are rotatably connected to a plurality of limiting wheels (22) on a side close to each other, and a plurality of limiting wheels (22) are coaxially connected to a gear (23) on the same side, and a plurality of gears (23) are meshed with racks (24) on their peripheries, and the gears (23) are driven by a servo motor.

3. The IGBT module selective wave soldering device with high efficiency heat dissipation according to claim 2 is characterized in that: A plurality of limit rods (25) are fixedly connected to the edge of the limit seat (21) located at the bottom, the limit seat (21) located at the top is slidably connected to the limit rod (25), and a spring (26) is provided on the periphery of the limit rod (25) between the two limit seats (21).

4. The IGBT module selective wave soldering device with high efficiency heat dissipation according to claim 1, characterized in that: The driving assembly (30) comprises a slide rail (31) fixedly connected to the bottom of the elevated frame (11); a slide seat (32) is slidably connected to the bottom of the slide rail (31); a plurality of pulleys (33) are rotatably connected inside the slide seat (32); and the pulleys (33) are driven by a servo motor.

5. The IGBT module selective wave soldering device with high efficiency heat dissipation according to claim 4 is characterized in that: The selective welding assembly (40) comprises a mounting plate fixedly connected to one side of a slide seat (32); a reciprocating ring (41) is slidably connected to the side of the mounting plate away from the slide seat (32); a single-sided driving wheel (42) is meshed inside the reciprocating ring (41); a welding gun (43) is fixedly connected to the bottom of the reciprocating ring (41); and the single-sided driving wheel (42) is driven by a servo motor.

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