Automatic cleaning device for selective wave soldering nozzle

Abstract

The utility model discloses an automatic cleaning device for a selective wave soldering nozzle. The automatic cleaning device comprises a shell assembly, a power transmission assembly, a rotating assembly and a cleaning assembly. An accommodating space is formed in the shell assembly; the power transmission assembly is arranged in the shell and comprises a power source and a transmission structure in transmission connection with the power source. The rotating assembly is connected with the power transmission assembly; the cleaning assembly comprises a high-temperature-resistant cleaning ball, a cleaning ball box, a heat insulation disc, a ball box base and a ball box cover, the ball box base is connected with the rotating assembly and can be driven by the rotating assembly to rotate, an open mounting space is formed in the cleaning ball box, and the high-temperature-resistant cleaning ball is arranged in the mounting space. The selective wave soldering machine has the advantages that residues on the nozzle are automatically cleaned through the automatic cleaning device, shutdown and manual operation are not needed, the use efficiency of the selective wave soldering machine is improved, cleanliness of the nozzle is guaranteed, and the welding quality is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of automation equipment, in particular to a selective wave soldering nozzle automatic cleaning device. Background Art

[0002] Selective wave soldering forms a precise annular wave crest to perform soldering at specific points by pumping solder from the nozzle. Since soldering parameters can be customized for each solder joint, the accuracy of PCBA processing can be improved. The size of the nozzle of the selective wave soldering can accurately control the area of ​​the soldering area during operation. The peak strength of the tin wave pumped out by the nozzle directly affects the tin penetration of the through hole during soldering. Therefore, to ensure stable and good soldering quality, no oxide residue is allowed on the nozzle of the selective wave soldering. To ensure smooth nozzle spraying and stable tin wave, the tin slag residue on the nozzle must be removed in time.

[0003] At present, the cleaning of selective wave soldering nozzles is mainly completed by regular shutdown maintenance. This cleaning method requires shutdown, which will reduce the efficiency of the selective wave soldering equipment and increase production costs. Because shutdown will significantly reduce the efficiency of the equipment, the frequency of shutdown maintenance cannot be too high, so the oxide residue in the nozzle cannot be cleaned in time, which will reduce the quality of welding.

[0004] Therefore, the prior art has defects and needs to be improved. Utility Model Content

[0005] The utility model aims to overcome the deficiencies of the prior art and provide a selective wave soldering nozzle automatic cleaning device.

[0006] The technical solution of the utility model is as follows: The utility model provides a selective wave soldering nozzle automatic cleaning device, comprising: a shell assembly, a power transmission assembly, a rotating assembly and a cleaning assembly; an accommodating space is formed in the shell assembly; the power transmission assembly is arranged in the shell, including a power source and a transmission structure connected to the power source; the rotating assembly is connected to the power transmission assembly; the cleaning assembly comprises: a high temperature resistant cleaning ball, a cleaning ball box, a heat insulation disk, a ball box base and a ball box cover, the ball box base is connected to the rotating assembly and can rotate under the drive of the rotating assembly, one side of the heat insulation disk is connected to the ball box base, and the other side is connected to the cleaning ball box, an opening installation space is formed in the cleaning ball box, the high temperature resistant cleaning ball is arranged in the installation space, a plurality of installation columns are provided on the heat insulation disk, the installation columns extend into the installation space for positioning the high temperature resistant cleaning ball, and the ball box cover is arranged at the opening of the cleaning ball box.

[0007] Further, the transmission structure includes: a driving gear, a first driven gear, and a second driven gear. The driving gear is connected to the power source, and the first driven gear meshes with the driving gear and the second driven gear.

[0008] Further, the power source is a motor, and the driving gear is arranged on the output shaft of the motor.

[0009] Further, the rotating assembly includes a rotating shaft, and the rotating shaft is respectively connected to the second driven gear and the ball box base.

[0010] Further, the rotating assembly further includes a shaft sleeve and a plurality of bearings, and the shaft sleeve and the bearings are sleeved on the rotating shaft.

[0011] Further, the housing assembly includes a main housing and an upper cover arranged on the main housing.

[0012] Further, the housing assembly further includes an avoidance block, and the avoidance block is arranged on one side surface of the main housing.

[0013] With the above solution, the beneficial effects of the present utility model are as follows: The automatic cleaning device automatically cleans the residues on the nozzle, eliminating the need for manual operation during downtime, improving the use efficiency of the selective wave soldering machine, ensuring the cleanliness of the nozzle, and enhancing the welding quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a schematic structural diagram of an embodiment of the present utility model Figure 1 .

[0015] Figure 2 is a schematic structural diagram of an embodiment of the present utility model Figure 2 .

[0016] Figure 3 is a schematic structural diagram of the power transmission assembly of an embodiment of the present utility model. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0017] The present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0018] Please refer to Figures 1 to 3 , in this embodiment, the present utility model provides a selective wave soldering nozzle automatic cleaning device, including: a housing assembly 1, a power transmission assembly 2, a rotating assembly 3, and a cleaning assembly 4.

[0019] The housing assembly 1 is provided with a storage space for accommodating and installing the power transmission assembly 2 and the rotating assembly 3. The housing assembly 1 comprises a main housing 11, an upper cover 12 arranged on the main housing 11, and a avoidance block 13 arranged on a side surface of the main housing 11. The avoidance block 13 can ensure that a clearance is left between the entire nozzle automatic cleaning device and the installation line body, thereby ensuring the unimpeded rotation and operation of the cleaning assembly 4. The power transmission assembly is arranged in the housing, and comprises a power source 21 and a transmission structure connected to the power source 21. The transmission structure comprises: a driving gear 22, a first driven gear 23 and a second driven gear 24, the driving gear 22 is connected to the power source 21, and the first driven gear 23 is meshed with the driving gear 22 and the second driven gear 24. The power source 21 is a motor, and the driving gear 22 is arranged on the output shaft of the motor.

[0020] The rotating assembly 3 is connected to the power transmission assembly. The rotating assembly 3 includes a rotating shaft 31, a sleeve 32 and a plurality of bearings 33. The rotating shaft 31 is respectively connected to the second driven gear 24 and the ball box base 41 to transmit power from the second driven gear 24 to the cleaning assembly 4. The sleeve 32 and the bearings 33 are sleeved on the rotating shaft 31 to realize the installation and positioning of the rotating shaft 31.

[0021] The cleaning component 4 includes: a high temperature resistant cleaning ball (such as a steel wool ball, not shown), a cleaning ball box 43, a heat insulating disk 42, a ball box base 41 and a ball box cover 44. The ball box base 41 is connected to the rotating component 3 and can rotate under the drive of the rotating component 3. One side of the heat insulating disk 42 is connected to the ball box base 41, and the other side is connected to the cleaning ball box 43. The heat insulating disk 42 can play a role in heat insulation to prevent high temperature from being transmitted to the rotating component 3 and the power transmission component 2, etc., which may cause damage to the automatic cleaning device. An opening is formed in the cleaning ball box 43. The installation space of the opening, the high temperature resistant cleaning ball is arranged in the installation space, a plurality of installation posts 45 are provided on the insulation disk 42, and the installation posts 45 extend into the installation space for positioning the high temperature resistant cleaning ball, ensuring that the high temperature resistant cleaning ball can rotate normally to achieve the corresponding cleaning function, the ball box cover 44 is arranged at the opening of the cleaning ball box 43 to prevent the high temperature resistant cleaning ball from falling out of the installation space during work, and the middle part of the ball box cover 44 is hollowed out to ensure that the nozzle on the tin furnace can extend into the cleaning ball box 43 to be cleaned by the high temperature resistant cleaning ball.

[0022] Please continue to refer to Figures 1 to 3, in this solution, during operation, when the selective wave soldering machine is cleaning the tin, the nozzle extends into the cleaning ball box 43, and the power transmission assembly 2 works to drive the cleaning assembly 4 to rotate through the rotating assembly 3, so that the solder residues on the surface of the nozzle are cleaned by the rotating high-temperature cleaning balls, realizing automatic cleaning of the nozzle without stopping the machine for manual operation.

[0023] In summary, the beneficial effects of this solution are as follows: The automatic cleaning device automatically cleans the residues on the nozzle, eliminating the need for manual operation during machine stoppage, improving the usage efficiency of the selective wave soldering machine, ensuring the cleanliness of the nozzle, and enhancing the welding quality.

[0024] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims

1. A selective wave soldering nozzle automatic cleaning device, characterized in that: include: A housing assembly, a power transmission assembly, a rotating assembly and a cleaning assembly; an accommodating space is formed in the housing assembly; The power transmission assembly is arranged in the housing, and includes a power source and a transmission structure connected to the power source; the rotating assembly is connected to the power transmission assembly; The cleaning assembly includes: a high-temperature resistant cleaning ball, a cleaning ball box, a heat-insulating disk, a ball box base and a ball box cover. The ball box base is connected to the rotating assembly and can rotate under the drive of the rotating assembly. One side of the heat-insulating disk is connected to the ball box base, and the other side is connected to the cleaning ball box. An open installation space is formed in the cleaning ball box. The high-temperature resistant cleaning ball is arranged in the installation space. A plurality of installation columns are provided on the heat-insulating disk. The installation columns extend into the installation space for positioning the high-temperature resistant cleaning ball. The ball box cover is arranged at the opening of the cleaning ball box.

2. The selective wave soldering nozzle automatic cleaning device according to claim 1, characterized in that: The transmission structure comprises: a driving gear, a first driven gear and a second driven gear, the driving gear is connected to the power source, and the first driven gear is meshed with the driving gear and the second driven gear.

3. The selective wave soldering nozzle automatic cleaning device according to claim 2, characterized in that: The power source is a motor, and the driving gear is arranged on the output shaft of the motor.

4. The selective wave soldering nozzle automatic cleaning device according to claim 2, characterized in that: The rotating assembly has a rotating shaft, and the rotating shaft is respectively connected to the second driven gear and the ball box base.

5. The selective wave soldering nozzle automatic cleaning device according to claim 4, characterized in that: The rotating assembly also includes a shaft sleeve and a plurality of bearings, and the shaft sleeve and the bearing sleeve are arranged on the rotating shaft.

6. The selective wave soldering nozzle automatic cleaning device according to any one of claims 1 to 5, characterized in that: The housing assembly comprises a main housing and an upper cover arranged on the main housing.

7. The selective wave soldering nozzle automatic cleaning device according to claim 6, characterized in that: The housing assembly further comprises a avoidance block, and the avoidance block is arranged on a side surface of the main housing.

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