Near-order vacuum etching machine

Abstract

The utility model relates to a near-order vacuum etching machine, and relates to the field of mechanical equipment manufacturing, the near-order vacuum etching machine comprises a machine body, the machine body is provided with an upper conveying roller and a lower conveying roller to clamp and convey a workpiece, two sides of the workpiece are provided with an upper pressurizing nozzle and a lower pressurizing nozzle to spray water flow, and the nozzles are connected with a liquid medicine tank through a water outlet pipe. A vacuum suction knife is further arranged on the machine body and connected with the same liquid medicine tank through a water suction pipe, and water circulation is achieved. Particularly, the optimal distance between the upper pressurizing nozzle or the lower pressurizing nozzle and the plate surface of the workpiece is kept between 30 mm and 60 mm, so that the etching efficiency and effect are improved.

Description

Technical Field

[0001] This application relates to the technical field of mechanical equipment manufacturing and automation, and particularly to a near-step vacuum etching machine. Background Art

[0002] Vacuum etching technology is widely used in the fine processing of various material surfaces, such as semiconductor wafers, optical elements, etc. With the progress of technology, the requirements for processing accuracy and efficiency are increasing day by day. There are requirements such as increasing the etching factor of the production board circuit and reducing the occurrence of short circuits between dense circuits. This has prompted the need to continuously optimize the technology and structure of the vacuum etching machine. Most of the existing vacuum etching machines adopt a fixed nozzle design and cannot adjust the distance between the nozzle and the workpiece, resulting in difficulties in accurately controlling the water flow impact force and etching depth.

[0003] Therefore, based on the above problems, the existing technology needs to be improved. Summary of the Utility Model

[0004] The purpose of this application is to achieve precise adjustment of the distance between the nozzle and the workpiece, and also to have a simple and efficient water circulation system to reduce energy consumption, improve production efficiency and product quality.

[0005] The above technical purpose of this application is achieved through the following technical solutions: A near-step vacuum etching machine includes a machine body (1). On the machine body (1), there are upper conveying rollers (2) and lower conveying rollers (3). The upper conveying rollers (2) and the lower conveying rollers (3) are used to clamp and transport the workpiece. Corresponding to both sides of the workpiece, on the machine body (1), there are an upper pressure nozzle (4) and a lower pressure nozzle (5) for spraying water onto the workpiece. The upper pressure nozzle (4) and the lower pressure nozzle (5) are connected to a water outlet pipe (6). The other end of the water outlet pipe (6) far from the upper pressure nozzle (4) or the lower pressure nozzle (5) is connected to a chemical liquid tank (7). On the machine body (1), there is a vacuum suction knife (8). The vacuum suction knife (8) is connected to a water suction pipe (9). The other end of the water suction pipe (9) far from the vacuum suction knife (8) is connected to a Venturi tube (10). The set distance (11) between the upper pressure nozzle (4) or the lower pressure nozzle (5) and the workpiece plate surface is 30 mm to 60 mm.

[0006] By adopting the above technical solutions, the upper conveying roller and the lower conveying roller stably clamp and transport the workpiece, and cooperate with the upper pressurizing nozzle and the lower pressurizing nozzle to spray water flow on the workpiece at a specific distance, which can ensure that the action of the water flow on the workpiece surface during the etching process is uniform, thereby improving the accuracy and uniformity of etching, and reducing the problems of line deviation and uneven etching. Optimize the etching efficiency: the nozzle-to-workpiece plate spacing of 30mm - 60mm can achieve the best water flow impact effect, effectively improve the etching speed, complete the etching of more workpieces in the same time, and improve the production efficiency. Through the action of the Venturi tube, the water flow speed and pressure distribution in the water suction pipe are optimized, so that the vacuum suction knife can more efficiently suck the etching solution on the workpiece surface, preventing the surface residual solution from blocking the sprayed solution and causing the spray to not effectively spray on the plate surface; thereby improving the etching uniformity and efficiency of the upper surface of the workpiece. When the vacuum suction knife sucks the residual etching solution on the workpiece surface, it also sucks in some air. Because the oxygen in the air is fully mixed with the solution, the oxygen will fully react with the solution and improve the regeneration ability of the solution, reducing the amount of oxidant used for solution regeneration and saving costs; the coordinated work of the entire system, including stable workpiece conveying, precise water flow spraying, and effective sucking away of the etching solution on the workpiece surface, can reduce the fluctuations and uncertainties during the etching process and ensure the stability of the etching quality.

[0007] Optionally, the upper pressurizing nozzle and the lower pressurizing nozzle are fan-shaped nozzles.

[0008] By adopting the above technical solutions, the unique shape of the fan-shaped nozzle enables the sprayed liquid or gas to be more evenly distributed in the target area. As a pressurizing nozzle, it can work stably under a certain pressure and provide a stable spraying effect. Due to more precise spraying and more uniform coverage, it can reduce the waste of resources and improve the utilization efficiency in some application scenarios. The angle of the fan shape and the spraying pressure can be adjusted according to specific requirements to adapt to different working environments and task requirements. In some occasions that require specific action effects, it can ensure sufficient contact with the target and enhance the effect.

[0009] Optionally, a filter is provided in the water outlet pipe.

[0010] By adopting the above technical solutions, the filter can remove impurities and particulate matters in the water, preventing these impurities from adhering to the workpiece surface during the etching process and affecting the accuracy and quality of etching. Reducing the entry of impurities into the upper pressurizing nozzle and the lower pressurizing nozzle can reduce the risk of nozzle blockage and wear, thereby extending the service life of the nozzle and reducing the equipment maintenance and replacement costs. Filtering out foreign matters in the water can ensure that the water flow in the water outlet pipe is smoother, avoiding unstable water flow caused by foreign matter blockage, and thus ensuring the stability of the water flow pressure and flow rate during the etching process. Reducing the impurities entering the vacuum suction knife can reduce its failure probability and enable it to work more effectively.

[0011] Optionally, a water pump is provided on the medicine water tank. One end of the water pump is connected to the side of the medicine water tank close to the ground, the other end of the water pump is connected to the water inlet of the Venturi tube, the water outlet of the Venturi tube is communicated with the medicine water tank, and the water suction port of the Venturi tube is connected to the water suction pipe.

[0012] By adopting the above technical solution, the water in the medicine water tank is continuously sucked and circulated by the water pump, so that the water can circulate more fully, improving the utilization rate of water resources and reducing the water consumption cost during the etching process. The continuous water flow circulation helps to evenly mix the water in the medicine water tank, avoiding local water quality differences, so as to ensure that the water entering the etching system has stable quality and characteristics. The stable water circulation can maintain the stability of the water pressure and water flow in the system, reducing the impact on the etching process caused by water pressure fluctuations and improving the stability of the etching quality. The movement of the water flow can reduce the possibility of impurities in the water precipitating and accumulating at the bottom of the medicine water tank, reducing the risk of pipeline blockage and equipment damage. During long-term operation, it can avoid the phenomenon of water temperature stratification in the medicine water tank, making the water temperature entering the etching system relatively stable, which helps to control the temperature conditions of the etching reaction.

[0013] Optionally, a pressure regulating valve is further provided on the water outlet pipe.

[0014] By adopting the above technical solution, the pressure regulating valve can accurately regulate the pressure in the water outlet pipe to adapt to different working requirements. Whether it is necessary for high-pressure strong jet or low-pressure gentle water outlet, it can be easily achieved through the regulating valve. The stable and appropriate water pressure helps to extend the service life of the equipment connected to the water outlet pipe. Avoiding the impact and damage of too high pressure on the equipment, reducing the maintenance and replacement costs. In some works with specific requirements for water pressure, such as specific cleaning operations or irrigation methods, more ideal working effects can be achieved by adjusting the pressure. It can be adjusted to the appropriate pressure according to actual needs, avoiding unnecessary energy consumption, achieving energy saving and efficient operation. Preventing safety hazards such as water pipe rupture and water leakage caused by too high water pressure, ensuring the safety of the working environment. Under different working conditions, such as changes in water source pressure or adjustment of work processes, the pressure regulating valve can quickly adjust the water outlet pipe pressure to maintain the stable operation of the system. It helps to maintain the pressure balance of the entire water outlet system, reducing the adverse effects caused by pressure fluctuations on the system and improving the stability and reliability of the system.

[0015] Optionally, a pressure gauge is further provided on the water outlet pipe.

[0016] By adopting the above technical solutions, the pressure gauge enables users to understand the pressure situation in the outlet pipe in real time and promptly grasp the pressure changes. This helps prevent safety problems such as system failures and pipeline ruptures caused by excessive or too low pressure. It provides an accurate basis for the operation of the pressure regulating valve, making the pressure regulation more precise and effective. When the system malfunctions, by observing the reading of the pressure gauge, it can assist in judging the cause and location of the fault. According to the pressure data shown by the pressure gauge, the entire system can be optimized and improved to enhance the working efficiency and stability of the system. It provides a reference for formulating a reasonable equipment maintenance plan. For example, when the pressure remains high or unstable for a long time, maintenance and repair can be arranged in advance. It enables the operators to have a clear understanding of the operating state of the system and enhances their confidence in the reliability of the system.

[0017] In summary, the present application has at least the following beneficial effects:

[0018] 1. The present application adopts a design of spraying at a short distance from the workpiece surface by the nozzle, enabling the water flow to impact the workpiece at the best angle and strength, thus obtaining higher etching accuracy and efficiency.

[0019] 2. The present application preferably adopts innovative designs such as a fan-shaped nozzle, a filter, a Venturi tube, and a dynamic water circulation system, which simplifies the equipment structure, reduces energy consumption, and at the same time improves the stability of water quality and the reliability of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a schematic structural diagram of a near-step vacuum etching machine.

[0021] REFERENCE SIGNS

[0022] 1, body; 2, upper conveying roller; 3, lower conveying roller; 4, upper pressurizing nozzle; 5, lower pressurizing nozzle; 6, outlet pipe; 7, chemical solution tank; 8, vacuum suction knife; 9, water suction pipe; 10, Venturi tube; 11, set distance; 12, filter; 13, water pump; 14, pressure regulating valve; 15, pressure gauge. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0023] The following further describes the present application in detail with reference to the drawings.

[0024] In this embodiment, refer to Figure 1, A near-stage vacuum etching machine mainly includes a machine body 1, which is equipped with an upper conveying roller 2 and a lower conveying roller 3. These two groups of rollers cooperate to stably clamp and convey workpieces. On both sides of the path through which the workpiece passes, the upper pressure nozzle 4 and the lower pressure nozzle 5 are arranged on the machine body 1. The upper pressure nozzle 4 and the lower pressure nozzle 5 are connected to the chemical solution tank 7 through a water outlet pipe 6. A suction water pump is provided on the water outlet pipe 6 to pump the chemical solution in the chemical solution tank 7 into the water outlet pipe 6 and transport the chemical solution to the upper pressure nozzle 4 and the lower pressure nozzle 5 through the water outlet pipe 6.

[0025] The upper pressure nozzle 4 and the lower pressure nozzle 5 are responsible for spraying water flow onto the surface of the workpiece to complete the etching operation. The set distance 11 between the upper pressure nozzle 4 or the lower pressure nozzle 5 and the workpiece board surface is controlled within the range of 30 mm to 60 mm. Using a principle similar to high-pressure water washing, a small-flow and high-pressure water flow is used to make the etching chemical solution more easily enter between the dry film and the circuit, improving the etching factor. The set distance 11 between the upper pressure nozzle 4 or the lower pressure nozzle 5 and the workpiece board surface is controlled within the range of 30 mm to 60 mm, increasing the impact force of the spray on the circuit on the workpiece board surface, reducing the area of the upper pressure nozzle 4 or the lower pressure nozzle 5 spraying on the workpiece board surface, improving the spraying accuracy, and enabling spraying on a smaller area. When the flow rate of each nozzle is reduced by 50%, the impact force on the board surface can still be increased by 2 times, ensuring the accuracy and efficiency of the etching operation.

[0026] A vacuum suction knife 8 is also integrated on the machine body. The vacuum suction knife 8 is connected to the Venturi tube 10 through a suction water pipe 9. The vacuum suction knife 8 sucks the chemical solution on the workpiece and transports the chemical solution back to the chemical solution tank 7 through the action of the suction water pipe 9 and the Venturi tube 10, completing the suction and recycling of the chemical solution.

[0027] The implementation principle of Embodiment 1 is as follows: The workpiece is stably transported by the upper conveying roller 2 and the lower conveying roller 3. After reaching the designated position, the upper pressure nozzle 4 and the lower pressure nozzle 5 start to work, and the etching chemical solution in the chemical solution tank 7 is accurately sprayed onto the surface of the workpiece through the transportation of the water outlet pipe 6. The vacuum suction knife 8 operates simultaneously, sucks the chemical solution on the surface of the workpiece through the suction water pipe 9 and the Venturi tube 10, and transports it back to the chemical solution tank 7 to realize the recycling of the chemical solution. The entire etching process of the upper pressure nozzle 4 and the lower pressure nozzle 5 is carried out within the accurately controlled set distance 11 of 30 mm to 60 mm, ensuring the etching accuracy, quality and efficiency. The preferred set distance 11 is 45 mm.

[0028] Embodiment 2

[0029] The difference between this embodiment and Embodiment 1 is that the upper pressure nozzle 4 and the lower pressure nozzle 5 are designed as fan nozzles. This design makes the etching more uniform, provides a stable spraying effect, and improves the product quality. At the same time, the fan nozzle can also reduce the waste of the chemical solution, making it more environmentally friendly and economical. The angle of the fan and the spraying pressure can be adjusted according to specific requirements to adapt to different working environments and task requirements. In some occasions where specific effects are required, it can ensure sufficient contact with the target and enhance the effect.

[0030] Embodiment 3

[0031] The difference between this embodiment and Embodiment 1 is that a filter 12 is also cleverly installed in the water outlet pipe 6, which can effectively intercept impurities and prevent nozzle blockage.

[0032] Embodiment 4

[0033] A water pump 13 is provided on the chemical solution tank 7. One end of the water pump 13 is connected to the side of the chemical solution tank 7 close to the ground, the other end of the water pump 13 is connected to the water inlet of the Venturi tube 10, the water outlet of the Venturi tube 10 is communicated with the chemical solution tank 7, and the water suction port of the Venturi tube 10 is connected to the water suction pipe 9. The water pump 13 continuously sucks and recirculates the chemical solution in the chemical solution tank 7, enabling the water to circulate more fully, improving the utilization rate of the chemical solution resources, and reducing the chemical solution consumption cost during the etching process. The continuous water flow circulation helps to mix the chemical solution in the chemical solution tank evenly, avoiding local water quality differences, so as to ensure that the chemical solution entering the etching system has stable quality and characteristics. The stable water circulation can maintain the water pressure and water flow stability in the system, reduce the impact on the etching process caused by water pressure fluctuations, and improve the stability of the etching quality. The movement of the water flow can reduce the possibility of impurities in the water precipitating and accumulating at the bottom of the chemical solution tank, reducing the risk of pipeline blockage and equipment damage. During the long-term operation process, it can prevent the water temperature in the chemical solution tank from stratifying, making the water temperature entering the etching system relatively stable, which helps to control the temperature conditions of the etching reaction.

[0034] Embodiment 5

[0035] The difference between this embodiment and the foregoing embodiments is that a pressure regulating valve 14 and a pressure gauge 15 are added to the water outlet pipe 6. The pressure regulating valve 14 allows the operator to adjust the spraying pressure of the chemical solution according to the actual situation to adapt to workpieces of different materials and thicknesses. The pressure gauge 15 provides real-time pressure readings to help the operator precisely control the etching process and ensure the stable operation of the equipment.

[0036] The embodiments of this specific implementation manner are all preferred embodiments of this application, and do not limit the protection scope of this application accordingly. Therefore, all equivalent changes made according to the structure, shape, and principle of this application shall be covered within the protection scope of this application.

Claims

1. A near-stage vacuum etching machine, characterized in that: The invention comprises a machine body (1), wherein the machine body (1) is provided with an upper conveying roller (2) and a lower conveying roller (3), wherein the upper conveying roller (2) and the lower conveying roller (3) are used to clamp and transport the workpiece, and corresponding to the two sides of the workpiece, the machine body (1) is provided with an upper pressurizing nozzle (4) and a lower pressurizing nozzle (5), which are used to spray water onto the workpiece, and the upper pressurizing nozzle (4) and the lower pressurizing nozzle (5) are connected to a water outlet pipe (6), and the water outlet pipe (6) is away from the workpiece. The other end of the upper pressure nozzle (4) or the lower pressure nozzle (5) is connected to a medicine tank (7), the machine body (1) is provided with a vacuum suction knife (8), the vacuum suction knife (8) is connected to a water suction pipe (9), the other end of the water suction pipe (9) away from the vacuum suction knife (8) is connected to a Venturi tube (10), and the setting distance (11) between the upper pressure nozzle (4) or the lower pressure nozzle (5) and the workpiece plate surface is 30 mm to 60 mm.

2. A near-stage vacuum etching machine according to claim 1, characterized in that: The upper pressure nozzle (4) and the lower pressure nozzle (5) are fan-shaped nozzles.

3. A near-stage vacuum etching machine according to claim 1, characterized in that: A filter (12) is provided in the water outlet pipe (6).

4. A near-stage vacuum etching machine according to claim 1, characterized in that: A water pump (13) is provided on the medicine water tank (7), one end of the water pump (13) is connected to the side of the medicine water tank (7) close to the ground, the other end of the water pump (13) is connected to the water inlet of the Venturi tube (10), the water outlet of the Venturi tube (10) is connected to the medicine water tank (7), and the water suction port of the Venturi tube (10) is connected to the water suction pipe (9).

5. A near-stage vacuum etching machine according to claim 1, characterized in that: The water outlet pipe (6) is also provided with a pressure regulating valve (14).

6. A near-stage vacuum etching machine according to claim 1, characterized in that: The water outlet pipe (6) is also provided with a pressure gauge (15).

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