Heat conduction assembly, heat dissipation device and vehicle-mounted power supply system
By designing thermal conductivity components, the direct fit between the thermal conductivity and the heat dissipation parts is solved, and the problem of overheating of power pipes in the on-board power supply system is achieved, achieving more efficient heat dissipation and safer thermal conductivity components.
Patent Information
- Application Number
- CN202421227562.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-31
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2034-05-31
AI Technical Summary
In the existing vehicle-mounted power system, the power pipes are overheated due to heat loss, which is prone to burning or power reduction. The existing heat dissipation device has a large thermal resistance, which reduces the heat dissipation efficiency.
A thermal conductivity component is designed, including a thermal conductivity member and an insulating member. The middle part of the insulating member forms an installation channel, and the heat dissipation member is installed along the installation channel. The thermal conductivity member is detachably fitted into the installation cavity and fits with the heat dissipation member, and directly transfers heat through the heat conduction member.
It effectively reduces thermal resistance, improves the thermal conductivity of the thermal components and the heat dissipation effect of the heat dissipation parts, prevents the thermal conductivity parts from being leaked due to heat melting due to long-term use, and improves safety performance.
Smart Images
Figure CN222916261U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of vehicle-mounted power supply, and in particular to a heat-conducting component, a heat dissipation device and a vehicle-mounted power supply system. Background Art
[0002] For the on-board power products of new energy vehicles, power tubes are installed in their power conversion modules. When the power tubes are powered on, a large amount of heat will be generated due to losses, which may easily cause the power tubes to overheat and burn out, or to operate at reduced power under software restrictions, and fail to work normally.
[0003] In the prior art, a heat sink is usually used for heat dissipation, and the power tube is welded on the PCB. An insulating sheet is installed between the PCB and the heat sink of the heat sink. After a thermal conductive gel is coated between the insulating sheet and the power tube, the PCB, the thermal conductive gel, the insulating sheet and the heat sink will fit tightly together. Among them, since the insulating sheet is generally a non-metallic organic film material, the thermal conductivity of the film material is low, and a large thermal resistance will be generated during heat conduction, thereby reducing the heat dissipation efficiency of the heat sink. Utility Model Content
[0004] Based on this, it is necessary to provide a heat conducting component, a heat dissipation device and a vehicle power system to improve the heat dissipation efficiency of the heat dissipation device.
[0005] A heat-conducting assembly for installing a heat sink, the heat-conducting assembly comprising a heat-conducting assembly and an insulating assembly, a mounting channel is formed through the middle of the insulating assembly, and the mounting channel has a first mounting opening and a second mounting opening that are arranged opposite to each other;
[0006] When the heat sink is installed in the installation channel along the first installation opening, the heat sink and the edge structure of the second installation opening form an installation cavity, and the thermal conductive element is detachably connected to the installation cavity through the second installation opening and fits with the heat sink.
[0007] In one embodiment, the insulating member includes an insulating body and a first retaining edge portion, the insulating body is provided with a first sub-cavity through its interior, the first retaining edge portion is circumferentially arranged at one end of the insulating body, and extends toward the inner side of the insulating body and surrounds to form a second sub-cavity; the first sub-cavity and the second sub-cavity are communicated with each other and are configured to form the installation channel, and the first installation opening and the second installation opening are formed at opposite ends of the first sub-cavity and the second sub-cavity, respectively;
[0008] When the heat sink is installed in the first sub-cavity through the first installation opening, the heat sink abuts against the junction of the first sub-cavity and the second sub-cavity, and the heat conductive element is detachably connected in the second sub-cavity through the second installation opening and fits with the surface of the heat sink.
[0009] In one of the embodiments, a second rib portion is further included, which is circumferentially arranged at one end of the insulating body close to the second mounting opening and extends toward the outside of the insulating body. The surface of the second rib portion facing away from the insulating body is used for fitting and supporting with the PCB board.
[0010] In one embodiment, the mounting cavity has a preset height L, and the preset height satisfies a condition L: L ≥ 0.5 mm.
[0011] In one embodiment, the heat conducting member is made of an insulating medium cast in place in the installation cavity; or
[0012] The heat conducting member is a prefabricated structure formed by an insulating medium.
[0013] A heat dissipation device comprises a heat sink and a heat conducting assembly as in the above-mentioned embodiment, wherein the heat sink comprises a heat dissipation element, the heat dissipation element comprises a heat dissipation body, a first step portion and a second step portion, the second step portion is connected between the heat dissipation body and the first step portion, the cross-sectional area of the second step portion is greater than the cross-sectional area of the first step portion, and the step surface is formed at the connection between the second step portion and the first step portion;
[0014] The first step portion can be installed in the installation channel along the first installation opening, and the installation cavity is formed between the first step portion and the second installation opening. One end of the insulating member close to the first installation opening abuts against the step surface.
[0015] In one embodiment, a connecting piece is formed on the heat sink, and a first matching portion is formed on the insulating member. The connecting piece is used to be detachably connected to the first matching portion when the heat sink is inserted into the installation channel, so that the heat sink and the insulating member are fixedly matched.
[0016] A vehicle-mounted power supply system includes the heat dissipation device as described in the above-mentioned embodiment.
[0017] In one embodiment, it further includes a PCB board and a power tube, wherein the power tube is connected to a side surface of the PCB board;
[0018] When the heat sink is inserted into the installation channel and the heat conductor is fitted into the installation cavity, the PCB board is fitted with the heat sink, and the surface of the PCB board facing away from the power tube is in contact with the heat conductor and the insulating member.
[0019] In one of the embodiments, the heat sink further includes a mounting portion matched with the heat sink body, the PCB board has a second matching portion, and the mounting portion and the second matching portion are connected via a fastener.
[0020] The above-mentioned heat-conducting component, heat dissipation device and vehicle-mounted power supply system, the heat-conducting component includes a heat-conducting part and an insulating part, the middle part of the insulating part is penetrated to form an installation channel, and the installation channel has a first installation port and a second installation port that are arranged oppositely. When the heat dissipating part is installed in the installation channel along the first installation port, a mounting cavity is formed between the heat dissipating part and the second installation port, and the heat-conducting part is detachably connected to the mounting cavity through the second installation port and fits with the heat dissipating part. In this way, heat is directly transferred between the PCB board and the heat dissipating part through the heat-conducting part, which can effectively reduce thermal resistance, thereby improving the heat-conducting effect of the heat-conducting component and the heat dissipation effect of the heat-conducting part. In addition, the heat-conducting component provided in the embodiment of the present application, the insulating part surrounds the outer side of the heat-conducting part, which can prevent the heat-conducting part from melting due to heat after long-term use and leaking, thereby reducing the risk of failure of the heat-conducting component and effectively improving the safety performance of the heat-conducting component. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 This is a schematic diagram of the structure of the vehicle power system in this application.
[0022] Figure 2 This is a schematic diagram of the exploded structure of the vehicle power system in this application.
[0023] Figure 3 This is a schematic diagram of the cross-sectional structure of the vehicle power system in this application.
[0024] Figure 4 for Figure 3 Schematic diagram of the local enlarged structure of area A in the middle.
[0025] Figure 5 This is a schematic diagram of the structure of an insulating component in an embodiment of the present application.
[0026] Figure 6 This is a schematic structural diagram of an insulating component in another embodiment of the present application.
[0027] Figure 7 This is a schematic structural diagram of an insulating component in another embodiment of the present application.
[0028] Figure 8 It is a schematic diagram of the structure of the heat sink in this application.
[0029] Reference numerals
[0030] Thermally conductive component 100;
[0031] Insulating member 10; mounting channel 101; first mounting opening 1011; second mounting opening 1012; insulating body 102; first sub-cavity 1021; first retaining edge portion 103; second sub-cavity 1031; mounting cavity 104; first matching portion 105;
[0032] Heat conducting member 11; second rib portion 12; heat conducting member 13;
[0033] Heat dissipation device 200;
[0034] Heat sink 20; connector 201; heat sink body 202; first step portion 203; second step portion 204; step surface 205; mounting portion 206;
[0035] On-board power system 300;
[0036] PCB board 30 ; second matching portion 301 ; power tube 31 ; rubber pad 32 ; fastener 33 . DETAILED DESCRIPTION
[0037] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.
[0038] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.
[0039] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0040] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.
[0041] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
[0042] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.
[0043] See also Figure 1 and Figure 2 The embodiment of the present application provides a vehicle power system 300, which includes a heat sink 200, a PCB board 30, and a power tube 31. The power tube 31 is matched to a side surface of the PCB board 30. The surface of the PCB board 30 away from the power tube 31 is assembled with the heat sink 200.
[0044] It is understandable that the power tube 31 will generate a large amount of heat due to loss when it is powered on. The heat dissipation device 200 can conduct and dissipate the heat generated by the power tube 31 to prevent the power tube 31 from overheating and burning or operating at reduced power under software restrictions, thereby ensuring the normal operation of the power tube 31.
[0045] The heat dissipation device 200 includes a heat conduction component 100 and a heat sink. The heat conduction component 100 is matched with the heat sink, and the surface of the PCB board 30 facing away from the power tube 31 is assembled with the heat conduction component 100.
[0046] It can be understood that the heat conducting component 100 can conduct the heat generated by the power tube 31 to the radiator, and the radiator can further dissipate the heat. In this way, the heat conducting component 100 and the radiator cooperate with each other to achieve the heat dissipation of the power tube 31, thereby ensuring the normal operation of the power tube 31.
[0047] See also Figure 1 and Figure 2 In the present application, the heat sink includes a heat sink 20. The heat conducting assembly 100 includes a heat conducting member 1311 and an insulating member 10. The insulating member 10 has a mounting channel 101 formed through the middle thereof. The mounting channel 101 has a first mounting opening 1011 and a second mounting opening 1012 arranged opposite to each other.
[0048] When the heat sink 20 is installed in the installation channel 101 along the first installation opening 1011 , the edge structure of the heat sink 20 and the second installation opening 1012 forms an installation cavity 104 , and the thermal conductive element 1311 is detachably connected to the installation cavity 104 through the second installation opening 1012 and fits with the heat sink 20 .
[0049] It is understandable that the heat sink 20 can partially extend into the installation channel 101 and be fixedly connected to the insulating member 10. The edge of the second installation opening 1012 is higher than the portion of the heat sink 20 extending into the installation channel 101, and the heat sink 20 located in the installation channel 101 can form a mounting cavity 104 with the edge structure of the second installation opening 1012. The present application is achieved by fitting the heat conductor 1311 into the mounting cavity 104, and making the heat conductor 1311 fit the heat sink 20. In this way, the heat conductor 1311 can transfer heat to the heat sink 20, and further dissipate heat through the heat sink 20. And the insulating member 10 surrounds the outside of the heat conductor 1311, and the insulating member 10 can reduce the safety risk caused by the leakage of the heat conductor 1311 due to melting due to heat after long-term use, thereby reducing the risk of failure of the heat conductive component 100 and effectively improving the safety performance of the heat conductive component 100.
[0050] Specifically, in an embodiment in which the heat-conducting component 100, the heat sink, the PCB board 30 and the power tube 31 are assembled correspondingly, the surface of the PCB board 30 facing away from the power tube 31 can be fitted with the surface of the heat-conducting member 1311 facing away from the heat sink 20. In this way, the heat-conducting component 100 can conduct the heat generated by the power tube 31 to the heat sink, and the heat sink can further dissipate the heat, thereby achieving heat dissipation of the power tube 31.
[0051] In addition, it is defined that the power tube 31, the PCB board 30 and the heat conducting assembly 100 are stacked and assembled in sequence along the gravity direction. Then, along the gravity direction, the projection of the insulating member 10 surrounds the projection of the power tube 31, and the projection of the power tube 31 is included in the projection range of the installation cavity 104. In this way, the insulating member 10 can prevent the power tube 31 from leaking electricity during the power-on process.
[0052] In the heat-conducting assembly 100 provided in the embodiment of the present application, the insulating member 10 surrounds the outer side of the heat-conducting member 1311, which can prevent the heat-conducting member 1311 from melting due to heat after long-term use and leaking, thereby reducing the risk of failure of the heat-conducting assembly 100 and effectively improving the safety performance of the heat-conducting assembly 100. In addition, heat is directly transferred between the PCB board 30 and the heat sink 20 through the heat-conducting member 1311, which can effectively reduce thermal resistance, thereby improving the heat conduction effect of the heat-conducting assembly 100 and the heat dissipation effect of the heat sink 20.
[0053] The specific structure of the insulating member 10 is not limited. In some embodiments, see Figure 5 The insulating member 10 includes an insulating body 102, and a mounting channel 101 is formed inside the insulating body 102. The mounting channel 101 has a first mounting opening 1011 and a second mounting opening 1012 which are arranged opposite to each other.
[0054] When the heat sink 20 is installed in the installation channel 101 along the first installation opening 1011 , the edge structure of the heat sink 20 and the second installation opening 1012 forms an installation cavity 104 , and the thermal conductive element 1311 is detachably connected to the installation cavity 104 through the second installation opening 1012 and fits with the heat sink 20 .
[0055] It can be understood that when the heat sink 20 is installed in the mounting channel 101 through the first mounting port 1011, the heat sink 20 abuts against the inner wall of the mounting channel 101, and the heat sink 20 and the edge structure of the second mounting port 1012 form an mounting cavity 104, and the thermal conductor 1311 can be detachably connected in the mounting cavity 104 through the second mounting port 1012 and fit with the surface of the heat sink 20.
[0056] For other embodiments, see Figure 6 The insulating member 10 includes an insulating body 102 and a first retaining edge portion 103. A first sub-cavity 1021 is formed inside the insulating body 102. The first retaining edge portion 103 is circumferentially arranged at one end of the insulating body 102 and extends toward the inner side of the insulating body 102 to form a second sub-cavity 1031. The first sub-cavity 1021 and the second sub-cavity 1031 are connected to each other and form a mounting channel 101. The first mounting opening 1011 and the second mounting opening 1012 are formed at opposite ends of the first sub-cavity 1021 and the second sub-cavity 1031, respectively.
[0057] When the heat sink 20 is installed in the first sub-cavity 1021 through the first installation opening 1011, the heat sink 20 abuts against the junction of the first sub-cavity 1021 and the second sub-cavity 1031, and the thermal conductive element 1311 is detachably connected to the second sub-cavity 1031 through the second installation opening 1012 and fits against the surface of the heat sink 20.
[0058] It can be understood that when the heat sink 20 is installed in the first sub-cavity 1021 through the first mounting port 1011, the heat sink 20 abuts against the junction of the first sub-cavity 1021 and the second sub-cavity 1031, and the heat sink 20 can block the connecting port between the first sub-cavity 1021 and the second sub-cavity 1031. In this way, the second sub-cavity 1031 is constructed to form the mounting cavity 104, and the thermal conductor 1311 can be detachably connected in the second sub-cavity 1031 through the second mounting port 1012 and fit with the surface of the heat sink 20.
[0059] It can be understood that the first retaining edge portion 103 can enhance the structural strength of the insulating member 10, and when the PCB board 30 and the power tube 31 are assembled accordingly, the first retaining edge portion 103 can fit with the surface of the PCB board 30 away from the power tube 31 to play a supporting role, thereby effectively improving the stability of the assembly.
[0060] For some examples, see Figure 7 , and also includes a second rib portion 12, which is circumferentially arranged at one end of the insulating body 102 close to the second mounting opening 1012 and extends toward the outside of the insulating body 102. The surface of the second rib portion 12 facing away from the insulating body 102 is used for fitting and supporting the PCB board 30.
[0061] It is understandable that the second flange portion 12 can enhance the structural strength of the insulating member 10, and when the PCB board 30 and the power tube 31 are assembled correspondingly, the second flange portion 12 can be attached to the surface of the PCB board 30 away from the power tube 31 to play a supporting role, thereby effectively improving the stability of the assembly. At the same time, the second flange portion 12 can increase the contact area between the insulating member 10 and the PCB board 30, so that within the contact range between the second flange portion 12 and the PCB board 30, a larger size or a larger number of power tubes 31 can be arranged, or the second flange portion 12 can better prevent the power tube 31 from leaking electricity during the power-on process.
[0062] In some other embodiments, the insulating member 10 includes an insulating body 102 and a first rib portion 103, a first sub-cavity 1021 is opened through the interior of the insulating body 102, the first rib portion 103 is circumferentially arranged at one end of the insulating body 102, and extends toward the inner side of the insulating body 102 and surrounds to form a second sub-cavity 1031; the first sub-cavity 1021 and the second sub-cavity 1031 are communicated with each other and are constructed to form an installation channel 101, and the first sub-cavity 1021 and the second sub-cavity 1031 have opposite ends to form a first installation port 1011 and a second installation port 1012 respectively; and the heat conductive component 100 also includes a second rib portion 12, the second rib portion 12 is circumferentially arranged at one end of the insulating body 102 close to the second installation port 1012, and extends toward the outer side of the insulating body 102.
[0063] It can be understood that both the first rib portion 103 and the second rib portion 12 can enhance the structural strength of the insulating member 10, and when the PCB board 30 and the power tube 31 are assembled correspondingly, both the first rib portion 103 and the second rib portion 12 can fit with the surface of the PCB board 30 away from the power tube 31 to play a supporting role, thereby effectively improving the stability of the assembly. In addition, the second rib portion 12 can increase the contact area between the insulating member 10 and the PCB board 30, so that within the contact range between the second rib portion 12 and the PCB board 30, a larger size or a larger number of power tubes 31 can be arranged, or the second rib portion 12 can better prevent the power tube 31 from leaking electricity during the power-on process.
[0064] For some examples, see Figure 4 , the installation cavity 104 has a preset height L. It can be understood that the preset height L is to ensure that the heat conducting member 1311 has sufficient thickness to meet the use requirements and structural strength.
[0065] The specific value range of the preset height L is not limited. In some embodiments, the preset height satisfies the condition L: L ≥ 0.5 mm.
[0066] It should be noted that the specific value range of the preset height L is obtained through experimental testing, and the parameters, steps, etc. related to the experimental testing of the specific value range of the preset height L are conventional techniques of those skilled in the art and will not be elaborated here.
[0067] The specific manufacturing method of the heat conducting member 1311 is not limited. In some embodiments, the heat conducting member 1311 is made by casting an insulating medium in the installation cavity 104. In other embodiments, the heat conducting member 1311 is a prefabricated structure formed by an insulating medium.
[0068] The specific material of the heat conducting member 1311 is not limited. It is understandable that the material of the heat conducting member 1311 needs to have both heat conduction and insulation functions, such as silicone grease, thermal conductive glue, phase change material, etc.
[0069] The specific material of the insulating member 10 is not limited, for example, plastic, ceramic, etc.
[0070] For some examples, see Figure 3 and Figure 4 The heat dissipation device 200 includes the heat-conducting assembly 100 and the heat sink in the above-mentioned embodiment, the heat sink includes a heat dissipation element 20, the heat dissipation element 20 includes a heat dissipation body 202, a first step portion 203 and a second step portion 204, the second step portion 204 is connected between the heat dissipation body 202 and the first step portion 203, the cross-sectional area of the second step portion 204 is greater than the cross-sectional area of the first step portion 203, and a step surface 205 is formed at the connection between the second step portion 204 and the first step portion 203;
[0071] The first step portion 203 can be installed in the installation channel 101 along the first installation opening 1011 , and a mounting cavity 104 is formed between the first step portion 203 and the second installation opening 1012 .
[0072] It is understandable that when the first step portion 203 is installed in the installation channel 101 along the first installation opening 1011, the outer wall of the first step portion 203 will be sealed and connected with the inner wall of the installation cavity 104, and the surface of the first step portion 203 away from the second step portion 204 can form the installation cavity 104 with the edge structure of the second installation opening 1012. After the heat conductive member 1311 is detachably connected to the installation cavity 104 through the second installation opening 1012, the heat conductive member 1311 will fit with the surface of the first step portion 203 away from the second step portion 204. In this way, the heat conductive member 1311 can transfer heat to the heat sink 20, and further dissipate heat through the heat sink 20.
[0073] In addition, one end of the insulating member 10 close to the first installation opening 1011 abuts against the step surface 205. The step surface 205 can support the insulating member 10, so that the insulating member 10 and the heat sink 20 are assembled more stably.
[0074] For some examples, see Figure 2 and Figure 8 A connecting piece 201 is formed on the heat sink 20, and a first matching portion 105 is formed on the insulating member 10. The connecting piece 201 is used to be detachably connected to the matching portion when the heat sink 20 is inserted into the installation channel 101, so that the heat sink 20 and the insulating member 10 are fixedly matched.
[0075] It is understandable that the corresponding connection between the connecting member 201 and the first matching portion 105 can improve the assembly accuracy of the heat sink 20 and the insulating member 10 and can simplify the assembly steps to effectively improve the assembly efficiency.
[0076] The specific styles of the connector 201 and the first matching portion 105 are not limited. In some embodiments, the connector 201 is a protruding structure of the heat sink 20, and the first matching portion 105 is a groove on the insulating member 10. The protruding structure can be correspondingly embedded in the groove to achieve fixed matching between the heat sink 20 and the insulating member 10.
[0077] The specific connection method of the connecting member 201 and the first matching portion 105 is not limited, for example: interference fit, clamping, bonding, etc.
[0078] The specific layout position of the connecting member 201 is not limited. In some embodiments, see Figure 2 and Figure 8 The connecting piece 201 protrudes from the outer wall of the first step portion 203 and is connected to the step surface 205 .
[0079] For some examples, see Figure 1 and Figure 2 The heat sink 20 further includes a mounting portion 206 matched with the heat sink body 202 , and the PCB board 30 has a second matching portion 301 , and the mounting portion 206 and the second matching portion 301 are connected via a fastener 33 .
[0080] The specific styles of the mounting portion 206, the second matching portion 301 and the fastener 33 are not limited. In some embodiments, the mounting portion 206 is a threaded column matched with the heat dissipation body 202, and a threaded hole is provided in the threaded column; the second matching portion 301 is a threaded hole opened on the PCB board 30, and the fastener 33 is a screw. After the PCB board 30 and the heat dissipation element 20 are assembled correspondingly, the screw can be inserted into the threaded hole of the threaded column and the threaded hole on the PCB board 30 to achieve fixed assembly of the PCB board 30 and the heat dissipation element 20.
[0081] For some examples, see Figure 1 and Figure 2 The vehicle power system further includes a rubber pad 32, which is used to fit the surface of the power tube 31 away from the PCB board 30.
[0082] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0083] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.
Claims
1. A heat conducting component, characterized in that: Used to install a heat sink, the heat conduction assembly includes a heat conduction member and an insulating member, a mounting channel is formed through the middle of the insulating member, and the mounting channel has a first mounting opening and a second mounting opening that are arranged oppositely; When the heat sink is installed in the installation channel along the first installation opening, the heat sink and the edge structure of the second installation opening form an installation cavity, and the thermal conductive element is detachably connected to the installation cavity through the second installation opening and fits with the heat sink.
2. The heat conducting component according to claim 1, characterized in that: The insulating member comprises an insulating body and a first retaining edge portion, wherein a first sub-cavity is formed through the interior of the insulating body, the first retaining edge portion is circumferentially arranged at one end of the insulating body, and extends toward the inner side of the insulating body and surrounds a second sub-cavity; the first sub-cavity and the second sub-cavity are connected to each other and are configured to form the installation channel, and the first installation opening and the second installation opening are formed at opposite ends of the first sub-cavity and the second sub-cavity respectively; When the heat sink is installed in the first sub-cavity through the first installation opening, the heat sink abuts against the junction of the first sub-cavity and the second sub-cavity, and the heat conductive element is detachably connected in the second sub-cavity through the second installation opening and fits with the surface of the heat sink.
3. The heat conducting component according to claim 2, characterized in that: It also includes a second rib portion, which is circumferentially arranged at one end of the insulating member close to the second mounting opening and extends toward the outside of the insulating body. The surface of the second rib portion facing away from the insulating body is used for fitting and supporting the PCB board.
4. The heat conducting component according to any one of claims 1 to 3, characterized in that: The installation cavity has a preset height L, and the preset height satisfies the condition: L≥0.5mm.
5. The heat conducting component according to any one of claims 1 to 3, characterized in that: The heat conducting member is made by casting an insulating medium in the installation cavity; or The heat conducting member is a prefabricated structure formed by an insulating medium.
6. A heat dissipation device, characterized in that: A heat sink and a heat conducting assembly as claimed in any one of claims 1 to 5, wherein the heat sink comprises a heat sink, the heat sink comprises a heat sink body, a first step portion and a second step portion, the second step portion is connected between the heat sink body and the first step portion, the cross-sectional area of the second step portion is greater than the cross-sectional area of the first step portion, and a step surface is formed at the connection between the second step portion and the first step portion; The first step portion can be installed in the installation channel along the first installation opening, and the installation cavity is formed between the first step portion and the second installation opening. One end of the insulating member close to the first installation opening abuts against the step surface.
7. The heat dissipation device according to claim 6, characterized in that: A connecting piece is formed on the heat sink, and a first matching portion is formed on the insulating piece. The connecting piece is used to be detachably connected to the first matching portion when the heat sink is inserted into the installation channel, so that the heat sink and the insulating piece are fixedly matched.
8. A vehicle-mounted power supply system, characterized in that: The method comprises a heat dissipation device as claimed in any one of claims 6 to 7.
9. The vehicle-mounted power supply system according to claim 8, characterized in that: It also includes a PCB board and a power tube, wherein the power tube is connected to a side surface of the PCB board; When the heat sink is inserted into the installation channel and the heat conductor is fitted into the installation cavity, the PCB board is fitted with the heat sink, and the surface of the PCB board facing away from the power tube is in contact with the heat conductor and the insulating member.
10. The vehicle-mounted power supply system according to claim 9, characterized in that: The heat sink also includes a mounting portion matched with the heat sink body, the PCB board has a second matching portion, and the mounting portion and the second matching portion are connected via a fastener.