Novel FPC signal acquisition module

Abstract

The utility model discloses a novel FPC signal acquisition module. The novel FPC signal acquisition module comprises a substrate, a connector and a plurality of acquisition terminals, the substrate comprises a base material and a circuit layer, and the base material is a covering film formed by gluing a middle glue layer on the upper surface of an insulating base film; the circuit layer is formed by printing silver paste on a plurality of conductive circuits on the middle adhesive layer of the base material; the connector is connected to one end of the base material, and a transverse pin of the connector is electrically connected with a conductive circuit output end of the circuit layer; the plurality of acquisition terminals are located on the front side and the rear side of the base material, the acquisition terminals are welded to the conductive circuit input end of the circuit layer, and acquired signals are transmitted to the connector through the acquisition terminals and the conductive circuit output end of the circuit layer. According to the utility model, good signal transmission capability is realized, the processing technology is simple, the production efficiency is high, and the cost is greatly reduced.

Description

Technical Field

[0001] The utility model relates to the field of information transmission of electronic products, in particular to a novel FPC signal acquisition module. Background Art

[0002] FPC signal acquisition module, also known as flexible circuit board, is commonly used in new energy battery pack PACK. At present, FPC production uses rolled copper foil as the base material, which is made by repeatedly rolling high-precision copper strips using the principle of plastic processing. FPC using copper foil needs to be etched to form circuits. The etching process involves more than twenty steps, involving photolithography machines, etching machines, hot presses and other equipment; the problem is: first, the high precision requirements of the equipment lead to high equipment investment prices and high fixed investment, and there are many etching production processes, high process difficulty coefficient, long processing flow and low processing efficiency; second, the etching process will produce wastewater during the production process, causing environmental pollution. Utility Model Content

[0003] In order to solve one or more of the above problems, the utility model provides a novel FPC signal acquisition module.

[0004] According to one aspect of the utility model, the novel FPC signal acquisition module comprises: a substrate, a connector and a plurality of acquisition terminals;

[0005] The substrate includes a base material and a circuit layer. The base material is a covering film made by gluing an intermediate adhesive layer on the upper surface of an insulating base film. The circuit layer is a plurality of conductive circuits formed by printing silver paste on the intermediate adhesive layer of the base material.

[0006] The connector is connected to one end of the substrate, and the lateral pins of the connector are electrically connected to the conductive circuit output end of the circuit layer;

[0007] Several acquisition terminals are located on the front and back sides of the substrate. The acquisition terminals are welded to the conductive line input end of the circuit layer. The collected signals are transmitted to the connector via the acquisition terminals and the conductive line output end of the circuit layer.

[0008] In some embodiments, the insulating base film is a PI film composed of a polyimide film.

[0009] Or the middle adhesive layer is hot melt adhesive.

[0010] In some embodiments, the thickness of the insulating base film is 25 um.

[0011] Or the thickness of the middle glue layer is 20um.

[0012] In some embodiments, the collection terminal is a nickel sheet;

[0013] Or the acquisition terminal also includes a plurality of NTC thermistors, and the NTC thermistors are welded to the corresponding conductive circuit input terminals of the circuit layer.

[0014] In some embodiments, the vertical leg of the connector passes through a through hole at one end of the substrate to connect to a first reinforcement plate below, and the first reinforcement plate is provided with a transverse oblong connection hole.

[0015] In some embodiments, a circuit diagram formed according to various requirements is processed on the printing mold, and the silver paste is formed on the middle glue layer of the substrate through the printing mold to form a circuit layer.

[0016] In some embodiments, a plurality of input connection positions are provided on the front and rear sides of the upper surface of the substrate in the longitudinal direction and an output connection position is provided on one side in the lateral direction. The output ends of the conductive circuits of the circuit layer are horizontally parallel and evenly spaced and distributed at the output connection positions. The input ends of the conductive circuits of the circuit layer are longitudinally bent and enter into each input connection position of the substrate.

[0017] In some embodiments, a first reinforcing plate is provided on the lower surface of the insulating base film opposite to the output connection position, and a second reinforcing plate is provided on the lower surface of the insulating base film opposite to the input connection position.

[0018] In some embodiments, the lower surface of the insulating base film is bonded to the lower protective film via a lower adhesive layer, and the upper surface of the circuit layer is bonded to the upper protective film via an upper adhesive layer.

[0019] The lower protective film and the upper protective film are both PI films made of polyimide films, and the lower adhesive layer and the upper adhesive layer are hot melt adhesives.

[0020] In some embodiments, the thickness of the lower protective film is 12 um, the thickness of the upper protective film is 25 um, the thickness of the lower glue layer is 15 um, and the thickness of the upper glue layer is 35 um.

[0021] The new FPC signal acquisition module uses silver paste to form various conductive circuits on the middle glue layer of the substrate by printing, forming the required circuit layer, which can well realize the signal transmission function; its beneficial effects are: first, the silver paste printing cost is cheaper than the rolled copper foil, and the raw material cost is low, which reduces the price of FPC products; second, the silver paste printing process is simple, with fewer processing steps, short process, short processing cycle, and high printing efficiency, which further reduces the price of FPC products; third, the equipment cost required for the printing method is low, and the fixed investment is greatly reduced compared with the equipment required for etching, such as the photolithography machine, etching machine, and hot press, while reducing the cost of FPC production; fourth, the printing process does not produce wastewater, reducing the pollution to the environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A three-dimensional schematic diagram of a novel FPC signal acquisition module according to one embodiment of the utility model;

[0023] Figure 2 for Figure 1 A schematic cross-sectional view of the substrate shown;

[0024] Figure 3 for Figure 2 A schematic top view of the substrate and the circuit layer shown;

[0025] Figure 4 for Figure 2 A schematic top view of the insulating base film and the reinforcing plate shown;

[0026] Substrate 01, base material 1, insulating base film 10, middle glue layer 11, circuit layer 2, lower protective film 3, upper protective film 4, lower glue layer 5, upper glue layer 6;

[0027] Connector 02;

[0028] Collection terminal 03, nickel sheet 031, NTC thermistor 032;

[0029] The first reinforcing plate 04 and the second reinforcing plate 05. DETAILED DESCRIPTION

[0030] The present invention is further described in detail below in conjunction with the accompanying drawings. It should be noted that the words "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to directions in the accompanying drawings, and the words "inner" and "outer" refer to directions toward or away from the geometric center of a specific component, respectively.

[0031] Figures 1 to 4 A new FPC signal acquisition module according to an embodiment of the utility model is schematically shown. As shown in the figure, the new FPC signal acquisition module includes: a substrate 01, a connector 02 and a plurality of acquisition terminals 03;

[0032] The substrate 01 includes a substrate 1 and a circuit layer 2. The substrate 1 is a covering film made by gluing an intermediate adhesive layer 11 on the upper surface of an insulating base film 10. The insulating base film 10 is preferably a PI film composed of a polyimide film. The PI film has good insulation performance, and the PI covering film has good electrical properties and high bonding strength, and is suitable for electrical insulation applications. The intermediate adhesive layer 11 can preferably be a hot melt adhesive. The thickness of the insulating base film 10 is preferably set to 25um, and the thickness of the intermediate adhesive layer 11 is preferably set to 20um.

[0033] The circuit layer 2 is a plurality of conductive circuits printed by silver paste on the intermediate adhesive layer 11 of the substrate 1. Preferably, a circuit diagram formed according to various requirements is processed on a printing mold, and the silver paste is formed on the intermediate adhesive layer 11 of the substrate 1 by the printing mold to form the circuit layer 2.

[0034] The connector 02 is connected to one end of the substrate 1, and the lateral pins of the connector 02 are electrically connected to the conductive circuit output end of the circuit layer 2;

[0035] Several collection terminals 03 are located on the front and back sides of the substrate 1, wherein the collection terminal 03 is preferably set as a nickel sheet 031, and the collection terminal 03 is welded to the conductive line input end of the circuit layer 2. The collected signal is transmitted to the connector 02 via the collection terminal 03 and the conductive line output end of the circuit layer 2.

[0036] The novel FPC signal acquisition module uses silver paste to form various conductive circuits on the intermediate glue layer 11 of the substrate 1 by printing, forming the required circuit layer 2, which can well realize the signal transmission function; its beneficial effects are: first, the silver paste printing cost is cheaper than the rolled copper foil, and the raw material cost is low, which reduces the price of FPC products; second, the silver paste printing process is simple, with fewer processing steps, short process, short processing cycle, and high printing efficiency, which further reduces the price of FPC products; third, the equipment cost required for the printing method is low, and the fixed investment is greatly reduced compared with the equipment required for etching, such as the photolithography machine, etching machine, and hot press, while reducing the cost of FPC production; fourth, the printing process does not produce wastewater, reducing the pollution to the environment.

[0037] Furthermore, the acquisition terminal 03 also includes a number of NTC thermistors 032, which are located on the front and back sides of the substrate 1. The NTC thermistors 032 are welded to the corresponding conductive line input ends of the circuit layer 2, and the corresponding signals collected are transmitted to the connector 02 via the NTC thermistors 032 and the conductive lines of the circuit layer 2. Among them, the nickel sheet 031 of the acquisition terminal 03 and the other end of the NTC thermistor 032 are welded to each aluminum bar. Other auxiliary parts are then assembled to form a CCS busbar product. For example, in one application scenario, the CCS busbar can be installed in a battery module, and the aluminum bar is welded to the battery cell to realize the collection of the voltage and temperature signals of the battery cell and transmit them to the connector. The beneficial effect is that the structure can achieve good signal transmission performance.

[0038] Furthermore, the vertical leg of the connector 02 passes through the through hole at one end of the substrate 01 to connect to the first reinforcing plate 04 below, and the first reinforcing plate 04 is provided with a transverse oblong connecting hole. The beneficial effect is that the arrangement facilitates the assembly of FPC products.

[0039] Furthermore, a plurality of input connection positions are provided on the front and rear sides of the upper surface of the substrate 1 in the longitudinal direction and an output connection position is provided on one side in the transverse direction, the output ends of the conductive lines of the circuit layer 2 are distributed in parallel and at equal intervals in the transverse direction at the output connection positions, and the input ends of the conductive lines of the circuit layer 2 are bent in the longitudinal direction and enter the input connection positions of the substrate 1. The beneficial effect is that the circuit arrangement of this arrangement facilitates the collection and transmission of signals and can be effectively applied in various scenarios.

[0040] Preferably, the lower surface of the insulating base film 10 opposite to the output connection position is provided with a first reinforcing plate 04, and the lower surface of the insulating base film 10 opposite to the input connection position is provided with a second reinforcing plate 05. The beneficial effect is that the reinforcing plate is provided to improve the structural strength of the device and facilitate the connection and setting of accessories.

[0041] Preferably, the substrate 1 is provided with a plurality of connection positions at the front and rear sides in the longitudinal direction, and the substrate 11 is provided with process holes. The beneficial effect is that the process holes facilitate the processing and manufacturing of various structures.

[0042] Further, the lower surface of the insulating base film 10 is bonded to the lower protective film 3 through the lower adhesive layer 5, and the upper surface of the circuit layer 2 is bonded to the upper protective film 4 through the upper adhesive layer 6. Preferably, the lower protective film 3 and the upper protective film 4 are both PI films composed of polyimide films, and the lower adhesive layer 5 and the upper adhesive layer 6 are hot melt adhesives. Preferably, the thickness of the lower protective film 3 is 12um, the thickness of the upper protective film 4 is 25um, the thickness of the lower adhesive layer 5 is 15um, and the thickness of the upper adhesive layer 6 is 35um. Its beneficial effects are: the PI film has good insulation performance, the PI cover film has good electrical properties, high bonding strength, and is suitable for electrical insulation applications.

[0043] Furthermore, the substrate 1 can be a sheet film cut from a roll film at equal intervals. Preferably, a plurality of oblong through holes are provided at equal intervals in the horizontal direction on the substrate 1. The beneficial effect is that the arrangement is convenient and fast to process, and the production efficiency is high.

[0044] The above are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. The new FPC signal acquisition module is characterized by: It comprises: a substrate (01), a connector (02) and a plurality of collection terminals (03); The substrate (01) comprises a base material (1) and a circuit layer (2); the base material (1) is a covering film formed by gluing an intermediate adhesive layer (11) on the upper surface of an insulating base film (10); the circuit layer (2) is a plurality of conductive circuits formed by printing silver paste on the intermediate adhesive layer (11) of the base material (1); The connector (02) is connected to one end of the substrate (1), and the lateral pins of the connector (02) are electrically connected to the conductive circuit output end of the circuit layer (2); A plurality of the collection terminals (03) are located on the front and rear sides of the substrate (1); the collection terminals (03) are welded to the conductive line input end of the circuit layer (2); and the collected signals are transmitted to the connector (02) via the collection terminals (03) and the conductive line output end of the circuit layer (2).

2. The novel FPC signal acquisition module according to claim 1 is characterized in that: The insulating base film (10) is a PI film made of a polyimide film. Or the middle adhesive layer (11) is hot melt adhesive.

3. The novel FPC signal acquisition module according to claim 2 is characterized in that: The thickness of the insulating base film (10) is 25 um, or the thickness of the intermediate glue layer (11) is 20 um.

4. The novel FPC signal acquisition module according to claim 1 is characterized in that: The collection terminal (03) is a nickel sheet (031); Or the collection terminal (03) further comprises a plurality of NTC thermistors (032), wherein the NTC thermistors (032) are welded to corresponding conductive circuit input ends of the circuit layer (2).

5. The novel FPC signal acquisition module according to claim 1 is characterized in that: The vertical foot of the connector (02) passes through a through hole at one end of the base plate (01) to connect to a first reinforcement plate (04) below, and the first reinforcement plate (04) is provided with a transverse oblong connection hole.

6. The novel FPC signal acquisition module according to claim 1 is characterized in that: A circuit diagram formed according to requirements is processed on the printing mold, and the silver paste is formed on the middle glue layer (11) of the substrate (1) through the printing mold to form the circuit layer (2).

7. The novel FPC signal acquisition module according to claim 1 is characterized in that: The upper surface of the substrate (1) is provided with a plurality of input connection positions on both sides in the longitudinal direction and on one side in the transverse direction, and an output connection position is provided on one side in the transverse direction, the conductive circuit output ends of the circuit layer (2) are distributed in the output connection positions in a transversely parallel manner and at equal intervals, and the conductive circuit input ends of the circuit layer (2) are bent in the longitudinal direction and enter each input connection position of the substrate (1).

8. The novel FPC signal acquisition module according to claim 7 is characterized in that: A first reinforcing plate (04) is provided on the lower surface of the insulating base film (10) opposite to the output connection position. A second reinforcing plate (05) is provided on the lower surface of the insulating base film (10) opposite to the input connection position.

9. The novel FPC signal acquisition module according to any one of claims 1 to 8, characterized in that: The lower surface of the insulating base film (10) is adhesively connected to the lower protective film (3) via a lower adhesive layer (5), and the upper surface of the circuit layer (2) is adhesively connected to the upper protective film (4) via an upper adhesive layer (6); The lower protective film (3) and the upper protective film (4) are both PI films made of polyimide films, and the lower adhesive layer (5) and the upper adhesive layer (6) are hot melt adhesives.

10. The novel FPC signal acquisition module according to claim 9 is characterized in that: The thickness of the lower protective film (3) is 12 um, the thickness of the upper protective film (4) is 25 um, the thickness of the lower adhesive layer (5) is 15 um, and the thickness of the upper adhesive layer (6) is 35 um.

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