Double-channel electronic equipment heat dissipation shell

Abstract

The utility model relates to the technical field of electronic equipment, in particular to a double-flow-channel electronic equipment heat dissipation shell which comprises a shell body. The active heat dissipation flow channel is arranged on the shell; a passive heat dissipation channel; the temperature sensing module is used for detecting the temperature of the electronic equipment on the shell; the micropump is connected with the active heat dissipation flow channel; the micropump can enable cooling liquid in the active heat dissipation flow channel to automatically and circularly flow, and cooling liquid in the passive heat dissipation flow channel spontaneously and circularly flows after being heated. The whole flow channel or at least part of the flow channel on the passive heat dissipation flow channel is arranged to be of a one-way communicated flow channel structure. And the flowing direction of the cooling liquid in the one-way conducting flow channel structure is consistent with the flowing direction of the cooling liquid in the active heat dissipation flow channel. By combining two modes of active heat dissipation and passive heat dissipation, it can be ensured that the cooling liquid forms a uniform and stable flowing layer on the surface of the electronic equipment, and therefore heat is effectively taken away.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic devices, and more specifically, to a heat dissipation shell of an electronic device with a double flow channel. Background Art

[0002] With the rapid development of smart phone technology, users' pursuit of mobile phone performance has reached an unprecedented level. To meet this growing demand, mobile phone manufacturers and individual users have begun to try to run mobile phones in high frame rate mode in order to obtain a smoother and more delicate control experience. However, the implementation of this mode is not without cost.

[0003] Although the high frame rate mode greatly improves the smoothness and response speed of the mobile phone screen, bringing an unprecedented immersive experience to users, at the same time, it also brings a series of problems that cannot be ignored. The most significant of these is the sharp increase in the heat generation and power consumption of the mobile phone. Since in the high frame rate mode, the core components such as the mobile phone processor and graphics processor need to continuously perform high-load operations, a large amount of heat will be generated, resulting in a rapid increase in the temperature of the mobile phone. This will not only affect the performance and stability of the mobile phone, but may also cause damage to the mobile phone hardware.

[0004] To address this issue, a new type of liquid-cooled mobile phone case has emerged on the market. This mobile phone case is filled with a coolant inside, and the heat generated by the mobile phone is taken away through the flow of the liquid, thereby achieving the purpose of heat dissipation. However, this liquid-cooled mobile phone case also has some problems. First, the liquid inside it is mainly driven by a pump, and the power of the pump comes from the mobile phone battery. This means that during the entire heat dissipation process, whether the mobile phone is in a low-power or high-power state, the micropump needs to work continuously. This not only increases the power consumption of the mobile phone, but may also cause rapid loss of the mobile phone battery. Second, due to material limitations after the mobile phone case absorbs heat, it cannot dissipate heat in time, resulting in an increase in the temperature of the mobile phone case itself. This will not only affect the user's holding experience, but may also cause damage to the material of the mobile phone case. Summary of the Utility Model

[0005] The main purpose of the utility model is to propose a heat dissipation shell of an electronic device with a double flow channel. By setting two flow channels to work together, one flow channel is used for active heat dissipation, and the other flow channel is used for passive heat dissipation, thereby effectively improving the heat dissipation efficiency of the electronic device and reducing power consumption.

[0006] To solve the above technical problems, the utility model proposes a heat dissipation shell of an electronic device with a double flow channel, including: a housing adapted to the electronic device; wherein, it also includes

[0007] an active heat dissipation flow channel;

[0008] a passive heat dissipation flow channel;

[0009] A temperature sensing module for detecting the temperature of the electronic device on the housing;

[0010] And a micro pump connected to the active heat dissipation channel;

[0011] Wherein, the micro pump can make the coolant in the active heat dissipation channel circulate automatically, and the coolant in the passive heat dissipation channel circulates spontaneously after being heated;

[0012] The entire channel or at least part of the channel on the passive heat dissipation channel is set as a unidirectional conduction channel structure;

[0013] The flow direction of the coolant in the unidirectional conduction channel structure is the same as that of the coolant in the active heat dissipation channel.

[0014] In the above technical solution, further, the unidirectional conduction channel structure is a Tesla valve channel.

[0015] In any of the above technical solutions, further, a layer structure for increasing the contact area between the inner wall of the active heat dissipation channel and / or the passive heat dissipation channel and the coolant is provided;

[0016] Wherein, the layer structure is a metal mesh layer or a sintered metal powder layer.

[0017] In any of the above technical solutions, further, the active heat dissipation channel and / or the passive heat dissipation channel are made of a metal material with a high thermal conductivity coefficient.

[0018] In any of the above technical solutions, further, it further includes:

[0019] A heat conducting plate is arranged on the heat dissipation channel for exchanging heat with the electronic device on the housing and transferring the heat to the heat dissipation channel.

[0020] In any of the above technical solutions, further, it further includes:

[0021] A heat insulation net is arranged on the outer surface of the heat dissipation channel.

[0022] In any of the above technical solutions, further, it further includes:

[0023] A power supply module is electrically connected to the micro pump to supply power to the micro pump;

[0024] Wherein, the power supply module is a wireless charging module.

[0025] In any of the above technical solutions, further, the electronic device is a mobile phone, a tablet computer or a notebook computer.

[0026] In any of the above technical solutions, further, the active heat dissipation channel and the passive heat dissipation channel are two separate and non-conductive channels.

[0027] In any of the above technical solutions, further, the active heat dissipation channel is divided into a first main channel and a second main channel, and the passive heat dissipation channel is divided into a first auxiliary channel and a second auxiliary channel;

[0028] Among them, the first main channel and the first auxiliary channel are the same channel, the micropump is arranged on the second main channel, and at least part of the unidirectional conductive channel structure forms the second auxiliary channel.

[0029] Beneficial effects: Compared with the prior art, by combining the two methods of active heat dissipation and passive heat dissipation, this structure can ensure that the coolant forms a uniform and stable flow layer on the surface of the electronic device, thereby effectively taking away heat. This design greatly improves the heat dissipation efficiency, can meet the heat dissipation requirements of high-performance electronic devices, and can also reduce power consumption. Description of the Drawings

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0031] Figure 1 is a schematic structural diagram of the heat dissipation housing of the present invention;

[0032] Figure 2 is an exploded structural diagram of the heat dissipation housing of the present invention;

[0033] Figure 3 is a schematic structural diagram of the first heat dissipation channel of the present invention;

[0034] Figure 4 is a schematic structural diagram of the second heat dissipation channel of the present invention;

[0035] Figure 5 is a schematic structural diagram of the unidirectional conductive channel structure of the present invention;

[0036] Figure 6 is a schematic internal structural diagram of the heat dissipation channel of the present invention.

[0037] The description of the reference numerals in the drawings is as follows:

[0038] 10. Housing; 100. Heat dissipation channel; 110. Active heat dissipation channel; 111. First main channel; 112. Second main channel; 120. Passive heat dissipation channel; 121. One-way conduction channel structure; 122. First auxiliary channel; 123. Second auxiliary channel; 200. Micro pump; 300. Control module; 400. Heat conducting plate; 500. Heat insulation net; 600. Layer structure; 700. Power supply module. Detailed implementation manners

[0039] Next, exemplary embodiments according to the present application will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. It should be understood that the present application is not limited by the exemplary embodiments described herein. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present invention without creative efforts shall fall within the scope of protection of the present invention.

[0040] It should be noted that, as shown in the present application and the claims, unless the context clearly indicates an exception, words such as "a", "an", "one" and / or "the" are not specifically singular and may also include plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of the clearly identified steps and elements, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements.

[0041] If there are directional indications (such as up, down, left, right, front, back...) involved in the embodiments of the present invention, the directional indications are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the drawings). If the specific posture changes, the directional indications will also change accordingly.

[0042] In the present invention, unless otherwise clearly specified and defined, terms such as "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] In addition, if the descriptions such as "first" and "second" are involved in the embodiments of the present utility model, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be construed as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and / or" appearing throughout the text includes three parallel scenarios. Taking "A and / or B" as an example, it includes scenario A, or scenario B, or the scenario where both A and B are satisfied simultaneously. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present utility model.

[0044] This embodiment provides a dual-channel heat dissipation housing for an electronic device. By setting two channels to work together, one channel is used for active heat dissipation and the other channel is used for passive heat dissipation, thereby effectively improving the heat dissipation efficiency of the electronic device and reducing power consumption.

[0045] The following will detail the heat dissipation housing of the electronic device of the present application through the following embodiments.

[0046] Embodiment 1:

[0047] As Figure 1 and Figure 2 shown, in this embodiment, the heat dissipation housing for an electronic device, which is used for dissipating heat from and protecting the electronic device, includes: a housing 10 adapted to the electronic device; wherein, a heat dissipation channel 100 is further provided on the housing 10, and the heat dissipation channel 100 is divided into an active heat dissipation channel 110 and a passive heat dissipation channel 120; a micropump 200 connected to the active heat dissipation channel 110; a temperature sensing module (not shown in the figure) for detecting the temperature of the electronic device; a control module 300 electrically connected to the micropump 200 and the temperature sensing module, and controlling the operating state of the micropump 200 according to the temperature signal detected by the temperature sensing module;

[0048] Among them, the micropump 200 can make the coolant in the active heat dissipation channel 110 circulate automatically, and the coolant in the passive heat dissipation channel 120 circulates spontaneously after being heated.

[0049] With the wide application of high-performance electronic devices, how to effectively manage the heat generated by these devices during operation has become a key challenge. Especially in high-integration and high-heat-density systems, the heat dissipation problem is even more important. In response to this need, we have designed an innovative dual-channel heat dissipation structure that combines the advantages of active heat dissipation and passive heat dissipation, providing an efficient heat dissipation solution for electronic devices.

[0050] Specifically, the heat dissipation channel 100 is the core part of the heat dissipation structure, which is divided into two independent but complementary channels: the active heat dissipation channel 110 and the passive heat dissipation channel 120. The design of these two channels enables the coolant to more efficiently carry away the heat generated by the electronic device.

[0051] The micropump 200 is closely connected to the active heat dissipation channel 110. The micropump 200 can generate a driving force to make the coolant in the active heat dissipation channel 110 circulate automatically. This kind of flow is not only fast, but also can ensure that the coolant evenly covers the surface of the electronic device, thereby effectively taking away the heat.

[0052] It should be noted that the control module 300 will intelligently adjust the operating state of the micropump 200 according to the temperature signal detected by the temperature sensing module. When the temperature of the electronic device rises, the control module 300 will increase the driving force of the micropump 200 or start the micropump 200 to make the coolant in the active heat dissipation channel 110 circulate rapidly, realizing the heat exchange of the electronic device; when the temperature of the electronic device is at room temperature, the control module 300 does not start the micropump 200. At this time, the electronic device exchanges heat through the coolant in the passive heat dissipation channel 120. According to the principle of heat conduction, heat flows from the high-temperature area to the low-temperature area, thereby realizing the heat dissipation and cooling of the electronic device to save energy.

[0053] This dual-channel heat dissipation structure provides a reliable heat dissipation solution for electronic devices with the advantages of high-efficiency heat dissipation, energy conservation and environmental protection, strong adaptability and easy maintenance.

[0054] It should be noted that the coolant in the heat dissipation channel 100 is a liquid with a high specific heat capacity, such as water, ethylene glycol, etc. High specific heat capacity means that these liquids can absorb and release more heat, thereby greatly improving the heat exchange efficiency and ensuring the continuous and stable operation of the electronic device.

[0055] It should be noted that the temperature sensing module is arranged close to the heat source of the electronic device. Such a layout ensures that the temperature sensing module can accurately and quickly detect the temperature change generated by the electronic device, providing key data support for subsequent temperature control.

[0056] It should be noted that regarding the settings of the active heat dissipation channel 110 and the passive heat dissipation channel 120 on the heat dissipation channel 100, after being arranged around the heat source of the electronic device, they are then arranged in a serpentine, straight groove, zigzag or loop shape at other positions of the electronic device.

[0057] It should be noted that the electronic device can be a mobile phone, a tablet computer or a laptop computer. However, it is not limited to the above products, and other products that can adopt this heat dissipation shell are also applicable.

[0058] Embodiment 2:

[0059] This embodiment is a further improvement based on Embodiment 1.

[0060] In this embodiment, the dual-channel heat dissipation structure further includes: a heat conducting plate 400, which is disposed on the heat dissipation channel 100, used for heat exchange with the electronic device and transferring the heat to the heat dissipation channel 100.

[0061] The main function of the heat conducting plate 400 is to conduct heat exchange with the electronic device, that is, to quickly absorb the heat generated by the electronic device and transfer it to other places, thereby preventing heat from accumulating inside the device.

[0062] Specifically, the heat conducting plate 400 is usually made of materials with high thermal conductivity, such as metal alloys like aluminum and copper, or heat-conducting silicone pads made of non-metallic materials. These materials have good thermal conductivity and can quickly transfer heat from the heat source to the other side of the heat conducting plate 400 (one side of the heat conducting plate 400 is closely connected to the heat dissipation channel 100, and the absorbed heat is quickly transferred to the heat dissipation channel 100 for dissipation). At the same time, the shape and size of the heat conducting plate 400 will also be optimized according to the specific structure of the electronic device and the heat dissipation requirements to ensure that it can effectively cover the heat source and maximize the contact area with the heat source.

[0063] Embodiment 3:

[0064] This embodiment is a further improvement based on any of the above embodiments.

[0065] As Figure 2 shown, in this embodiment, the dual-channel heat dissipation structure further includes: a heat insulation net 500, which is arranged to cover the outer surface of the heat dissipation channel 100.

[0066] By setting the heat insulation net 500, it effectively prevents the human body from directly contacting the high-temperature heat dissipation channel 100, while maintaining good air permeability. While providing heat insulation, it can also promote the heat exchange between the heat dissipation channel 100 and the atmospheric environment.

[0067] Embodiment 4:

[0068] This embodiment is a further improvement based on any of the above embodiments.

[0069] As Figure 2 and Figure 6 shown, in this embodiment, both the active heat dissipation channel 110 and the passive heat dissipation channel 120 are made of metal materials with high thermal conductivity.

[0070] Adopting a metal heat dissipation flow channel 100 with a high thermal conductivity coefficient and combining it with a heat conducting plate 400 can quickly transfer the heat of the heat source of the electronic device into the coolant in the flow channel, further accelerating the heat dissipation process.

[0071] It should be noted that the heat dissipation flow channel 100 can be processed by etching or 3D printing, but is not limited thereto.

[0072] Optimally, a layer structure 600 for increasing the contact area between it and the coolant is provided on the inner wall of the active heat dissipation flow channel 110 and / or the passive heat dissipation flow channel 120;

[0073] Among them, the layer structure 600 is a metal mesh layer or a sintered metal powder layer, and the particle size of the metal powder can be 60 - 100 um.

[0074] In the design of optimizing the heat dissipation system, we propose to provide a special layer structure 600 on the inner wall of the active heat dissipation flow channel 110 and / or the passive heat dissipation flow channel 120, aiming to increase the contact area between the inner wall of the flow channel and the coolant, thereby accelerating the heat transfer and further accelerating the heat dissipation process.

[0075] The metal mesh layer is woven by fine metal wires and can form a porous structure on the inner wall of the flow channel. This structure can not only increase the contact area between the inner wall of the flow channel and the coolant, but also allow the coolant to flow more freely, reduce the flow resistance, and improve the heat dissipation efficiency. At the same time, the metal mesh layer has excellent thermal conductivity and can quickly transfer the heat from the inner wall of the flow channel to the coolant, thereby realizing efficient heat exchange.

[0076] The sintered metal powder layer is a porous structure formed by sintering metal powder at high temperature. This structure has good thermal conductivity and high temperature resistance, and can also increase the contact area between the inner wall of the flow channel and the coolant, improving the heat dissipation efficiency.

[0077] Therefore, whether choosing the metal mesh layer or the sintered metal powder layer as the layer structure 600 can significantly increase the contact area between the inner wall of the heat dissipation flow channel 100 and the coolant, thereby accelerating the heat transfer and heat dissipation process. This design can not only improve the heat dissipation efficiency, but also reduce the temperature of the device and extend the service life of the device.

[0078] Example Five:

[0079] This embodiment is a further improvement based on any of the above embodiments.

[0080] As Figure 2 shown, in this embodiment, the double-flow channel heat dissipation structure further includes: a power supply module 700, electrically connected to the micro pump 200, the temperature sensing module, and the control module 300;

[0081] Among them, the power supply module 700 is a wireless charging module.

[0082] The power supply module 700 provides stable power support for the entire temperature control system. It can provide sufficient electrical energy for the micropump 200, the temperature sensing module, and the control module 300 to ensure that they can work continuously and stably.

[0083] Optimally, the power supply module 700 is a wireless charging module.

[0084] In this embodiment, we optimized the power supply module 700 and specifically selected a wireless charging module as the power supply solution. This choice not only meets the pursuit of convenience and efficiency but also brings a more flexible and convenient charging experience to users.

[0085] The wireless charging module realizes wireless power transmission between the power sending end and the power receiving end through technologies such as electromagnetic induction or magnetic resonance.

[0086] It should be noted that the electronic device needs to be equipped with a wireless reverse charging device. After the heat dissipation structure is set on the electronic device, the micropump 200, the temperature sensing module, and the control module 300 are powered by the wireless reverse charging device on the electronic device. This design can effectively reduce the volume of the entire heat dissipation structure. There is no need to build in a battery anymore. As long as the electronic device has power, it can work and can achieve automatic charging, which is very convenient.

[0087] As an optimized choice for the power supply module 700, the wireless charging module not only improves the charging experience of the electronic device but also brings a more convenient and efficient using feeling to users.

[0088] It should be noted that the wireless charging module is arranged on the outer shell and corresponds to the wireless reverse charging module on the electronic device. When it is detected that the battery level of the electronic device is below 20%, it will stop working. This setting can prevent the electronic device from continuously supplying power to the outer shell, resulting in the shutdown of the electronic device due to too low battery level.

[0089] Embodiment Six:

[0090] This embodiment is a further improvement based on any of the above embodiments.

[0091] As Figure 4 and Figure 5 shown, in this embodiment, the entire flow channel or at least part of the flow channel on the passive heat dissipation flow channel 120 is set as a unidirectional conduction flow channel structure 121;

[0092] Among them, the flow direction of the coolant in the unidirectional conduction flow channel structure 121 is the same as the flow direction of the coolant in the active heat dissipation flow channel 110.

[0093] By setting the passive heat dissipation channel 120 as a unidirectional conduction structure, the flow resistance in the passive heat dissipation channel 120 can be effectively reduced, so that the coolant can flow rapidly in the passive heat dissipation channel 120, improving the heat dissipation efficiency. At the same time, the temperature threshold for starting the micropump 200 is also reduced, which is more environmentally friendly and energy-saving than before.

[0094] It should be noted that the unidirectional conduction channel structure 121 is a Tesla valve channel.

[0095] The Tesla valve is a special unidirectional conduction air flow valve with a unique channel design, which can achieve unidirectional conduction of fluid without any moving parts.

[0096] When the fluid flows through the Tesla valve channel in the forward direction, the fluid is divided into two parts in different directions, forming a vortex-like flow. When the fluid flows through the Tesla valve channel in the reverse direction, the large angular momentum generated by the vortex fluid causes the reverse fluid to be subjected to a large pressure, so that the channel cannot conduct in the reverse direction, realizing the unidirectional conduction of the fluid.

[0097] By using the Tesla valve channel as the unidirectional conduction channel structure 121, it is beneficial to the flow of the coolant in the passive heat dissipation channel 120.

[0098] Embodiment Seven:

[0099] This embodiment is a further improvement based on any of the above embodiments.

[0100] As Figure 3 shown, in this embodiment, the active heat dissipation channel 110 and the passive heat dissipation channel 120 are two separate and non-conductive channels, and the active heat dissipation channel 110 and the passive heat dissipation channel 120 are arranged at intervals.

[0101] Embodiment Eight:

[0102] The difference between this embodiment and Embodiment Seven is that the structures of the active heat dissipation channel 110 and the passive heat dissipation channel 120 are optimized.

[0103] As Figure 4 shown, specifically, the active heat dissipation channel 110 is divided into a first main channel 111 and a second main channel 112, and the passive heat dissipation channel 120 is divided into a first auxiliary channel 122 and a second auxiliary channel 123;

[0104] Among them, the first main channel 111 and the first auxiliary channel 122 are the same channel, the micropump 200 is arranged on the second main channel 112, and at least part of the unidirectional conduction channel structure 121 forms the second auxiliary channel 123.

[0105] By setting the active heat dissipation channel 110 and the passive heat dissipation channel 120 in parallel, on the one hand, it is convenient for the processing of the heat dissipation channel 100; on the other hand, it can effectively save production costs.

[0106] Embodiment Nine:

[0107] This embodiment is a further improvement based on any of the above embodiments.

[0108] As Figures 1-4 shown, in this embodiment, a control method for the heat dissipation housing of an electronic device is proposed.

[0109] Specifically, the contact position between the heat dissipation channel 100 and the heat source of the electronic device on the housing 10 is the heat absorption area, and the non-heat source areas are all radiator areas.

[0110] When operating at low power, the electronic device is connected to the heat dissipation channel 100 through the heat conduction plate 400. The heat of the heat source on the electronic device is quickly transferred to a local area of the passive heat dissipation channel 120. The temperature of the coolant inside this area rises. The high-energy coolant molecules spontaneously flow towards the low-temperature area inside the passive heat dissipation channel 120. When the high-temperature coolant flows to the low-temperature area, the temperature gradually drops. This process is repeated, causing the coolant to circulate inside the channel. The low-temperature coolant circulates back to the heat absorption area to continue taking away heat, achieving cyclic heat dissipation.

[0111] As the coolant circulates, the heat is evenly distributed throughout the channel, avoiding heat concentration in the heat source area and affecting the product use experience and the service life of electronic components. After heat equalization, the coolant gradually dissipates the heat to the atmospheric environment through natural heat dissipation during the flow process. The cooled coolant continues to participate in the cycle and continuously equalizes heat. At this time, the passive heat dissipation channel 120 plays a major role, and the active heat dissipation channel 110 is blocked by the micropump 200 and does not work.

[0112] When the electronic device operates in a high-power state and the passive heat dissipation channel 120 alone cannot meet the radiator requirements, at this time, the passive heat dissipation channel 120 and the active heat dissipation channel 110 work together. During operation, when the temperature sensing module detects that the temperature at the heat source of the electronic device reaches the threshold, the micropump 200 is started to drive the coolant inside the active heat dissipation channel 110 to flow, evenly distribute the heat throughout the channel, and take away the heat through natural heat dissipation. After the coolant temperature drops, it circulates to the heat absorption area to continue absorbing heat and transferring it to the radiator area.

[0113] According to the actual situation, the temperature threshold for starting the micropump 200 can be set at about 15°C. When the temperature sensing module detects that the temperature at the heat source of the electronic device is greater than or equal to 15°C, the micropump 200 is started, otherwise the micropump 200 is not started.

[0114] The embodiments of the present disclosure have been described above. The above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations are obvious to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The choice of terms used herein is intended to best explain the principles of the embodiments, the practical application, or the improvement of technologies in the market, or to enable other ordinary skilled persons in the art to understand the embodiments disclosed herein.

Claims

1. A dual-channel electronic equipment heat dissipation housing, comprising: A housing (10) adapted to the electronic device; characterized in that it also comprises a Active heat dissipation channel (110); Passive heat dissipation channel (120); A temperature sensing module, used to detect the temperature of the electronic device on the housing (10); and a micro pump (200) connected to the active heat dissipation channel (110); The micro pump (200) can cause the coolant in the active heat dissipation channel (110) to circulate automatically, and the coolant in the passive heat dissipation channel (120) to circulate spontaneously after being heated; The entire flow channel or at least a portion of the flow channel on the passive heat dissipation flow channel (120) is configured as a unidirectional flow channel structure (121); The flow direction of the coolant in the unidirectional flow channel structure (121) is consistent with the flow direction of the coolant in the active heat dissipation flow channel (110).

2. The dual-channel electronic equipment heat dissipation housing according to claim 1, characterized in that: The one-way conducting flow channel structure (121) is a Tesla valve flow channel.

3. The dual-channel electronic equipment heat dissipation housing according to claim 1, characterized in that: The inner wall of the active heat dissipation channel (110) and / or the passive heat dissipation channel (120) is provided with a layer structure (600) for increasing the contact area between the active heat dissipation channel (110) and the passive heat dissipation channel (120); Wherein, the layer structure (600) is a metal mesh layer or a sintered metal powder layer.

4. The dual-channel electronic equipment heat dissipation housing according to claim 1, characterized in that: The active heat dissipation channel (110) and / or the passive heat dissipation channel (120) are made of a metal material with a high thermal conductivity.

5. The dual-channel electronic equipment heat dissipation housing according to claim 1, characterized in that: Also includes: The heat conducting plate (400) is arranged on the heat dissipation channel (100) and is used to perform heat exchange on the electronic equipment on the housing (10) and transfer the heat to the heat dissipation channel (100).

6. The dual-channel electronic equipment heat dissipation housing according to claim 1, characterized in that: Also includes: The heat insulation net (500) is provided to cover the outer surface of the heat dissipation channel (100).

7. The electronic equipment heat dissipation housing with dual flow channels as claimed in claim 1, characterized in that: Also includes: A power supply module (700) is electrically connected to the micro pump (200) to supply power to the micro pump (200); Wherein, the power supply module (700) is a wireless charging module.

8. The dual-channel electronic equipment heat dissipation housing according to claim 1, characterized in that: The electronic device is a mobile phone, a tablet computer or a laptop computer.

9. The electronic equipment heat dissipation housing with double flow channels according to any one of claims 1 to 8, characterized in that: The active heat dissipation flow channel (110) and the passive heat dissipation flow channel (120) are two groups of independent and non-conducting flow channels.

10. The electronic equipment heat dissipation housing with double flow channels according to any one of claims 1 to 8, characterized in that: The active heat dissipation channel (110) is divided into a first main channel (111) and a second main channel (112), and the passive heat dissipation channel (120) is divided into a first auxiliary channel (122) and a second auxiliary channel (123); The first main flow channel (111) and the first auxiliary flow channel (122) are the same flow channel, the micro pump (200) is arranged on the second main flow channel (112), and the unidirectional flow channel structure (121) at least partially forms the second auxiliary flow channel (123).

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