High-precision die bonder
By designing a high-precision crystal solid machine containing a variety of key components, automated blue film expansion and chip angle adjustment are achieved, which solves the high defect rate and low efficiency problems caused by inaccuracy in these processes by existing crystal solid machines, and improves production accuracy and efficiency.
Patent Information
- Application Number
- CN202422018066.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-19
- Publication Date
- 2025-06-03
- Estimated Expiration
- 2034-08-19
AI Technical Summary
The existing crystal-fixing machines have inaccuracies in the process of chip angle adjustment and blue film expansion, resulting in high product defect rate and low production efficiency, making it difficult to meet the needs of modern industry for efficient and precise production.
A high-precision crystal solidification machine is designed, including a crystal cell film expander, a material transfer mechanism, an angle adjustment mechanism, a crystal solidification mechanism, a glue dispensing mechanism and a crystal solidification platform. Through an automated process, the automatic film expansion of the blue film and the arbitrary adjustment of the chip angle are achieved, and the crystal solidification process is optimized.
The automated crystal solidification process is realized, which reduces the defect rate of the product, saves labor costs, improves the crystal solidification accuracy and efficiency, and can meet the needs of modern industries for efficient and precise production.
Smart Images
Figure CN222939879U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of semiconductor die bonding equipment, and particularly relates to a high-precision die bonder. Background Art
[0002] In the semiconductor packaging and LED manufacturing industries, as one of the key equipment, the performance and efficiency of the die bonder directly affect the product quality and production cost. The existing die bonders mainly adopt a single die bonding mode, which cannot effectively adjust the chip angle, resulting in a high defective rate of products. At the same time, during the operation process, there are often problems such as manual operation required for blue film expansion, inaccurate chip angle adjustment, low die bonding accuracy, and low overall production efficiency. These problems not only increase the labor cost but also may lead to a decrease in product yield, making it difficult to meet the requirements of modern industry for efficient and precise production.
[0003] Therefore, the inventor is committed to designing a die bonder to solve the above problems. Summary of the Utility Model
[0004] The purpose of the utility model is to provide a high-precision die bonder, which can automatically expand the blue film, adjust the chip angle, optimize the die bonding process, not only reduce the defective rate of products, but also save labor and improve die bonding accuracy and efficiency.
[0005] In order to achieve the above purpose, a technical solution adopted by the utility model is as follows:
[0006] A high-precision die bonder includes a working panel, on which a wafer expanding machine, a material transfer mechanism, an angle adjustment mechanism, a die bonding mechanism, a dispensing mechanism, and a die bonding table are provided. The wafer expanding machine, the angle adjustment mechanism, and the die bonding table are arranged at intervals in a row. The material transfer mechanism is located between the wafer expanding machine and the angle adjustment mechanism. The die bonding mechanism and the dispensing mechanism are arranged side by side between the angle adjustment mechanism and the die bonding table. The dispensing mechanism is located between the die bonding mechanism and the die bonding table, and a glue pan mechanism is provided beside the dispensing mechanism.
[0007] As an improvement of the high-precision die bonder of the utility model, the wafer expanding machine is slidably arranged on the working panel along the transverse and longitudinal directions of the working panel, and a wafer detection CCD camera is provided directly above the wafer expanding machine.
[0008] As an improvement of the high-precision die bonder of the utility model, the material transfer mechanism includes a material transfer voice coil motor, a material transfer swing arm, and a material transfer head. The material transfer voice coil motor is rotatably arranged on a fixing plate directly above the working panel, and two ends of the material transfer swing arm are respectively connected to the material transfer voice coil motor and the material transfer head.
[0009] As an improvement of the high-precision die bonder of the present utility model, a swing arm protective cover is fixed on the fixed plate, and the outer end of the swing arm protective cover is arc-shaped and corresponds to the movement track of the transfer head.
[0010] As an improvement of the high-precision die bonder of the present utility model, the angle adjustment mechanism includes a rotating table, and the rotating table is rotatably arranged on the working panel.
[0011] As an improvement of the high-precision die bonder of the present utility model, the rotating table is columnar and a plurality of suction holes are provided at the top thereof, and a calibration CCD camera is provided directly above the rotating table.
[0012] As an improvement of the high-precision die bonder of the present utility model, the die bonding mechanism includes a die bonding voice coil motor, a die bonding swing arm and a die bonding suction head. The die bonding voice coil motor is rotatably arranged on the fixed plate directly above the working panel, and the two ends of the die bonding swing arm are respectively connected to the die bonding voice coil motor and the die bonding suction head.
[0013] As an improvement of the high-precision die bonder of the present utility model, the dispensing mechanism includes a dispensing voice coil motor, a dispensing swing arm and a dispensing head. The dispensing voice coil motor is rotatably arranged on the fixed plate directly above the working panel, and the two ends of the dispensing swing arm are respectively connected to the dispensing voice coil motor and the dispensing head.
[0014] As an improvement of the high-precision die bonder of the present utility model, a fixed plate is provided directly above the working panel, a bracket is provided on the fixed plate, the glue disk mechanism includes a glue disk and a scraper, the glue disk is rotatably arranged on the bracket, and the scraper is located inside the glue disk and its upper end is fixedly connected to the bracket.
[0015] As an improvement of the high-precision die bonder of the present utility model, the glue disk mechanism further includes a glue disk motor, the glue disk motor is fixed on the bracket, and the glue disk motor drives the glue disk to rotate through a belt transmission mechanism and a gear transmission mechanism in sequence.
[0016] Compared with the prior art, the high-precision die bonder of the present utility model arranges key components such as a wafer expanding film machine, a transfer mechanism, an angle adjustment mechanism, a die bonding mechanism, a dispensing mechanism and a die bonding table on the working panel. The wafer expanding film machine automatically expands the blue film, the transfer mechanism transfers materials, the angle adjustment mechanism can arbitrarily adjust the angle of the chip, the dispensing mechanism can accurately suck the solder paste from the glue disk mechanism and complete the dispensing operation on the wafer of the die bonding table. Subsequently, the die bonding mechanism sucks the chip with the adjusted angle and places it on the solder paste to complete the die bonding operation. The whole die bonder can automatically expand the blue film, adjust the chip angle, optimize the die bonding process, not only reduce the defective rate of products, but also save manpower and improve the die bonding precision and efficiency. Description of the Drawings
[0017] Figure 1 is the top view of the high-precision die bonder of the present utility model;
[0018] Figure 2 is the front view of the high-precision die bonder of the present utility model;
[0019] Figure 3 is the perspective view of the high-precision die bonder of the present utility model;
[0020] Figure 4 is Figure 3 the enlarged view of part A in
[0021] Figure 5 is Figure 3 the enlarged view of part B in
[0022] Figure 6 is the enlarged perspective view of the fixing plate, the material transfer mechanism and each CCD camera of the present utility model;
[0023] Figure 7 is the enlarged perspective view of the dispensing mechanism of the present utility model;
[0024] Figure 8 is the enlarged perspective view of the glue tray mechanism of the present utility model.
[0025] Illustration:
[0026] 1. Working panel; 11. Fixing plate; 12. Swing arm protective cover; 13. Wafer detection CCD camera; 14. Calibration CCD camera; 15. Die bonding CCD camera; 2. Wafer film expanding machine; 21. Crosswise sliding rail; 22. Longitudinal sliding rail; 3. Material transfer mechanism; 31. Material transfer motor; 32. Material transfer voice coil motor; 33. Material transfer swing arm; 331. Material transfer head; 4. Angle adjustment mechanism; 41. Rotating table; 5. Die bonding mechanism; 51. Die bonding motor; 52. Die bonding voice coil motor; 53. Die bonding swing arm; 531. Die bonding suction head; 6. Glue tray mechanism; 61. Bracket; 62. Glue tray motor; 63. Belt; 64. First gear; 65. Second gear; 66. Glue tray; 67. Scraper; 7. Dispensing mechanism; 71. Dispensing motor; 72. Dispensing voice coil motor; 73. Dispensing swing arm; 731. Dispensing head; 8. Die bonding table; 81. Slide carriage; 82. Longitudinal guide rail; 83. Crosswise guide rail. Specific embodiments
[0027] The following combines with the attached drawings to specifically clarify the embodiments of the present utility model. The attached drawings are only for reference and illustration, and do not constitute a limitation to the scope of patent protection of the present utility model.
[0028] Refer to Figures 1 to 8, A high-precision die bonder, comprising a working panel 1, a wafer film expanding machine 2, a transfer mechanism 3, an angle adjustment mechanism 4, a glue disk mechanism 6, a dispensing mechanism 7, a die bonding mechanism 5 and a die bonding stage 8. The wafer film expanding machine 2, the transfer mechanism 3, the angle adjustment mechanism 4, the die bonding mechanism 5, the dispensing mechanism 7 and the die bonding stage 8 are all arranged on the working panel 1. The wafer film expanding machine 2, the angle adjustment mechanism 4 and the die bonding stage 8 are arranged at intervals in a row. The transfer mechanism 3 is located between the wafer film expanding machine 2 and the angle adjustment mechanism 4. The die bonding mechanism 5 and the dispensing mechanism 7 are arranged side by side between the angle adjustment mechanism 4 and the die bonding stage 8. The dispensing mechanism 7 is located between the die bonding mechanism 5 and the die bonding stage 8. The glue disk mechanism 6 is arranged beside the dispensing mechanism 7.
[0029] Refer to Figures 1 to 3 , Two transverse sliding rails 21 are fixedly arranged at intervals at the right end of the working panel 1. Each transverse sliding rail 21 is arranged along the transverse direction of the working panel 1. Two longitudinal guide rails 82 are fixedly arranged at intervals at the left end of the working panel 1. Each longitudinal guide rail 82 is arranged along the longitudinal direction of the working panel 1. A fixed plate 11 is arranged directly above the working panel 1. The fixed plate 11 is fixedly connected to the working panel 1 through support columns. A wafer detection CCD camera 13, a calibration CCD camera 14 and a die bonding CCD camera 15 are fixedly arranged on the fixed plate 11 in sequence from right to left.
[0030] Refer to Figures 1 to 3 , The wafer film expanding machine 2 can automatically perform film expanding treatment on the blue film without manual intervention, thus saving labor costs and process time and improving production efficiency. Two longitudinal sliding rails 22 are arranged at intervals at the bottom of the wafer film expanding machine 2. The wafer film expanding machine 2 is slidably arranged on the two longitudinal sliding rails 22. The wafer film expanding machine 2 and the two longitudinal sliding rails 22 are slidably arranged on the two transverse sliding rails 21, so that the wafer film expanding machine 2 can slide along the transverse and longitudinal directions of the working panel 1. The user can automatically or manually control the specific position of the wafer film expanding machine 2 on the working panel 1. The wafer detection CCD camera 13 is located directly above the wafer film expanding machine 2.
[0031] Refer to Figure 3 and Figure 6, the transfer mechanism 3 is responsible for quickly and accurately transferring the wafer after film expansion to the angle adjustment mechanism 4 to prepare for the subsequent chip angle adjustment. The transfer mechanism 3 includes a transfer motor 31, a transfer voice coil motor 32, a transfer swing arm 33, and a transfer head 331. The transfer motor 31 is fixed on the fixed plate 11. The transfer voice coil motor 32 is rotatably arranged at the bottom of the fixed plate 11 and fixed on the output shaft of the transfer motor 31. One end of the transfer swing arm 33 is arranged at the output end of the transfer voice coil motor 32, and the transfer head 331 is arranged at the other end of the transfer swing arm 33. To prevent the transfer swing arm 33 from hitting other objects during the rapid swing, a swing arm protective cover 12 is also fixed on the fixed plate 11. The swing arm protective cover 12 is located above the transfer swing arm 33 and close to the transfer swing arm 33. The outer end of the swing arm protective cover 12 is arc-shaped and corresponds to the movement track of the transfer head 331.
[0032] Refer to Figure 3 and Figure 4 , the angle adjustment mechanism 4 adopts high-precision module technology and can realize arbitrary adjustment of the chip angle. This rotation correction function not only improves the accuracy of chip placement but also makes the die bonding operation more flexible and diverse, meeting the production requirements of different products. The angle adjustment mechanism 4 includes a rotating table 41 and a rotating motor. The rotating table 41 is rotatably arranged on the working panel 1, and the rotating motor is fixed on the working panel 1 and located at the bottom of the rotating table 41. The rotating table 41 is driven by the rotating motor to rotate. The entire rotating table 41 is columnar and has a plurality of suction holes at its top. The calibration CCD camera 14 is arranged directly above the rotating table 41, and the rotating table 41 is driven by the rotating motor to rotate.
[0033] Refer to Figure 3 , a slide carriage 81 is provided between the die bonding table 8 and the working panel 1. Two transverse guide rails 83 are fixed on the top of the slide carriage 81. Each transverse guide rail 83 is arranged along the transverse direction of the working panel 1. The slide carriage 81 and the die bonding table 8 are slidably arranged on two longitudinal guide rails 82. The die bonding table 8 is slidably arranged on the two transverse guide rails 83 of the slide carriage 81 so that the die bonding table 8 can slide along the transverse and longitudinal directions of the working panel 1. The user can automatically or manually control the specific position of the die bonding table 8 on the working panel 1. The die bonding CCD camera 15 is located directly above the die bonding table 8.
[0034] Refer to Figure 3 , Figure 5 and Figure 8, a bracket 61 is fixed to the left end of the fixing plate 11. The glue dispensing mechanism 6 includes a glue dispensing motor 62, a belt transmission mechanism, a gear transmission mechanism, a glue dispensing tray 66 and a squeegee 67. The glue dispensing motor 62 is fixed to the bracket 61. The driving pulley of the belt transmission mechanism is arranged on the output shaft of the glue dispensing motor 62. The belt 63 of the belt transmission mechanism is sleeved on its driving pulley and its driven pulley. The gear transmission mechanism includes a first gear 64 and a second gear 65. The first gear 64 meshes with the second gear 65. The first gear 64 is coaxially arranged with the driven pulley of the belt transmission mechanism. The glue dispensing tray 66 is coaxially arranged with the second gear 65 and is located directly below the second gear 65. The glue dispensing tray 66 is rotatably connected to the bracket 61. The glue dispensing motor 62 drives the glue dispensing tray 66 to rotate through the belt transmission mechanism and the gear transmission mechanism in sequence. The squeegee 67 is located inside the glue dispensing tray 66 and its upper end is fixedly connected to the bracket 61. As the glue dispensing tray 66 rotates, the squeegee 67 can scrape the solder paste in the glue dispensing tray 66 evenly.
[0035] Refer to Figure 3 , Figure 5 and Figure 7 , the dispensing mechanism 7 is located between the glue dispensing mechanism 6 and the die bonding mechanism 5. The dispensing mechanism 7 and the die bonding mechanism 5 are arranged side by side between the angle adjustment mechanism 4 and the die bonding table 8. This layout enables seamless connection between the dispensing and die bonding operations, improving production efficiency. The dispensing mechanism 7 can accurately suck the solder paste from the glue dispensing mechanism 6 and complete the dispensing operation on the wafer of the die bonding table 8. Subsequently, the die bonding mechanism 5 sucks the chip with the adjusted angle and places it on the solder paste to complete the die bonding operation. The dispensing mechanism 7 includes a dispensing motor 71, a dispensing voice coil motor 72, a dispensing swing arm 73 and a dispensing head 731. The dispensing motor 71 is fixed to the fixing plate 11. The dispensing voice coil motor 72 is rotatably arranged on the fixing plate 11 and is connected to the output end of the dispensing motor 71. One end of the dispensing swing arm 73 is connected to the output end of the dispensing voice coil motor 72. The dispensing head 731 is arranged at the other end of the dispensing swing arm 73.
[0036] Refer to Figure 3 and Figure 5 , the die bonding mechanism 5 includes a die bonding motor 51, a die bonding voice coil motor 52, a die bonding swing arm 53 and a die bonding suction head 531. The die bonding motor 51 is fixed to the fixing plate 11. The die bonding voice coil motor 52 is rotatably arranged on the fixing plate 11 and is located on the output end of the die bonding motor 51. The two ends of the die bonding swing arm 53 are respectively connected to the die bonding voice coil motor 52 and the die bonding suction head 531.
[0037] Refer to Figures 1 to 8 , the working principle of the high-precision die bonder of the present utility model is as follows:
[0038] Place the blue film on the wafer expanding machine 2 for automatic film expansion;
[0039] The material transfer voice coil motor 32 drives the material transfer swing arm 33 and the material transfer head 331 to move up and down together. At the same time, the material transfer motor 31 drives the material transfer voice coil motor 32 to rotate a certain angle, thereby driving the material transfer swing arm 33 to swing around the output shaft of the material transfer motor 31, so that the material transfer head 331 transfers the wafer on the wafer expanding film machine 2 to the top of the rotating table 41;
[0040] The rotation motor drives the rotating table 41 to rotate to adjust the angle of the wafer;
[0041] The glue disk motor 62 controls the rotation of the glue disk 66 through the belt transmission mechanism and the gear transmission mechanism in sequence, and the squeegee 67 spreads the solder paste in the glue disk 66 evenly;
[0042] The dispensing voice coil motor 72 controls the dispensing swing arm 73 and the dispensing head 731 to move up and down. At the same time, the dispensing motor 71 controls the dispensing voice coil motor 72 to rotate a certain angle, thereby driving the dispensing swing arm 73 to swing, so that the dispensing head 731 sucks the solder paste in the glue disk 66 and dots the solder paste on the wafer on the die bonding stage 8;
[0043] The die bonding voice coil motor 52 controls the die bonding swing arm 53 and the die bonding suction head 531 to move up and down. The die bonding motor 51 controls the die bonding voice coil motor 52 to rotate a certain angle, thereby driving the die bonding swing arm 53 to swing, so that the die bonding suction head 531 sucks the wafer on the rotating table 41 and places the wafer on the solder paste of the wafer, and the die bonding is completed.
[0044] The high-precision die bonder of the present utility model realizes the full-automatic process from blue film expanding to chip die bonding through integrated design and intelligent control. Specifically, the die bonder includes a working panel 1, on which key components such as a wafer expanding film machine 2, a material transfer mechanism 3, an angle adjustment mechanism 4, a die bonding mechanism 5, a dispensing mechanism 7, and a die bonding stage 8 are arranged. This layout design not only optimizes the equipment structure but also enables the components to cooperate closely to jointly complete the complex die bonding operation.
[0045] The high-precision die bonder of the present utility model can not only automatically expand the blue film, saving manpower and processes, but also has a rotation correction function, can arbitrarily adjust the chip angle, and can perform die bonding more precisely. The entire die bonder can optimize the existing process flow and greatly improve production efficiency.
[0046] The above-disclosed are only the preferred embodiments of the present utility model and cannot be used to limit the scope of the patent protection of the present utility model. Therefore, equivalent changes made according to the scope of the patent application of the present utility model still fall within the scope covered by the present utility model.
Claims
1. A high-precision die bonding machine, comprising a working panel, characterized in that: The working panel is provided with a wafer expander, a material transfer mechanism, an angle adjustment mechanism, a crystal bonding mechanism, a glue dispensing mechanism and a crystal bonding table. The wafer expander, the angle adjustment mechanism and the crystal bonding table are arranged in a row with intervals. The material transfer mechanism is located between the wafer expander and the angle adjustment mechanism. The crystal bonding mechanism and the glue dispensing mechanism are arranged side by side between the angle adjustment mechanism and the crystal bonding table. The glue dispensing mechanism is located between the crystal bonding mechanism and the crystal bonding table. A glue disc mechanism is provided next to the glue dispensing mechanism.
2. The high-precision die bonding machine according to claim 1, characterized in that: The wafer expander is slidably arranged on the working panel in the horizontal and vertical directions of the working panel, and a wafer detection CCD camera is arranged directly above the wafer expander.
3. The high-precision die bonding machine according to claim 1, characterized in that: The material transfer mechanism includes a material transfer voice coil motor, a material transfer swing arm and a material transfer head. The material transfer voice coil motor is rotatably arranged on a fixed plate directly above the working panel, and the two ends of the material transfer swing arm are respectively connected to the material transfer voice coil motor and the material transfer head.
4. The high-precision die bonding machine according to claim 3, characterized in that: A swing arm protective cover is fixed on the fixed plate, and the outer end of the swing arm protective cover is arc-shaped and corresponds to the movement trajectory of the material transfer head.
5. The high-precision die bonding machine according to claim 1, characterized in that: The angle adjustment mechanism comprises a rotating platform, and the rotating platform is rotatably arranged on the working panel.
6. The high-precision die bonding machine according to claim 5, characterized in that: The rotating platform is columnar and has a plurality of air suction holes on its top. A calibration CCD camera is arranged directly above the rotating platform.
7. The high-precision die bonding machine according to claim 1, characterized in that: The crystal bonding mechanism includes a crystal bonding voice coil motor, a crystal bonding swing arm and a crystal bonding suction head. The crystal bonding voice coil motor is rotatably arranged on a fixed plate directly above the working panel, and the two ends of the crystal bonding swing arm are respectively connected to the crystal bonding voice coil motor and the crystal bonding suction head.
8. The high-precision die bonding machine according to claim 1, characterized in that: The glue dispensing mechanism includes a glue dispensing voice coil motor, a glue dispensing swing arm and a glue dispensing head. The glue dispensing voice coil motor is rotatably arranged on a fixed plate directly above the working panel, and the two ends of the glue dispensing swing arm are respectively connected to the glue dispensing voice coil motor and the glue dispensing head.
9. The high-precision die bonding machine according to claim 1, characterized in that: A fixing plate is provided just above the working panel, a bracket is provided on the fixing plate, the glue disc mechanism comprises a glue disc and a scraper, the glue disc is rotatably arranged on the bracket, the scraper is located in the glue disc and the upper end thereof is fixedly connected to the bracket.
10. The high-precision die bonding machine according to claim 9, characterized in that: The glue disc mechanism also includes a glue disc motor, which is fixed on the bracket and drives the glue disc to rotate through a belt transmission mechanism and a gear transmission mechanism in turn.