High-thermal-conductivity voltage-resistant high-power LED (light-emitting diode) aluminum substrate

Abstract

The utility model discloses a high-heat-conduction pressure-resistant high-power LED aluminum substrate which comprises a mounting base and a mounting plate, the inner bottom of the mounting base is fixedly connected with a cooling fan through a support, the outer side wall of the mounting base is provided with a plurality of cooling holes communicated with the interior of the mounting base, the upper surface of the mounting base is fixedly connected with a first mounting ring, and the first mounting ring is fixedly connected with a second mounting ring. A plurality of limiting blocks are fixedly connected to the outer side wall of the first mounting ring. A second mounting ring on the mounting plate is aligned with a first mounting ring on the mounting base, the mounting plate is rotated, the mounting plate and the mounting base are fixed, when the temperature is too high, the temperature measuring instrument sets the specified standard exceeding temperature, the cooling fan works, heat is discharged through the heat dissipation holes, the inner side walls of the heat dissipation holes are provided with filter sleeves, and the heat dissipation effect is good. External dust, mosquitoes and the like can be prevented from entering, a certain temperature is reached through the aluminum substrate main body, the cooling fan is automatically started, the cooling performance is greatly improved, and the service life of the aluminum substrate main body is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of aluminum substrates, in particular to a high thermal conductivity, high voltage resistant and high power LED aluminum substrate. Background Technique

[0002] An aluminum substrate is a metal-based copper clad laminate with good heat dissipation function. Generally, it consists of three layers. For high-end applications, it is also designed as a double-sided board, with a structure of circuit layer, insulating layer, aluminum base, insulating layer, and circuit layer. Very few applications are multi-layer boards, which can be formed by laminating ordinary multi-layer boards with insulating layers and aluminum bases. In actual use, it is often used for the installation of LED lights, and most aluminum substrates can meet the current basic use requirements.

[0003] In the existing high thermal conductivity, high voltage resistant and high power LED aluminum substrate, a light-emitting LED lighting lamp is arranged on the top copper foil layer. During continuous use, the lighting lamp will generate a large amount of heat. Traditionally, using components made of materials with good thermal conductivity can produce a certain heat dissipation function, but during long-term use, the heat dissipation effect of the aluminum substrate will become worse and worse, which may cause damage to the aluminum substrate and greatly reduce its service life. Therefore, we provide a high thermal conductivity, high voltage resistant and high power LED aluminum substrate. Content of the Utility Model

[0004] The purpose of the present invention is to provide a high thermal conductivity, high voltage resistant and high power LED aluminum substrate to solve the above deficiencies in the prior art.

[0005] To achieve the above purpose, the utility model adopts the following technical scheme: A high thermal conductivity, high voltage resistant and high power LED aluminum substrate, comprising: a mounting base and a mounting plate. A cooling fan is fixedly connected to the inner bottom of the mounting base through a bracket. A plurality of heat dissipation holes are opened on the outer side wall of the mounting base and are communicated with its interior. The upper surface of the mounting base is fixedly connected with a first mounting ring. A plurality of limiting blocks are fixedly connected to the outer side wall of the first mounting ring. The lower surface of the mounting plate is fixedly connected with a second mounting ring. A plurality of sliding grooves are opened on the inner side wall of the second mounting ring. A limiting groove is opened on the inner side wall of the sliding groove. A rubber block is fixedly connected to the inner side wall of the limiting groove. The limiting block is slidably connected to the inner side wall of the limiting groove. A clamping groove is opened on the upper surface of the mounting plate. An aluminum substrate body is clamped in the clamping groove. A through groove is opened at the inner bottom of the clamping groove. A limiting component is arranged on the mounting plate.

[0006] As a further description of the above technical solution:

[0007] A thermometer is fixedly connected to the inner bottom of the mounting base.

[0008] As a further description of the above technical solution:

[0009] The inner side wall of the mounting base is fixedly connected with a filter sleeve.

[0010] As a further description of the above technical solution:

[0011] The limiting component includes a worm and a worm gear. A plurality of mounting grooves are evenly formed in the outer side wall of the mounting plate. The worm is rotatably connected to the inner bottom of the mounting groove. A groove is formed in the inner side wall of the mounting groove. A worm gear is rotatably connected to the inner bottom of the groove. The worm gear is meshed with the worm.

[0012] As a further description of the above technical solution:

[0013] One end of the worm gear is fixedly connected with a rotating rod. One end of the rotating rod penetrates above the mounting plate and is fixedly sleeved with a baffle.

[0014] As a further description of the above technical solution:

[0015] One end of the worm penetrates outside the mounting groove and is fixedly connected with a turning head.

[0016] The utility model provides a high thermal conductivity and pressure-resistant high-power LED aluminum substrate. It has the following beneficial effects:

[0017] 1. By aligning the second mounting ring on the mounting plate with the first mounting ring on the mounting base and rotating the mounting plate, the limiting block enters the limiting groove through the sliding groove. The limiting block presses the rubber block, so that the limiting block enters the inner bottom of the limiting groove, and the mounting plate and the mounting base are fixed. When the temperature is too high, the thermometer sets a specified over-temperature value, and the cooling fan works, so that the heat is discharged through the heat dissipation holes. The inner side wall of the heat dissipation holes is provided with a filter sleeve, which can prevent external dust, mosquitoes, etc. from entering. When the aluminum substrate body reaches a certain temperature, the cooling fan is automatically turned on, greatly improving its heat dissipation performance and extending the service life of the aluminum substrate body;

[0018] 2. Rotate the turning head, the turning head drives the worm to rotate, so that the worm gear rotates, so that the worm gear drives the baffle to rotate, so that the baffle rotates above the clamping groove on the upper surface of the mounting plate. The aluminum substrate body is clamped in the clamping groove, so that the baffle cooperates with the clamping groove to fix the aluminum substrate body. When replacing the aluminum substrate body, as long as the turning head is rotated so that the baffle and the clamping groove do not coincide in the vertical direction, it can be taken out. The operation is convenient and there is no need to fix it with bolts. The meshing of the worm gear and the worm also makes the limiting component have strong stability and improves the efficiency of replacing the aluminum substrate body. Description of the Drawings

[0019] Figure 1 It is a schematic diagram of the overall structure of a high thermal conductivity and pressure-resistant high-power LED aluminum substrate proposed by the utility model;

[0020] Figure 2The sectional view of the overall structure of a high - thermal - conductivity and high - voltage - resistant high - power LED aluminum substrate proposed by the present utility model;

[0021] Figure 3 The schematic diagram of the connection structure of the mounting base in the present utility model;

[0022] Figure 4 The sectional view of the connection structure of the mounting plate in the present utility model;

[0023] Figure 5 The schematic diagram of the connection structure of the mounting plate in the present utility model.

[0024] Legend description:

[0025] 1. Mounting base; 2. Cooling fan; 3. Thermometer; 4. Heat dissipation holes; 5. First mounting ring; 6. Limiting block; 7. Mounting plate; 8. Second mounting ring; 9. Sliding groove; 10. Limiting groove; 11. Rubber block; 12. Card slot; 13. Through - slot; 14. Aluminum substrate body; 15. Mounting slot; 16. Worm; 17. Groove; 18. Worm gear; 19. Rotating head; 20. Rotating rod; 21. Baffle; 22. Filter sleeve. Specific implementation manners

[0026] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments.

[0027] Refer to Figures 1-5 , a high - thermal - conductivity and high - voltage - resistant high - power LED aluminum substrate, comprising: a mounting base 1 and a mounting plate 7. A cooling fan 2 is fixedly connected to the inner bottom of the mounting base 1 through a bracket. A plurality of heat dissipation holes 4 penetrating through its interior are opened on the outer side wall of the mounting base 1. A first mounting ring 5 is fixedly connected to the upper surface of the mounting base 1. A plurality of limiting blocks 6 are fixedly connected to the outer side wall of the first mounting ring 5. A second mounting ring 8 is fixedly connected to the lower surface of the mounting plate 7. A plurality of sliding grooves 9 are opened on the inner side wall of the second mounting ring 8. A limiting groove 10 is opened on the inner side wall of the sliding groove 9. A rubber block 11 is fixedly connected to the inner side wall of the limiting groove 10. The limiting block 6 is slidably connected to the inner side wall of the limiting groove 10. A card slot 12 is opened on the upper surface of the mounting plate 7. An aluminum substrate body 14 is clamped in the card slot 12. A through - slot 13 is opened at the inner bottom of the card slot 12. A limiting component is arranged on the mounting plate 7. A thermometer 3 is fixedly connected to the inner bottom of the mounting base 1. A filter sleeve 22 is fixedly connected to the inner side wall of the mounting base 1.

[0028] Specifically, when using this high thermal conductivity and high voltage resistant high-power LED aluminum substrate, by fixedly installing the mounting base 1 at the usage position, the aluminum substrate body 14 in the card slot 12 is limited by the limiting component. Then, by aligning the second mounting ring 8 on the mounting plate 7 with the first mounting ring 5 on the mounting base 1, the limiting block 6 on the first mounting ring 5 slides into the chute 9 on the inner side wall of the second mounting ring 8. Rotate the mounting plate 7 so that the limiting block 6 enters the limiting groove 10 via the chute 9. The limiting block 6 presses the rubber block 11, causing the limiting block 6 to enter the inner bottom of the limiting groove 10. The limiting block 6 is thus limited, and the fixing between the mounting plate 7 and the mounting base 1 is completed. The aluminum substrate body 14 on the mounting plate 7 operates. When the temperature is too high, the heat enters the interior of the mounting base 1 through the through groove 13. The thermometer 3 is set with a specified over-temperature value and is electrically connected to the cooling fan 2. The cooling fan 2 operates, causing the heat to be discharged through the heat dissipation holes 4. The inner side wall of the heat dissipation hole 4 is provided with a filter sleeve 22, which can prevent external dust, mosquitoes, etc. from entering. When the aluminum substrate body 14 reaches a certain temperature, the cooling fan 2 is automatically turned on, greatly improving its heat dissipation performance and extending the service life of the aluminum substrate body 14.

[0029] The limiting component includes a worm 16 and a worm gear 18. A number of mounting grooves 15 are evenly formed on the outer side wall of the mounting plate 7. The worm 16 is rotatably connected to the inner bottom of the mounting groove 15. A groove 17 is formed on the inner side wall of the mounting groove 15. The inner bottom of the groove 17 is rotatably connected to the worm gear 18. The worm gear 18 is meshed with the worm 16. One end of the worm gear 18 is fixedly connected to a rotating rod 20. One end of the rotating rod 20 penetrates above the mounting plate 7 and is fixedly sleeved with a baffle 21. One end of the worm 16 penetrates outside the mounting groove 15 and is fixedly connected to a rotating head 19.

[0030] Specifically, rotate the rotating head 19. The rotating head 19 drives the worm 16 to rotate. The worm 16 is meshed with the worm gear 18, causing the worm gear 18 to rotate. The worm gear 18 is fixedly connected to the baffle 21 on the upper surface of the mounting plate 7 through the rotating rod 20, causing the worm gear 18 to drive the baffle 21 to rotate. The baffle 21 rotates above the card slot 12 on the upper surface of the mounting plate 7. The aluminum substrate body 14 is clamped in the card slot 12, causing the baffle 21 to cooperate with the card slot 12 to fix the aluminum substrate body 14. When replacing the aluminum substrate body 14 itself, just rotate the rotating head 19 so that the baffle 21 and the card slot 12 do not coincide in the vertical direction, and then it can be taken out. The operation is convenient and there is no need to fix it with bolts. The meshing of the worm gear 18 and the worm 16 also makes the limiting component have strong stability and improves the efficiency of replacing the aluminum substrate body 14.

[0031] In the description of this specification, the descriptions referring to terms such as "one embodiment", "example", "specific example", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0032] As described above, only the preferred specific embodiments of the present utility model are given, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution and the inventive concept of the present utility model, makes equivalent substitutions or changes, and should be covered by the protection scope of the present utility model.

Claims

1. A high thermal conductivity and pressure-resistant high-power LED aluminum substrate, characterized in that: include: A mounting seat (1) and a mounting plate (7), wherein the inner bottom of the mounting seat (1) is fixedly connected to a cooling fan (2) via a bracket, the outer side wall of the mounting seat (1) is provided with a plurality of cooling holes (4) which penetrate the interior thereof, the upper surface of the mounting seat (1) is fixedly connected to a mounting ring 1 (5), the outer side wall of the mounting ring 1 (5) is fixedly connected to a plurality of limit blocks (6), the lower surface of the mounting plate (7) is fixedly connected to a mounting ring 2 (8), the inner side wall of the mounting ring 2 (8) is provided with a plurality of limit blocks (6) which penetrate the interior thereof, A plurality of slide grooves (9) are provided, the inner side wall of the slide groove (9) is provided with a limit groove (10), the inner side wall of the limit groove (10) is fixedly connected with a rubber block (11), the limit block (6) is slidably connected with the inner side wall of the limit groove (10), the upper surface of the mounting plate (7) is provided with a clamping groove (12), an aluminum substrate body (14) is clamped in the clamping groove (12), a through groove (13) is provided at the inner bottom of the clamping groove (12), and a limit assembly is provided on the mounting plate (7).

2. The high thermal conductivity and pressure-resistant high-power LED aluminum substrate according to claim 1, characterized in that: A temperature measuring instrument (3) is fixedly connected to the inner bottom of the mounting seat (1).

3. The high thermal conductivity and pressure-resistant high-power LED aluminum substrate according to claim 1, characterized in that: A filter sleeve (22) is fixedly connected to the inner side wall of the mounting seat (1).

4. The high thermal conductivity and pressure-resistant high-power LED aluminum substrate according to claim 1, characterized in that: The limiting assembly comprises a worm (16) and a worm wheel (18); the outer side wall of the mounting plate (7) is evenly provided with a plurality of mounting grooves (15); the worm (16) is rotatably connected to the inner bottom of the mounting groove (15); the inner side wall of the mounting groove (15) is provided with a groove (17); the inner bottom of the groove (17) is rotatably connected to the worm wheel (18); the worm wheel (18) is meshingly connected to the worm (16).

5. The high thermal conductivity and pressure-resistant high-power LED aluminum substrate according to claim 4, characterized in that: One end of the worm wheel (18) is fixedly connected to a rotating rod (20), one end of the rotating rod (20) penetrates above the mounting plate (7) and a baffle (21) is fixedly sleeved thereon.

6. The high thermal conductivity and pressure-resistant high-power LED aluminum substrate according to claim 4, characterized in that: One end of the worm (16) passes through the outside of the mounting groove (15) and is fixedly connected to a rotating head (19).

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