Protective plate

Abstract

The utility model provides a protection plate which comprises an upper protection layer, a detection assembly and a lower protection layer, and the detection assembly is located between the upper protection layer and the lower protection layer. The detection assembly comprises an anti-impact layer, a buffer layer and a detection circuit layer, and the anti-impact layer, the buffer layer and the detection circuit layer are stacked in the first direction; the detection circuit layer comprises a detection circuit, the detection circuit comprises a plurality of detection wires, and when the protection plate is impacted by external force and impact energy is transmitted from the anti-impact layer to the buffer layer, the buffer layer with high static pressure strength increases the strain degree of the anti-impact layer at the impacted part, so that the plurality of detection wires in the detection circuit can be broken by impact pits formed by impact; after the plurality of detection wires are broken, the detection circuit can output graded early warning signals. The purpose of reflecting whether the protection plate is impacted and damaged or not through the on-off condition of the wires is achieved through the shearing effect of external force impact kinetic energy on the wires in the detection circuit layer, and after the multiple wires are impacted and broken, the detection circuit can output graded early warning signals.

Description

Technical Field

[0001] This application belongs to the technical field of batteries, and particularly relates to a protective plate. Background Art

[0002] As the most core power supply component in a new energy vehicle, the battery pack determines key indicators such as the vehicle's cruising range, cost, service life, and safety. Currently, the existing battery pack is assembled onto the vehicle as an independent assembly, where the electrical, thermal management, battery management system, etc. in the battery pack are integrated and fixed inside the battery pack. The protective plate of the battery pack not only plays a role in supporting and bearing the internal components of the battery pack but also plays a role in the safety protection of the battery pack. However, the protective plate of the battery pack at the bottom of the vehicle is easily damaged to varying degrees by the bumping, scraping, and squeezing of foreign objects, which poses a serious threat to the safety of the battery pack. However, the driver may not be able to detect it in time, and the damage to the bottom guard plate is highly concealed. If it cannot be detected and effectively controlled in time, it is very likely to cause serious accidents such as the battery pack catching fire or exploding.

[0003] Therefore, there is an urgent need for a sensing device that can monitor the condition of the protective plate at any time to promptly detect abnormal damage at the bottom of the battery pack, thereby reducing and avoiding further hazards. Existing related methods for monitoring the damage of the protective plate using mechanical sensors or through displacement and other schemes generally have problems such as high detection costs, low detection reliability, and limited detection response ranges. These factors may pose risks of false alarms or misreports for damage warnings. Summary of the Utility Model

[0004] The purpose of the embodiments of this application is to provide a protective plate to solve the technical problem of low detection reliability in the prior art when monitoring the damage of the protective plate through mechanical sensors.

[0005] To achieve the above purpose, the technical solution adopted in this application is:

[0006] The second aspect of this application provides a protective plate, including an upper protective layer, a detection component, and a lower protective layer. The detection component is located between the upper protective layer and the lower protective layer, and the three are stacked in a first direction; the detection component includes an impact-resistant layer, a buffer layer, and a detection circuit layer, and the impact-resistant layer, the buffer layer, and the detection circuit layer are stacked in the first direction; the detection circuit layer includes a detection circuit, and the detection circuit includes detection wires. The detection wires are distributed between two layers of the protective plate. When the protective plate is impacted by an external force and the impact energy is transmitted from the impact-resistant layer to the buffer layer, the buffer layer with high static pressure strength increases the strain degree of the impact-resistant layer at the impact point, so that the impact pit formed by the impact can break several detection wires in the detection circuit. After several detection wires are broken, the detection circuit can output a graded warning signal.

[0007] Optionally, the lower protective layer, the impact-resistant layer, the buffer layer, and the upper protective layer are arranged in the first direction, and the lower protective layer is the layer directly contacted by the impact; a detection circuit layer is arranged between the lower protective layer and the impact-resistant layer, and / or a detection circuit layer is arranged between the impact-resistant layer and the buffer layer, and / or a detection circuit layer is arranged between the buffer layer and the upper protective layer.

[0008] Optionally, the buffer layer has a honeycomb structure. The through holes in the buffer layer in the first direction are buffer spaces. The buffer layer includes a plurality of buffer corrugated plates stacked in sequence in the second direction, and the second direction is perpendicular to the first direction; a plurality of corrugated grooves are formed on the buffer corrugated plates, and the plurality of corrugated grooves are arranged at intervals in the third direction in sequence; two adjacent buffer corrugated plates are symmetrically arranged with the central plane therebetween, and two corrugated grooves arranged oppositely in the second direction in two adjacent buffer corrugated plates form a buffer space.

[0009] Optionally, the buffer layer has a corrugated structure. The buffer layer includes a plurality of buffer corrugated plates stacked in sequence in the first direction; a plurality of corrugated grooves are formed on the buffer corrugated plates, and the plurality of corrugated grooves are arranged at intervals in the second direction in sequence; two adjacent buffer corrugated plates are symmetrically arranged with the central plane therebetween, and two corrugated grooves arranged oppositely in the first direction in two adjacent buffer corrugated plates form a buffer space.

[0010] Optionally, a reinforcing flat plate is arranged between two adjacent buffer corrugated plates, and the material of the reinforcing flat plate is metal foil or PP glass fiber.

[0011] Optionally, the buffer space is filled with a filler, and the material of the filler is foamed polyurethane, non-Newtonian fluid or resin glue.

[0012] Optionally, the material of the buffer layer is one of aluminum, stainless steel or polypropylene; the wall thickness range of the buffer layer is 0.02 mm to 0.50 mm.

[0013] Optionally, the static pressure strength range of the buffer layer is 1 MPa to 50 MPa.

[0014] Optionally, the detection wire is a metal wire with an insulating layer; or the detection wire is a non-metallic conductive wire with an insulating layer; or the detection wire is only a metal wire or a non-metallic conductive wire, and the detection wire is insulated by a hot melt adhesive film during the composite process of the protective plate.

[0015] Optionally, the detection wires are arranged in parallel at intervals, and the distance between two adjacent detection wires is between 3 mm and 50 mm.

[0016] Optionally, there is one detection circuit layer, and the detection wires in the detection circuit layer are arranged on the entire board surface inside the protection board; or, there are two or more detection circuit layers, and the detection circuit layers are stacked in the first direction between two layers of the protection board, or the detection circuit layers are distributed in different regions between two layers of the protection board.

[0017] The beneficial effects of this application are as follows: Compared with the prior art, in this application, when the board surface of the protection board is impacted and damaged, the outermost layer (lower protection layer) of the board surface of the protection board is first impacted and deformed by depression. Then, the impact energy is sequentially transmitted to the detection circuit layer and the impact-resistant layer. Since the buffer layer and the impact-resistant layer can focus the impact energy within a certain impact range, the depression amount generated by the impact is more significant within the impact range than outside the range, and the difference in the depression amount is also greater. This makes the depth drop of the impact pit generated by the external force impact even greater, which is more conducive to the detection circuit layer to detect the damage of the protection board and improves the detection reliability of the impact damage of the protection board. In addition, by using the shearing effect of the external force impact kinetic energy on the wires in the detection circuit layer, the purpose of reflecting whether the protection board is impacted and damaged through the on-off situation of the wires is realized. And after several wires are broken, the detection circuit can output a graded warning signal. The scheme is simple and feasible, highly operable, and low in cost. Description of the Drawings

[0018] In order to more clearly illustrate the technical solutions in the embodiments of this application, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of this application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0019] Figure 1 It is a schematic structural diagram of the protection board provided by the embodiment of this application;

[0020] Figure 2 It is a schematic cross-sectional view of the protection board provided by the embodiment of this application;

[0021] Figure 3 It is a schematic structural diagram of the detection circuit layer provided by the embodiment of this application (Case 1);

[0022] Figure 4 It is a schematic structural diagram of the buffer layer provided by the embodiment of this application (Case 1);

[0023] Figure 5 For Figure 4 It is a schematic structural diagram of the buffer corrugated board of the buffer layer in

[0024] Figure 6 It is a schematic structural diagram of the buffer layer provided by the embodiment of this application (Case 2);

[0025] Figure 7 is Figure 6 a schematic structural view of the buffer corrugated board of the buffer layer in the middle;

[0026] Figure 8 is a schematic structural view of the buffer layer provided by the embodiment of the present application (Case 3);

[0027] Figure 9 is a schematic structural view of the detection circuit layer provided by the embodiment of the present application (Case 2);

[0028] Figure 10 is a schematic structural view of the detection circuit layer provided by the embodiment of the present application (Case 3).

[0029] Among them, each reference numeral in the figure:

[0030] 1 - protective plate;

[0031] 11 - lower protective layer; 12 - detection circuit layer; 13 - impact resistance layer; 14 - buffer layer; 15 - upper protective layer;

[0032] 121 - detection wire; 122 - current limiting protection resistor; 123 - voltage dividing resistor; 124 - parallel group; 125 - logic control circuit;

[0033] 141 - buffer corrugated board; 142 - buffer space; 143 - reinforcing flat plate;

[0034] 1411 - first connecting plate part; 1412 - second connecting plate part; 1413 - corrugated groove. Detailed implementation manners

[0035] To make the purpose, technical solutions and advantages of the present application clearer, the following will further describe the embodiments of the present application in detail with reference to the drawings. The embodiments described by referring to the drawings are exemplary and are intended to explain the present application, rather than being construed as a limitation to the present application.

[0036] In the description of the present application, it should be understood that the orientation or positional relationships indicated by the terms "length", "width", "thickness", "top", "bottom", "inner", "outer", "upper", "lower", "left", "right", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0037] For the convenience of clearly describing the technical solution of the present application, terms such as "first" and "second" are used to distinguish the same items or similar items with basically the same functions and roles. Those skilled in the art can understand that terms such as "first" and "second" do not limit the quantity and execution order, and "first", "second", etc. do not necessarily mean different.

[0038] In the present application, unless otherwise clearly specified and limited, terms such as "connected" and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0039] In the present application, "and / or" is merely a description of the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this article generally represents an "or" relationship between the front and back associated objects.

[0040] It should be noted that in the present application, words such as "in one embodiment", "exemplarily", and "for example" are used to give examples, illustrations, or explanations. Any embodiment or design solution described as "in one embodiment", "exemplarily", or "for example" in the present application should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Exactly, the use of words such as "in one embodiment", "exemplarily", and "for example" is intended to present relevant concepts in a specific manner.

[0041] Combined with the accompanying drawings, the protective plate 1 provided by the embodiment of the present application will be described in detail below.

[0042] A protective plate 1 provided in this embodiment includes an upper protective layer 15, a detection component, and a lower protective layer 11. The detection component is located between the upper protective layer 15 and the lower protective layer 11, and the three are stacked in the first direction; the detection component includes an impact-resistant layer 13, a buffer layer 14, and a detection circuit layer 12, and the impact-resistant layer 13, the buffer layer 14, and the detection circuit layer 12 are stacked in the first direction. Please refer to Figure 1 , which shows a protective plate 1 with a certain structure. The layers of the protective plate 1 can be bonded by a hot melt adhesive film.

[0043] In an embodiment, the protection plate 1 is generally used for installation and covering on a battery pack. The battery pack has an exposed surface, and the protection plate 1 is fixedly covered on the exposed surface of the battery pack. The protection plate 1 not only plays a role in supporting and bearing the internal components of the battery pack, but also plays a role in the safety protection of the battery pack. The protection plate 1 can also be used for installation and covering on other devices, that is, the protection plate 1 provided in this embodiment is not limited to the protection of only the battery pack.

[0044] The detection circuit layer includes a detection circuit. The detection circuit includes a plurality of detection wires 121. The plurality of detection wires 121 are respectively between two layers of the protection plate 1. When the protection plate 1 is subjected to an external force impact and the impact energy is transmitted from the impact-resistant layer 13 to the buffer layer 14, the buffer layer 14 with high hydrostatic pressure strength increases the strain degree of the impact-resistant layer 13 at the impacted location, so that the impact pit formed by the impact can break a plurality of detection wires 121 in the detection circuit. After the plurality of detection wires 121 are broken, the detection circuit can output a graded warning signal.

[0045] Exemplarily, the detection circuit layer 12 further includes a logic control circuit 125. Each detection wire 121 is connected to the logic control circuit 125 provided on one side of the protection plate 1. By detecting the cutting situation of the detection wires 121 in the detection circuit layer 12, the impact damage situation of the protection plate 1 can be judged. Please refer to Figure 2 , which is a cross-sectional schematic diagram of the protection plate 1. Figure 2 The logic control circuit 125 located outside the protection plate 1 is simply schematically shown in

[0046] Please refer to Figure 3 , which is an embodiment of the arrangement of the detection wires 121 in the protection plate 1. The detection wires 121 are connected to the logic control circuit 125 to form a closed circuit, Figure 3 mainly schematically showing the arrangement situation of the detection wires 121 in the protection plate 1.

[0047] The detection wires 121 are arranged between two layers of the protection plate 1. The detection wires 121 will have a chance to be cut off by the impact when subjected to an external force impact. When the impact-resistant layer 13 cooperates with the buffer layer 14 to be impacted and generates local severe deformation, the detection wires 121 in the corresponding area of the protection plate 1 will be cut off. The cutting off of the detection wires 121 will affect the circuit signal, and the circuit signal includes changes in electrical signals such as resistance value and voltage in the circuit. Thus, the energy level of the foreign object impact and the severity of the damage of the protection plate 1 can be judged by the proportion of the number of broken detection wires 121 after the impact damage to the total number of detection wires 121. The logic control circuit 125 serves as a signal analysis and warning signal output unit, and when the detection wires 121 are cut off, the logic control circuit 125 will output a graded warning signal.

[0048] In this embodiment, detection wires (detection wire 121) are arranged between certain two layers of the protection plate 1, and at the same time, in combination with the detection enhancement effect of the buffer layer 14 in the protection plate 1, the reliability of damage detection is improved. When the protection plate 1 is impacted by an external force, the buffer layer 14 cooperates with the impact-resistant layer 13 in the protection plate 1 to concentrate the impact energy in a smaller impact area and form a deeper pit, which is more conducive to achieving the goal of impact-shearing the wire, and then triggering the logic control circuit 125 to send out a hierarchical early warning signal.

[0049] In this embodiment, by using the shearing effect of the kinetic energy of the external impact on the wires in the detection circuit layer 12, the purpose of reflecting whether the protection plate 1 is damaged by impact through the on-off situation of the wires is realized. The scheme is simple and feasible, highly operable, and low in cost.

[0050] Next, the specific positional relationship of each layer of the protection plate 1 will be further described.

[0051] The lower protection layer 11, the impact-resistant layer 13, the buffer layer 14, and the upper protection layer 15 are arranged along the first direction. The lower protection layer 11 is the layer directly in contact with the impact, and the upper protection layer 15 is the structural layer installed on the innermost side. The upper protection layer 15 plays a connecting role, enabling the protection plate 1 to be smoothly installed on an external device.

[0052] Regarding the materials of the lower protection layer 11, the impact-resistant layer 13, and the upper protection layer 15, the lower protection layer 11 is preferably made of fiber-reinforced resin material, which can not only improve the corrosion resistance and anti-wear and scratch resistance of the protection plate 1, but also effectively improve the stiffness and strength of the protection plate 1, so that the protection plate 1 has better impact resistance. The impact-resistant layer 13 can be made of high-strength steel plate to absorb most of the impact energy; the impact-resistant layer 13 can also be made of other high-strength metal materials. The upper protection layer 15 is preferably made of fiber-reinforced resin material, and the upper protection layer 15 and the lower protection layer 11 jointly play a protective role.

[0053] Regarding the position of the detection circuit layer 12, the detection circuit layer 12 can be arranged between the lower protection layer 11 and the impact-resistant layer 13, or the detection circuit layer 12 is arranged between the impact-resistant layer 13 and the buffer layer 14, or the detection circuit layer 12 is arranged between the buffer layer 14 and the upper protection layer 15

[0054] Specifically, the detection circuit layer 12 can also be arranged between different layers. The detection circuit layer 12 is arranged between any two of the lower protection layer 11 and the impact-resistant layer 13, the impact-resistant layer 13 and the buffer layer 14, and the buffer layer 14 and the upper protection layer 15, or the detection circuit layer 12 is arranged at all three positions between the lower protection layer 11 and the impact-resistant layer 13, the impact-resistant layer 13 and the buffer layer 14, and the buffer layer 14 and the upper protection layer 15.

[0055] See also Figure 1 , schematically showing that the detection circuit layer 12 is arranged between the lower protective layer 11 and the anti-impact layer 13, that is, the lower protective layer 11, the detection circuit layer 12, the anti-impact layer 13, the buffer layer 14 and the upper protective layer 15 are stacked in sequence along the first direction.

[0056] In such Figure 1 In the structure of the protective plate 1 shown, when the surface of the protective plate 1 is damaged by impact, the outermost layer of the surface of the protective plate 1 (lower protective layer 11) is first affected by the impact and deforms, and then the impact energy is transmitted to the detection circuit layer 12 and the impact-resistant layer 13 in turn. Since the buffer layer 14 with a specific structure and specific compression strength is combined with the impact-resistant layer 13, the impact energy can be focused more within a certain impact range. Therefore, the amount of depression caused by the impact is concentrated in a smaller range and is more significant within the impact range than outside the range. The difference in the amount of depression is also greater, which makes the depth difference of the impact pit caused by the external force impact greater. This is conducive to the detection circuit layer 12 to detect the damage of the protective plate 1, thereby improving the detection reliability of the impact damage of the protective plate 1.

[0057] Next, the damage detection reliability of the protection plate 1 is further described.

[0058] In one embodiment, the static pressure strength of the buffer layer 14 ranges from 1 MPa to 50 MPa.

[0059] Static compressive strength refers to the strength limit that a material can withstand when external force is applied under static conditions.

[0060] The buffer layer 14 in the protective plate 1 can provide strong structural support for the protective plate 1 as a whole, which helps to enhance the overall structural strength of the protective plate 1 while ensuring lightweight, and protect the battery pack from external impact or extrusion. At the same time, the buffer layer 14 has excellent energy absorption and shock absorption characteristics, and can play a mutually reinforcing effect when used in combination with the impact-resistant layer 13. For the protective plate 1 with a buffer layer 14 with higher static pressure strength, when it is subjected to a high-energy impact, the deformation of the plate surface shows obvious concave deformation within the impact influence range, while the concave deformation outside the impact influence range is not obvious. For the protective plate 1 with a buffer layer 14 with lower static pressure strength, the area affected by the impact is larger, and the concave deformation of the plate surface in the area outside the impact is smoother, and the impact energy is shared.

[0061] Preferably, the buffer layer 14 has a high static pressure strength, enabling all the detection wires 121 in the sunken area of the detection circuit layer 12 to be disconnected within the range of external force impact, thereby improving the detection reliability of the impact damage of the protection plate 1. If the static pressure strength of the buffer layer 14 is low, it is difficult for all the detection wires 121 in the sunken area of the detection circuit layer 12 to be disconnected within the range of external force impact, resulting in low detection reliability. Specifically, if the static pressure strength of the buffer layer 14 is low, when the preset impact threshold for the first-level warning is reached, the impact pit formed by the detection wire within the range of external force impact is relatively gentle, and it is difficult to achieve the effect of complete fracture of the detection wire under theoretical conditions, causing the detection result to not match the actual damage situation, leading to poor reliability of the detection result.

[0062] The material, structure, and size of the buffer layer 14 will all affect the static pressure strength of the buffer layer 14. By selecting a suitable material, setting a reasonable structure, and size, it is possible to obtain a buffer layer 14 with a high static pressure strength.

[0063] In this embodiment, the static pressure strength range of the buffer layer 14 is defined as 1 MPa to 50 MPa. For example, the static pressure strength of the buffer layer 14 can be 1 MPa, 10 MPa, 20 MPa, 30 MPa, 40 MPa, 50 MPa, and so on. The static pressure strength of the buffer layer 14 can be set according to the required protection requirements of the plate.

[0064] The above text has stated the influence of the static pressure strength of the buffer layer 14 on the detection reliability of the damage of the protection plate 1. Not only does the static pressure strength of the buffer layer 14 affect the detection reliability, but parameters such as the diameter, material, and shape of the detection wire 121, as well as the density distribution of the detection wire 121, may all affect the detection reliability of the damage of the protection plate 1.

[0065] A preset impact energy threshold can be set. When the detection wire 121 is disconnected under the impact of an external force greater than or equal to the preset impact energy threshold, the logic control circuit 125 outputs a warning signal. The preset impact energy threshold can be flexibly adjusted according to different protection requirements, mainly by changing parameters such as the diameter, material, and shape of the detection wire 121 in the detection circuit layer 12 to change the preset impact energy threshold, providing a reliable damage warning function for protection plates 1 with different protection requirements, which has the advantages of being simple, feasible, and highly adaptable.

[0066] Next, the structure of the buffer layer 14 will be further described.

[0067] The material of the buffer layer 14 is one of aluminum, stainless steel, or polypropylene; the wall thickness range of the buffer layer 14 is 0.02 mm to 0.50 mm. This enables the buffer layer 14 to have a high static pressure strength.

[0068] For the specific structure of the buffer layer 14, it can be divided into the following three cases:

[0069] Case 1:

[0070] Please refer to Figure 4 , the buffer layer 14 has a honeycomb structure. The through holes in the buffer layer 14 along the first direction are buffer spaces 142. The buffer layer 14 includes a plurality of buffer corrugated plates 141 stacked in sequence along the second direction, and the second direction is perpendicular to the first direction.

[0071] The buffer layer 14 has a honeycomb structure. When the buffer layer 14 is subjected to an impact, the impact can be transmitted along the edges of the buffer layer 14, which not only ensures uniform stress on the buffer layer 14 but also improves the static compression strength of the buffer layer 14, enabling the buffer layer 14 to effectively absorb energy and buffer, thereby effectively improving the overall impact resistance of the buffer layer 14.

[0072] Regarding the buffer layer 14, please refer to Figure 4 , which shows a plurality of buffer corrugated plates 141 stacked in sequence along the second direction. Each buffer corrugated plate 141 extends along the third direction, where the second direction and the first direction are both perpendicular to the third direction.

[0073] Regarding the buffer corrugated plate 141, refer to Figure 5 , a number of corrugated grooves 1413 are formed on the buffer corrugated plate 141. The number of corrugated grooves 1413 are arranged at intervals along the third direction, and the third direction is perpendicular to the first direction and the second direction; refer to Figure 4 , two adjacent buffer corrugated plates 141 are symmetrically arranged with respect to the central plane therebetween, and two corrugated grooves 1413 arranged opposite to each other along the second direction in two adjacent buffer corrugated plates 141 form a buffer space 142

[0074] Regarding the dry corrugated grooves 1413 on the buffer corrugated plate 141, further, refer to Figure 5 , the buffer corrugated plate 141 includes a plurality of first connecting plate parts 1411 and a plurality of second connecting plate parts 1412. Two adjacent second connecting plate parts 1412 are connected by the first connecting plate part 1411. The second connecting plate part 1412 protrudes relative to the first connecting plate part 1411 along the second direction to form a corrugated groove 1413, and the cross-sectional shape of the corrugated groove 1413 is trapezoidal or triangular, etc.

[0075] The buffer layer 14 can not only flexibly adjust its overall strength (static pressure strength) and adaptability by changing the material, wall thickness, shape (size of the corrugated groove 1413) or quantity of the buffer corrugated plate 141, but also reduces the difficulty and cost of the assembly process. Of course, it also reduces the weight on the premise of ensuring its own strength.

[0076] Furthermore, the cross-sectional shape of the buffer space 142 is a regular hexagon. Of course, the cross-sectional shape of the buffer space 142 can also be other shapes except for the regular hexagon.

[0077] Furthermore, the thickness of the buffer corrugated board 141 ranges from 0.02 mm to 0.50 mm. For example, the thickness of the buffer corrugated board 141 is 0.02 mm, 0.050 mm, 0.10 mm, 0.30 mm, 0.50 mm, etc. The thickness of the buffer corrugated board 141 can be set according to the required protection requirements of the board.

[0078] Furthermore, two adjacent buffer corrugated boards 141 are fixedly connected by gluing or laser welding.

[0079] Furthermore, the material of the buffer corrugated board 141 is one of aluminum, stainless steel, etc. In addition, preferably, the buffer corrugated board 141 is an integral stamping part.

[0080] Preferably, the buffer space 142 is filled with a filler to improve the impact resistance of the buffer layer 14. The material of the filler is foamed polyurethane, non-Newtonian fluid or resin glue.

[0081] Case two:

[0082] Please refer to Figure 6 , which shows a buffer layer 14 of a structure. The buffer layer 14 is a corrugated structure. The buffer layer 14 includes a plurality of buffer corrugated boards 141 sequentially stacked in a first direction. The number of buffer corrugated boards 141 can be two, three, four, etc. Two adjacent buffer corrugated boards 141 are adhesively connected. Figure 6 shows that the buffer layer 14 includes two buffer corrugated boards 141, that is, preferably, the buffer layer 14 includes two buffer corrugated boards 141 sequentially stacked in the first direction.

[0083] Regarding the buffer corrugated board 141, please refer to Figure 7 , a plurality of corrugated grooves 1413 are formed on the buffer corrugated board 141. The plurality of corrugated grooves 1413 are sequentially arranged at intervals in a second direction. Each corrugated groove 1413 extends in a third direction. The second direction and the third direction are both perpendicular to the first direction. Specifically, the buffer corrugated board 141 includes a plurality of first connecting plate parts 1411 and a plurality of second connecting plate parts 1412. Two adjacent second connecting plate parts 1412 are connected by the first connecting plate part 1411. The second connecting plate part 1412 protrudes relative to the first connecting plate part 1411 in the first direction to form the corrugated groove 1413. The cross-sectional shape of the second connecting plate part 1412 is trapezoidal or triangular, etc.

[0084] Two adjacent buffer corrugated boards 141 are symmetrically arranged with respect to the central plane therebetween, and two corrugated grooves 1413 arranged opposite to each other in the first direction in two adjacent buffer corrugated boards 141 form a buffer space 142. Please refer to Figure 6, which shows two oppositely arranged buffer corrugated plates 141 and also shows a buffer space 142.

[0085] In the buffer layer 14 provided in this embodiment, two or more buffer corrugated plates 141 are arranged along the first direction, so that the buffer layer 14 is formed into a corrugated structure capable of absorbing energy and buffering. In addition, for the convenience of manufacturing the buffer layer 14, the wall thickness of each part structure in the buffer corrugated plate 141 is kept consistent.

[0086] In addition, the buffer layer 14 can not only flexibly adjust its overall strength (hydrostatic strength) and adaptability by changing the material, wall thickness, (the size of the corrugated groove 1413) shape or quantity of the buffer corrugated plate 141, but also reduces the difficulty and cost of the assembly process. Of course, it also reduces the weight on the premise of ensuring its own strength.

[0087] Furthermore, the cross-sectional shape of the buffer space 142 is a regular hexagon. Of course, the cross-sectional shape of the buffer space 142 can also be other shapes except the regular hexagon.

[0088] Furthermore, the thickness range of the buffer corrugated plate 141 is 0.02 mm to 0.50 mm. For example, the thickness of the buffer corrugated plate 141 is 0.02 mm, 0.050 mm, 0.10 mm, 0.30 mm, 0.50 mm, etc. The thickness of the buffer corrugated plate 141 can be set according to the required protection requirements of the plate.

[0089] Furthermore, two adjacent buffer corrugated plates 141 are fixedly connected by means of gluing or laser welding.

[0090] Furthermore, the material of the buffer corrugated plate 141 is one of aluminum, stainless steel, etc. In addition, it is preferred that the buffer corrugated plate 141 is an integral stamping part as a whole.

[0091] Preferably, the buffer space 142 is filled with a filler to improve the impact resistance of the buffer layer 14. The material of the filler is foamed polyurethane, non-Newtonian fluid or resin glue.

[0092] Case Three:

[0093] Please refer to Figure 8 , the difference in the structure of the buffer layer 14 in Case Three from that in Case Two above is that a reinforcing flat plate 143 is arranged between two adjacent buffer corrugated plates 141. The arranged reinforcing flat plate 143 not only enables two adjacent buffer corrugated plates 141 to be connected, but also strengthens the connection strength between two adjacent buffer corrugated plates 141, thereby strengthening the overall strength of the buffer layer 14.

[0094] By adjusting parameters such as the size of the buffer space 142, buffer layers 14 with different static pressure strengths are obtained. Selecting a buffer layer 14 with a higher static compression strength can better focus the impact load within the locally impacted area. At the same time, by adding the reinforcing plate 143, the impact load can also be better focused within the locally impacted area, so that when the preset impact energy threshold is reached, all the detection wires 121 in the impact area are disconnected within the range of the external force impact, keeping in line with the theoretical estimation results and improving the reliability of the detection circuit for impact damage detection.

[0095] Specifically, the material of the reinforcing plate 143 is a metal foil or a fiber-reinforced resin material. For example, the material of the reinforcing plate 143 can be glass fiber-reinforced polypropylene resin, or the reinforcing plate 143 is made of a metal foil.

[0096] Specifically, the reinforcing plate 143 is clamped and fixed between two adjacent buffer corrugated plates 141 by means of adhesion.

[0097] Next, the structure of the detection circuit layer 12 is further described.

[0098] Please refer to Figure 3 、 Figures 9 - 10 , the detection circuit layer 12 includes a number of detection wires 121, and multiple detection wires 121 form a parallel group 124. The detection circuit layer 12 includes multiple parallel groups 124, and each parallel group 124 is connected to the logic control circuit 125, that is, both ends of each parallel group 124 are connected in the logic control circuit 125.

[0099] Please refer to Figure 3 、 Figures 9 - 10 , which shows that three detection wires 121 form a parallel group 124. Figure 3 、 Figures 9 - 10 It is only a schematic diagram, that is, the parallel group 124 can include a number of detection wires 121 other than three.

[0100] When the detection wires 121 in the deformed area of the protection plate 1 are broken under an external force impact, the change in the ratio of the number of broken wires to the total number of wires will cause a change in the overall resistance value of the conductive branch. That is, the breakage of the detection wires 121 will cause a change in the circuit signal, and the logic control circuit 125 outputs a warning signal according to the change in the circuit signal. Please refer to Figure 3 、 Figures 9 - 10 , which shows the voltages V1, V2, V3, V4... that can detect the voltage change at both ends of the parallel group 124. By the change in the voltage value at both ends of the parallel group 124, it is determined whether the protection plate 1 is damaged by an impact and the corresponding severity of the impact damage.

[0101] Adjusting the number of detection wires 121 in the parallel group 124 can adjust the accuracy of impact damage detection, and the layout density of the detection circuit layer 12 can be increased or decreased according to the actual application situation. In addition, for the sake of detection accuracy, it is best to detect the entire board surface within the protective plate 1 where the detection wires 121 of the detection circuit layer 12 are arranged.

[0102] Please refer to Figure 3 , which shows a detection circuit layer 12 of a structure. Figure 3 shows the distribution of each detection wire 121 in the detection circuit layer 12. Each detection wire 121 in the parallel group 124 is arranged parallel to each other, and the detection wires 121 in each parallel group 124 are arranged parallel to each other and laid on the board surface of the corresponding layer. Figure 3 In, the wires on the board surface are evenly distributed in terms of density, and the distance between two adjacent detection wires 121 can be set between 3 mm and 50 mm. A non-uniform density distribution can also be adopted. For example, the arrangement of the wires can be reasonably set according to the positions vulnerable to impact. For example, the arrangement gap of the detection wires 121 on the protective plate 1 close to the front of the vehicle can be designed to be closer. At this time, the wire gap can be controlled within the range of 2 mm to 5 mm to ensure a higher detection accuracy of the impact strength.

[0103] Please refer to Figure 3 , a current-limiting protection resistor 122 can be set on each detection wire 121. Of course, if the detection wire 121 itself has a certain resistance value, the current-limiting protection resistor 122 can be omitted.

[0104] Furthermore, please refer to Figure 3 , a voltage-dividing resistor 123 is connected in series on each parallel group 124 for circuit protection.

[0105] Regarding the detection wire 121, the detection wire 121 can be a metal wire with an insulating layer, such as an oxygen-free copper wire coated with polyimide (enameled copper wire) as the detection wire 121. The enameled copper wire has a low cost, which can reduce the manufacturing cost, and the polyimide insulating layer coated on the wire surface can improve the stability and reliability of the wire detection function. The copper wire itself has certain anti-bending and anti-fatigue properties. Therefore, the effect of breaking only after withstanding an impact energy greater than a certain specific value can be achieved. The detection wire 121 sampling the enameled copper wire solution can cover the entire board surface within the protective plate, ensuring that the impact detection of the protective plate 1 has a sufficiently large response coverage area.

[0106] Regarding the detection wire 121, a non-metal conductive wire with an insulating layer can be used, such as a conductive fiber with an insulating layer, or the detection wire 121 is an etched metal wire.

[0107] Regarding the detection wire 121, on the premise of not affecting the sufficient insulation between the wire and the steel plate impact-resistant layer 13 in the protection plate 1, the insulating material outside the etched metal wire can be removed, and only the hot melt adhesive film is used as insulation, which not only saves costs but also achieves the goal of lightweighting.

[0108] For the number and distribution of the detection circuit layers 12 between two certain layers of the protection plate 1, it can be divided into the following three cases:

[0109] Case 1: There is one detection circuit layer 12, and the detection wires 121 in the detection circuit layer 12 are arranged on the entire board surface inside the protection plate 1.

[0110] Please refer to Figure 3 , the detection circuit layer 12 includes several detection wires 121, and the several detection wires 121 are arranged on the entire board surface inside the protection plate 1. Multiple detection wires 121 form a parallel group 124, the detection circuit layer 12 includes multiple parallel groups 124, both ends of each parallel group 124 are connected to the logic control circuit 125, each parallel group 124 includes multiple detection wires 121, and the detection wires 121 are arranged in parallel with each other. In addition, a current-limiting protection resistor 122 is connected in series on each detection wire 121, and each parallel group 124 is respectively connected in series with a voltage-dividing resistor 123.

[0111] Case 2: There are two or more detection circuit layers 12, and each detection circuit layer 12 is distributed in different areas between two layers of the protection plate 1.

[0112] Please refer to Figure 9 , the figure shows four detection circuit layers 12, the four detection circuit layers 12 are arranged on the entire board surface inside the protection plate 1, and the four detection circuit layers 12 are distributed in a matrix manner on the entire board surface inside the protection plate 1. In addition, the number of detection circuit layers 12 is not limited to Figure 9 shown as four in, and can also be other numbers of detection circuit layers 12. The detection circuit layers 12 arranged in a matrix can realize the specific position where the impact damage occurs.

[0113] Each detection circuit layer 12 can be the same, or each detection circuit layer 12 can be set to be different. Figure 9 shows that each detection circuit layer 12 is the same. The detection circuit layer 12 includes multiple parallel groups 124, both ends of each parallel group 124 are connected to the logic control circuit 125, and each parallel group 124 includes multiple detection wires 121. In addition, a current-limiting protection resistor 122 is connected in series on each detection wire 121, and each parallel group 124 is respectively connected in series with a voltage-dividing resistor 123.

[0114] Case 3: There are two or more detection circuit layers 12, and each detection circuit layer 12 is stacked along the first direction between two layers of the protection plate 1.

[0115] Please refer to Figure 10 , Figure 10 which shows two detection circuit layers 12. The detection wires 121 in each detection circuit layer 12 are arranged across the entire plate surface within the protection plate 1. The two detection circuit layers 12 are stacked between two layers of the protection plate 1 along the first direction, and the detection wires 121 in the two detection circuit layers 12 are arranged perpendicular to each other.

[0116] Figure 10 shows that the number of detection circuit layers 12 is two, and the number of detection circuit layers 12 is not limited to Figure 10 the two shown in

[0117] Figure 10 which shows that the detection wires 121 in the two detection circuit layers 12 are arranged perpendicular to each other. It is also possible to arrange the detection wires 121 in the two detection circuit layers 12 not perpendicular to each other. For example, the detection wires 121 in the two detection circuit layers 12 are arranged in parallel and offset.

[0118] Each detection circuit layer 12 can be the same, or each detection circuit layer 12 can be set to be different. Figure 10 shows that each detection circuit layer 12 is the same. The detection circuit layer 12 includes a plurality of parallel groups 124. The two ends of each parallel group 124 are connected to the logic control circuit 125. Each parallel group 124 includes multiple detection wires 121. In addition, a current-limiting protection resistor 122 is connected in series on each detection wire 121, and each parallel group 124 is respectively connected in series with a voltage-dividing resistor 123.

[0119] Next, an embodiment of four protection plates 1 with specific parameters is given, and the detection reliability of different protection plates 1 is illustrated through comparison of experimental data.

[0120] Embodiment 1:

[0121] The protection plate 1 includes a lower protection layer 11, a detection circuit layer 12, an impact-resistant layer 13, a buffer layer 14, and an upper protection layer 15 that are stacked in sequence along the first direction. The thickness of the lower protection layer 11 is 1.0 mm, and the thickness of the upper protection layer 15 is 0.6 mm. The buffer layer 14 is Figure 7 the honeycomb structure shown (the two adjacent buffer corrugated plates 141 in the buffer layer 14 are bonded by glue). The buffer space 142 of the buffer layer 14 is a regular hexagon. The thickness of the buffer corrugated plate 141 in the buffer layer 14 is 0.18 mm. The static pressure strength of the buffer layer 14 is 18 MPa. The height of the buffer layer 14 along the first direction is 5 mm. The buffer corrugated plate 141 is made of metal material, and the distance between adjacent detection wires 121 in the detection circuit layer 12 is 10 mm.

[0122] Embodiment 2:

[0123] The protective plate 1 includes a lower protective layer 11, a detection circuit layer 12, an impact-resistant layer 13, a buffer layer 14, and an upper protective layer 15 that are sequentially stacked in the first direction. The thickness of the lower protective layer 11 is 1.0 mm, and the thickness of the upper protective layer 15 is 0.6 mm. The buffer layer 14 is Figure 4 the corrugated structure shown (the two buffer corrugated plates 141 in the buffer layer 14 are bonded by glue). The thickness of the buffer corrugated plate 141 in the buffer layer 14 is 0.18 mm, the height of the buffer layer 14 in the first direction is 5.5 mm, the buffer corrugated plate 141 is made of metal, and the distance between adjacent detection wires 121 in the detection circuit layer 12 is 10 mm.

[0124] Example 3:

[0125] The protective plate 1 includes a lower protective layer 11, a detection circuit layer 12, an impact-resistant layer 13, a buffer layer 14, and an upper protective layer 15 that are sequentially stacked in the first direction. The thickness of the lower protective layer 11 is 1.0 mm, and the thickness of the upper protective layer 15 is 0.6 mm. The buffer layer 14 is Figure 6 the corrugated structure shown. The thickness of the buffer corrugated plate 141 in the buffer layer 14 is 0.18 mm. An aluminum foil flat sheet (reinforcing flat plate 143) is located between two buffer corrugated plates 141. The reinforcing flat plate 143 is connected to the two buffer corrugated plates 141 by glue. The buffer corrugated plate 141 is made of metal. The height of the buffer layer 14 in the first direction is 5.7 mm. The distance between adjacent detection wires 121 in the detection circuit layer 12 is 10 mm.

[0126] Example 4:

[0127] The protective plate 1 includes a lower protective layer 11, a detection circuit layer 12, an impact-resistant layer 13, a buffer layer 14, and an upper protective layer 15 that are sequentially stacked in the first direction. The thickness of the lower protective layer 11 is 1.0 mm, and the thickness of the upper protective layer 15 is 0.6 mm. The buffer layer 14 is a plastic PP honeycomb (static compression strength ≈ 1 MPa). The height of the plastic PP honeycomb in the first direction is 5 mm. The distance between adjacent detection wires 121 in the detection circuit layer 12 is 10 mm.

[0128] For the protective plate 1 in the above Examples 1 - 4, an impact test is performed. In the impact test, the drop hammer head is mainly a 15 kg hemisphere with a diameter of 25 mm, and it vertically impacts the surface of the protective plate 1 in Examples 1 - 4 with a certain impact energy.

[0129] Referring to the following table, when the impact energy is 150 J, the logic control circuit 125 of the protective plate 1 in the scenarios of Example 1 and Example 3 issues a secondary alarm, while the logic control circuit 125 of the protective plate 1 in the scenarios of Example 2 and Example 4 still maintains the standard state.

[0130] When the impact energy is 300 J, the protection plate 1 in the scenario of Embodiment 1 will cause the logic control circuit 125 to issue a first-level alarm, while the logic control circuit 125 of the protection plate 1 in the scenarios of Embodiment 2, Embodiment 3 and Embodiment 4 will issue a second-level alarm.

[0131] Among them, the standard state is the normal state, indicating that the protection plate 1 has no damage or superficial mild damage; the first-level alarm and the second-level alarm indicate that the protection plate 1 has damage, and the damage degree of the protection plate 1 under the first-level alarm is greater than that of the protection plate 1 under the second-level alarm.

[0132] Through experiments, it can be known that when the buffer layer 14 is a honeycomb structure, the detection reliability of the protection plate 1 is better than that of the protection plate 1 when the buffer layer 14 is a corrugated structure.

[0133] When the impact energy is 150 J, the logic control circuit 125 of the protection plate 1 in the scenario of Embodiment 3 issues a second-level alarm, and the logic control circuit 125 of the protection plate 1 in the scenario of Embodiment 2 maintains the standard state, indicating that the detection reliability of the protection plate 1 with the reinforcement flat plate 143 added in the buffer layer 14 is high.

[0134]

[0135] In the embodiment of the present application, the battery pack refers to a device that combines multiple battery cells together to form a whole, and its specific structure belongs to the common knowledge of those skilled in the art and will not be elaborated in detail here; the whole protection plate 1 is fixed and covered on the exposed surface of the battery pack by rivets to play a protective role. Of course, in other embodiments, the protection plate 1 can also be installed and covered on the exposed surface of the battery pack by other detachable installation methods, such as screws.

[0136] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A protective plate, characterized in that: It comprises an upper protective layer, a detection component and a lower protective layer, wherein the detection component is located between the upper protective layer and the lower protective layer and the three are stacked in a first direction; The detection component comprises an anti-impact layer, a buffer layer and a detection circuit layer, wherein the anti-impact layer, the buffer layer and the detection circuit layer are stacked in the first direction; The detection circuit layer includes a detection circuit, and the detection circuit includes a plurality of detection wires, and the detection wires are distributed between the two layers of the protective plate. When the protective plate is impacted by an external force and the impact energy is transferred from the anti-impact layer to the buffer layer, the buffer layer with high static pressure strength increases the strain degree of the anti-impact layer at the impacted point, so that the impact pit formed by the impact can break several of the detection wires in the detection circuit. After several of the detection wires are broken, the detection circuit can output a graded warning signal.

2. The protective plate according to claim 1, characterized in that: The lower protective layer, the anti-impact layer, the buffer layer and the upper protective layer are arranged along the first direction, and the lower protective layer is a layer that is in direct contact with the impact; The detection circuit layer is arranged between the lower protective layer and the anti-impact layer, and / or the detection circuit layer is arranged between the anti-impact layer and the buffer layer, and / or the detection circuit layer is arranged between the buffer layer and the upper protective layer.

3. The protective plate according to claim 1, characterized in that: The buffer layer is in a honeycomb structure, the through holes on the buffer layer along the first direction are buffer spaces, and the buffer layer includes a plurality of buffer corrugated plates stacked in sequence along a second direction, and the second direction is perpendicular to the first direction; A plurality of corrugated grooves are formed on the buffer corrugated board, and the plurality of corrugated grooves are sequentially spaced along the third direction; The two adjacent buffer corrugated plates are symmetrically arranged with the center plane therebetween, and the two corrugated grooves in the two adjacent buffer corrugated plates that are oppositely arranged along the second direction form the buffer space.

4. The protective plate according to claim 1, characterized in that: The buffer layer is a corrugated structure, and the buffer layer includes a plurality of buffer corrugated boards stacked in sequence along the first direction; A plurality of corrugated grooves are formed on the buffer corrugated plate, and the plurality of corrugated grooves are sequentially spaced apart along the second direction; The two adjacent buffer corrugated plates are symmetrically arranged with the center plane therebetween, and the two corrugated grooves in the two adjacent buffer corrugated plates that are oppositely arranged along the first direction form a buffer space.

5. The protective plate according to claim 4, characterized in that: A reinforcing plate is arranged between two adjacent buffer corrugated plates, and the material of the reinforcing plate is metal foil or PP glass fiber.

6. The protective plate according to any one of claims 3 to 5, characterized in that: The buffer space is filled with a filler, and the material of the filler is foamed polyurethane or resin glue.

7. The protective plate according to any one of claims 1 to 5, characterized in that: The material of the buffer layer is one of aluminum, stainless steel or polypropylene; and / or the wall thickness of the buffer layer ranges from 0.02 mm to 0.50 mm; and / or the static pressure strength of the buffer layer ranges from 1 MPa to 50 MPa.

8. The protective plate according to any one of claims 1 to 5, characterized in that: The detection wire is a metal wire with an insulating layer; or the detection wire is a non-metallic conductive wire with an insulating layer; or the detection wire is only a metal wire or a non-metallic conductive wire, and the detection wire is insulated by a hot melt adhesive film in the composite process of the protective plate.

9. The protective plate according to any one of claims 1 to 5, characterized in that: The detection wires are arranged in parallel and at intervals, and the distance between two adjacent detection wires is between 3 mm and 50 mm.

10. The protective plate according to any one of claims 1 to 5, characterized in that: There is one detection circuit layer, and the detection wires in the detection circuit layer are arranged on the entire board surface of the protective plate; or, there are more than two detection circuit layers, and each detection circuit layer is stacked between two layers of the protective plate along the first direction, or, each detection circuit layer is distributed in different areas between the two layers of the protective plate.

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