Printed circuit board (PCB) electroplating processing equipment

Abstract

The utility model provides electroplating processing equipment for a PCB (Printed Circuit Board), and relates to the technical field of electroplating processing. The PCB electroplating processing equipment is used for electroplating a PCB and comprises an electroplating cylinder, a guide bar device and two cathode and anode shielding plates, wherein the two cathode and anode shielding plates are oppositely arranged in the electroplating cylinder in the Y direction and can both ascend and descend in the electroplating cylinder in the Z direction; the guide bar device is fixedly arranged in the electroplating cylinder and located between the two cathode and anode shielding plates, the guide bar device comprises a guide bar mechanism and at least two sets of guide assemblies, the guide bar mechanism is provided with a limiting groove used for limiting the position of a PCB, and the guide assemblies are arranged on the guide bar mechanism; and two side walls extending along the X direction in the limiting groove are correspondingly positioned in the limiting groove so as to guide the PCB to be parallel to the Z direction. According to the PCB electroplating processing equipment, the situation that an inclined PCB collides with the guide strip structure can be avoided, so that production accidents are avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating processing, in particular to a PCB board electroplating processing device. Background Technique

[0002] A PCB (Printed Circuit Board), also known as a printed wiring board, is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. Electroplating is a process of plating a thin layer of other metals or alloys on the surface of certain metals by using the principle of electrolysis. It is a process of making the surface of metal or other material parts adhere to a metal film by using electrolysis, so as to prevent metal oxidation (such as rust), improve wear resistance, electrical conductivity, reflectivity, corrosion resistance (such as copper sulfate), and enhance beauty. During the processing of PCB, it is often necessary to use a PCB electroplating device for electroplating.

[0003] For the existing PCB electroplating device, when electroplating PCB boards of different lengths, the anode and cathode masking devices will rise and fall to different heights according to different board lengths, and the existing guide bar structure is fixedly connected to the anode and cathode masking plates, so that the anode and cathode masking plates and the guide bar structure rise and fall together; if the PCB board located in the electroplating tank is tilted, when the guide bar structure is lifted with the anode and cathode masking plates in this state, there may be a situation where the tilted PCB board collides with the guide bar structure, resulting in the PCB board being scratched or the guide bar structure being damaged, and then production accidents occur. Content of the Utility Model

[0004] The purpose of the utility model is to provide a PCB board electroplating processing device, which can avoid the situation of collision between the tilted PCB board and the guide bar structure, thus avoiding production accidents.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] A PCB board electroplating processing device for electroplating a PCB board, comprising:

[0007] An electroplating tank;

[0008] Two anode and cathode masking plates, which are oppositely arranged in the electroplating tank along the Y direction and can both rise and fall along the Z direction in the electroplating tank;

[0009] A guide bar device is fixedly arranged in the electroplating cylinder and located between the two anode and cathode shielding plates. The guide bar device includes a guide bar mechanism and at least two sets of guide components. The guide bar mechanism is provided with a limit groove for limiting the position of the PCB board. The guide components are all arranged in the guide bar mechanism and are located in the limit groove corresponding to the two side walls extending in the X direction in the limit groove to guide the PCB board to be parallel to the Z direction.

[0010] As a further technical solution, the guide assembly includes a guide roller, a roller pin and a guide plate. The first end of the guide plate is connected to the guide bar mechanism, and the second end extends into the limiting groove. The guide roller is rotatably connected to the second end of the guide plate through the roller pin.

[0011] As a further technical solution, the guide bar mechanism includes an installation component and two groups of guide bar components. The two groups of guide bar components are relatively connected to the installation component at intervals along the Y direction and cooperate with the installation component to form the limiting groove. The guide component is connected to the corresponding guide bar component.

[0012] As a further technical solution, the mounting assembly includes a mounting plate, a mounting seat and a fixing seat;

[0013] The two groups of guide bar assemblies are respectively connected to the two side walls of the mounting plate on one side close to the bottom wall of the electroplating cylinder. The mounting seat is fixedly arranged on the side of the mounting plate away from the limiting groove. The fixing seat is fixedly arranged on the bottom wall of the electroplating cylinder, and the mounting seat is connected to the fixing seat.

[0014] As a further technical solution, the mounting plate is provided with at least one flow hole.

[0015] As a further technical solution, the installation assembly further comprises a plurality of fixing members, which are arranged at intervals along the X direction on the corresponding guide bar assemblies, and each of the fixing members is provided with a clamping groove clamped with the installation plate.

[0016] As a further technical solution, the mounting assembly includes two fixed plates and a plurality of upper connecting parts, the two fixed plates are respectively connected to two side walls of the electroplating cylinder spaced apart along the Y direction, and the guide bar assembly is fixedly connected to the corresponding fixed plates through the plurality of upper connecting parts.

[0017] As a further technical solution, the guide bar assembly includes multiple guide shafts and multiple guide blades, the multiple guide shafts are connected to the mounting assembly at intervals along the X direction to form an X guide group, and the multiple guide blades are arranged in the X guide group at intervals along the Z direction.

[0018] As a further technical solution, along the X direction, multiple said guide plates are all inclined towards or away from the bottom wall of the electroplating tank.

[0019] As a further technical solution, the guide bar assembly further includes a plurality of sleeves, and the plurality of sleeves are sleeved on the corresponding guide shafts and are located between two adjacent said guide plates.

[0020] Compared with the prior art, the technical advantages of the PCB electroplating processing equipment provided by the present utility model are as follows:

[0021] 1. Since the guide bar device and the two anode and cathode shielding plates are respectively arranged in the electroplating tank, that is, the guide bar device and the two anode and cathode shielding plates are arranged in a split manner. Therefore, when electroplating PCB boards of different lengths, only according to the specifications of the current PCB board, the two anode and cathode shielding plates are lifted or lowered along the Z direction to the corresponding height, so that the two anode and cathode shielding plates block the current below the PCB board to prevent the copper plating at the bottom of the PCB board from being too thick. In this process, the position of the guide bar device in the electroplating tank remains unchanged all the time. Therefore, when electroplating PCB boards of different lengths, the target PCB board can be directly placed in the limiting groove in the guide bar mechanism. The whole process can avoid the situation of collision between the guide bar device and the inclined PCB board, thereby avoiding the situation that the PCB board is scratched or the guide bar structure is damaged, and avoiding production accidents.

[0022] 2. Since there are at least two groups of guiding components arranged on the guide bar mechanism, and the two groups of guiding components are arranged corresponding to the two side walls extending along the X direction in the limiting groove and are partially located in the limiting groove. Therefore, when the target PCB board is placed in the limiting groove, the guiding components arranged oppositely in the limiting groove guide the PCB board to be parallel to the Z direction, that is, guide the PCB board to be as perpendicular as possible in the limiting groove, thereby further avoiding the collision between the guide bar device and the inclined PCB board and improving the production safety. Description of the Drawings

[0023] Figure 1 is a side view of the PCB electroplating processing equipment provided by the embodiment of the present utility model;

[0024] Figure 2 is a structural schematic diagram of the PCB electroplating processing equipment provided by the embodiment of the present utility model;

[0025] Figure 3 is a front view of the PCB electroplating processing equipment provided by the embodiment of the present utility model;

[0026] Figure 4 is a partial structural schematic diagram of the PCB electroplating processing equipment provided by the embodiment of the present utility model;

[0027] Figure 5 is Figure 4Partial enlarged view of location A in [the figure];

[0028] Figure 6 is Figure 4 Partial enlarged view of location B in [the figure];

[0029] Figure 7 It is a schematic structural diagram of a guide bar mechanism in the PCB board electroplating processing equipment provided by an embodiment of the present invention;

[0030] Figure 8 is Figure 7 Partial enlarged view of location C in [the figure].

[0031] In the figure:

[0032] 100, electroplating tank; 200, anode and cathode shielding plate;

[0033] 300, guide bar device; 310, guide bar mechanism; 311, installation component; 3111, installation plate; 3101, current-carrying hole; 3112, installation seat; 3113, fixing seat; 3114, fixing piece; 31141, connecting part; 31142, upper fixing part; 31143, lower fixing part; 3115, fixing plate; 3116, upper connecting piece; 3117, upper connecting plate; 312, guide bar component; 3121, guiding shaft; 3122, guide piece; 3123, sleeve; 3124, locking piece; 320, guiding component; 321, guiding roller; 322, roller pin; 323, guiding plate;

[0034] 400, PCB hanging rack;

[0035] 500, anode plate. Detailed implementation manners

[0036] The present invention will be further described in detail below with reference to the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present invention, rather than limiting the present invention. Additionally, it should be noted that for the sake of description, only parts related to the present invention are shown in the drawings, rather than all structures.

[0037] In the description of the present invention, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection, an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the internal connection or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0039] In the description of this embodiment, the terms "upper", "lower", "right", etc., are based on the directions or positions shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0040] Combination Figures 1 to 8 As shown, the PCB electroplating processing equipment provided in this embodiment is used for electroplating PCB boards. Specifically, the PCB electroplating processing equipment includes an electroplating cylinder 100, a guide bar device 300 and two anode and cathode shields 200: the two anode and cathode shields 200 are relatively arranged in the electroplating cylinder 100 along the Y direction, and can be lifted and lowered in the electroplating cylinder 100 along the Z direction; the guide bar device 300 is fixedly arranged in the electroplating cylinder 100 and is located between the two anode and cathode shields 200, the guide bar device 300 includes a guide bar mechanism 310 and at least two groups of guide components 320, the guide bar mechanism 310 is provided with a limit groove for limiting the position of the PCB board, and the guide components 320 are all arranged in the guide bar mechanism 310, and are located in the limit groove corresponding to the two side walls extending in the X direction in the limit groove, so as to guide the PCB board to be parallel to the Z direction.

[0041] A PCB hanger 400 and two anode plates 500 are also provided in the electroplating cylinder 100. The two anode plates 500 are provided corresponding to the two anode and cathode shielding plates 200 and are respectively located on the sides of the two anode and cathode shielding plates 200 that are opposite to each other. The PCB hanger 400 is used to hang the PCB board that needs to be electroplated and make the hung PCB board be located in the limiting groove; the PCB hanger 400 is connected to the cathode and cooperates with the two anode plates 500 to electroplate the hung PCB board.

[0042] During the whole process, since the guide bar device 300 and the two anode-cathode masks 200 are respectively arranged in the electroplating tank 100, that is, the guide bar device 300 and the two anode-cathode masks 200 are arranged in a split manner. Therefore, when plating PCB boards of different lengths, only according to the specifications of the current PCB board, the two anode-cathode masks 200 are lifted or lowered along the Z direction to the corresponding height, so that the two anode-cathode masks 200 block the current below the PCB board to prevent the copper plating at the bottom of the PCB board from being too thick. During this process, the position of the guide bar device 300 in the electroplating tank 100 remains unchanged all the time. Therefore, when plating PCB boards of different lengths, the target PCB board can be directly placed in the limit slot in the guide bar mechanism 310. The whole process can avoid the collision between the guide bar device 300 and the inclined PCB board, thus avoiding the situation that the PCB board is scratched or the guide bar structure is damaged, and avoiding production accidents.

[0043] Since there are at least two groups of guiding components 320 arranged on the guide bar mechanism 310, and the two groups of guiding components 320 are arranged corresponding to the two side walls extending along the X direction in the limit slot and partially located in the limit slot. Therefore, when the target PCB board is placed in the limit slot, the guiding components 320 arranged oppositely in the limit slot guide the PCB board to be parallel to the Z direction, that is, guide the PCB board to be as perpendicular as possible in the limit slot, so as to further avoid the collision between the guide bar device 300 and the inclined PCB board and improve the production safety.

[0044] Furthermore, the guiding component 320 includes a guiding roller 321, a roller pin 322 and a guiding plate 323. The first end of the guiding plate 323 is connected to the guide bar mechanism 310, and the second end extends towards the inside of the limit slot. The guiding roller 321 is rotatably connected to the second end of the guiding plate 323 through the roller pin 322.

[0045] The limit slot is set as a U-shaped slot extending along the X direction. When plating PCB boards of different lengths, the PCB board is slid into the limit slot from one side of the limit slot with the help of the PCB hanger 400. During this process, on the one hand, the guiding rollers 321 located on both sides of the limit slot start to roll, assisting the PCB board to slide into the limit slot more smoothly; on the second hand, the guiding rollers 321 on both sides of the limit slot cooperate with each other to try to guide the PCB board to be parallel to the Z direction, so as to further avoid the collision between the guide bar device 300 and the inclined PCB board and improve the safety during production; on the third hand, during the process of the PCB board sliding into the limit slot, the PCB board can be prevented from scratching with the guide bar mechanism 310, thus improving the production yield of the PCB board. And since the guiding roller 321 is connected to the guide bar mechanism 310 through the guiding plate 323, while ensuring the use effect of the guiding roller 321, the interference between the guiding roller 321 and the guide bar mechanism 310 is avoided.

[0046] Preferably, the guide bar mechanism 310 includes a mounting assembly 311 and two groups of guide bar assemblies 312, the two groups of guide bar assemblies 312 are connected to the mounting assembly 311 at intervals along the Y direction, and cooperate with the mounting assembly 311 to form a limiting groove, and the guide assembly 320 is connected to the corresponding guide bar assembly 312. The two groups of guide bar assemblies 312 are connected to the electroplating cylinder 100 through the mounting assembly 311, so that the position of the guide groove in the electroplating cylinder 100 remains unchanged during the process of the two cathode and anode shielding plates 200 being lifted and lowered to the corresponding height, thereby avoiding the collision between the two groups of guide bar assemblies 312 and the inclined PCB board. The guide assembly 320 is provided with multiple groups, and the multiple groups of guide assemblies 320 are divided into two guide groups, and the two guide groups are respectively arranged on the side where the two groups of guide bar assemblies 312 are close to each other. The multiple groups of guide assemblies 320 in each guide group are arranged in a rectangular array on the corresponding guide bar assembly 312, and the two guide groups cooperate with the corresponding guide group to guide the PCB board to be vertically arranged in the limiting groove.

[0047] Furthermore, the mounting assembly 311 includes a mounting plate 3111, a mounting seat 3112 and a fixed seat 3113; the two groups of guide bar assemblies 312 are respectively connected to the two side walls of the mounting plate 3111 on one side close to the bottom wall of the electroplating cylinder 100, the mounting seat 3112 is fixedly arranged on the side of the mounting plate 3111 away from the limiting groove, the fixed seat 3113 is fixedly arranged on the bottom wall of the electroplating cylinder 100, and the mounting seat 3112 is connected to the fixed seat 3113.

[0048] Specifically, the mounting plate 3111 is configured as a long strip extending in the X direction, and the two groups of guide bar assemblies 312 are connected to the mounting plate 3111 at intervals along the Y direction on one side close to the bottom wall of the electroplating cylinder 100, so that a limiting groove is formed between the two groups of guide bar assemblies 312 and the mounting plate 3111. Along the X direction, a plurality of mounting seats 3112 are evenly spaced on the side of the mounting plate 3111 away from the limiting groove, and correspondingly, a plurality of mounting seats 3112 are arranged on the inner side of the bottom wall of the electroplating cylinder 100, and the plurality of mounting seats 3112 are plugged into the plurality of mounting seats 3112 one by one, so that the bottom ends of the two groups of guide bar assemblies 312 are fixedly connected to the electroplating cylinder 100, thereby ensuring the stability of the limiting groove during the use of the electroplating cylinder 100.

[0049] Furthermore, the mounting assembly 311 further includes a plurality of fixing members 3114 , which are arranged at intervals along the X direction on the corresponding guide bar assemblies 312 , and each fixing member 3114 is provided with a coupling groove for coupling with the mounting plate 3111 .

[0050] Specific combination Figure 6As shown in the figure, the guide bar assembly 312 includes a plurality of guide shafts 3121. The fixing members 3114 are arranged corresponding to the guide shafts 3121. Each fixing member 3114 includes a connecting portion 31141, an upper fixing portion 31142, and a lower fixing portion 31143. A first through groove is provided in the middle of the connecting portion 31141. The upper fixing portion 31142 is connected to the upper part of the connecting portion 31141, and the lower fixing portion 31143 is connected to the lower part of the connecting portion 31141. A second through groove is formed between the upper fixing portion 31142 and the lower fixing portion 31143. The first through groove and the second through groove cooperate to form a clamping groove. And when the upper fixing portion 31142 and the lower fixing portion 31143 are connected to the connecting portion 31141, a connecting channel extending in the Z direction is formed between the upper fixing portion 31142, the lower fixing portion 31143 and the connecting portion 31141. The fixing member 3114 is connected to the lower end of the corresponding guide shaft 3121 through the connecting channel, and the fixing member 3114 is clamped to the corresponding side of the mounting plate 3111 through the clamping groove, so that the corresponding guide shaft 3121 is connected to the mounting plate 3111. By providing the clamping groove and the connecting channel fixing member 3114, the corresponding guide bar assembly 312 is connected to the mounting plate 3111, improving the connection strength and connection stability between the mounting plate 3111 and the two guide bar assemblies 312, and avoiding the situation that the two guide bar assemblies 312 collide with the PCB board in the limiting groove due to the shaking of the guide bar assembly 312.

[0051] In this embodiment, a connecting rail (not shown in the figure) is provided on one of the upper fixing portion 31142 and the connecting portion 31141, and a clamping groove (not shown in the figure) is provided on the other. The upper fixing portion 31142 is connected to the upper part of the connecting portion 31141 by the rail being clamped in the clamping groove. Threaded holes (not shown in the figure) are provided in both the lower fixing portion 31143 and the lower part of the connecting portion 31141. The threaded holes are provided on one side of the connecting channel. A threaded connecting member (not shown in the figure) passes through the two threaded holes at one time and is tightened to connect the lower fixing portion 31143 to the lower part of the connecting portion 31141. And a bolt cover is provided corresponding to the threaded connecting member. The two ends of the threaded connecting member are covered by the bolt cover to reduce the corrosion of the threaded connecting member by the electroplating solution in the electroplating tank 100, thereby prolonging the service life of the fixing member 3114 and the guide bar mechanism 310. In addition, according to actual requirements, the connecting portion 31141, the upper fixing portion 31142, and the lower fixing portion 31143 can also be connected by bonding, pin connection, welding and other connection methods, or can be directly integrally formed.

[0052] Furthermore, the mounting assembly 311 includes two fixing plates 3115 and a plurality of upper connecting members 3116. The two fixing plates 3115 are respectively connected to two side walls of the electroplating tank 100 arranged at intervals in the Y direction. The guide bar assembly 312 is fixedly connected to the corresponding fixing plate 3115 through a plurality of upper connecting members 3116.

[0053] In this embodiment, the mounting assembly 311 further includes two upper connecting plates 3117. Both of the two upper connecting plates 3117 extend along the X direction. The upper ends of multiple guide shafts 3121 in each group of guide bar assemblies 312 are fixedly connected to the upper connecting plates 3117 to ensure that the distance between adjacent two guide shafts 3121 is always equal, so as to improve the structural strength and structural stability of the guide bar assembly 312 itself.

[0054] Taking one group of guide bar assemblies 312 as an example, multiple upper connecting pieces 3116 are all arranged as long strip-shaped codes. The first ends of multiple codes are fixedly connected to the corresponding connecting plates at equal intervals along the X direction. One side of the fixing plate 3115 is fixedly connected to the side wall of the electroplating tank 100 and is arranged close to the tank opening of the electroplating tank 100. The second ends of multiple codes are all connected to the other side of the fixing plate 3115, so as to realize the fixed connection of the top end of the guide bar assembly 312 to the electroplating tank 100, and further improve the stability of the limiting groove during the use of the electroplating tank 100; at the same time, through the cooperation of the upper connecting plate 3117, the fixing plate 3115 and multiple codes, an installation space and a lifting space are left for the anode-cathode mask 200, to avoid interference between the anode-cathode mask 200 and the guide bar mechanism 310.

[0055] In some other embodiments, the upper ends of multiple guide shafts 3121 can be directly connected to the corresponding inner wall of the electroplating tank 100 through the corresponding codes.

[0056] Furthermore, the mounting plate 3111 is provided with at least one current passing hole 3101.

[0057] Specifically, the current passing hole 3101 is set as a long strip hole. Along the X direction, multiple long strip holes are evenly spaced on the spacer of the mounting plate 3111. Multiple long strip holes cooperate with each other to ensure that the current can pass through multiple long strip holes to reach the lower part of the PCB board placed in the limiting groove, to ensure the uniformity of the plating layer on the lower part of the PCB board; the whole structure can avoid the collision between the PCB board and the guide bar device 300 while ensuring the electroplating effect on the PCB board.

[0058] Preferably, the guide bar assembly 312 includes multiple guide shafts 3121 and multiple guide pieces 3122. Multiple guide shafts 3121 are connected to the mounting assembly 311 at intervals along the X direction to form an X guiding group. Multiple guide pieces 3122 are arranged at intervals along the Z direction on the X guiding group. Multiple guide pieces 3122 are divided into multiple guide bar groups. Multiple guide bar groups are evenly spaced along the X direction on the X guiding group. Multiple guide pieces 3122 in each guide bar group are arranged at intervals along the Z direction on the X guiding group. When the PCB board is placed in the limiting groove, it can limit and support PCB boards of different specifications and different positions, and at the same time ensure the uniformity of the limiting of each part of the PCB board.

[0059] Further, along the X direction, the plurality of guide pieces 3122 are all inclined towards or away from the bottom wall of the electroplating tank 100. In this way, during the electroplating process, by changing the position of the PCB board in the limiting groove, the shielding area of the guide piece 3122 on the PCB board can be changed, rather than a certain area on the PCB board being always shielded by the guide piece 3122, thereby further improving the uniformity of the plating layer on the PCB board.

[0060] Further, the guide bar assembly 312 further includes a plurality of sleeves 3123, and the plurality of sleeves 3123 are sleeved on the corresponding guide shafts 3121 and are located between two adjacent guide pieces 3122.

[0061] Specifically combined with Figure 5 As shown in the figure, in this embodiment, the guide rollers 321 are arranged corresponding to the guide pieces 3122. Therefore, the first end of the guide plate 323 is connected to the corresponding guide shaft 3121, and the guide piece 3122 is connected to the second end of the guide plate 323; the plurality of sleeves 3123 are sleeved on the corresponding guide shafts 3121, and sleeves 3123 are arranged between two adjacent guide plates 323, between the lowermost guide plate 323 and the fixing member 3114, and between the uppermost guide plate 323 and the upper connecting plate 3117. With such an arrangement, on the one hand, in the Z direction, the sleeve 3123 restricts the relative position of the corresponding guide plate 323 on the guide shaft 3121, thereby restricting the relative position of the guide piece 3122 in the Z direction to further improve the structural stability and structural strength of the guide bar assembly 312; on the other hand, the plurality of sleeves 3123 cooperate to protect the corresponding guide shaft 3121, reducing the direct contact between the electroplating solution in the electroplating tank 100 and the guide shaft 3121, thereby slowing down the corrosion rate of the electroplating solution in the electroplating tank 100 on the guide shaft 3121 to extend the service life of the guide shaft 3121 and the guide bar assembly 312. In addition, in order to further improve the structural stability and structural strength of the guide bar assembly 312, the uppermost guide plate 323 and the upper connecting plate 3117 are both connected to the corresponding guide shaft 3121 through locking members 3124; the specific structure and setting method of the locking members 3124 refer to the prior art and will not be elaborated here.

[0062] Obviously, the above embodiments of the present invention are merely examples for clearly explaining the present invention and are not intended to limit the implementation manners of the present invention. For those of ordinary skill in the art, various obvious changes, re-adjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to enumerate all the implementation manners here. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included within the protection scope of the claims of the present invention.

Claims

1. PCB electroplating equipment, used for electroplating PCB boards, characterized in that: include: Electroplating tank (100); Two cathode and anode shielding plates (200) are arranged opposite to each other in the electroplating cylinder (100) along the Y direction, and are both capable of rising and falling in the electroplating cylinder (100) along the Z direction; A guide bar device (300) is fixedly arranged in the electroplating cylinder (100) and is located between the two anode and cathode shielding plates (200). The guide bar device (300) comprises a guide bar mechanism (310) and at least two groups of guide components (320). The guide bar mechanism (310) is provided with a limit groove for limiting the position of the PCB board. The guide components (320) are all arranged in the guide bar mechanism (310) and are located in the limit groove corresponding to two side walls extending in the X direction in the limit groove, so as to guide the PCB board to be parallel to the Z direction.

2. The PCB electroplating processing equipment according to claim 1, characterized in that: The guide assembly (320) comprises a guide roller (321), a roller pin (322) and a guide plate (323); a first end of the guide plate (323) is connected to the guide bar mechanism (310), and a second end extends toward the inside of the limiting groove; the guide roller (321) is rotatably connected to the second end of the guide plate (323) via the roller pin (322).

3. The PCB electroplating processing equipment according to claim 1, characterized in that: The guide bar mechanism (310) comprises a mounting assembly (311) and two groups of guide bar assemblies (312); the two groups of guide bar assemblies (312) are connected to the mounting assembly (311) at intervals along the Y direction and cooperate with the mounting assembly (311) to form the limiting groove; the guide assembly (320) is connected to the corresponding guide bar assembly (312).

4. The PCB electroplating processing equipment according to claim 3, characterized in that: The mounting assembly (311) comprises a mounting plate (3111), a mounting seat (3112) and a fixing seat (3113); The two groups of guide bar assemblies (312) are respectively connected to the two side walls of the mounting plate (3111) on one side close to the bottom wall of the electroplating cylinder (100); the mounting seat (3112) is fixedly arranged on the side of the mounting plate (3111) away from the limiting groove; the fixing seat (3113) is fixedly arranged on the bottom wall of the electroplating cylinder (100); and the mounting seat (3112) is connected to the fixing seat (3113).

5. The PCB electroplating processing equipment according to claim 4, characterized in that: The mounting plate (3111) is provided with at least one flow hole (3101).

6. The PCB electroplating processing equipment according to claim 4, characterized in that: The mounting assembly (311) further comprises a plurality of fixing members (3114), wherein the plurality of fixing members (3114) are arranged at intervals along the X direction on the corresponding guide bar assembly (312), and each of the fixing members (3114) is provided with a clamping groove for clamping with the mounting plate (3111).

7. The PCB electroplating processing equipment according to claim 3, characterized in that: The mounting assembly (311) comprises two fixing plates (3115) and a plurality of upper connecting members (3116), wherein the two fixing plates (3115) are respectively connected to two side walls of the electroplating cylinder (100) spaced apart along the Y direction, and the guide bar assembly (312) is fixedly connected to the corresponding fixing plates (3115) via the plurality of upper connecting members (3116).

8. The PCB electroplating processing equipment according to claim 3, characterized in that: The guide bar assembly (312) comprises a plurality of guide shafts (3121) and a plurality of guide pieces (3122); the plurality of guide shafts (3121) are connected to the mounting assembly (311) at intervals along the X direction to form an X guide group; and the plurality of guide pieces (3122) are arranged at intervals along the Z direction on the X guide group.

9. The PCB electroplating processing equipment according to claim 8, characterized in that: Along the X direction, the plurality of guide plates (3122) are all arranged to be inclined toward or away from the bottom wall of the electroplating tank (100).

10. The PCB electroplating processing equipment according to claim 8, characterized in that: The guide bar assembly (312) further comprises a plurality of sleeves (3123), wherein the plurality of sleeves (3123) are sleeved on the corresponding guide shafts (3121) and are located between two adjacent guide plates (3122).

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