Special annealing furnace device for plug-in crystal

Abstract

The utility model discloses a special annealing furnace device for a plug-in crystal, and relates to the technical field of vacuum annealing of quartz oscillators. The device comprises a double-layer frame and a carrying disc, the double-layer frame comprises two bearing frames, the middles of the two ends of the two bearing frames are connected through transverse supporting columns, and L-shaped grooves are formed in the tops and the bottoms of the bearing frames; a plurality of carrying discs are placed on the L-shaped grooves, and a plurality of rows of two-pin jacks and a plurality of rows of multi-pin jacks are evenly distributed in the carrying discs. According to the utility model, the double-layer frame is provided with two layers, the loading discs are provided with two pin jacks and multiple pin jacks, the upper layer and the lower layer of the double-layer frame can bear six loading discs in total according to the designed size and the number of the jacks, 145 quartz oscillators can be inserted into each loading disc in total, 870 quartz oscillators can be inserted into the six loading discs in total, and the quartz oscillators can be inserted into the loading discs in total. And the annealing production efficiency is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of vacuum annealing of quartz oscillators, and more specifically, it is a special annealing furnace device for plug-in crystals. Background Art

[0002] A quartz crystal resonator is an important electronic component for stabilizing and selecting frequencies, and is widely used in fields such as instrument equipment, military reconnaissance, navigation, radar, missile guidance, satellite tracking, space communication, and time and frequency measurement; stress will be generated during the processing and use of quartz crystal resonators, mainly including residual stress in the surface processing layer of the quartz wafer, interfacial stress between the wafer and the electrode, base stress, thermal shock stress, etc. The stress existing in the quartz oscillator will slowly release over time, and this change in stress will cause frequency changes. For high-precision crystal resonators, it will have an adverse impact on the frequency stability of the product.

[0003] During the assembly process of a quartz crystal resonator, a product with glue dotting cured and not sealed is called a quartz oscillator; in order to release various stresses caused by the previous process to the greatest extent, a high-temperature vacuum annealing method is often used to eliminate the internal stress of the product, so as to ensure that the crystal resonator product has excellent frequency stability during long-term operation; for a conventional tubular vacuum annealing furnace, due to its cylindrical cavity structure, there are very large limitations on the placement of plug-in quartz crystal resonators, resulting in a greatly reduced annealing production efficiency of plug-in quartz crystal resonator products.

[0004] Therefore, it is necessary to develop a special annealing furnace device for plug-in crystals that can not only ensure the production efficiency of quartz crystal resonator products but also ensure the production quality of quartz crystal resonator products. Summary of the Invention

[0005] The purpose of the utility model is to overcome the deficiencies of the above background art, and provide a special annealing furnace device for plug-in crystals with a simple structure and capable of making full use of the space of the vacuum annealing furnace.

[0006] In order to achieve the above purpose, the technical solution of the utility model is: a special annealing furnace device for plug-in crystals, characterized in that: it includes a double-layer frame and a carrier plate, the double-layer frame includes two bearing frames, and the middle parts of both ends of the two bearing frames are connected by transverse support columns, and L-shaped grooves are provided at the top and bottom of the bearing frame; a plurality of carrier plates are placed on the L-shaped grooves, and a plurality of rows of two-pin jacks and a plurality of rows of multi-pin jacks are evenly distributed on the carrier plate, and the plurality of rows of two-pin jacks and the plurality of rows of multi-pin jacks are arranged in parallel at intervals.

[0007] In the above technical solution, the carrier frame includes two carrier columns, the two carrier columns are arranged in parallel, both ends of the two carrier columns are connected by longitudinal support columns, and L-shaped grooves are formed on the carrier columns; the middle of the longitudinal support column is connected to the transverse support column.

[0008] In the above technical solution, the carrier column is connected to the longitudinal support column by an internal hexagonal bolt, and the longitudinal support column is connected to the transverse support column by an internal hexagonal bolt.

[0009] In the above technical solution, corner bolts are provided at the four corners of the carrier plate.

[0010] In the above technical solution, the radius of the two-pin jack is 0.5 mm, and the distance between adjacent two-pin jacks is 4.4 mm; the diameter of the multi-pin jack is 5.6 mm.

[0011] In the above technical solution, there are 7 rows of two-pin jacks on each carrier plate, 13 two-pin jacks in each row, and two jacks for each two-pin jack; there are 6 rows of multi-pin jacks on each carrier plate, and 9 multi-pin jacks in each row.

[0012] In the above technical solution, 3 carrier plates can be placed on both the top and bottom of the double-layer frame.

[0013] Compared with the prior art, the present utility model has the following advantages:

[0014] 1) The structure of the present utility model is simple and firm, which is convenient for the staff to perform the operation of vacuum annealing, and the carrier plate can also be used alone to store quartz resonators.

[0015] 2) The designed size of the present utility model can just be placed in the middle position of the vacuum annealing furnace, which can better ensure the uniformity of the annealing temperature.

[0016] 3) The connection methods of the present utility model all adopt screw connections, which are easy to disassemble, and all components can be cleaned in place, so as to better ensure the cleanliness of the device and improve the product quality.

[0017] 4) The double-layer frame of the present utility model is designed with two layers, and the carrier plate is designed with two-pin jacks and multi-pin jacks. According to the designed size and the number of jacks, a total of 6 carrier plates can be carried on the upper and lower layers of the double-layer frame, and each carrier plate can insert a total of 145 quartz resonators. A total of 870 quartz resonators can be inserted into 6 carrier plates, greatly improving the annealing production efficiency.

[0018] 5) The carrier plate design of the present utility model can be applicable to plug-in quartz resonators with various external dimensions, and can insert two-pin and multi-pin quartz resonators simultaneously, with strong versatility and applicability. The two-pin jacks are applicable to products with a spacing of 3.7 - 5.1 mm, such as quartz crystal resonators with the external shapes of 43U, 45U, 49U / T, UM-1 / 4 / 5, 49S, etc.; the multi-pin jacks are applicable to quartz crystal resonators with the external shapes of 35U, 37U, etc.

[0019] 6) The material used in the present utility model is aluminum metal after high-temperature oxidation. After the aluminum metal undergoes high-temperature oxidation, an oxide film will be generated on the surface, which can prevent the aluminum metal from further oxidizing, with stable performance, high temperature resistance, and oxidation resistance. Description of the Drawings

[0020] Figure 1 is a structural schematic diagram of the present utility model.

[0021] Figure 2 is a structural schematic diagram of the double-layer frame.

[0022] Figure 3 is a front view of the double-layer frame.

[0023] Figure 4 is a structural schematic diagram of the carrier plate.

[0024] Figure 5 is an effect presentation diagram of the present utility model when using the upper layer.

[0025] Among them, 1 - double-layer frame, 11 - bearing frame, 111 - bearing column, 112 - longitudinal support column, 12 - transverse support column, 13 - L-shaped groove, 14 - hexagon socket head cap screw, 2 - carrier plate, 21 - two-pin jacks, 22 - multi-pin jacks, 23 - angle bolts. Detailed Description of the Preferred Embodiments

[0026] The following will describe in detail the implementation of the present utility model with reference to the drawings, but they do not constitute a limitation to the present utility model and are only for illustration purposes. At the same time, the advantages of the present utility model will become clearer and easier to understand through the description.

[0027] Referring to the drawings, it can be seen that a special annealing furnace device for plug-in crystals includes a double-layer frame 1 and a carrier plate 2. The double-layer frame 1 includes two bearing frames 11, and the middle parts of both ends of the two bearing frames 11 are connected by transverse support columns 12. L-shaped grooves 13 are provided at the top and bottom of the bearing frame 11; a plurality of carrier plates 2 are placed on the L-shaped grooves 13, and multiple rows of two-pin jacks 21 and multiple rows of multi-pin jacks 22 are evenly distributed on the carrier plate 2, and the multiple rows of two-pin jacks 21 and the multiple rows of multi-pin jacks 22 are arranged in parallel at intervals.

[0028] The carrier frame 11 includes two carrier columns 111 which are arranged in parallel. Both ends of the two carrier columns 111 are connected by longitudinal support columns 112. An L-shaped groove 13 is formed on the carrier column 111. The middle part of the longitudinal support column 112 is connected to the transverse support column 12.

[0029] The carrier column 111 is connected to the longitudinal support column 112 by an Allen bolt 14, and the longitudinal support column 112 is connected to the transverse support column 12 by an Allen bolt 14.

[0030] Angle bolts 23 are provided at the four corners of the carrier plate 2.

[0031] The radius of the two-pin jack 21 is 0.5 mm, and the distance between adjacent two-pin jacks 21 is 4.4 mm. The diameter of the multi-pin jack 22 is 5.6 mm.

[0032] There are 7 rows of two-pin jacks 21 on each carrier plate 2, with 13 two-pin jacks 21 in each row, and each two-pin jack 21 has two jacks. There are 6 rows of multi-pin jacks 22 on each carrier plate 2, with 9 multi-pin jacks 22 in each row.

[0033] Three carrier plates 2 can be placed on both the top and bottom of the double-layer frame 1.

[0034] In actual use, both the double-layer frame 1 and the carrier plate 2 are made of aluminum metal after high-temperature oxidation. The carrier column 111 is an L-shaped aluminum metal rod. The sizes of the double-layer frame 1 and the carrier plate 2 can be adjusted according to the size of the actual annealing furnace used, and the jack distribution of the carrier plate 2 can also be reasonably adjusted according to the usage scenario. The two-pin jack 21 and the multi-pin jack 22 are jointly used to place the plug-in quartz oscillator.

[0035] The utility model is applicable to the vacuum annealing process of all plug-in quartz crystal resonators. During the assembly production process of the plug-in quartz crystal resonator, multiple vacuum annealing processes are required to release the stress generated in each process. Taking the conductive adhesive curing annealing process as an example, the quartz oscillator with the base and conductive adhesive applied is inserted into the corresponding two-pin jack 21 or multi-pin jack 22 of the carrier plate 2 in sequence according to the number of its pins. Then, the carrier plate 2 with the inserted quartz oscillator is placed in an electrothermal blast drying oven for conductive adhesive curing. After the curing process, the conductive adhesive curing annealing process is carried out. First, the double-layer frame 1 is placed in the middle position of the vacuum annealing furnace, and then the carrier plate 2 with the cured quartz oscillator inserted is pushed into the vacuum annealing furnace along the L-shaped groove 13 of the double-layer frame 1 in sequence. The number of layers of the double-layer frame 1 can be selected according to the number of carrier plates 2 used. Subsequently, the furnace door of the vacuum annealing furnace is closed, and the vacuum annealing process is started.

[0036] Figure 5For the present utility model, only the effect presentation diagram of the upper layer is used. In actual application on products, the distances between the quartz oscillators are appropriate, and they will not touch each other, which will not affect the vacuum annealing quality of the products. At the same time, the number of products that can be subjected to vacuum annealing at one time increases, greatly improving the production efficiency of the products.

[0037] Other parts not described belong to the prior art.

Claims

1. A special annealing furnace device for plug-in crystals, characterized in that: The invention comprises a double-layer frame (1) and a carrier (2), wherein the double-layer frame (1) comprises two carrier frames (11), the middle parts of both ends of the two carrier frames (11) are connected by a transverse support column (12), and the top and bottom of the carrier frames (11) are both provided with L-shaped grooves (13); a plurality of carriers (2) are placed on the L-shaped grooves (13), and a plurality of rows of two-pin plug holes (21) and a plurality of rows of multi-pin plug holes (22) are evenly distributed on the carrier (2), and the plurality of rows of two-pin plug holes (21) and the plurality of rows of multi-pin plug holes (22) are arranged in parallel and spaced apart.

2. The annealing furnace device for plug-in crystal according to claim 1, characterized in that: The bearing frame (11) comprises two bearing columns (111), the two bearing columns (111) are arranged in parallel, both ends of the two bearing columns (111) are connected by a longitudinal support column (112), and an L-shaped groove (13) is provided on the bearing column (111); the middle part of the longitudinal support column (112) is connected to the transverse support column (12).

3. The annealing furnace device for plug-in crystal according to claim 2, characterized in that: The bearing column (111) is connected to the longitudinal support column (112) via a hexagon socket bolt (14), and the longitudinal support column (112) is connected to the transverse support column (12) via a hexagon socket bolt (14).

4. The annealing furnace device for plug-in crystal according to claim 1, characterized in that: Corner bolts (23) are provided at the four corners of the carrier plate (2).

5. The annealing furnace device for plug-in crystal according to claim 1, characterized in that: The radius of the two-pin plug holes (21) is 0.5 mm, and the distance between two adjacent pin plug holes (21) is 4.4 mm; the diameter of the multi-pin plug hole (22) is 5.6 mm.

6. The annealing furnace device for plug-in crystal according to claim 5, characterized in that: Each of the carrier plates (2) has 7 rows of two-pin sockets (21), each row has 13 two-pin sockets (21), and each two-pin socket (21) has two sockets; each of the carrier plates (2) has 6 rows of multi-pin sockets (22), and each row has 9 multi-pin sockets (22).

7. The annealing furnace device for plug-in crystal according to claim 1, characterized in that: The top and bottom of the double-layer frame (1) can both accommodate three carriers (2).

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