Silicon wafer basket
By setting flexible barriers, such as rubber strips, on the bottom rod of the silicon wafer basket, the damage caused by friction with the bottom rod of the extremely thin silicon wafer during the cleaning process is solved, and a higher yield and better silicon wafer protection is achieved.
Patent Information
- Application Number
- CN202422170012.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-04
- Publication Date
- 2025-06-13
- Estimated Expiration
- 2034-09-04
AI Technical Summary
When cleaning extremely thin HJT silicon wafers, the traditional flower basket bottom rod may easily cause the edge of the silicon wafer to rub against the flower basket bottom rod, forming a "basket bottom rod printing" and may cause the silicon wafer to break and affect the yield rate.
A silicon wafer flower basket is designed with flexible barriers, such as rubber strips, which are provided on the bottom rod to prevent the direct contact between the silicon wafer and the bottom rod, and the rubber strips are fastened by snap and slot structures to reduce friction and vibration.
It effectively prevents direct friction between the silicon wafer and the bottom rod, reduces the risk of silicon wafer damage, improves the yield rate, and further protects the silicon wafer through the elastic vibration damping effect of the flexible material.
Smart Images
Figure CN222980471U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of silicon wafers, and more specifically, to a silicon wafer carrier. Background Art
[0002] With the development of photovoltaic technology, especially the gradual rise of heterojunction (HJT) cell technology, silicon wafers are getting thinner and thinner, which brings new challenges to the cleaning process. The traditional cleaning carrier (a device for fixing silicon wafers for cleaning) is composed of a stainless steel frame, card teeth and a bottom rod made of PVDF material. Although this material is heat-resistant and corrosion-resistant, it is easy to produce "bottom rod marks of the carrier" when cleaning extremely thin HJT silicon wafers - that is, the marks left after the silicon wafer edge rubs against the bottom rod of the carrier, and sometimes it will even cause the silicon wafer to break.
[0003] Since the silicon wafers are very thin (for example, 80-90 microns), during the cleaning process, especially under ultrasonic vibration, the silicon wafers are prone to severe friction with the bottom rod of the carrier, thus forming obvious "bottom rod marks of the carrier". In severe cases, it will even cause the edge of the silicon wafer to break, affecting the yield. Summary of the Utility Model
[0004] The purpose of the utility model is to provide a silicon wafer carrier, which can eliminate the "bottom rod marks of the carrier", reduce the damage to the silicon wafers and improve the yield.
[0005] The technical solution of the utility model is realized as follows:[[]]
[0006] A silicon wafer carrier, comprising:
[0007] A main body frame, having a plurality of positioning grooves for loading silicon wafers, and the plurality of positioning grooves are arranged in sequence along a first direction;
[0008] Wherein, the main body frame includes two carrier end plates and a bottom rod located between the two carrier end plates, a barrier member is arranged on the bottom rod, and the barrier member is made of a flexible material for blocking direct contact between the bottom rod and the silicon wafers.
[0009] Further, the barrier member is made of a rubber strip, and the rubber strip is arranged on the top of the bottom rod along the length direction of the bottom rod.
[0010] Further, a plurality of buckles are arranged in sequence along the length direction of the top of the bottom rod, a card slot is formed in each buckle, and the rubber strip is clamped in the card slot.
[0011] Further, the rubber strip is made of a fluororubber strip.
[0012] Further, all the positioning grooves are divided into at least two regions, and a partition plate is arranged between two adjacent regions;
[0013] The sizes of the positioning grooves within the same area are the same, while the sizes of the positioning grooves in different areas are different, so as to load wafers of different sizes in a segmented manner.
[0014] Furthermore, the partition is made of an insulating material.
[0015] Furthermore, each of the positioning grooves is lined with a flexible material layer.
[0016] Furthermore, the opening at the top of the wafer carrier is a placement opening for putting wafers, and a movable cover is provided at the top of the main body frame to block the placement opening.
[0017] Furthermore, a plurality of height-adjustable support feet are sequentially arranged at the bottom of the main body frame to adjust the height of the wafer carrier.
[0018] Furthermore, an anti-slip pad is provided at the bottom of the support feet.
[0019] Compared with the prior art, the beneficial effects of the present utility model are as follows:
[0020] In this application, by providing a barrier on the bottom rod of the carrier, and the barrier is made of a flexible material, it can not only prevent direct contact between the wafer and the bottom rod after the wafer is placed in the carrier, but also the flexible material has elasticity, improving the vibration damping effect, reducing damage to the wafer, and increasing the yield. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required to be used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present utility model, and thus should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.
[0022] Figure 1 It is a schematic structural diagram of the bottom rod of the present utility model;
[0023] Figure 2 For the present utility model Figure 1 is a cross-sectional view of the buckle part.
[0024] In the figure:
[0025] 1 - bottom rod; 101 - connecting part; 2 - buckle; 3 - rubber strip. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0026] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. Components of the embodiments of the present utility model usually described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.
[0027] Therefore, the following detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the claimed present utility model, but merely represents selected embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts fall within the scope of protection of the present utility model.
[0028] It should be noted that: similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.
[0029] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the utility model product is usually placed during use. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and should not be construed as indicating or implying relative importance.
[0030] In addition, terms such as "horizontal", "vertical", "hanging" do not mean that the components are required to be absolutely horizontal or hanging, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.
[0031] In the description of the present utility model, it should also be noted that unless otherwise clearly specified and limited, the terms "set", "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.
[0032] The following will describe in detail some embodiments of the present utility model in conjunction with the accompanying drawings. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.
[0033] Embodiment 1
[0034] Regarding the abnormal printing on the bottom rod of the flower basket for HJT half - slice thin wafers, the problem points are verified by investigating the following aspects:
[0035] 1. Adjust the running speed of the belt of the wafer aligner:
[0036] Reduce the running speed of the belt of the wafer aligner to reduce the impact force of the wafer edge on the bottom rod of the flower basket when the wafer is transferred into the flower basket. After experimental verification, there is no effect of reducing or alleviating the breakage of the bottom rod of the flower basket, and the verification is NG.
[0037] 2. Adjust the position of the baffle for wafer entering the basket:
[0038] Adjust the position of the baffle at the bottom rod of the wafer - arranging flower basket so that the wafer hits the soft baffle when being transferred into the basket instead of hitting the bottom rod of the flower basket. After experimental verification, there is no effect of reducing or alleviating the breakage of the bottom rod of the flower basket, and the verification is NG.
[0039] 3. Turn off the ultrasonic device of the cleaning machine:
[0040] Turn off the ultrasonic device of the cleaning machine to reduce the influence of ultrasonic vibration on the wafer and reduce the friction at the contact position between the wafer edge and the bottom rod 1 of the flower basket. After experimental verification, the breakage of the bottom rod of the flower basket has decreased significantly, and the printing on the bottom rod of the flower basket has become very slight, and the verification is effective.
[0041] 4. Turn off the fan of the drying tank:
[0042] Turn off the fan of the drying tank or reduce the fan frequency by 50% to reduce the friction between the wafer and the bottom rod of the flower basket under the blowing of the fan. After experimental verification, the breakage of the bottom rod of the flower basket has decreased, but not significantly, and the printing on the bottom rod of the flower basket is still obvious. The verification is effective, but the effect is not great.
[0043] Through the above investigation and verification, it can be concluded that the printing on the bottom rod of the flower basket and the breakage of the bottom rod of the flower basket mainly occur in the cleaning machine tank, and the main influencing factors are the ultrasonic device of the cleaning machine and the air volume of the fan in the drying tank. However, the ultrasonic device of the cleaning machine is mainly used to clean the silicon powder dirt on the wafer surface. After turning it off or reducing it, the silicon powder cannot be cleaned thoroughly, resulting in abnormal silicon powder dirt; after turning off or reducing the fan in the drying tank, there are water stains on the wafer, resulting in abnormal wet wafers. Therefore, if you want to solve the abnormal printing and edge breakage of the bottom rod of the flower basket, it can only be solved and improved by changing the existing material of the bottom rod of the flower basket or adding a device to the existing bottom rod of the flower basket.
[0044] In summary, this embodiment provides a wafer flower basket, including:
[0045] A main body frame has a plurality of positioning slots for loading silicon wafers, and the plurality of positioning slots are arranged in sequence along a first direction; there are many engaging teeth on the main body frame, and the positioning slots are formed between the engaging teeth.
[0046] Wherein, the main body frame further includes two flower basket end plates and a bottom rod 1 located between the two flower basket end plates. A barrier member is arranged on the bottom rod 1, and the barrier member is made of a flexible material for preventing the bottom rod 1 from directly contacting the silicon wafer. Connecting portions 101 are respectively arranged at two ends of the bottom rod 1 for bolt connection with the flower basket end plates.
[0047] The silicon wafer can be a whole silicon wafer or a half silicon wafer.
[0048] The barrier member made of a flexible material can not only prevent the silicon wafer from directly contacting the bottom rod 1 after being placed in the flower basket, but also the flexible material has elasticity, which improves the vibration damping effect, reduces the damage to the silicon wafer, and improves the yield.
[0049] In this embodiment, the barrier member is a rubber strip 3, and the rubber strip 3 is arranged along the length direction of the bottom rod 1 at its top. Preferably, the barrier member is made of fluororubber material because fluororubber materials have the characteristics of high temperature resistance (the temperature in the drying tank reaches 100 - 120 °C) and acid and alkali resistance (the chemical agent tank in the cleaning machine is a strong alkali solution), and the texture is soft, which can well damp vibration, reduce the friction risk between the silicon wafer and the bottom rod 1 caused by the vibration of the silicon wafer, and thus avoid the abnormal problem of the bottom rod mark on the edge of the silicon wafer and reduce the breakage rate of the silicon wafer.
[0050] In this embodiment, a plurality of buckles 2 are sequentially arranged along the length direction of the top of the bottom rod 1. The buckles 2 have clamping grooves inside, as Figure 2 , and the rubber strip 3 is clamped in the clamping grooves. The plurality of clamping grooves together play a role in fastening the rubber strip 3.
[0051] Preferably, as Figure 1 , the buckles 2 are designed to be four, and are arranged in sequence according to the first direction, and the rubber strip 3 is clamped in the four clamping grooves.
[0052] In this embodiment, the sizes of all the positioning slots can be the same or different, specifically as follows:
[0053] All the positioning slots are divided into at least two regions, such as two regions or three regions, namely the first region, the second region, the third region, etc. A partition board is arranged between adjacent two regions; the sizes of the positioning slots in the same region are the same, while the sizes of the positioning slots in different regions are different. The silicon wafer sizes or models applicable to each region are different to load silicon wafers of different sizes in a partitioned manner to adapt to different silicon wafers. Among them, the partition board is made of an insulating material to reduce the influence of static electricity on the silicon wafer.
[0054] Each of the positioning grooves is lined with a flexible material layer, which can better protect the silicon wafers when they are placed in the positioning grooves.
[0055] The opening at the top of the silicon wafer carrier is a placement opening for inserting silicon wafers. The top of the main body frame is provided with a movable cover for blocking the placement opening. The movable cover can be directly placed on the top of the main body frame to block the placement opening; alternatively, sliding grooves are respectively formed in opposite sides of the top of the main body frame along a first direction, and clamping strips are respectively arranged in opposite sides of the movable cover along the first direction. The clamping strips and the sliding grooves correspond to each other one by one, and the movable cover can slide in the sliding grooves through the clamping strips on both sides, realizing the sliding connection between the movable cover and the main body frame.
[0056] A plurality of height-adjustable support feet are sequentially arranged at the bottom of the main body frame for adjusting the height of the silicon wafer carrier.
[0057] An anti-slip pad is arranged at the bottom of the support feet to increase stability and protect the storage surface.
[0058] The silicon wafer carrier can also be internally provided with a lighting system for providing local lighting when needed, facilitating users to identify and operate the silicon wafers.
[0059] 1. Transformation method:
[0060] - Add four buckles 2 to the existing bottom rod 1 of the carrier.
[0061] - Fix a soft fluororubber strip 3 in these buckles 2 so that the strip closely adheres to the bottom rod 1 of the carrier.
[0062] - When the silicon wafers are inserted into the carrier, this soft strip will contact the edges of the silicon wafers, reducing the friction between the silicon wafers and the hard bottom rod 1.
[0063] 2. Technical effects:
[0064] - The phenomenon of "bottom rod marks on the carrier" is almost eliminated or completely eliminated in the transformed carrier.
[0065] - The proportion of edge breakage of the silicon wafers is effectively reduced, and the yield is improved.
[0066] Technical advantages:
[0067] 1. Significantly improve the yield: For 110-micron-thick half silicon wafers, the transformed carrier can effectively control the problems of "bottom rod marks on the carrier" and edge breakage, and the yield is increased by 2 - 2.5%.
[0068] 2. Easy to transform and upgrade: Only need to simply add fluororubber strips to the original carrier, with low cost and convenient transformation.
[0069] It should be noted that a fixed fluororubber strip 3 (or other soft materials with acid and alkali corrosion resistance and high temperature resistance characteristics) is added to the bottom rod 1 of the cleaning basket to solve the friction problem in the cleaning of thin silicon wafers. This includes but is not limited to the use of strips made of specific materials (such as fluororubber) and the installation method on the bottom rod 1 of the cleaning basket.
[0070] Embodiment 2
[0071] This embodiment provides specific dimensions of the bottom rod 1, such as Figure 1 and Figure 2 the dimensional markings on it. The overall length of the bottom rod 1 is 571 mm, the length of the rod body after removing the connecting parts 101 at both ends is 555 mm, the length of the buckle 2 is 10 mm, the bottom rod 1 is a hollow rod, the inner diameter of the bottom rod 1 is 3.34 mm, the outer diameter is 10 mm, and the diameter of the rubber strip 3 is 3 mm.
[0072] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.
[0073] In addition, those skilled in the art can understand that although some of the embodiments herein include certain features included in other embodiments rather than other features, the combination of the features of different embodiments means that it is within the scope of the present invention and forms different embodiments. For example, in the above claims, any one of the claimed embodiments can be used in any combination. The information disclosed in this background art section is only intended to deepen the understanding of the overall background art of the present invention, and should not be regarded as admitting or implying in any form that this information constitutes the prior art known to those skilled in the art.
[0074] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.
[0075] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. For those skilled in the art, various modifications and variations can be made to the present utility model. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.
Claims
1. A silicon wafer flower basket, characterized in that: include: A main frame having a plurality of positioning grooves for loading silicon wafers, wherein the plurality of positioning grooves are arranged in sequence along a first direction; The main frame comprises two flower basket end plates and a bottom rod (1) located between the two flower basket end plates, and a barrier is provided on the bottom rod (1). The barrier is made of a flexible material and is used to prevent the bottom rod (1) from directly contacting the silicon wafer.
2. The silicon wafer flower basket according to claim 1, characterized in that: The barrier member is a rubber strip (3) which is arranged on the top of the bottom rod (1) along the length direction thereof.
3. The silicon wafer flower basket according to claim 2, characterized in that: A plurality of buckles (2) are sequentially arranged on the top of the bottom rod (1) along its length direction, and a slot is provided in the buckle (2), and the rubber strip (3) is clamped in the slot.
4. The silicon wafer flower basket according to claim 2, characterized in that: The rubber strip (3) is a fluororubber strip (3).
5. The silicon wafer flower basket according to claim 1, characterized in that: All the positioning grooves are divided into at least two areas, and a partition is provided between two adjacent areas; The sizes of the positioning grooves in the same area are the same, while the sizes of the positioning grooves in different areas are different, so as to load silicon wafers of different sizes in different areas.
6. The silicon wafer flower basket according to claim 5, characterized in that: The partition is made of insulating material.
7. The silicon wafer flower basket according to claim 1, characterized in that: Each positioning groove is lined with a flexible material layer.
8. The silicon wafer flower basket according to claim 1, characterized in that: The opening at the top of the silicon wafer flower basket is a storage opening for placing silicon wafers, and a movable cover is arranged on the top of the main frame for sealing the storage opening.
9. The silicon wafer flower basket according to claim 1, characterized in that: A plurality of height-adjustable support legs are sequentially arranged at the bottom of the main frame to adjust the height of the silicon wafer flower basket.
10. The silicon wafer flower basket according to claim 9, characterized in that: The bottom of the supporting foot is provided with an anti-skid pad.