Electronic equipment

Abstract

The embodiment of the utility model provides electronic equipment. The electronic equipment comprises a rear shell, a lampshade and an optical film layer, the lampshade is arranged on the inner side of the rear shell and fixedly connected with the rear shell, and part of the lampshade is exposed out of the rear shell. The face, away from the rear shell, of the lampshade is sunken in the rear shell to form a containing space. The optical film layer is arranged on the side, away from the rear shell, of the lampshade and located in the containing space. The thickness of the optical film layer is smaller than the depth of the containing space, so that the face, away from the rear shell, of the optical film layer is lower than the face, away from the farthest point of the rear shell, of the lampshade in the thickness direction of the electronic equipment, and therefore the optical film layer does not occupy extra space in the thickness direction of the electronic equipment, and the service life of the electronic equipment is prolonged. The maximum space occupied by the optical film layer and the lampshade in the thickness direction of the electronic equipment is only the space occupied by the thickness of the lampshade, so that the space occupied by the lampshade and the optical film layer in the thickness direction of the electronic equipment is reduced, and thinning of the electronic equipment is facilitated.

Description

Technical Field

[0001] This application relates to the technical field of electronic products, and particularly to an electronic device. Background Art

[0002] With the continuous development of electronic technology, electronic devices such as mobile phones and tablet computers are gradually becoming thinner and lighter. For an electronic device with a flash, a lamp cover is usually provided on the rear shell thereof, and an optical film layer is provided on a side of the lamp cover away from the rear shell. The positions of the optical film layer and the lamp cover correspond to those of the flash, so that the light emitted by the flash can pass through the optical film layer and the lamp cover from the inside of the electronic device and then be emitted from the electronic device.

[0003] In the related art, the lamp cover and the optical film layer inside the electronic device occupy a relatively large space, which is not conducive to the thinning of the electronic device. Summary of the Utility Model

[0004] The purpose of the embodiments of this application is to provide an electronic device to reduce the space occupied by the lamp cover and the optical film layer in the thickness direction of the electronic device, which is conducive to the thinning of the electronic device. The specific technical solutions are as follows:

[0005] The embodiments of this application provide an electronic device, including a rear shell, a lamp cover and an optical film layer; the lamp cover is arranged on the inner side of the rear shell, fixedly connected to the rear shell, and partially exposed outside the rear shell; the side of the lamp cover away from the rear shell is recessed towards the rear shell to form a receiving space; the optical film layer is arranged on a side of the lamp cover away from the rear shell and is located in the receiving space; the thickness of the optical film layer is less than the depth of the receiving space.

[0006] As can be seen from the above, the electronic device of the embodiments of this application includes a rear shell, a lamp cover and an optical film layer; the lamp cover is arranged on the inner side of the rear shell, fixedly connected to the rear shell, and partially exposed outside the rear shell; the side of the lamp cover away from the rear shell is recessed towards the rear shell to form a receiving space; the optical film layer is arranged on a side of the lamp cover away from the rear shell and is located in the receiving space; the thickness of the optical film layer is less than the depth of the receiving space, so that in the thickness direction (Z direction) of the electronic device, the surface of the optical film layer away from the rear shell is lower than the surface where the farthest point of the lamp cover away from the rear shell is located. In this way, in the thickness direction of the electronic device, the optical film layer does not occupy extra space, and the maximum space occupied by the optical film layer and the lamp cover in the Z direction is only the space occupied by the thickness of the lamp cover, thereby reducing the space occupied by the lamp cover and the optical film layer in the thickness direction of the electronic device, which is conducive to the thinning of the electronic device.

[0007] In some embodiments of this application, a first through hole is provided on the rear shell;

[0008] The lamp cover includes a main body portion and a fixing portion; the main body portion is disposed within the first through hole and is exposed outside the rear housing; the fixing portion is fixedly connected to the edge of the main body portion, is disposed inside the rear housing, and is fixedly connected to the rear housing.

[0009] As can be seen from the above, light can be emitted through the main body portion. The fixing portion is fixedly connected to the edge of the main body portion, and the lamp cover is fixedly connected to the rear housing through the fixing portion, avoiding occupying the space of the main body portion for fixing the lamp cover, which may affect the light emission.

[0010] In some embodiments of the present application, the accommodation space includes: a first groove and a second through hole that are communicatively provided; the first groove is located in the main body portion; the second through hole is located in the fixing portion;

[0011] The optical film layer is disposed in the first groove and the second through hole and is fixedly connected to the rear housing through the second through hole.

[0012] As can be seen from the above, in the first embodiment of the present application, the depth of the accommodation space refers to the depth of the first groove, such that the surface of the optical film layer away from the rear housing is lower than the notch of the first groove. A part of the structure of the fixing portion of the lamp cover is hollowed out to form a second through hole, so that the optical film layer can be directly connected to the rear housing, thereby minimizing the thickness of the lamp cover corresponding to the optical film layer and providing space for other devices, which is further conducive to the miniaturization of the electronic device.

[0013] In some embodiments of the present application, the main body portion includes: a first sub-portion and a second sub-portion; in the thickness direction of the lamp cover, the second sub-portion protrudes from the first sub-portion, and the two form a stepped structure;

[0014] The surface of the first sub-portion away from the rear housing is flush with the surface of the fixing portion away from the rear housing, and the two together form the accommodation space;

[0015] The optical film layer is disposed on the fixing portion and the first sub-portion.

[0016] As can be seen from the above, the depth of the accommodation space refers to the height difference between the first sub-portion and the second sub-portion, such that the surface of the optical film layer away from the rear housing is lower than the surface of the second sub-portion away from the rear housing. By thinning the thickness of the second sub-portion of the main body portion, an accommodation space is provided for the optical film layer, thereby reducing the space occupied by the optical film layer and the lamp cover in the thickness direction of the electronic device.

[0017] In some embodiments of the present application, the optical film layer includes: a light homogenizing layer and an infrared cut-off layer that are stacked;

[0018] The light homogenizing layer is disposed on the side of the infrared cut-off layer close to the lamp cover;

[0019] The orthographic projection of the light homogenizing layer on the lamp cover covers the orthographic projection of the infrared cut-off layer on the lamp cover.

[0020] As can be seen from the above, the light homogenizing layer can homogenize light, disperse and gather the light from the flash, making the light more uniform, which is beneficial to improving the clarity and brightness of the captured image; the infrared cut-off layer can filter out infrared light to prevent infrared light from interfering with the imaging of the rear camera module; the superposition of the light homogenizing layer and the infrared cut-off layer is beneficial to improving the imaging effect of the electronic device. And because the orthographic projection of the light homogenizing layer on the lamp cover covers the orthographic projection of the infrared cut-off layer on the lamp cover, the light homogenizing layer is arranged on the side of the infrared cut-off layer close to the lamp cover, which is beneficial to ensuring the flatness of the light homogenizing layer and can prevent the infrared cut-off layer from being arranged between the light homogenizing layer and the lamp cover, resulting in the deformation of the light homogenizing layer at the edge of the infrared cut-off layer, and further resulting in the unevenness of the light homogenizing layer.

[0021] In some embodiments of the present application, the accommodating space is a groove structure; a part of the groove structure is located in the main body part, and the remaining part is located in the fixing part;

[0022] The groove structure is adapted to the shape of the optical film layer.

[0023] As can be seen from the above, the groove structure is convenient for processing, the groove structure is adapted to the shape of the optical film layer, which is convenient for installation and is beneficial to improving the position accuracy of the optical film layer.

[0024] In some embodiments of the present application, the groove structure includes: a second groove and a third groove;

[0025] The third groove is located within the range of the second groove; the third groove is formed by recessing from the bottom of the second groove towards the rear shell.

[0026] As can be seen from the above, the third groove continues to be grooved on the basis of the second groove, providing more setting space for the optical film layer and reducing the space occupied by the optical film layer.

[0027] In some embodiments of the present application, the optical film layer includes: a light homogenizing layer and an infrared cut-off layer stacked;

[0028] The infrared cut-off layer is arranged in the third groove;

[0029] The light homogenizing layer is arranged on the side of the infrared cut-off layer away from the rear shell and is located in the second groove;

[0030] The orthographic projection of the light homogenizing layer on the lamp cover covers the orthographic projection of the infrared cut-off layer on the lamp cover.

[0031] As can be seen from the above, the depth of the accommodating space refers to the total depth of the second groove and the third groove, such that the surface of the optical film layer away from the rear housing is lower than the notch of the second groove. In this way, it is beneficial to ensure the flatness of the light homogenizing layer, and since the third groove is provided, the infrared cut-off layer can be embedded into the lamp housing, which is beneficial to further reducing the occupied space of the optical film layer and the lamp housing in the thickness direction of the electronic device.

[0032] In some embodiments of the present application, both the main body portion and the fixing portion are made of transparent plastic, and the two are of an integrally formed structure;

[0033] Or, the fixing portion is a metal thin sheet, and the main body portion is made of transparent plastic, and the two are injection molded.

[0034] As can be seen from the above, the integrally formed processing method is convenient for processing and is beneficial to improving production efficiency. The transparent plastic material enables light to pass through the lamp housing, and has a light texture, which is beneficial to the lightweight design of the electronic device. Compared with the integrally formed transparent plastic structure, the metal thin sheet occupies less space in the thickness direction of the electronic device, further reducing the occupied space of the lamp housing in the thickness direction of the electronic device, which is beneficial to the miniaturization design of the electronic device.

[0035] In some embodiments of the present application, the electronic device further includes: a circuit board, a flash lamp, and a color temperature lamp;

[0036] The circuit board is disposed on a side of the lamp housing away from the rear housing;

[0037] The flash lamp and the color temperature lamp are disposed on the circuit board and are located between the optical film layer and the circuit board;

[0038] The orthographic projection of the optical film layer on the circuit board covers the orthographic projection of the flash lamp on the circuit board and is spaced apart from the orthographic projection of the color temperature lamp on the circuit board.

[0039] As can be seen from the above, the color temperature lamp and the flash lamp are used in cooperation, which can make the imaging of the electronic device clearer.

[0040] In some embodiments of the present application, the electronic device further includes: a shielding cover and a buffer member;

[0041] The shielding cover is disposed on the circuit board, surrounds the flash lamp and the color temperature lamp, and is located between the rear housing and the circuit board;

[0042] The buffer member is disposed at the edge of the lamp housing; one end of the buffer member is fixedly connected to the lamp housing, and the other end abuts against the shielding cover.

[0043] As can be seen from the above, the buffer has a buffering effect, which can improve the installation stability of the shielding cover and the lamp cover, and at the same time avoid damage caused by rigid contact between the two. Other electronic components can be arranged inside the shielding cover to avoid mutual influence between the electronic components and improve the working stability of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other embodiments can be obtained based on these drawings.

[0045] Figure 1 Structural schematic diagram of the electronic device according to the embodiment of the present application;

[0046] Figure 2 Exploded structural schematic diagram of the electronic device according to the embodiment of the present application;

[0047] Figure 3 For Figure 1 Partial enlarged schematic diagram at P of

[0048] Figure 4 For Figure 3 Structural schematic diagram from another perspective;

[0049] Figure 5 Exploded structural schematic diagram of the first perspective of P in the first embodiment of the present application;

[0050] Figure 6 Exploded structural schematic diagram of the second perspective of P in the first embodiment of the present application;

[0051] Figure 7 For the first embodiment of the present application Figure 4 A-A cross-sectional view of

[0052] Figure 8 For Figure 7 Partial enlarged schematic diagram at Q of

[0053] Figure 9 Structural schematic diagram of the first perspective of the lamp cover in the first embodiment of the present application;

[0054] Figure 10 Structural schematic diagram of the second perspective of the lamp cover in the first embodiment of the present application;

[0055] Figure 11 For Figure 8 Front view of

[0056] Figure 12Connection diagram of the lamp shade, optical film layer, buffer, flash lamp and color temperature lamp for the first embodiment of the present application;

[0057] Figure 13 Exploded structural schematic diagram of the first view at P for the second embodiment of the present application;

[0058] Figure 14 Exploded structural schematic diagram of the second view at P for the second embodiment of the present application;

[0059] Figure 15 For the second embodiment of the present application Figure 4 A-A cross-sectional view;

[0060] Figure 16 Is Figure 15 Partial enlarged schematic diagram at R of;

[0061] Figure 17 Structural schematic diagram of the first view of the lamp shade for the second embodiment of the present application;

[0062] Figure 18 Structural schematic diagram of the second view of the lamp shade for the second embodiment of the present application;

[0063] Figure 19 Is Figure 16 Front view of;

[0064] Figure 20 Connection diagram of the lamp shade, optical film layer, buffer, flash lamp and color temperature lamp for the second embodiment of the present application;

[0065] Figure 21 Exploded structural schematic diagram of the first view at P for the third embodiment of the present application (omitting the circuit board, flash lamp, color temperature lamp and shield);

[0066] Figure 22 Exploded structural schematic diagram of the second view at P for the third embodiment of the present application (omitting the circuit board, flash lamp, color temperature lamp and shield);

[0067] Figure 23 Structural schematic diagram of the first view of the lamp shade for the third embodiment of the present application;

[0068] Figure 24 Structural schematic diagram of the second view of the lamp shade for the third embodiment of the present application;

[0069] Figure 25 Connection diagram of the lamp shade, optical film layer, buffer for the third embodiment of the present application;

[0070] Figure 26 For the third embodiment of the present application Figure 4AA cross-sectional view (circuit board, flash, color temperature lamp and shield cover omitted).

[0071] Description of reference numerals:

[0072] The rear shell 100; the first through hole 110; the camera decoration 120; the lampshade 200; the accommodating space 201; the second groove 2011; the third groove 2012; the main body 210; the first groove 211; the first sub-section 212; the second sub-section 213; the fixing part 220; the second through hole 221; the fool-proof structure 222; the optical film layer 300; the light-homogenizing layer 310; the infrared cutoff layer 320; the circuit board 400; the flash 500; the color temperature lamp 600; the first adhesive layer 710; the second adhesive layer 720; the third adhesive layer 730; the fourth adhesive layer 740; the shielding cover 750; the buffer 760; the battery 770; the middle frame 800; the display screen 900. DETAILED DESCRIPTION

[0073] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0074] In order to facilitate the clear description of the technical solutions of the embodiments of the present application, in the embodiments of the present application, the words "first", "second" and the like are used to distinguish the same items or similar items with substantially the same functions and effects. For example, the first swing arm and the second swing arm are used to distinguish different swing arms, and the order thereof is not limited. Those skilled in the art can understand that the words "first", "second" and the like do not limit the quantity and position, and the words "first", "second" and the like do not necessarily limit the difference.

[0075] It should be noted that, in this application, words such as "exemplarily" or "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design described as "exemplarily" or "for example" in this application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplarily" or "for example" is intended to present related concepts in a specific way.

[0076] With the continuous development of electronic technology, electronic devices such as mobile phones and tablet computers are gradually developing towards being lighter and thinner. An electronic device with a flash is usually provided with a lampshade on its rear shell, and an optical film layer is provided on the side of the lampshade away from the rear shell. The optical film layer and the lampshade correspond to the position of the flash, so that the light emitted by the flash can be emitted from the inside of the electronic device through the optical film layer and the lampshade. In the electronic device in the related art, the lampshade and the optical film layer inside it occupy a large space, which is not conducive to the thinning of the electronic device. In order to solve the above technical problems, an electronic device is proposed in an embodiment of the present application.

[0077] The electronic device provided by the embodiments of the present application may be a terminal product with a flashlight, such as a mobile phone, a tablet computer, a wearable device, a vehicle-mounted device, an augmented reality (AR) / virtual reality (VR) device, a notebook computer, an ultra-mobile personal computer (UMPC), a netbook, a personal digital assistant (PDA), etc. The embodiments of the present application do not limit the specific type of the electronic device.

[0078] For the convenience of description, in the following embodiments, the electronic device is taken as an example of a mobile phone to describe the structure of the electronic device.

[0079] As Figure 1 and Figure 2 shown, Figure 1 is a schematic structural diagram of the electronic device according to the embodiment of the present application, Figure 2 is an exploded structural diagram of the electronic device according to the embodiment of the present application, Figure 2 In, the X direction is the width direction of the electronic device, the Y direction is the length direction of the electronic device, and the Z direction is the thickness direction of the electronic device. It can be understood that the coordinate system of the electronic device can be flexibly set according to actual needs. The present application only gives an example and should not be considered as a special limitation to the present application.

[0080] As shown in Figure 2, the electronic device may include a display screen 900, a middle frame 800, a circuit board 400, a battery 770, a flashlight 500, and a rear camera module (not shown in the figure). The display screen 900, the middle frame 800, and the rear shell 100 enclose a receiving space, and the circuit board 400, the battery 770, the flashlight 500, and the rear camera module are all disposed in the receiving space.

[0081] The display screen 900 can be a flexible display screen or a rigid display screen. For example, the display screen 900 can be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode display screen, a micro organic light-emitting diode display screen, a micro organic light-emitting diode display screen, a quantum dot light emitting diodes (QLED) display screen, or a liquid crystal display (LCD), etc.

[0082] The circuit board 400 can be fixed to the middle frame 800 by means of threaded connection, gluing, snap connection, welding, or the like.

[0083] The battery 770 and the circuit board 400 are arranged along the Y direction. The battery 770 is used to supply power to the circuit board 400 and other electronic components. The battery 770 can include, but is not limited to, nickel-cadmium batteries, nickel-metal hydride batteries, lithium batteries, or other types of batteries containing bare battery cells. Moreover, in the electronic device provided in the embodiments of the present application, the number of the batteries 770 can be one or multiple. The specific number and arrangement of the batteries 770 can be set according to actual needs, and the embodiments of the present application do not limit this.

[0084] The materials of the middle frame 800 and the rear cover 100 include, but are not limited to, metal, ceramic, plastic, and glass. The materials of the middle frame 800 and the rear cover can be the same or different. The embodiments of the present application do not limit this.

[0085] An installation opening (not shown in the figure) is provided on the rear cover 100. The installation opening can be a circular opening, a square opening, or a special-shaped opening. The camera decoration piece 120 is installed in the installation opening. The material of the camera decoration piece 120 includes, but is not limited to, plastic and metal. The shape of the camera decoration piece 120 is adapted to the shape of the installation opening.

[0086] The rear camera module is correspondingly arranged with the camera decorative part 120, and the rear camera module is used for taking photos / videos. The rear camera module may be integrated with functions such as automatic focusing (AF) and / or optical image stabilization (OIS).

[0087] The flash 500 is used to supplement light for the photo or video shooting of the rear camera module in a dim environment, and is usually arranged beside the rear camera module.

[0088] It should be noted that in the embodiments of the present application, the "inner side" used to describe the rear shell 100 and other components refers to the side of the described component close to the internal accommodation space of the electronic device. Correspondingly, the "inner surface" refers to the surface of the described component close to the internal accommodation space of the electronic device; on the contrary, the "outer side" refers to the side of the described component far from the internal accommodation space of the electronic device, and the "outer surface" is the surface of the described component far from the internal accommodation space of the electronic device.

[0089] The embodiments of the present application propose an electronic device, such as Figures 3 to 6 shown, Figure 3 is Figure 1 a partial enlarged schematic view of the P position of Figure 4 is Figure 3 a schematic structural view from another perspective, Figure 5 is a first - perspective exploded structural schematic view of the P position of the first embodiment of the present application, Figure 6 is a second - perspective exploded structural schematic view of the P position of the first embodiment of the present application; the electronic device includes a rear shell 100, a lamp cover 200, and an optical film layer 300. Specifically, as Figure 7 and Figure 8 shown, Figure 7 is the Figure 4 A - A cross - sectional view of Figure 8 is Figure 7 a partial enlarged schematic view of the Q position of , the lamp cover 200 is arranged on the inner side of the rear shell 100, fixedly connected to the rear shell 100, and partially exposed outside the rear shell 100; the side of the lamp cover 200 away from the rear shell 100 is recessed towards the rear shell 100 to form an accommodation space 201; the optical film layer 300 is arranged on the side of the lamp cover 200 away from the rear shell 100 and is located in the accommodation space 201; the thickness of the optical film layer 300 is less than the depth of the accommodation space 201.

[0090] The electronic device according to an embodiment of the present application includes a rear case 100, a lamp shade 200, and an optical film layer 300; the lamp shade 200 is disposed inside the rear case 100, fixedly connected to the rear case 100, and partially exposed outside the rear case 100; the lamp shade 200 is recessed facing the rear case 100 away from the rear case 100 to form a receiving space 201; the optical film layer 300 is disposed on a side of the lamp shade 200 away from the rear case 100 and is located in the receiving space 201; the thickness of the optical film layer 300 is less than the depth of the receiving space 201, so that in the thickness direction (Z direction) of the electronic device, the surface of the optical film layer 300 away from the rear case 100 is lower than the surface where the farthest point of the lamp shade 200 away from the rear case 100 is located. In this way, in the thickness direction of the electronic device, the optical film layer 300 does not additionally occupy space, and the maximum space occupied by the optical film layer 300 and the lamp shade 200 in the Z direction is only the space occupied by the thickness of the lamp shade 200, thereby reducing the space occupied by the lamp shade 200 and the optical film layer 300 in the thickness direction of the electronic device, which is beneficial to the thinning of the electronic device.

[0091] In addition, the saved space can be used for high device layout or other higher material arrangements, so that the Z-direction space is compact and more electronic devices can be arranged.

[0092] In the first embodiment of the present application, as Figures 6 to 8 shown, the optical film layer 300 may include a light homogenizing layer 310 and an infrared cut-off layer 320 which are stacked and fixedly connected through a second adhesive layer 720. The second adhesive layer 720 is divided into two parts and is respectively disposed at the edges of the opposite sides of the infrared cut-off layer 320 and the light homogenizing layer 310, which not only plays a fixing role but also avoids the influence on the function of the optical film layer 300 caused by setting the second adhesive layer 720 in the middle position.

[0093] In the first embodiment of the present application, as Figures 6 to 8 shown, the rear case 100 is provided with a first through hole 110; the lamp shade 200 includes a main body portion 210 and a fixing portion 220; the main body portion 210 is disposed in the first through hole 110 and is exposed outside the rear case 100; the fixing portion 220 is fixedly connected to the edge of the main body portion 210, is disposed inside the rear case 100, and is fixedly connected to the rear case 100. So that light can be emitted through the main body portion 210, and the fixing portion 220 is fixedly connected to the edge of the main body portion 210. Through the fixing portion 220, the lamp shade 200 is fixedly connected to the rear case 100, avoiding the situation that the space of the main body portion 210 is occupied to fix the lamp shade 200, resulting in the influence on light emission.

[0094] Optionally, as Figure 9 and Figure 10 shown, Figure 9 is a schematic structural diagram of the first perspective of the lamp shade 200 of the first embodiment of the present application.Figure 10 This is a schematic structural diagram of the second perspective of the lamp cover 200 according to the first embodiment of the present application. The shape of the main body portion 210 is a combined shape of a rectangle in the middle and semi - circles at both ends; the fixing portion 220 can be arranged around the main body portion 210. In this way, the lamp cover 200 can be fixed in the circumferential direction through the fixing portion 220, and the connection is more reliable. The edge of the fixing portion 220 can extend in a direction away from the main body portion 210 to form an anti - misalignment structure 222, which is convenient for installation.

[0095] In the first embodiment of the present application, as Figure 9 and Figure 10 shown, the accommodation space 201 includes a first groove 211 and a second through - hole 221 which are connected in communication; the first groove 211 is located in the main body portion 210; the second through - hole 221 is located in the fixing portion 220; as Figure 11 shown, Figure 11 is Figure 8 the front view of, the optical film layer 300 is arranged in the first groove 211 and the second through - hole 221, and is fixedly connected to the rear case 100 through the second through - hole 221. That is, in the first embodiment of the present application, the depth of the accommodation space 201 refers to the depth of the first groove 211, so that the surface of the optical film layer 300 away from the rear case 100 is lower than the notch of the first groove 211. A part of the structure of the fixing portion 220 of the lamp cover 200 is hollowed out to form the second through - hole 221, so that the optical film layer 300 can be directly connected to the rear case 100, thereby minimizing the thickness of the corresponding part of the lamp cover 200 and the optical film layer 300, providing space for other devices, and further facilitating the miniaturization of the electronic device.

[0096] Optionally, as Figure 11 shown, the lamp cover 200 can be attached to the inner side of the rear case 100 through the first adhesive layer 710. At the same time, the position of the light - homogenizing layer 310 corresponding to the second through - hole 221 can also be fixed to the inner side of the rear case 100 through the first adhesive layer 710.

[0097] In the first embodiment of the present application, as Figure 11 and Figure 12 shown, Figure 12Connection diagram of the lamp cover 200, optical film layer 300, buffer 760, flash 500 and color temperature lamp 600 according to the first embodiment of the present application. The optical film layer 300 includes a light homogenizing layer 310 and an infrared cut-off layer 320 which are stacked. The light homogenizing layer 310 can also be called a light homogenizing film, and the infrared cut-off layer 320 can also be called an infrared cut-off film. The light homogenizing layer 310 is disposed on one side of the infrared cut-off layer 320 close to the lamp cover 200. The orthographic projection of the light homogenizing layer 310 on the lamp cover 200 covers the orthographic projection of the infrared cut-off layer 320 on the lamp cover 200. The light homogenizing layer 310 can homogenize light, disperse and gather the light from the flash 500, making the light more uniform, which is beneficial to improving the clarity and brightness of the captured image. The infrared cut-off layer 320 can filter out infrared light to prevent infrared light from interfering with the imaging of the rear camera module. The superposition of the light homogenizing layer 310 and the infrared cut-off layer 320 is beneficial to improving the imaging effect of the electronic device. And because the orthographic projection of the light homogenizing layer 310 on the lamp cover 200 covers the orthographic projection of the infrared cut-off layer 320 on the lamp cover 200, and the light homogenizing layer 310 is disposed on one side of the infrared cut-off layer 320 close to the lamp cover 200, it is beneficial to ensure the flatness of the light homogenizing layer 310, and can prevent the infrared cut-off layer 320 from being disposed between the light homogenizing layer 310 and the lamp cover 200, resulting in deformation of the light homogenizing layer 310 at the edge of the infrared cut-off layer 320, and further resulting in the situation that the light homogenizing layer 310 is uneven.

[0098] As Figure 12 shown, the outer contour of the light homogenizing layer 310 can be adapted to the shape of the accommodation space 201 to improve the position accuracy of the optical film layer 300.

[0099] In the first embodiment of the present application, as Figure 11 and Figure 12 shown, the electronic device further includes a circuit board 400, a flash 500 and a color temperature lamp 600. The circuit board 400 is disposed on one side of the lamp cover 200 away from the rear case 100. The flash 500 and the color temperature lamp 600 are disposed on the circuit board 400 and are located between the optical film layer 300 and the circuit board 400. The orthographic projection of the optical film layer 300 on the circuit board 400 covers the orthographic projection of the flash 500 on the circuit board 400 and is spaced from the orthographic projection of the color temperature lamp 600 on the circuit board 400. The color temperature lamp 600 and the flash 500 are used in cooperation, which can make the imaging of the electronic device clearer. Optionally, the flash 500 can be a high-brightness LED (light-emitting diode) white lamp, and the color temperature lamp 600 can be an amber LED warm-color lamp. The two provide light with different color temperatures, so as to balance the light, reduce the situation of color distortion, make the imaging color saturated, and be closer to the actual color of the object being photographed.

[0100] As Figure 11 and Figure 12As shown, the electronic device further includes a shielding cover 750 and a buffer member 760; the shielding cover 750 is disposed on the circuit board 400, around the flash lamp 500 and the color temperature lamp 600, and between the rear housing 100 and the circuit board 400; the buffer member 760 is disposed at the edge of the lamp housing 200; one end of the buffer member 760 is fixedly connected to the lamp housing 200, and the other end abuts against the shielding cover 750. The buffer member 760 has a buffering effect, which can improve the installation stability of the shielding cover 750 and the lamp housing 200 while avoiding damage caused by rigid contact between the two. Other electronic components can be disposed inside the shielding cover 750 to avoid mutual influence between the electronic components and improve the working stability of the electronic device.

[0101] As Figure 11 and Figure 12 shown, the buffer member 760 can be fixedly connected to the lamp housing 200 through the third adhesive layer 730. Optionally, the number of the buffer members 760 can be three, evenly distributed along the edge of the fixing portion 220, so that the supporting force between the lamp housing 200 and the shielding cover 750 is more uniform.

[0102] The structure of the shielding cover 750 and the shapes of the adhesive layers can be referred back Figure 5 and Figure 6 , in the first embodiment of the present application, the number of the shielding covers 750 is three. In some other embodiments of the present application, the number of the shielding covers 750 can also be other, which can be set according to the actual situation, and the present application does not limit this.

[0103] As Figure 5 shown, the first adhesive layer 710 can be annular, adapted to the shape of the fixing portion 220, and disposed around the main body portion 210, so as to avoid the influence of the first adhesive layer 710 on the light passing of the main body portion 210.

[0104] In the first embodiment of the present application, the materials of the main body portion 210 and the fixing portion 220 can both be transparent plastics, and the two are integrally formed structures. The integrally formed processing method is convenient for processing and is beneficial to improving production efficiency. The transparent plastic material can enable light to pass through the lamp housing 200, and has a light texture, which is beneficial to the lightweight design of the electronic device.

[0105] As Figures 13 to 16 shown, Figure 13 is a schematic exploded view of the first perspective of the P position in the second embodiment of the present application, Figure 14 is a schematic exploded view of the second perspective of the P position in the second embodiment of the present application, Figure 15 is for the second embodiment of the present application Figure 4 A-A cross-sectional view of Figure 16 is for Figure 15Partial enlarged schematic view at R. The electronic device of the second embodiment of the present application is different from that of the first embodiment of the present application in that the structure of the lamp cover 200 and the setting method of the adhesive layer are different.

[0106] In the second embodiment of the present application, as Figures 17 to 19 shown, Figure 17 is the schematic structural view of the lamp cover 200 of the second embodiment of the present application from the first perspective, Figure 18 is the schematic structural view of the lamp cover 200 of the second embodiment of the present application from the second perspective, Figure 19 is Figure 16 the front view of

[0107] Figure 20 is the connection relationship diagram of the lamp cover 200, the optical film layer 300, the buffer 760, the flash lamp 500 and the color temperature lamp 600 of the second embodiment of the present application. The outer contour of the optical film layer 300 can be adapted to the shape of the accommodation space 201 to improve the position accuracy of the optical film layer 300.

[0108] Return to reference Figure 13 , the light homogenizing layer 310 can be fixedly connected to the lamp cover 200 through the fourth adhesive layer 740. The fourth adhesive layer 740 is U-shaped and is arranged along the fixing part 220 of the lamp cover 200 and the edge of the light homogenizing layer 310.

[0109] In the second embodiment of the present application, the fixing part 220 can be a metal sheet, and the material of the main body part 210 can be transparent plastic, and the two are injection molded. Compared with the integrally formed transparent plastic structure, the metal sheet occupies less space in the thickness direction of the electronic device, further reducing the space occupied by the lamp cover 200 in the thickness direction of the electronic device, which is beneficial to the miniaturization design of the electronic device.

[0110] As Figure 21 and Figure 22 shown, Figure 21Schematic exploded view of the first perspective at P of the third embodiment of the present application (circuit board, flash light, color temperature light, and shielding cover omitted). Figure 22 Schematic exploded view of the second perspective at P of the third embodiment of the present application (circuit board, flash light, color temperature light, and shielding cover omitted). The electronic device of the third embodiment of the present application is different from the electronic device of the first embodiment of the present application in terms of the structure of the lamp cover 200, the setting method of the adhesive layer, and the vertical position relationship between the light homogenizing layer 310 and the infrared cut-off layer 320.

[0111] In the third embodiment of the present application, as Figures 23 to 25 shown, Figure 23 Schematic structural view of the first perspective of the lamp cover 200 of the third embodiment of the present application. Figure 24 Schematic structural view of the second perspective of the lamp cover 200 of the third embodiment of the present application. Figure 25 Connection relationship diagram of the lamp cover 200, the optical film layer 300, and the buffer member 760 of the third embodiment of the present application. The accommodation space 201 is a groove structure; part of the groove structure is located in the main body part 210, and the remaining part is located in the fixing part 220; the shapes of the groove structure and the optical film layer 300 are adapted to each other. The groove structure is convenient for processing, and the shapes of the groove structure and the optical film layer 300 are adapted to each other, which is convenient for installation and helps to improve the position accuracy of the optical film layer 300.

[0112] In the third embodiment of the present application, as Figures 24 to 26 shown, Figure 26 of the third embodiment of the present application Figure 4 A-A cross-sectional view omitted (circuit board, flash light, color temperature light, and shielding cover). The groove structure includes a second groove 2011 and a third groove 2012; the third groove 2012 is located within the range of the second groove 2011; the third groove 2012 is recessed from the bottom of the second groove 2011 towards the housing 100. The third groove 2012 continues to be grooved on the basis of the second groove 2011, providing more installation space for the optical film layer 300 and reducing the space occupied by the optical film layer 300.

[0113] In the third embodiment of the present application, as Figure 25 and Figure 26As shown, the optical film layer 300 includes a light homogenizing layer 310 and an infrared cut-off layer 320 which are stacked; the infrared cut-off layer 320 is disposed in the third groove 2012; the light homogenizing layer 310 is disposed on a side of the infrared cut-off layer 320 away from the rear housing 100 and is located in the second groove 2011; the orthographic projection of the light homogenizing layer 310 on the lamp cover 200 covers the orthographic projection of the infrared cut-off layer 320 on the lamp cover 200. The depth of the accommodation space 201 refers to the total depth of the second groove 2011 and the third groove 2012, such that the surface of the optical film layer 300 away from the rear housing 100 is lower than the notch of the second groove 2011. Thus, it is beneficial to ensure the flatness of the light homogenizing layer 310, and since the third groove 2012 is provided, the infrared cut-off layer 320 can be embedded into the lamp cover 200, which is beneficial to further reducing the occupied space of the optical film layer 300 and the lamp cover 200 in the thickness direction of the electronic device.

[0114] It can be understood that, in order to better ensure the flatness of the light homogenizing layer 310, the depth of the third groove 2012 should be consistent with the thickness of the infrared cut-off layer 320, so that the surface of the infrared cut-off layer 320 away from the rear housing 100 can be on the same plane as the bottom of the second groove 2011, which is beneficial to the arrangement of the light homogenizing layer 310.

[0115] It should be noted that in the examples and description of this patent, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprises", "comprising" or any other variation thereof is intended to cover a non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising one" does not exclude the existence of another identical element in the process, method, article or device comprising the element.

[0116] Although the present application has been illustrated and described by referring to some preferred embodiments of the present application, those of ordinary skill in the art should understand that various changes can be made in form and detail without departing from the spirit and scope of the present application.

Claims

1. An electronic device, characterized in that: include: Back shell; A lampshade is arranged on the inner side of the rear shell, fixedly connected to the rear shell, and partially exposed to the outside of the rear shell; the surface of the lampshade away from the rear shell is recessed toward the rear shell to form a receiving space; The optical film layer is arranged on a side of the lampshade away from the rear shell and is located in the accommodation space; the thickness of the optical film layer is less than the depth of the accommodation space.

2. The electronic device according to claim 1, characterized in that: The rear shell is provided with a first through hole; The lampshade includes: a main body and a fixing part; the main body is arranged in the first through hole and exposed to the outside of the rear shell; the fixing part is fixedly connected to the edge of the main body, arranged on the inner side of the rear shell, and fixedly connected to the rear shell.

3. The electronic device according to claim 2, characterized in that: The accommodation space comprises: a first groove and a second through hole which are connected to each other; the first groove is located in the main body; and the second through hole is located in the fixing part; The optical film layer is disposed in the first groove and the second through hole, and is fixedly connected to the rear shell through the second through hole.

4. The electronic device according to claim 2, characterized in that: The main body comprises: a first sub-part and a second sub-part; in the thickness direction of the lampshade, the second sub-part protrudes from the first sub-part, and the two form a step structure; The surface of the first sub-portion away from the rear shell is flush with the surface of the fixing portion away from the rear shell, and the two together form the accommodation space; The optical film layer is disposed on the fixing portion and the first sub-portion.

5. The electronic device according to claim 3 or 4, characterized in that: The optical film layer comprises: a light homogenizing layer and an infrared cutoff layer which are stacked; The light homogenizing layer is arranged on a side of the infrared cutoff layer close to the lampshade; The orthographic projection of the light-homogenizing layer on the lampshade covers the orthographic projection of the infrared cutoff layer on the lampshade.

6. The electronic device according to claim 2, characterized in that: The accommodating space is a groove structure; a portion of the groove structure is located in the main body, and the remaining portion is located in the fixing portion; The groove structure is adapted to the shape of the optical film layer.

7. The electronic device according to claim 6, characterized in that: The groove structure comprises: a second groove and a third groove; The third groove is located within the range of the second groove; the third groove is formed by the groove bottom of the second groove being recessed toward the rear shell.

8. The electronic device according to claim 7, characterized in that: The optical film layer comprises: a light homogenizing layer and an infrared cutoff layer which are stacked; The infrared cutoff layer is arranged in the third groove; The light homogenizing layer is arranged on a side of the infrared cut-off layer away from the rear shell and is located in the second groove; The orthographic projection of the light-homogenizing layer on the lampshade covers the orthographic projection of the infrared cutoff layer on the lampshade.

9. The electronic device according to claim 2, characterized in that: The main body and the fixing part are both made of transparent plastic, and the two are an integrally formed structure; Alternatively, the fixing portion is a metal sheet, and the main body portion is made of transparent plastic, and the two are injection molded.

10. The electronic device according to claim 1, characterized in that: The electronic device also includes: a circuit board, a flash lamp and a color temperature lamp; The circuit board is arranged on a side of the lampshade away from the rear housing; The flash lamp and the color temperature lamp are arranged on the circuit board, and are located between the optical film layer and the circuit board; The orthographic projection of the optical film layer on the circuit board covers the orthographic projection of the flash lamp on the circuit board, and is spaced apart from the orthographic projection of the color temperature lamp on the circuit board.

11. The electronic device according to claim 10, characterized in that: The electronic device further comprises: a shielding cover and a buffer; The shielding cover is arranged on the circuit board, is located around the flash lamp and the color temperature lamp, and is located between the rear housing and the circuit board; The buffer is arranged at the edge of the lampshade; one end of the buffer is fixedly connected to the lampshade, and the other end is abutted against the shielding cover.

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