Multilayer printed circuit board
By setting up "mountain" font-shaped limiting plates at both ends of the multi-layer printed circuit board and setting up heat dissipation plates and thermal conductivity fins on both sides, the problem of circuit boards being misaligned during bonding and bent when affected by external forces is solved, and higher position accuracy and service life are achieved.
Patent Information
- Application Number
- CN202421514385.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-28
- Publication Date
- 2025-06-13
- Estimated Expiration
- 2034-06-28
AI Technical Summary
The existing multi-layer printed circuit board cannot effectively control the placement of the two boards during bonding, which is prone to misalignment, and is prone to bending when affected by external forces, affecting service life.
A multi-layer printed circuit board is designed. By setting "mountain" font-shaped limit boards at both ends of the two circuit boards and setting positioning columns on the inside of the limit board, the positioning columns are ensured to be accurate in the position of the two circuit boards; at the same time, heat dissipation plates and thermal conduction fins are installed on both sides of the two circuit boards to enhance the strength and heat dissipation effect of the circuit board.
It effectively prevents the circuit board from being misaligned during the bonding process and provides protection when affected by external forces, extends the service life of the circuit board, and improves the overall strength and heat dissipation performance of the circuit board.
Smart Images
Figure CN222981747U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of circuit boards, and particularly relates to a multi-layer printed circuit board. Background Art
[0002] As a carrier for electronic components, printed circuit boards have been widely used in the field of electronic devices to achieve connections between electronic components. The names of circuit boards include ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, etc. Circuit boards miniaturize and visualize circuits, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layouts. Circuit boards are classified into single-sided boards, double-sided boards, and multi-layer printed circuit boards according to the number of layers.
[0003] When bonding multiple existing multi-layer printed circuit boards to multiple double-sided or single-sided boards, the placement positions of the two boards cannot be well controlled, resulting in misalignment between the two boards, which in turn affects the quality of the multi-layer printed circuit board. In addition, once the multi-layer circuit board is affected by external forces, the circuit board is prone to bending, which in turn affects the service life of the circuit board. Summary of the Utility Model
[0004] The technical problem to be solved by the utility model is that when bonding existing multi-layer printed circuit boards, the placement positions of the two boards cannot be well controlled, resulting in misalignment, and the circuit board is prone to bending when affected by external forces.
[0005] To solve the above technical problems, the technical solution provided by the utility model is: a multi-layer printed circuit board, including the same first circuit board body and second circuit board body. The first circuit board body is located above the second circuit board body. A plurality of positioning holes are provided at both ends of the first circuit board body and the second circuit board body. Horizontally arranged "mountain"-shaped limiting plates are inserted on both sides of the first circuit board body and the second circuit board body. Positioning columns matching the shapes of the plurality of positioning holes are provided on the inner side of the limiting plates. A plurality of heat-conducting fins are arranged in the middle of the first circuit board body and the second circuit board body. Heat dissipation plates are connected to both ends of the plurality of heat-conducting fins on both sides of the limiting plates.
[0006] As an improvement, the length of the limiting plate is the same as that of the first circuit board body and the second circuit board body, and a plurality of mounting feet are provided on the outer side of the limiting plate.
[0007] As an improvement, rubber pads are provided on the upper and lower sides of the inner side of the limiting plate for the first circuit board body and the second circuit board body.
[0008] As an improvement, the multiple thermal conductive fins are arranged perpendicular to the direction of the line connecting the limit plates on both sides, and the multiple thermal conductive fins are arranged equidistantly, the length of the multiple thermal conductive fins is the same as the width of the first circuit board body and the second circuit board body, and the height of the multiple thermal conductive fins is less than the distance between the first circuit board body and the second circuit board body.
[0009] As an improvement, the heat sink and the multiple heat-conducting fins are an integrated structure, the two ends of the heat sink match the shape of the limit plate, and the middle height of the heat sink is greater than the thickness of the first circuit board body and the second circuit board body after being fixed, and the two ends of the heat sink are fixedly connected to the upper and lower ends of the side of the limit plate by multiple screws.
[0010] The advantages of the utility model compared with the prior art are:
[0011] 1. The multilayer printed circuit board sets a mountain-shaped limit block at both ends of the two circuit boards to limit the distance between the two circuit boards, and determines the positions of the two circuit boards through the positioning columns inside the limit block to prevent misalignment;
[0012] 2. This multilayer printed circuit board provides heat dissipation plates on both sides of the two circuit boards to protect the circuit boards from the side while increasing the overall strength of the circuit boards. It can also provide multiple heat-conducting fins in the middle to dissipate the temperature at the internal sealing portion without affecting the normal use of the circuit boards. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 The utility model is a structural diagram of a multi-layer printed circuit board.
[0014] Figure 2 The utility model is a cross-sectional three-dimensional structural diagram of a multi-layer printed circuit board.
[0015] Figure 3 The utility model is an exploded structural diagram of a multi-layer printed circuit board.
[0016] As shown in the figure: 1. First circuit board body; 2. Second circuit board body; 3. Multiple positioning holes; 4. Limiting plate; 5. Positioning column; 6. Multiple thermal fins; 7. Heat sink; 8. Multiple mounting feet; 9. Rubber pad; 10. Multiple screws DETAILED DESCRIPTION
[0017] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.
[0018] In the description of the utility model, it should be noted that unless otherwise clearly defined and limited, terms such as "installation", "provided with", "connection", etc. shall be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.
[0019] Embodiment 1:
[0020] As shown in the Figures 1-3 specification drawings, a multi-layer printed circuit board includes the same first circuit board body 1 and second circuit board body 2. The first circuit board body 1 is located above the second circuit board body 2. A plurality of positioning holes 3 are provided at both ends of the first circuit board body 1 and the second circuit board body 2. A horizontally placed "mountain"-shaped limiting plate 4 is inserted on both sides of the first circuit board body 1 and the second circuit board body 2. Rubber pads 9 are provided on both the upper and lower sides of the inner side of the limiting plate 4 where the first circuit board body 1 and the second circuit board body 2 are located. Positioning posts 5 matching the shapes of the plurality of positioning holes 3 are provided on the inner side of the limiting plate 4. The limiting plate 4 has the same length as the first circuit board body 1 and the second circuit board body 2. A plurality of mounting feet 8 are provided on the outer side of the limiting plate 4. The printed circuit board is installed and fixed through the plurality of mounting feet 8.
[0021] In the present utility model, a plurality of heat dissipation fins 6 are provided in the middle of the first circuit board body 1 and the second circuit board body 2. The plurality of heat dissipation fins 6 are arranged perpendicular to the direction connecting the two side limiting plates 4, and are equidistantly arranged between the plurality of heat dissipation fins 6. The length of the plurality of heat dissipation fins 6 is the same as the width of the first circuit board body 1 and the second circuit board body 2. The height of the plurality of heat dissipation fins 6 is less than the distance between the first circuit board body 1 and the second circuit board body 2. Both ends of the plurality of heat dissipation fins 6 are connected with heat dissipation plates 7 on both sides of the limiting plate 4. The heat dissipation plates 7 and the plurality of heat dissipation fins 6 are of an integral structure. The shapes of both ends of the heat dissipation plates 7 match the shapes at the limiting plate 4, and the middle height of the heat dissipation plates 7 is greater than the thickness after the first circuit board body 1 and the second circuit board body 2 are fixed. Both ends of the heat dissipation plates 7 are fixedly connected to the upper and lower ends of the side surface of the limiting plate 4 through a plurality of screws 10.
[0022] When the present utility model is specifically implemented, during use, the first circuit board body 1 and the second circuit board body 2 are placed on both sides of a plurality of heat dissipation fins 6. Then, the limiting plates 4 are inserted and fixed to both sides of the first limiting plate 4 and the second limiting plate 4 from both sides. After that, the heat dissipation plate 7 is fixed to the limiting plate 4 through a plurality of screws 10 to complete the installation. During use, the limiting plates 4 and the heat dissipation plate 7 are used to prevent external force influence and protect the first circuit board body 1 and the second circuit board body 2.
[0023] The above describes the present utility model and its implementation manners. Such description is not restrictive. What is shown in the specific implementation manners is only one of the implementation manners of the present utility model, and the actual structure is not limited thereto. Generally speaking, if those of ordinary skill in the art are inspired by it and, without departing from the gist of the creation of the present utility model, design similar structural manners and embodiments to this technical solution without creative efforts, they shall fall within the protection scope of the present utility model.
Claims
1. A multilayer printed circuit board, comprising a first circuit board body and a second circuit board body that are identical, wherein the first circuit board body is located above the second circuit board body, characterized in that: Both ends of the first circuit board body and the second circuit board body are provided with a plurality of positioning holes, and both sides of the first circuit board body and the second circuit board body are plugged with horizontal "mountain" shaped limiting plates, and the inner side of the limiting plates is provided with positioning columns matching the shapes of the plurality of positioning holes; A plurality of heat-conducting fins are disposed between the first circuit board body and the second circuit board body, and two ends of the plurality of heat-conducting fins are located on both sides of the limiting plate and are connected to a heat dissipation plate.
2. A multilayer printed circuit board according to claim 1, characterized in that: The limiting plate has the same length as the first circuit board body and the second circuit board body, and a plurality of mounting feet are arranged on the outer side of the limiting plate.
3. A multilayer printed circuit board according to claim 1, characterized in that: The inner side of the limiting plate is provided with rubber pads on both upper and lower sides of the first circuit board body and the second circuit board body.
4. A multilayer printed circuit board according to claim 1, characterized in that: The multiple heat-conducting fins are arranged perpendicularly to the direction of the connection line of the limiting plates on both sides, and the multiple heat-conducting fins are arranged equidistantly. The length of the multiple heat-conducting fins is the same as the width of the first circuit board body and the second circuit board body, and the height of the multiple heat-conducting fins is less than the distance between the first circuit board body and the second circuit board body.
5. A multilayer printed circuit board according to claim 1, characterized in that: The heat sink and the multiple heat-conducting fins are an integrated structure. The two ends of the heat sink match the shape of the limiting plate, and the middle height of the heat sink is greater than the thickness of the first circuit board body and the second circuit board body after being fixed. The two ends of the heat sink are fixedly connected to the upper and lower ends of the side of the limiting plate by multiple screws.