Probe structure for circuit board through hole test

Abstract

The utility model discloses a probe structure for a circuit board through hole test, which belongs to the technical field of circuit test elements and comprises a sunken guide part, an abutting conduction part, a stepped limit part and a connecting rod body part. The sunken guide part is connected to the bottom of the abutting conduction part, and the stepped limiting part is connected to the top of the abutting conduction part; and the connecting rod body part is connected to the top of the stepped limiting part relative to the sunken guide part. The probe structure for the circuit board through hole test solves the technical problem of how to improve the positioning convenience and the measurement accuracy of the test probe.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit test components, in particular to a probe structure for testing through holes of a circuit board. Background Art

[0002] A circuit board, also known as a Printed Circuit Board (PCB), is a support for connecting electronic components and circuits together, and is used to realize functions such as layout design of complex circuits and electrical signal transmission in electrical and electronic devices. It usually uses fiberglass as the base material and is processed through processes such as copper cladding, gold plating, and etching. The main functions of the circuit board include supporting and connecting components, transmitting signals, protecting components, and improving integration, etc.

[0003] With the gradual improvement of the performance of large-scale circuit devices such as servers, the design scheme of the circuit board as an internal component thereof has become increasingly complex; thus, the manufacturing process and quality requirements of the circuit board also face severe challenges. Circuit board testing is an important link to ensure the quality, reliability, and performance of the circuit board. Therefore, during the design, production, processing, and assembly of the circuit board, strict monitoring of its process and raw materials is required, and furthermore, pre-reliability testing needs to be carried out to avoid failure accidents such as leakage, open circuit, poor soldering, and board explosion and delamination.

[0004] Based on this, Chinese Patent CN104111386A discloses a PCB board testing device, which includes: an operation panel, a lower test positioning component, and an upper test component. The lower test positioning component includes: a lower thimble fixing plate installed on the operation panel; lower test thimbles fixed on the lower thimble fixing plate; a plurality of direction positioning pins, longer than the lower test thimbles, installed on the surfaces of the lower thimble fixing plate and the operation panel facing away from each other. The top corners of the PCB board are provided with first positioning holes, and the direction positioning pins pass through the first positioning holes and jack up the PCB board; lower pressing positioning columns, shorter than the direction positioning pins, fixed on the lower thimble fixing plate, and used to abut against the lower surface of the PCB board; the upper test positioning component includes: an upper thimble fixing plate, arranged opposite to the lower thimble fixing plate at an interval; upper test thimbles fixed on the upper thimble fixing plate; upper pressing positioning columns fixed on the upper thimble fixing plate and used to abut against the upper surface of the PCB board. The above-mentioned PCB board testing device has the advantages of high testing efficiency and low testing cost.

[0005] However, the above-disclosed test thimble still has technical problems of inconvenient positioning and inaccurate detection. Specifically, the main purpose of the via hole test is to verify the via holes on the circuit board, also known as through holes, whether they meet the design requirements, can provide stable electrical connections, and check for short circuits, open circuits, or other defects. The via hole test is an essential part of the circuit board test. By testing the via holes, the electrical connection performance and reliability of the circuit board can be ensured, and the quality and performance of the circuit board can be improved. At the same time, the via hole test also helps to discover potential defects and problems, providing valuable reference information for the improvement and optimization of the circuit board. The thimbles or probes for testing via holes disclosed in the prior art are prone to resistance displacement and inaccurate positioning when contacting the conductive layer on the surface of the via hole due to positioning failure or lack of prior positioning; thus affecting the accuracy of the circuit board detection. Summary of the Invention

[0006] Based on this, it is necessary to provide a probe structure for circuit board via hole testing to address the technical problems of how to improve the positioning convenience and measurement accuracy of the test probe.

[0007] A probe structure for circuit board via hole testing includes: a sunken guiding part, a contact conduction part, a stepped limiting part, and a connecting rod body part; the sunken guiding part is connected to the bottom of the contact conduction part, and the stepped limiting part is connected to the top of the contact conduction part; the connecting rod body part is connected to the top of the stepped limiting part relative to the sunken guiding part.

[0008] Further, the contact conduction part has a conduction main body, a first through hole, and several cutting surfaces.

[0009] Furthermore, the first through hole is provided in the middle of the conduction main body; the sunken guiding part is connected to the first through hole.

[0010] Furthermore, several of the cutting surfaces are evenly distributed between the conduction main body and the sunken guiding part.

[0011] Furthermore, the stepped limiting part has a stepped main body structure and a second through hole.

[0012] Furthermore, the stepped main body structure is connected to the top of the conduction main body, the second through hole is provided in the middle of the stepped main body structure, and the second through hole is connected to the connecting rod body part.

[0013] Furthermore, the first through hole is in communication with the second through hole, and the sunken guiding part is connected to the connecting rod body part.

[0014] Further, a gradually-varying special-shaped spring is arranged on the connecting rod body part. The gradually-varying special-shaped spring is arranged at the other end of the connecting rod body part relative to the stepped limiting part, and one end of the gradually-varying special-shaped spring abuts against the end of the connecting rod body part.

[0015] Further, a connecting cable is arranged at one end of the gradually-varying special-shaped spring. The connecting cable has an insulating structure and a core structure.

[0016] Further, the core structure is arranged in the insulating structure. The core structure is arranged at the other end of the gradually-varying special-shaped spring relative to the connecting rod body part, and the core structure is soldered to the gradually-varying special-shaped spring.

[0017] In summary, a probe structure for through-hole testing of a circuit board according to the present utility model is respectively provided with a sunken guiding part, a contact conduction part, a stepped limiting part and a connecting rod body part; the sunken guiding part is connected to the bottom of the contact conduction part, and the stepped limiting part is connected to the top of the contact conduction part; the connecting rod body part is connected to the top of the stepped limiting part relative to the sunken guiding part. When the sunken guiding part provided in the probe structure for through-hole testing of a circuit board according to the present utility model is used in through-hole testing, an external through-hole can be used as a positioning point, and in a form of sinking or passing through the through-hole, the contact conduction part can be accurately guided to the surface of the test point, so that the positioning of the test is simple and accurate; thereafter, since the sunken guiding part is always located in the through-hole, the situation that the contact conduction part is displaced during the test and causes inaccurate measurement can be avoided; therefore, the probe structure for through-hole testing of a circuit board according to the present utility model solves the technical problem of how to improve the positioning convenience and measurement accuracy of the test probe. Description of the Drawings

[0018] Figure 1 is a schematic structural diagram of a probe structure for through-hole testing of a circuit board according to the present utility model;

[0019] Figure 2 is a schematic structural diagram of another direction of a partial structure of a probe structure for through-hole testing of a circuit board according to the present utility model;

[0020] Figure 3 is an exploded structural diagram of another embodiment of a probe structure for through-hole testing of a circuit board according to the present utility model;

[0021] Figure 4 is a schematic structural diagram of another embodiment of a probe structure for through-hole testing of a circuit board according to the present utility model;

[0022] Figure 5This is a schematic structural diagram of another embodiment of a probe structure for through-hole testing of a circuit board according to the present utility model. Detailed implementation manners

[0023] To make the above objects, features, and advantages of the present utility model more obvious and understandable, the following will describe the detailed implementation manners of the present utility model with reference to the accompanying drawings. Many specific details are set forth in the following description to fully understand the present utility model. However, the present utility model can be implemented in many other ways different from those described herein. Those skilled in the art can make similar improvements without departing from the connotation of the present utility model. Therefore, the present utility model is not limited by the specific embodiments disclosed below.

[0024] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of the present utility model.

[0025] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present utility model, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0026] In the present utility model, unless otherwise clearly defined and limited, the terms "mounted", "connected", "connected to", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. It can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0027] In the present utility model, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the horizontal height of the first feature is less than that of the second feature.

[0028] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are only for the purpose of illustration and do not represent the only implementation.

[0029] Please refer to Figures 1 to 3 , a probe structure for through-hole testing of a circuit board in the present utility model includes: a sunken guiding portion 1, an abutting conduction portion 2, a stepped limiting portion 3 and a connecting rod body portion 4; the sunken guiding portion 1 is connected to the bottom of the abutting conduction portion 2, and the stepped limiting portion 3 is connected to the top of the abutting conduction portion 2; the connecting rod body portion 4 is connected to the top of the stepped limiting portion 3 relative to the sunken guiding portion 1.

[0030] Specifically, when a probe structure for through-hole testing of a circuit board according to the present utility model is in the working process, one end of the connecting rod body portion 4 is connected to the thimble connecting plate of an external circuit board testing device. The stepped limiting portion 3 can serve as a limiting connecting portion of the external thimble connecting plate, so that each group of evenly distributed and exposed abutting conduction portions 2 and the sunken guiding portion 1 at the thimble connecting plate can all have the same contact testing plane. The other end of the connecting rod body portion 4 is connected to the stepped limiting portion 3; the abutting conduction portion 2 and the sunken guiding portion 1 are sequentially connected below the stepped limiting portion 3. Thereafter, the connecting rod body portion 4 can be driven by the thimble connecting plate provided in the external circuit board testing device. Thus, the sunken guiding portion 1 and the abutting conduction portion 2 are moved above the testing points of the circuit board to be tested. When the connecting rod body portion 4 is driven downward during the lawsuit, the sunken guiding portion 1 first enters the through-hole on the circuit board and sinks into the through-hole of the circuit board so that the abutting conduction portion 2 contacts the surface of the corresponding testing point on the circuit board; to achieve electrical conduction between the testing point and the external circuit board testing device. After the abutting conduction portion 2 contacts the external testing point for a preset time, the connecting rod body portion 4 lifts the sunken guiding portion 1 and the abutting conduction portion 2 and returns to the initial position. Thus, a single through-hole testing process of the circuit board can be completed. It can be seen that when the sunken guiding portion 1 provided in a probe structure for through-hole testing of a circuit board according to the present utility model is used during through-hole testing, by using the external through-hole as a positioning point and in the connection form of sinking or passing through the through-hole, the abutting conduction portion 2 can be accurately guided to the surface of the testing point, making the testing positioning simple and accurate; thereafter, since the sunken guiding portion 1 is always located in the through-hole, it is possible to avoid the situation that the abutting conduction portion 2 is displaced during the testing process, resulting in inaccurate measurement; thus, a probe structure for through-hole testing of a circuit board according to the present utility model solves the technical problems of how to improve the positioning convenience and measurement accuracy of the testing probe.

[0031] Further, the abutting conduction portion 2 has a conduction main body 201, a first through-hole 202, and a plurality of cutting surfaces 203; the first through-hole 202 is provided in the middle of the conduction main body 201; the sunken guiding portion 1 is connected to the first through-hole 202.

[0032] Further, a plurality of the cutting surfaces 203 are evenly distributed between the conduction main body 201 and the sunken guiding portion 1.

[0033] Specifically, the material of the conduction body 201 is preferably copper or copper alloy; the first through hole 202 is connected through the middle of the conduction body 201, and the sunken guiding part 1 is inserted into the first through hole 202. In addition, a plurality of cutting surfaces 203 are arranged on the bottom end side of the conduction body 201; the cutting surfaces 203 can be applied to some specific occasions. For example, when the sunken guiding part 1 is inserted into the through hole of an external circuit board, the cutting surfaces 203 can abut against the surface of the through hole and the wall surface of the edge of the through hole; so as to further enhance the stability of conductive connection.

[0034] Further, the stepped limiting part 3 has a stepped main body structure 301 and a second through hole 302; the stepped main body structure 301 is connected to the top of the conduction body 201, the second through hole 302 is arranged in the middle of the stepped main body structure 301, and the second through hole 302 is connected to the connecting rod body part 4.

[0035] Specifically, the material of the stepped main body structure 301 is preferably copper or copper alloy, and the second through hole 302 can be arranged through the middle of the stepped main body structure 301 to facilitate the insertion of the connecting rod body part 4.

[0036] Further, the first through hole 202 is communicated with the second through hole 302, and the sunken guiding part 1 is connected to the connecting rod body part 4. Specifically, in this embodiment, the sunken guiding part 1 and the connecting rod body part 4 can be an integrally formed structure, and the material thereof is preferably steel. Thus, it is convenient for the production of the product.

[0037] Furthermore, please continue to refer to Figure 4 With Figure 5 ; in another embodiment, a gradient-shaped special spring 5 is arranged on the connecting rod body part 4, the gradient-shaped special spring 5 is arranged at the other end of the connecting rod body part 4 relative to the stepped limiting part 3, and one end of the gradient-shaped special spring 5 abuts against the end of the connecting rod body part 4.

[0038] Further, a connecting cable 6 is arranged on the gradient-shaped special spring 5, and the connecting cable 6 has an insulating structure 601 and a core structure 602; the core structure 602 is arranged in the insulating structure 601, the core structure 602 is arranged at the other end of the gradient-shaped special spring 5 relative to the connecting rod body part 4, and the core structure 602 is soldered to the gradient-shaped special spring 5.

[0039] Specifically, the tapered special-shaped spring 5 is a spring structure with a tapered changing diameter. One end with a smaller diameter abuts against the connecting rod body portion 4, and the end with a larger diameter is connected to the wire core structure 602 by soldering. Moreover, the spring pitches of the smaller diameter end and the larger diameter end are also different. Thus, the electrical connection between the connecting rod body portion 4 and an external testing device can be achieved. And the structure of this electrical connection can be made flexible, facilitating the layout and application of this kind of probe structure.

[0040] In summary, the probe structure for through-hole testing of a circuit board according to the present invention is respectively provided with a sunken guiding portion 1, an abutting conduction portion 2, a stepped limiting portion 3, and a connecting rod body portion 4. The sunken guiding portion 1 is connected to the bottom of the abutting conduction portion 2, and the stepped limiting portion 3 is connected to the top of the abutting conduction portion 2. The connecting rod body portion 4 is connected to the top of the stepped limiting portion 3 relative to the sunken guiding portion 1. When the sunken guiding portion 1 provided in the probe structure for through-hole testing of a circuit board according to the present invention is used during through-hole testing, by using an external through-hole as a positioning point and in the form of sinking or passing through the through-hole, the abutting conduction portion 2 can be accurately guided to the surface of the test point, making the positioning of the test simple and accurate. Thereafter, since the sunken guiding portion 1 is always located within the through-hole to prevent the abutting conduction portion 2 from shifting during the test, resulting in inaccurate measurement. Therefore, the probe structure for through-hole testing of a circuit board according to the present invention solves the technical problems of how to improve the positioning convenience and measurement accuracy of the test probe.

[0041] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0042] The above-described embodiments merely represent several implementation manners of the present invention. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the utility model patent shall be subject to the appended claims.

Claims

1. A probe structure for circuit board through-hole testing, characterized in that: It includes: A sunken guide portion (1), an abutting conductive portion (2), a stepped limiting portion (3) and a connecting rod body portion (4); the sunken guide portion (1) is connected to the bottom of the abutting conductive portion (2), the stepped limiting portion (3) is connected to the top of the abutting conductive portion (2); and the connecting rod body portion (4) is connected to the top of the stepped limiting portion (3) relative to the sunken guide portion (1).

2. A probe structure for circuit board through-hole testing according to claim 1, characterized in that: The abutting conductive portion (2) comprises a conductive body (201), a first through hole (202) and a plurality of cutting surfaces (203).

3. A probe structure for circuit board through-hole testing according to claim 2, characterized in that: The first penetration hole (202) is arranged in the middle of the conductive body (201); and the sunken guiding portion (1) is connected to the first penetration hole (202).

4. A probe structure for circuit board through-hole testing according to claim 3, characterized in that: A plurality of cutting surfaces (203) are evenly distributed between the conducting body (201) and the sunken guiding portion (1).

5. A probe structure for circuit board through-hole testing according to claim 4, characterized in that: The stepped limiting portion (3) comprises a stepped main body structure (301) and a second penetration hole (302).

6. A probe structure for circuit board through-hole testing according to claim 5, characterized in that: The stepped main body structure (301) is connected to the top of the conductive body (201), the second penetration hole (302) is arranged in the middle of the stepped main body structure (301), and the second penetration hole (302) is connected to the connecting rod body (4).

7. A probe structure for circuit board through-hole testing according to claim 6, characterized in that: The first penetration hole (202) is communicated with the second penetration hole (302), and the sunken guide portion (1) is connected to the connecting rod body (4).

8. A probe structure for circuit board through-hole testing according to claim 7, characterized in that: The connecting rod body (4) is provided with a gradually changing special-shaped spring (5), and the gradually changing special-shaped spring (5) is arranged at the other end of the connecting rod body (4) relative to the stepped limiting portion (3), and one end of the gradually changing special-shaped spring (5) abuts against the end of the connecting rod body (4).

9. A probe structure for circuit board through-hole testing according to claim 8, characterized in that: A connecting cable (6) is provided at one end of the gradual special-shaped spring (5), and the connecting cable (6) has an insulating structure (601) and a wire core structure (602).

10. A probe structure for circuit board through-hole testing according to claim 9, characterized in that: The wire core structure (602) is arranged in the insulating structure (601), and the wire core structure (602) is arranged at the other end of the gradual special-shaped spring (5) relative to the connecting rod body (4), and the wire core structure (602) is connected to the gradual special-shaped spring (5) by soldering.

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