TFT (Thin Film Transistor) display module without dispensing IC (Integrated Circuit) protection glue

Abstract

The utility model discloses a TFT (Thin Film Transistor) display module without dispensing IC (Integrated Circuit) protective glue, which comprises a display screen, a driving IC is bound on the display screen, a binding position for binding the driving IC on the display screen is arranged on the display screen, the size of the binding position is larger than that of the driving IC, and the size of the binding position is larger than that of the driving IC. And the binding position covers the display screen circuit at the periphery of the driving IC. The display module has the effect that the size of the ACF film is enlarged to cover the driving IC and the circuits around the driving IC, so that the driving IC and the circuits around the driving IC are protected, and the product cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of display modules, in particular to a TFT display module that does not require dotting IC protective glue. Background Art

[0002] TFT display screens are widely used in modern society and can be seen everywhere. Through the display screen, information can be expressed more intuitively and vividly. In the industrial and consumer fields, in addition to products that commonly use TFT display screens, such as monitors, telephones, handheld scanners, cameras, etc., now many devices that did not use them before also start to use TFT display screens, such as remote controls, ovens, refrigerators, etc. A driving IC is usually bonded to the TFT display screen. After the driving IC is bonded, protective glue needs to be applied to the bonding position of the driving IC to protect the TFT circuit around the bonding position of the driving IC.

[0003] However, applying protective glue requires additional consumption of protective glue materials and increases the operation steps of applying protective glue, increasing the cost of the product. Summary of the Utility Model

[0004] The purpose of the utility model is to overcome the deficiencies in the prior art and provide a TFT display module that does not require dotting IC protective glue.

[0005] The purpose of the utility model is achieved through the following technical solutions:

[0006] A TFT display module that does not require dotting IC protective glue, comprising: a display screen, a driving IC is bonded to the display screen, a bonding position for bonding the driving IC to the display screen is provided on the display screen, the size of the bonding position is larger than the size of the driving IC, and the bonding position covers the display screen circuit around the driving IC.

[0007] In one embodiment, the display screen includes an upper polarizer, an upper layer of glass, a lower layer of glass, and a lower polarizer arranged in sequence, and the driving IC is bonded to one side of the lower layer of glass facing the upper layer of glass.

[0008] In one embodiment, the size of the lower layer of glass is larger than the size of the upper layer of glass, and the driving IC is located in the area where the lower layer of glass extends beyond the upper layer of glass.

[0009] In one embodiment, the bonding position is an ACF film, the ACF film is arranged on the lower layer of glass, and the driving IC is bonded to the ACF film.

[0010] In one embodiment, the ACF film is an anisotropic conductive film with several anisotropic conductive balls inside.

[0011] In one embodiment, a plurality of external pins are provided on the driving IC, a plurality of electrode pins are provided on the lower glass, the ACF film is respectively connected to the external pins of the driving IC and the electrode pins on the lower glass, and the external pins of the driving IC and the electrode pins on the lower glass are electrically connected through the ACF film.

[0012] In one embodiment, both the length and width of the ACF film are greater than the length and width of the driving IC, and the left and right side edges of the ACF film are respectively close to the left and right side edges of the lower glass.

[0013] In one embodiment, the left and right side edges of the ACF film are respectively 1-2 mm away from the left and right side edges of the lower glass.

[0014] In one embodiment, the upper side edge of the ACF film is 1-2 mm away from the lower side edge of the upper glass.

[0015] In one embodiment, an FPC is also bonded on the lower glass, the FPC is bonded below the driving IC, and the lower side edge of the ACF film is 2-3 mm away from the bonding position of the FPC.

[0016] Compared with the prior art, the present utility model has at least the following advantages:

[0017] A TFT display module without applying IC protective glue according to the present utility model makes the ACF film cover the bonding position of the driving IC and the surrounding display screen circuits by increasing the size of the ACF film. Thus, after the driving IC is bonded to the ACF film, the ACF film can protect the driving IC and the surrounding display screen circuits, saving the operation steps of applying protective glue and the protective glue material, and optimizing the product cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required to be used in the embodiments will be briefly introduced below.

[0019] Figure 1 It is a schematic structural diagram of a TFT display module without applying IC protective glue provided by the present utility model;

[0020] Figure 2 It is a partial structural schematic diagram of a TFT display module without applying IC protective glue provided by the present utility model;

[0021] Figure 3 It is a schematic side view of a TFT display module without applying IC protective glue provided by the present utility model.

[0022] Description of the drawings: 10, display screen; 11, upper polarizer; 12, upper layer glass; 13, lower layer glass; 14, lower polarizer; 20, driving IC; 30, ACF film; 40, FPC. Detailed implementation

[0023] To facilitate the understanding of the present utility model, the present utility model will be described more comprehensively below with reference to the relevant drawings.

[0024] A TFT display module that does not require dotting IC protective glue, referring to Figure 1 , includes a display screen 10, and the display screen 10 includes an upper polarizer 11, an upper layer glass 12, a lower layer glass 13, and a lower polarizer 14 arranged in sequence. The size of the lower layer glass 13 is larger than that of the upper layer glass 12.

[0025] Referring to Figure 2 and Figure 3 , a driving IC 20 is bonded on the display screen 10. The driving IC 20 is bonded to the side of the lower layer glass 13 facing the upper layer glass 12, and the driving IC 20 is located in the area where the lower layer glass 13 extends beyond the upper layer glass 12. There is a bonding position on the lower layer glass 13 for bonding the driving IC 20 to the lower layer glass 13. The size of the bonding position is larger than that of the driving IC 20, and the bonding position covers the circuits around the driving IC 20 to protect the driving IC 20 bonded to the bonding position and the circuits of the display screen 10 around it, so that there is no need to apply additional protective glue to protect the driving IC 20 and the circuits of the display screen 10 around it.

[0026] Further, referring to Figure 2 , the bonding position is an ACF film 30. The ACF film 30 is arranged on the lower layer glass 13, and the driving IC 20 is bonded to the ACF film 30. The ACF film 30 is an anisotropic conductive film with several anisotropic conductive balls inside. The ACF film 30 is fixed on the lower layer glass 13 by hot pressing. Among them, there are multiple external pins on the driving IC 20, and there are multiple electrode pins on the lower layer glass 13 that are connected to the inside of the display screen 10. After hot pressing, the anisotropic conductive balls inside the ACF film 30 are respectively connected to the external pins of the driving IC 20 and the electrode pins on the lower layer glass 13, so that the external pins of the driving IC 20 are electrically connected to the electrode pins on the lower layer glass 13, so that the driving IC 20 is bonded to the lower layer glass 13.

[0027] Further, referring to Figure 2 , both the length and width of the ACF film 30 are larger than those of the driving IC 20. The left and right side edges of the ACF film 30 are respectively close to the left and right side edges of the lower layer glass 13. The left and right side edges of the ACF film 30 are respectively 1 - 2 mm away from the left and right side edges of the lower layer glass 13. The upper side edge of the ACF film 30 is 1 - 2 mm away from the lower side edge of the upper layer glass 12.

[0028] Referring to Figure 2 , an FPC 40 is also bonded to the lower-layer glass 13. The FPC 40 is bonded below the driving IC 20. To avoid the ACF film 30 affecting the bonding of the FPC 40, the lower edge of the ACF film 30 is 2-3 mm away from the bonding position of the FPC 40.

[0029] Referring to Figure 2 , the display module makes the size of the ACF film 30 larger, so that the ACF film 30 covers the bonding position of the driving IC 20 and the surrounding display screen 10 circuits. Thus, after the driving IC 20 is bonded to the ACF film 30, the ACF film 30 can protect the driving IC 20 and the surrounding display screen 10 circuits, saving the operation steps of applying the protective glue and the protective glue material, and optimizing the product cost.

[0030] The above embodiments only represent several implementation manners of the present utility model, and the description thereof is relatively specific and detailed, but it should not be construed as a limitation on the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several modifications and improvements can still be made, and these all belong to the protection scope of the present utility model. Therefore, the protection scope of the utility model patent shall be subject to the appended claims.

Claims

1. A TFT display module that does not require IC protective glue, characterized in that: include: A display screen (10), wherein a driver IC (20) is bound to the display screen (10), and the display screen (10) is provided with a binding position for binding the driver IC (20) to the display screen (10), the size of the binding position is larger than the size of the driver IC (20), and the binding position covers the display screen (10) circuit around the driver IC (20).

2. A TFT display module without IC protective glue according to claim 1, characterized in that: The display screen (10) comprises an upper polarizer (11), an upper layer of glass (12), a lower layer of glass (13), and a lower polarizer (14) which are arranged in sequence, and the driver IC (20) is bound to a side of the lower layer of glass (13) facing the upper layer of glass (12).

3. The TFT display module without IC protective glue according to claim 2, characterized in that: The size of the lower layer of glass (13) is larger than the size of the upper layer of glass (12), and the driver IC (20) is located in a region where the lower layer of glass (13) exceeds the upper layer of glass (12).

4. The TFT display module without IC protective glue according to claim 3, characterized in that: The binding position is an ACF film (30), the ACF film (30) is arranged on the lower layer of glass (13), and the driver IC (20) is bound to the ACF film (30).

5. The TFT display module without IC protective glue according to claim 4, characterized in that: The ACF film (30) is an anisotropic conductive film having a plurality of anisotropic conductive balls inside.

6. The TFT display module without IC protective glue according to claim 5, characterized in that: The driver IC (20) is provided with a plurality of external pins, the lower layer of glass (13) is provided with a plurality of electrode pins, the ACF film (30) is respectively connected to the external pins of the driver IC (20) and the electrode pins on the lower layer of glass (13), and the external pins of the driver IC (20) and the electrode pins on the lower layer of glass (13) are electrically connected via the ACF film (30).

7. The TFT display module without IC protective glue according to claim 6, characterized in that: The length and width of the ACF film (30) are both greater than the length and width of the driver IC (20), and the left and right edges of the ACF film (30) are respectively close to the left and right edges of the lower layer of glass (13).

8. The TFT display module without IC protective glue application according to claim 7, characterized in that: The left and right edges of the ACF film (30) are respectively 1-2 mm away from the left and right edges of the lower layer of glass (13).

9. A TFT display module without IC protective glue application according to claim 8, characterized in that: The upper edge of the ACF film (30) is 1-2 mm away from the lower edge of the upper glass (12).

10. The TFT display module without IC protective glue application according to claim 9, characterized in that: The lower layer of glass (13) is also bound with an FPC (40), the FPC (40) is bound below the driver IC (20), and the lower edge of the ACF film (30) is 2-3 mm away from the binding position of the FPC (40).

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