Novel microwave plate power supply device

Abstract

The utility model relates to the technical field of microelectronic equipment, and provides a novel microwave plate power supply device which comprises a low-frequency microwave power supply plate, a bare chip and a microstrip line, the low-frequency microwave power supply plate comprises an upper-layer microwave plate and a lower-layer microwave plate, the edge of the lower-layer microwave plate is provided with a notch, and the bare chip is arranged in the notch. The bare chip penetrates through the notch and is installed on the bottom surface of the upper-layer microwave plate, one end of the microstrip line is arranged in the upper-layer microwave plate, and the other end of the microstrip line is arranged in the lower-layer microwave plate; according to the utility model, the notch for placing the chip is arranged at the edge of the low-frequency microwave power supply board, so that the possibility of physical damage is reduced; meanwhile, the top layer of the low-frequency microwave power supply board can dissipate heat of the chip, so that the temperature of the whole module is reduced, and the working stability is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of microelectronic devices, and particularly to a novel microwave board power supply device. Background Art

[0002] With the development of the microelectronics industry, integrated and miniaturized modules have become the industry trend and the requirements are increasing day by day; in this regard, three-dimensional assembly greatly reduces the volume of the module; currently, in three-dimensional assembly, the packaged radio frequency chips are attached to the multi-layer microwave board, which is costly and large in volume; in response to this, the Chinese utility model patent with the publication number CN 209344067 U provides a novel microwave board power supply device to solve the above problems. It uses the opened-cavity low-frequency microwave power supply board as the top layer of the multi-layer microwave board, which reduces the cost. At the same time, the chip is protected by the groove, so the bare chip is used to replace the traditional packaged chip, which further reduces the cost and saves space; however, since the chip will generate a certain amount of heat during operation and is in the groove, the heat of the chip is not easily dissipated, which will affect the working performance of the multi-layer microwave board; in addition, even if the chip is in the groove, since the groove is a flat rectangular structure, its opening is still very large, and there is a great possibility of physical damage, which affects the stability of the electrical connection. Summary of the Utility Model

[0003] The purpose of the utility model is to provide a novel microwave board power supply device. By setting the notch for placing the chip at the edge of the low-frequency microwave power supply board, the possibility of physical damage is reduced; at the same time, the top layer of the low-frequency microwave power supply board can dissipate the heat of the chip, thereby reducing the temperature of the overall module and improving the working stability.

[0004] The embodiment of the utility model is realized by the following technical solutions: A novel microwave board power supply device includes a low-frequency microwave power supply board, a bare chip, and a microstrip line. The low-frequency microwave power supply board includes an upper microwave board and a lower microwave board. A notch is provided at the edge of the lower microwave board. The bare chip passes through the notch and is installed on the bottom surface of the upper microwave board. One end of the microstrip line is arranged in the upper microwave board, and the other end is arranged in the lower microwave board; the bare chip is connected to the microstrip line to form a structure of low-frequency power supply on the upper microwave board and high-frequency output on the lower microstrip line.

[0005] Furthermore, a power supply PAD is also provided. The power supply PAD passes through the notch and is arranged on the bottom surface of the upper microwave board. The power supply PAD is connected to the power supply port of the bare chip by means of gold wire bonding; a decoupling capacitor is also arranged between the power supply PAD and the bare chip.

[0006] Furthermore, a limiting protrusion is arranged outside the notch of the lower microwave board.

[0007] Furthermore, a first heat dissipation structure is arranged on the top surface of the upper microwave board.

[0008] Furthermore, the first heat dissipation structure includes graphene sheets and heat dissipation silica gel.

[0009] Furthermore, the limiting protrusion is a grille and covers the side surface of the low-frequency microwave power supply board.

[0010] Furthermore, the first heat dissipation structure is in contact with the limiting protrusion.

[0011] Furthermore, the limiting protrusion extends inward into the interior of the low-frequency microwave power supply board.

[0012] The utility model has at least the following advantages and beneficial effects:

[0013] 1. By arranging the notch at the edge of the lower microwave board, a smaller opening is formed with the upper microwave board and the three-dimensional assembly structure, improving the physical protection of the bare chip and reducing the probability of its damage.

[0014] 2. By arranging the notch on the lower microwave board, the top surface of the upper microwave board can be used as the heat dissipation structure of the chip, improving the overall heat dissipation of the power supply device.

[0015] 3. The costs of both the bare chip and the low-frequency microwave power supply board are reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present utility model, and thus should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0017] Figure 1 Structural schematic diagram of a novel microwave board power supply device provided in Embodiment 1;

[0018] Figure 2 Schematic diagram of an electrical connection of a novel microwave board power supply device provided in Embodiment 1;

[0019] Figure 3 Top view structural schematic diagram of a novel microwave board power supply device provided in Embodiment 1;

[0020] Figure 4 Structural schematic diagram of a novel microwave board power supply device provided in Embodiment 2;

[0021] Figure 5 Structural schematic diagram of the first heat dissipation structure in a novel microwave board power supply device provided in Embodiment 3;

[0022] Figure 6 Schematic diagram of the structure of the grille in a novel microwave board power supply device provided in the third embodiment

[0023] Icon: 1 - Low - frequency microwave power supply board, 2 - Notch, 3 - Chip, 4 - Microstrip line, 5 - Power supply PAD, 6 - Limit projection, 7 - First heat dissipation structure, 8 - Grille. Detailed implementation manners

[0024] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. Usually, the components of the embodiments of the present utility model described and illustrated in the accompanying drawings herein can be arranged and designed in various different configurations.

[0025] Therefore, the following detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the present utility model claimed, but merely represents the selected embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts fall within the scope of protection of the present utility model.

[0026] Embodiment 1

[0027] As Figure 1 , shown in Fig. 3, in this embodiment, a novel microwave board power supply device is mainly disclosed, which includes a low - frequency microwave power supply board 1, a bare chip 3, and a microstrip line 4. The low - frequency microwave power supply board 1 includes an upper - layer microwave board and a lower - layer microwave board. A notch 2 is provided at the edge of the lower - layer microwave board. The bare chip 3 passes through the notch 2 and is installed on the bottom surface of the upper - layer microwave board. One end of the microstrip line 4 is arranged in the upper - layer microwave board, and the other end is arranged in the lower - layer microwave board; the bare chip 3 is connected to the microstrip line 4 to form a structure of low - frequency power supply for the upper - layer microwave board and high - frequency output for the lower - layer microstrip line 4. Further, as Figure 2 shown, a power supply PAD 5 is also provided. The power supply PAD 5 passes through the notch 2 and is arranged on the bottom surface of the upper - layer microwave board. The power supply PAD 5 is connected to the power supply port of the bare chip 3 by means of gold wire bonding; a decoupling capacitor is also provided between the power supply PAD 5 and the bare chip 3, which includes ceramic capacitors, capacitors of the bare chip 3, etc., to ensure the radio - frequency performance. Resistors and capacitors can also be added to adjust the peripheral circuit of the bare chip 3 to make the bare chip 3 work in a stable state; similarly, the adjustment of the peripheral circuit of the bare chip 3 by resistors and capacitors also passes through the notch 2 and is arranged on the bottom layer of the upper - layer microwave board.

[0028] The entire device uses a bare chip 3 and a low-frequency microwave power supply board 1 to reduce costs, and at the same time, the entire structure does not exceed the original volume of the low-frequency microwave power supply board 1, so it occupies less space. During actual use, the bare chip 3 is connected to the microstrip line 4 to form a structure where the upper microwave board is powered by low frequency and the lower microstrip line 4 outputs high frequency. It should be noted that for the connection of the power line, it can be adopted in the way of Figure 2 By setting through holes on the upper microwave board to pass through the power line, the connection end is located at the top of the upper microwave board for easy connection. Of course, the connection end can be directly connected from the notch 2, that is, from the side. No matter which method is used, it can ensure the effective wiring area of the upper microwave board and the lower microwave board. The repairability of electronic components can also be ensured through the notch 2.

[0029] Embodiment 2

[0030] As Figure 4 shown, in this embodiment, a new type of microwave board power supply device is mainly disclosed. The main structure is completely the same as that of Embodiment 1. The notch 2 is mainly arranged at the edge of the lower microwave board, so as to form a smaller opening with the upper microwave board and the three-dimensional assembly structure, improving the physical protection of the bare chip 3 and reducing the probability of its damage. Further, a limiting protrusion 6 can be arranged outside the notch 2 of the lower microwave board to protect the open part of the notch 2. There are no restrictions on the material and shape of the limiting protrusion 6. Preferably, rubber is used to protect when the end of the notch 2 touches the ground by using the elasticity of the rubber.

[0031] Embodiment 3

[0032] As Figure 5 ,6 shown, in this embodiment, a new type of microwave board power supply device is mainly disclosed. The main structure is completely the same as that of Embodiment 1. The difference is that in this embodiment, a heat dissipation structure is also provided to assist in the heat dissipation of parts such as the bare chip 3, decoupling capacitor, and power supply PAD 5, so as to ensure stability and reduce the impact on the three-dimensional assembly structure.

[0033] In some embodiments, as Figure 5 shown, the heat dissipation structure mainly includes a first heat dissipation structure 7, which is composed of graphene sheets, arranged on the top surface of the upper microwave board and its projection along the vertical direction overlaps with the notch 2, so as to reduce the heat accumulated during the operation of parts such as the bare chip 3, decoupling capacitor, and power supply PAD 5 by increasing the heat dissipation rate of the upper microwave board.

[0034] In some embodiments, as Figure 6As shown, the heat dissipation structure is also provided with a grille 8. Specifically, the grille 8 is arranged on the side of the low-frequency microwave power supply board 1, that is, outside the notch 2. On the one hand, the grille 8 acts as a limiting protrusion 6 to play a protective role, and on the other hand, it plays a role in heat dissipation. Specifically, the grille 8 is made of a heat-conducting metal, such as copper or aluminum; the heat dissipation efficiency is improved by increasing the heat dissipation area. Further, the grille 8 is in contact with the graphene sheet arranged on the upper-layer microwave board, and the contact method is fitting to assist the graphene sheet in heat dissipation; in addition, one end of the grille 8 can be extended into the low-frequency microwave power supply board 1, and the specific extension length is the same as the depth of the notch 2 to ensure heat conduction in the notch 2.

[0035] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A novel microwave board power supply device, comprising a low-frequency microwave power supply board (1), a bare chip (3) and a microstrip line (4), characterized in that: The low-frequency microwave power supply board (1) comprises an upper microwave board and a lower microwave board, A notch (2) is provided at the edge of the lower microwave board, the bare chip (3) passes through the notch (2) and is installed on the bottom surface of the upper microwave board, one end of the microstrip line (4) is arranged in the upper microwave board, and the other end is arranged in the lower microwave board; the bare chip (3) is connected to the microstrip line (4) to form a structure in which the upper microwave board is powered at a low frequency and the lower microstrip line (4) is output at a high frequency.

2. The novel microwave board power supply device as claimed in claim 1, characterized in that: A power supply PAD (5) is also provided. The power supply PAD (5) passes through the notch (2) and is arranged on the bottom surface of the upper microwave board. The power supply PAD (5) is connected to the power supply port of the bare chip (3) by means of gold wire bonding. A decoupling capacitor is also provided between the power supply PAD (5) and the bare chip (3).

3. The novel microwave board power supply device as claimed in claim 2, characterized in that: A limiting protrusion (6) is provided on the outer side of the notch (2) of the lower microwave plate.

4. The novel microwave board power supply device as claimed in claim 3, characterized in that: A first heat dissipation structure (7) is provided on the top surface of the upper microwave board.

5. The novel microwave board power supply device as claimed in claim 4, characterized in that: The first heat dissipation structure (7) comprises a graphene sheet and heat dissipation silica gel.

6. The novel microwave board power supply device as claimed in claim 5, characterized in that: The limiting protrusion (6) is a grid (8) and is distributed all over the side surface of the low-frequency microwave power supply board (1).

7. The novel microwave board power supply device as claimed in claim 6, characterized in that: The first heat dissipation structure (7) is arranged in contact with the limiting protrusion (6).

8. The novel microwave board power supply device as claimed in claim 6, characterized in that: The limiting protrusion (6) extends inwardly to the interior of the low-frequency microwave power supply board (1).

Images