Improved cooling device for copper wire processing

Abstract

The utility model relates to an improved cooling device for copper wire processing, which comprises a device frame, an upper mounting structure, a wire inlet structure and an air cooling heat dissipation structure, an immersed copper wire cooling structure is mounted in the upper mounting structure, and a water circulation heat dissipation structure is mounted on the inner side of the device frame. The water circulation heat dissipation structure is connected with the copper wire cooling structure to achieve flowing type immersed heat dissipation. The copper wire cooling structure comprises a first cooling pipe, a second cooling pipe, a water inlet pipe and a water outlet pipe. The first cooling pipe and the second cooling pipe are installed in the upper installation structure, a cooling connecting pipe is connected between the first cooling pipe and the second cooling pipe, planes are arranged on the left side face and the right side face of the first cooling pipe and the left side face and the right side face of the second cooling pipe respectively, and holes are formed in the surfaces of the planes. The copper wire machining cooling device solves the problems that an existing copper wire machining cooling device cannot effectively cool copper wires under the condition that the copper wires are normally wound, and then impurities on the surfaces of the copper wires cannot be effectively cleaned.

Description

Technical Field

[0001] The utility model relates to the technical field of copper wire processing, and specifically relates to an improved cooling device for copper wire processing. Background Technique

[0002] As an essential item in industries such as construction and decoration, copper wire has strong electrical conductivity and is used in the manufacturing of wire and cable as well as common motors. When processing copper wire, during wire drawing, due to the friction caused by extrusion, the temperature of the copper wire will rise rapidly. Therefore, after wire drawing, the copper wire needs to be cooled. The existing cooling method generally presses the copper wire into a water tank for cooling. This cooling method will cause the temperature in the water tank to rise rapidly, and after a long time, it will not be able to effectively cool the copper wire, so the cooling effect is poor.

[0003] In order to improve the cooling effect, Chinese Patent CN219497417U, a copper wire processing cooling mechanism, points out that when the copper wire enters the cooling cover and passes through the symmetrically arranged upper and lower guide wheels installed at both ends of the cooling cover, the water pump will pump out the cooling water in the cooling water tank through the water outlet pipe, and transport the cooling water to the shunt pipe through the delivery pipe on the three-way valve, and then spray the cooling water into the cooling cover through the atomizing nozzles. Thus, after the copper wire enters the cooling cover, it can continuously cool the copper wire by cross-spraying. And when the copper slag dropped during the cooling of the copper wire flows through the liquid return hole into the lower part with the cooling water, the filter screen in the filter frame will filter and block the copper slag to recycle the copper slag, avoid waste of copper slag and scratches on the copper wire caused by copper slag. Finally, the cooling water will flow back to the cooling water tank, thereby achieving the purpose of water-cooling circulation for the copper wire and avoiding waste of water resources. The method listed in the above patent can indeed improve the cooling treatment of the copper wire and solve the deficiencies in the existing technology. However, the above patent still has certain technical problems. First, this patent reduces the temperature by cross-spraying. This method cannot compare with immersion cooling. Firstly, the moving speed of the copper wire cannot be too fast during spray cooling, which affects the winding time of the copper wire. Secondly, after wire drawing, there will be impurities such as oxide film, copper mud, and copper powder on the surface of the copper wire. The above patent uses a filter screen to block them. Firstly, copper powder is soluble in water. Therefore, a simple filter screen cannot effectively intercept copper powder, and thus cannot clean the surface of the copper wire.

[0004] Therefore, in order to solve the deficiencies in the above patent, to be able to effectively prevent impurities from polluting the surface of the copper wire during the immersion cooling process of the copper wire and achieve effective cooling treatment of the copper wire without affecting the winding process of the copper wire, an improved cooling device for copper wire processing is hereby proposed to solve the deficiencies in the existing technology. Content of the Utility Model

[0005] In view of the deficiencies of the prior art, the utility model provides an improved cooling device for copper wire processing, which solves the problems that the existing copper wire processing cooling device cannot effectively cool the copper wire while ensuring normal winding of the copper wire, and secondly, cannot effectively clean the impurities on the surface of the copper wire.

[0006] To achieve the above object, the utility model provides the following technical solution: an improved cooling device for copper wire processing, including a device frame, an upper mounting structure, a wire inlet structure, and an air-cooled heat dissipation structure. An immersion-type copper wire cooling structure is installed in the upper mounting structure, and a water circulation heat dissipation structure is installed inside the device frame. The water circulation heat dissipation structure is connected to the copper wire cooling structure to achieve flowing immersion heat dissipation. The copper wire cooling structure includes a first cooling pipe, a second cooling pipe, a water inlet pipe, and a water outlet pipe. The first cooling pipe and the second cooling pipe are installed in the upper mounting structure. A cooling connection pipe is connected between the first cooling pipe and the second cooling pipe. Planes are provided on the left and right sides of the first cooling pipe and the left and right sides of the second cooling pipe. Holes are provided on the surface of the plane, and rubber blocks are installed in the holes. A water inlet pipe is provided on the right side of the first cooling pipe, and a water outlet pipe is installed on the right side of the second cooling pipe. The water inlet pipe and the water outlet pipe are connected to the water circulation heat dissipation structure.

[0007] Through the above technical solution, further, a heat dissipation plate is clamped on the surface of the cooling connection pipe, and an air-cooled heat dissipation structure is installed at the upper end of the upper mounting structure. There are two groups of the air-cooled heat dissipation structures, and one group is located above the heat dissipation plate.

[0008] Further, the upper mounting structure includes an upper mounting plate installed at the upper end of the device frame. The first cooling pipe and the second cooling pipe are installed on the inner side surface of the upper mounting plate. Openings are provided at the right end face and the left end face of the upper mounting plate, cotton pads are installed in the openings, and a wire inlet structure is installed at the right end face of the upper mounting plate.

[0009] As a preferred technical solution, the wire inlet structure includes an L-shaped mounting block, a fixed shaft, and a wire transmission wheel. The L-shaped mounting blocks are symmetrically installed at the right end of the upper mounting plate. A fixed shaft is installed between the two groups of L-shaped mounting blocks, and a device frame is movably installed on the surface of the fixed shaft. The number of wire transmission wheels is the same as the number of openings.

[0010] Further, the air-cooled heat dissipation structure is divided into two groups. One group of the air-cooled heat dissipation structures includes a first mounting plate installed at the upper end of the upper mounting plate, and a first heat dissipation fan is installed on the surface of the first mounting plate. The other group of the air-cooled heat dissipation structures includes a second mounting plate, and a second heat dissipation fan is installed at the upper end of the second mounting plate.

[0011] As a preferred technical solution, the water circulation cooling structure includes a water-cooled radiator, a cooling fan, a water pump, and a water suction pipe. The water pump and the water-cooled radiator are both installed inside the device frame. The water outlet of the water pump is connected to a water inlet pipe, and the water inlet is connected to a water suction pipe. One end of the water suction pipe is connected to the water outlet end of the water-cooled radiator, and its water outlet pipe is connected to the water inlet end of the water-cooled radiator. A cooling fan is installed on the right side surface of the water-cooled radiator.

[0012] Furthermore, a tee pipe is connected to the surface of the water inlet pipe, and a valve is installed at one port of the tee pipe. The valve is connected to a water pipe.

[0013] Compared with the prior art, the present utility model provides an improved cooling device for copper wire processing, having the following beneficial effects:

[0014] 1. In this device, the first cooling pipe and the second cooling pipe are connected by a cooling connection pipe, so that the copper wire is cooled through the cooling connection pipe to achieve immersion cooling. Then, through the water circulation cooling structure, the water in the cooling connection pipe flows and the temperature of the water is reduced. And the copper wire passes through the rubber block to enter the cooling pipe without causing the internal water to flow out. Therefore, it can effectively cool the temperature of the copper wire without affecting the movement of the copper wire. Thus, it solves the problem in the prior art that it is impossible to cool the copper wire during the normal movement of the copper wire. Therefore, this device will not affect the subsequent winding time of the copper wire.

[0015] 2. In this device, through the cotton pad in the opening on the surface of the upper mounting plate, the copper powder and impurities on the surface of the copper wire are cleaned, preventing problems such as the precipitation of copper powder and other impurities in the cooling pipe and causing pollution on the surface of the copper wire.

[0016] Therefore, based on the above advantages, this device solves the problems that the existing copper wire processing cooling device cannot effectively cool the copper wire under the condition of ensuring normal winding of the copper wire, and secondly, it cannot effectively clean the impurities on the surface of the copper wire. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a schematic structural diagram of an improved copper wire processing cooling device of the present utility model;

[0018] Figure 2 is a schematic structural diagram of the cooling connection pipe of an improved copper wire processing cooling device of the present utility model;

[0019] Figure 3 is a schematic structural diagram of the first cooling pipe and the second cooling pipe of an improved copper wire processing cooling device of the present utility model;

[0020] Figure 4Schematic diagram of the L-shaped mounting block structure of an improved cooling device for copper wire processing according to the present utility model;

[0021] Figure 5 Schematic diagram of the rubber block structure of an improved cooling device for copper wire processing according to the present utility model;

[0022] Figure 6 Schematic diagram of the heat dissipation plate structure of an improved cooling device for copper wire processing according to the present utility model;

[0023] Figure 7 An improved cooling device for copper wire processing according to the present utility model Figure 3 Partial enlarged structure schematic diagram of part A;

[0024] Figure 8 An improved cooling device for copper wire processing according to the present utility model Figure 2 Partial enlarged structure schematic diagram of part B.

[0025] In the figure: 1, device frame; 2, upper mounting plate; 3, water-cooled radiator; 4, cooling fan; 5, first cooling pipe; 6, second cooling pipe; 7, water inlet pipe; 8, water pump; 9, water outlet pipe; 10, first mounting plate; 11, first heat dissipation fan; 12, opening; 13, L-shaped mounting block; 14, fixed shaft; 15, wire passing wheel; 16, water extraction pipe; 17, three-way pipe; 18, valve; 19, heat dissipation plate; 20, cooling connection pipe; 21, second mounting plate; 22, second heat dissipation fan; 23, rubber block. Specific implementation mode

[0026] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0027] Embodiment

[0028] Please refer to Figure 1-8, the present utility model provides the following technical solutions: An improved cooling device for copper wire processing, including a device frame 1, an upper mounting structure, a wire inlet structure, an air-cooled heat dissipation structure. An immersion-type copper wire cooling structure is installed in the upper mounting structure. A water circulation heat dissipation structure is installed inside the device frame 1. The water circulation heat dissipation structure is connected to the copper wire cooling structure to achieve flowing immersion heat dissipation. The copper wire cooling structure includes a first cooling pipe 5, a second cooling pipe 6, a water inlet pipe 7, and a water outlet pipe 9. The first cooling pipe 5 and the second cooling pipe 6 are installed in the upper mounting structure. A cooling connection pipe 20 is connected between the first cooling pipe 5 and the second cooling pipe 6. Planes are provided on the left and right sides of the first cooling pipe 5 and the left and right sides of the second cooling pipe 6. Holes are provided on the surface of the plane, and rubber blocks 23 are installed in the holes. A water inlet pipe 7 is provided on the right side of the first cooling pipe 5, and a water outlet pipe 9 is installed on the right side of the second cooling pipe 6. The water inlet pipe 7 and the water outlet pipe 9 are connected to the water circulation heat dissipation structure.

[0029] In this implementation scheme, the specific working principle is as follows: For this device, the copper wire is passed through the wire inlet structure and then enters the first cooling pipe 5 in the upper mounting structure, then passes through the cooling connection pipe 20 and enters the second cooling pipe 6, and then exits. At this time, the water in the first cooling pipe 5, the second cooling pipe 6, and the cooling connection pipe 20 can effectively cool the copper wire, enabling the water to continuously cool down. Moreover, the copper wire is immersed in the water, so it can quickly cool the copper wire without affecting the movement of the copper wire, thus solving the problem in the prior art that the moving speed of the copper wire cannot be too fast when using the spraying method, resulting in too long a time for winding the wire. Secondly, in order to reduce the temperature of the water, through the water circulation heat dissipation structure, the water in the cooling pipe can be circulated and cooled at the same time, so that the continuous cooling treatment of the copper wire can be achieved without changing the water.

[0030] According to the above, in order to accelerate the heat dissipation of the cooling connection pipe 20, specifically, reference can be made to Figure 2 and Figure 6 It can be seen that a heat dissipation plate 19 is clamped on the surface of the cooling connection pipe 20, and an air-cooled heat dissipation structure is installed at the upper end of the upper mounting structure. There are two groups of the air-cooled heat dissipation structures. One group is located above the heat dissipation plate 19. The heat on the surface of the cooling connection pipe 20 is absorbed by the heat dissipation plate 19 and then dissipated through the air-cooled heat dissipation structure.

[0031] Among them, for the specific structure of the upper mounting structure, reference can be made to Figure 1 , Figure 2 , Figure 3It can be seen that the upper mounting structure includes an upper mounting plate 2 installed at the upper end of the device frame 1. Its first cooling pipe 5 and second cooling pipe 6 are installed on the inner side surface of the upper mounting plate 2, and openings are provided on both the right end face and the left end face of the upper mounting plate 2. Cotton pads for removing impurities on the surface of the copper wire are installed in the openings, and an inlet structure for facilitating the entry of the copper wire into the cooling pipe is installed on the right end face of the upper mounting plate 2.

[0032] According to the above, how the copper wire enters the cooling pipe through the inlet structure can be specifically referred to Figure 4 and Figure 7 It can be seen that the inlet structure includes an L-shaped mounting block 13, a fixed shaft 14, and a wire transmission wheel 15. The L-shaped mounting blocks 13 are symmetrically installed at the right end of the upper mounting plate 2. A fixed shaft 14 is installed between the two groups of L-shaped mounting blocks 13. The device frame 1 is movably installed on the surface of the fixed shaft 14, and the number of wire transmission wheels 15 is the same as the number of openings 12.

[0033] In order to dissipate the heat on the surface of the heat dissipation plate 19 and also be able to cool the copper wire after cooling, it can be specifically referred to Figure 1 and Figure 2 It can be seen that the air-cooled heat dissipation structure is divided into two groups. One group of the air-cooled heat dissipation structure includes a first mounting plate 10 installed at the upper end of the upper mounting plate 2. A first heat dissipation fan 11 is installed on the surface of the first mounting plate 10. The other group of the air-cooled heat dissipation structure includes a second mounting plate 21. A second heat dissipation fan 22 is installed at the upper end of the second mounting plate 21. After the copper wire comes out of the second cooling pipe 6, there will be moisture on its surface. However, due to the preheating of the copper wire, the moisture on the surface of the copper wire is evaporated by the action of the wind, thereby reducing the heat of the copper wire again (the air-cooling here is the first mounting plate 10 and the first heat dissipation fan 11). The second heat dissipation fan 22 is directly facing the heat dissipation plate 19, so it can cool the heat on the heat dissipation plate 19.

[0034] In order to cool the water in the cooling pipe, it can be specifically referred to Figure 1 and Figure 8 It can be seen that the water circulation heat dissipation structure includes a water-cooled radiator 3, a heat dissipation fan 4, a water pump 8, and a water suction pipe 16. The water pump 8 and the water-cooled radiator 3 are both installed inside the device frame 1. The water outlet of the water pump 8 is connected to a water inlet pipe 7 and the water inlet is connected to the water suction pipe 16. One end of the water suction pipe 16 is connected to the water outlet end of the water-cooled radiator 3, and its water outlet pipe 9 is connected to the water inlet end of the water-cooled radiator 3. A heat dissipation fan 4 is installed on the right side surface of the water-cooled radiator 3. The water in the cooling pipe is pumped into the water-cooled radiator 3 by the water pump 8 and then dissipated by the heat dissipation fan 4, and then the cooled water is transported back to the first cooling pipe 5 through the water inlet pipe 7 again, so as to realize the circulating cooling of the water and facilitate the continuous cooling of the copper wire.

[0035] For the convenience of filling water into the cooling pipe through the water pipe, please refer to specifically Figure 8 It can be seen that a tee pipe 17 is connected to the surface of the water inlet pipe 7, and a valve 18 is installed at one port of the tee pipe 17, and the valve 18 is connected to the water pipe.

[0036] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments or perform equivalent replacements on some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An improved cooling device for copper wire processing, comprising a device frame (1), an upper mounting structure, a wire inlet structure, and an air cooling and heat dissipation structure, characterized in that: An immersed copper wire cooling structure is installed in the upper mounting structure, and a water circulation heat dissipation structure is installed on the inner side of the device frame (1). The water circulation heat dissipation structure is connected to the copper wire cooling structure to realize flow-type immersed heat dissipation. The copper wire cooling structure comprises a first cooling pipe (5), a second cooling pipe (6), a water inlet pipe (7), and a water outlet pipe (9); the first cooling pipe (5) and the second cooling pipe (6) are installed in the upper mounting structure, and a cooling connecting pipe (20) is connected between the first cooling pipe (5) and the second cooling pipe (6). Planes are provided on the left and right sides of the first cooling pipe (5) and the left and right sides of the second cooling pipe (6), and holes are provided on the plane surfaces. A rubber block (23) is installed in the hole. A water inlet pipe (7) is provided on the right side of the first cooling pipe (5), and a water outlet pipe (9) is installed on the right side of the second cooling pipe (6). The water inlet pipe (7) and the water outlet pipe (9) are connected to the water circulation heat dissipation structure.

2. The improved cooling device for copper wire processing according to claim 1, characterized in that: A heat sink (19) is clamped on the surface of the cooling connecting pipe (20), and an air-cooling heat sink structure is installed on the upper end of the upper mounting structure. The air-cooling heat sink structure is provided with two groups, one of which is located above the heat sink (19).

3. The improved cooling device for copper wire processing according to claim 1, characterized in that: The upper mounting structure comprises an upper mounting plate (2) mounted on the upper end of the device frame (1), wherein the first cooling pipe (5) and the second cooling pipe (6) are mounted on the inner side surface of the upper mounting plate (2), and openings are provided on the right end surface and the left end surface of the upper mounting plate (2), wherein cotton pads are installed in the openings, and an inlet structure is installed on the right end surface of the upper mounting plate (2).

4. The improved cooling device for copper wire processing according to claim 3 is characterized in that: The line-in structure comprises an L-shaped mounting block (13), a fixed shaft (14), and a line transmission wheel (15); the L-shaped mounting block (13) is symmetrically mounted on the right end of the upper mounting plate (2); a fixed shaft (14) is mounted between two groups of L-shaped mounting blocks (13); a device frame (1) is movably mounted on the surface of the fixed shaft (14); and the number of the line transmission wheels (15) is consistent with the number of the openings (12).

5. The improved cooling device for copper wire processing according to claim 2, characterized in that: The air-cooling heat dissipation structure is divided into two groups, one of which comprises a first mounting plate (10) mounted on the upper end of an upper mounting plate (2), a first heat dissipation fan (11) being mounted on the surface of the first mounting plate (10), and the other comprises a second mounting plate (21), a second heat dissipation fan (22) being mounted on the upper end of the second mounting plate (21).

6. The improved cooling device for copper wire processing according to claim 1, characterized in that: The water circulation heat dissipation structure comprises a water-cooled radiator (3), a heat dissipation fan (4), a water pump (8), and a water pump pipe (16). The water pump (8) and the water-cooled radiator (3) are both installed on the inner side of the device frame (1). The water outlet of the water pump (8) is connected to a water inlet pipe (7), and the water inlet is connected to a water pump pipe (16). One end of the water pump pipe (16) is connected to the water outlet of the water-cooled radiator (3), and the water outlet pipe (9) is connected to the water inlet of the water-cooled radiator (3). The heat dissipation fan (4) is installed on the right side of the water-cooled radiator (3).

7. The improved cooling device for copper wire processing according to claim 1, characterized in that: The surface of the water inlet pipe (7) is connected with a three-way pipe (17), one end of the three-way pipe (17) is equipped with a valve (18), and the valve (18) is connected to the water pipe.

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