Water-cooling heat dissipation blade board card and electronic equipment

Abstract

The utility model discloses a water-cooling heat dissipation blade board card which comprises a PCB, an interface heat conduction material, a water-cooling assembly and an upper cooling plate. A chip is arranged on the top surface of the PCB, and an interface heat conduction material is filled between the chip and the bottom surface of the upper cold plate; the water cooling assembly comprises a water cooling flow channel with a first connector and a second connector; a water cooling runner is arranged on the top surface of the upper cooling plate; the first joint and the second joint are arranged on the side surface of the upper cooling plate; one of the first connector and the second connector is a water inlet connector, and the other one is a water outlet connector. According to the technical scheme, the water cooling flow channel is arranged to replace a traditional air cooling mode, heat dissipation efficiency is improved, noise is reduced, space is saved, and the service life of the blade board card is prolonged. And the upper cold plate and the cold plate cover plate are directly melted into a whole in a friction stir welding mode, so that the service life of the blade plate card is further prolonged. The utility model further discloses electronic equipment applying the blade board card.

Description

Technical Field

[0001] The utility model relates to the field of electronic devices, and particularly relates to a blade board with water-cooling heat dissipation and an electronic device. Background Art

[0002] With the continuous development of electronic devices, their performance and power consumption are getting higher and higher, and the traditional air-cooling heat dissipation method has been difficult to meet the heat dissipation requirements of the devices.

[0003] At present, most of the blade boards on the market still adopt the traditional air-cooling heat dissipation method. The air-cooling heat dissipation method has problems such as low heat dissipation efficiency, high noise, and more space occupation, which limits the performance of the devices. Content of the Utility Model

[0004] In view of this, the utility model provides a blade board with water-cooling heat dissipation. By setting a water-cooling flow channel to replace the traditional air-cooling method, the heat dissipation efficiency of the device is improved, the noise is reduced, and the space is saved.

[0005] The utility model also provides an electronic device including the above-mentioned blade board with water-cooling heat dissipation.

[0006] To achieve the above object, the utility model provides the following technical solutions:

[0007] A blade board with water-cooling heat dissipation includes: a PCB board, an interface thermal conductive material, a water-cooling component, and an upper cold plate;

[0008] A chip is provided on the top surface of the PCB board, and the interface thermal conductive material is filled between the chip and the bottom surface of the upper cold plate;

[0009] The water-cooling component includes: a water-cooling flow channel having a first joint and a second joint;

[0010] The water-cooling flow channel is provided on the top surface of the upper cold plate, and both the first joint and the second joint are opened on the side surface of the upper cold plate;

[0011] One of the first joint and the second joint is an inlet joint, and the other is an outlet joint.

[0012] Preferably, the water-cooling flow channel includes: a straight flow channel and a serpentine flow channel;

[0013] Both the first joint and the second joint are opened on the same side surface;

[0014] Wherein, the first joint, the straight flow channel, the serpentine flow channel, and the second joint are connected in sequence.

[0015] Preferably, the water-cooling component further includes: a plurality of groups of heat dissipation fins which are all arranged on the top surface of the upper cold plate and are all located in the serpentine flow channel.

[0016] Preferably, multiple straight pipe segments of the serpentine flow channel are arranged at uniform intervals along the width direction of the upper cold plate;

[0017] The number of multiple groups of the heat dissipation fins is the same as the number of the multiple straight pipe segments, and a corresponding group of the heat dissipation fins is located in a corresponding one of the straight pipe segments.

[0018] Preferably, multiple heat dissipation fins in each group of the heat dissipation fins are uniformly distributed at intervals along the length direction of the upper cold plate.

[0019] Preferably, a part of the top surface of the upper cold plate is recessed to form the water cooling flow channel.

[0020] Preferably, it further includes: a cold plate cover plate;

[0021] The cold plate cover plate is used to seal the top surface of the upper cold plate, and the cold plate cover plate and the top surface of the upper cold plate are sealed by friction stir welding.

[0022] Preferably, the interface thermal conductive material is thermal conductive silicone grease;

[0023] And / or, the upper cold plate is made of 6063 aluminum alloy.

[0024] Preferably, it further includes: a lower cold plate, side plates and a VPX connector;

[0025] The lower cold plate fixes the PCB board on the bottom surface of the upper cold plate, the side plates and the VPX connector are respectively assembled on opposite sides of the upper cold plate, and the VPX connector is arranged between the first joint and the second joint.

[0026] An electronic device includes the above-mentioned blade board.

[0027] As can be seen from the above technical solutions, the blade board provided by the present utility model is provided with a water cooling flow channel, replacing the traditional air cooling method, improving the heat dissipation efficiency of the device, reducing noise, saving space, and prolonging the service life of the blade board.

[0028] In this solution, the upper cold plate and the cold plate cover plate are directly melted into one body by friction stir welding. This sealing method can withstand higher water pressure, has higher reliability, and prolongs the service life of this blade board.

[0029] The present utility model also provides an electronic device. Since the above-mentioned blade board is adopted, it has corresponding beneficial effects, which can be specifically referred to the previous description and will not be elaborated here. Description of the Drawings

[0030] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0031] Figure 1 It is an exploded view of the blade board;

[0032] Figure 2 It is a structural diagram of an embodiment of the cooperation between the upper cold plate and other structures;

[0033] Figure 3 It is a structural diagram of another embodiment of the cooperation between the upper cold plate and other structures;

[0034] Figure 4 It is an overall structural diagram of the blade board.

[0035] Among them, 1 is the cold plate cover, 2 is the upper cold plate, 3 is the side plate, 4 is the PCB board, 5 is the lower cold plate, 6 is the water-cooling head, 61 is the first water-cooling head, 62 is the second water-cooling head, 7 is the VPX connector, 8 is the water-cooling component, 81 is the water-cooling flow channel, 82 is the first joint, 83 is the second joint, 84 is the linear flow channel, 85 is the serpentine flow channel, and 86 is the heat dissipation fin. Specific embodiments

[0036] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0037] The water-cooled blade board provided by the embodiment of the present invention, as Figures 1-4 shown, includes: a PCB board 4, an interface thermal conductive material, a water-cooling component 8, and an upper cold plate 2;

[0038] The top surface of the PCB board 4 is provided with chips, and the interface thermal conductive material is filled between the chips and the bottom surface of the upper cold plate 2;

[0039] The water-cooling component 8 includes: a water-cooling flow channel 81 having a first joint 82 and a second joint 83;

[0040] The top surface of the upper cold plate 2 is provided with the water-cooling flow channel 81, and both the first joint 82 and the second joint 83 are opened on the side surface of the upper cold plate 2;

[0041] One of the first connector 82 and the second connector 83 is an inlet connector, and the other is an outlet connector.

[0042] In the above technical solution, when the electronic device is in use, the chip on the PCB board 4 runs and works. During the working process, the temperature of the chip continuously increases. The heat of the chip is transferred to the upper cold plate 2 through the interface thermal conductive material. Since the water cooling flow channel 81 is provided on the top surface of the upper cold plate 2 and the coolant flows through the water cooling flow channel 81, during the flow of the coolant, the heat on the upper cold plate 2 is taken away. Furthermore, the upper cold plate 2 can continuously absorb the heat generated by the chip, making the temperature of the chip suitable during operation; it should be noted that the electronic devices in this article include but are not limited to computers and communication devices.

[0043] Compared with the prior art, through the setting of the water cooling flow channel 81, the traditional air cooling method is replaced, the heat dissipation efficiency of the device is improved, the noise is reduced, the space is saved, and the service life of the blade board is extended.

[0044] Optimize the above technical solution, as Figure 2 shown, the water cooling flow channel 81 includes: a linear flow channel 84 and a serpentine flow channel 85;

[0045] Both the first connector 82 and the second connector 83 are provided on the same side. In this way, it is more convenient to introduce the coolant and the efficiency is improved;

[0046] Among them, the first connector 82, the linear flow channel 84, the serpentine flow channel 85 and the second connector 83 are connected in sequence; as Figure 2 shown, when the first connector 82 is the inlet connector, the coolant flows in from the first connector 82, passes through the linear flow channel 84 and the serpentine flow channel 85 in sequence, and flows out through the second connector 83 (as Figure 2 shown, the direction indicated by the arrow in the figure is the flow direction of the coolant); when the second connector 83 is the inlet connector, the coolant flows in from the second connector 83, passes through the serpentine flow channel 85 and the linear flow channel 84 in sequence, and flows out through the first connector 82 (as Figure 3 shown, the direction indicated by the arrow in the figure is the flow direction of the coolant).

[0047] In the above technical solution, it should be noted that the serpentine flow channel 8 can cover most of the top surface of the upper cold plate 2 (at least more than four-fifths of the top surface area of the upper cold plate 2). In this way, the heat dissipation effect of the water cooling component is better; it should also be noted that the axial direction of the linear flow channel 84 is parallel to the extending direction of the serpentine flow channel 85 (i.e., the width direction of the upper cold plate 2).

[0048] Further optimize the above technical solution, as Figure 2 shown, the water cooling component 8 further includes: a plurality of heat dissipation fins 86 which are all arranged on the top surface of the upper cold plate 2 and are all located in the serpentine flow channel 85.

[0049] In the above technical solution, through the arrangement of multiple groups of heat dissipation fins 86, the heat transferred from the chip to the upper cold plate can be dissipated more quickly. The heat dissipated by the multiple groups of heat dissipation fins 86 is taken away by the coolant more quickly, improving the overall cooling speed.

[0050] To further optimize the above technical solution, such as Figure 2 and Figure 3 shown, the multiple straight pipe segments of the serpentine flow channel 85 are arranged at equal intervals along the width direction of the upper cold plate 2;

[0051] The number of multiple groups of heat dissipation fins 86 is the same as the number of multiple straight pipe segments, and a corresponding group of heat dissipation fins 86 is located within a corresponding straight pipe segment.

[0052] In the above technical solution, there is a group of heat dissipation fins 86 in each straight pipe segment. With such an arrangement, the heat dissipation speed is further accelerated, enabling the blade board to adapt to a higher temperature working environment.

[0053] As a preference, as Figure 2 and Figure 3 shown, the multiple heat dissipation fins 86 in each group of heat dissipation fins 86 are evenly spaced along the length direction of the upper cold plate 2. With such an arrangement, the heat dissipation effect is further improved.

[0054] In this technical solution, as Figures 1-3 shown, a part of the top surface of the upper cold plate 2 is recessed to form a water cooling flow channel 81. With such an arrangement, the structure of this blade board is more stable and the heat dissipation is faster.

[0055] To optimize the above technical solution, it further includes: a cold plate cover 1;

[0056] The cold plate cover 1 is used to seal the top surface of the upper cold plate 2, and the cold plate cover 1 and the top surface of the upper cold plate 2 are sealed by friction stir welding.

[0057] In the above technical solution, through the method of friction stir welding, the upper cold plate 2 and the cold plate cover 1 are directly melted into one body. This sealing method can withstand higher water pressure, has higher reliability, and extends the service life of this blade board. With such an arrangement, the blade board is fully enclosed, which can prevent the board from being affected by factors such as dust, salt spray, and mildew, and the overall electromagnetic interference resistance ability is also improved.

[0058] In this technical solution, the interface thermal conductive material is thermal conductive silicone grease. The thermal conductive silicone grease has good thermal conductivity and is an industrial finished product with low cost, reducing the cost while improving the heat dissipation efficiency.

[0059] In this technical solution, the material of the upper cold plate 2 is 6063 aluminum alloy, which has a faster heat dissipation speed, and the cost of industrial finished products of 6063 aluminum alloy is low, reducing costs while improving the heat dissipation efficiency.

[0060] In this technical solution, as Figure 1 shown, it further includes: a first water-cooling head 61 and a second water-cooling head 62;

[0061] The first water-cooling head 61 is detachably connected to the first connector 82, and the second water-cooling head 62 is detachably connected to the second connector 83.

[0062] In the above technical solution, the first water-cooling head 61 is detachably connected to the first connector 82, and the second water-cooling head 62 is detachably connected to the second connector 83. With such a setting, in the case of damage to the first water-cooling head 61 and the second water-cooling head 62, they can be replaced, reducing the usage cost.

[0063] In this technical solution, it further includes: a lower cold plate 5, side plates 3, and a VPX connector 7;

[0064] The lower cold plate 5 fixes the PCB board 4 on the bottom surface of the upper cold plate 2. The side plates 3 and the VPX connector 7 are respectively assembled on the opposite sides of the upper cold plate 2, and the VPX connector 7 is arranged between the first connector 82 and the second connector 83.

[0065] In the above technical solution, through such a setting, the structure is more stable, and the service life of this blade board is extended; it should be noted that the side plates 3 and the VPX connector 7 are respectively snap-fixed on the opposite sides of the upper cold plate 2.

[0066] This utility model example also provides an electronic device, including: the blade board as described above. Since this solution adopts the above blade board, it thus has corresponding beneficial effects, which can be specifically referred to the previous description and will not be elaborated here.

[0067] The technical features mentioned above, the technical features to be mentioned below, and the technical features shown separately in the drawings can be arbitrarily combined with each other as long as the combined technical features are not mutually contradictory. All feasible feature combinations are the technical contents clearly recorded in this article. Any one of the sub-features included in the same statement can be independently applied without necessarily being applied together with other sub-features.

[0068] The following further introduces this solution with specific embodiments:

[0069] In this technical solution, the heat dissipation body of the blade board is the upper cold plate 2. The heating chips on the PCB board 4 are in contact with the upper cold plate 2 through thermal conductive silicone grease, so that the heat is transferred to the upper cold plate 2 through the thermal conductive silicone grease; the upper cold plate 2 is processed and manufactured with 6063 aluminum alloy with excellent thermal conductivity, so that the heat of the heating chips on the PCB board 4 can be quickly transferred inside the upper cold plate 2. The internal flow channel of the upper cold plate 2 is provided with a plurality of heat dissipation fins 86, which increases the contact area between the upper cold plate 2 and the coolant and improves the overall heat exchange efficiency; in this solution, the upper cold plate is directly melted into one body with the cold plate cover 1 by friction stir welding. This sealing method can withstand higher water pressure and has higher reliability. Different from the traditional sealing method using silicone rubber sealing strips, the sealing is not affected by aging. Two water cooling heads 6 are installed at the left and right ends of the upper cold plate of the water-cooled blade, which are the water inlet and the water outlet respectively. The coolant enters the cavity of the upper cold plate 2 through the water inlet, takes away the heat generated by the chips through the heat dissipation fins 8, and flows out from the water outlet. Thus, the water-cooling heat dissipation process is completed.

[0070] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same and similar parts among the various embodiments can be referred to each other.

[0071] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be obvious to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A water-cooled blade card, characterized in that: include: PCB board (4), interface thermal conductive material, water cooling component (8) and upper cold plate (2); A chip is provided on the top surface of the PCB board (4), and the interface thermal conductive material is filled between the chip and the bottom surface of the upper cold plate (2); The water cooling component (8) comprises: a water cooling channel (81) having a first joint (82) and a second joint (83); The water cooling channel (81) is provided on the top surface of the upper cold plate (2), and the first joint (82) and the second joint (83) are both opened on the side surface of the upper cold plate (2); One of the first joint (82) and the second joint (83) is a water inlet joint, and the other is a water outlet joint.

2. The blade card according to claim 1, characterized in that: The water-cooling flow channel (81) comprises: a straight flow channel (84) and a serpentine flow channel (85); The first joint (82) and the second joint (83) are both opened on the same side; Wherein, the first joint (82), the straight flow channel (84), the serpentine flow channel (85) and the second joint (83) are connected in sequence.

3. The blade card according to claim 2, characterized in that: The water cooling assembly (8) further comprises: a plurality of groups of heat dissipation fins (86) which are all arranged on the top surface of the upper cold plate (2) and are all located in the serpentine flow channel (85).

4. The blade card according to claim 3, characterized in that: The plurality of straight pipe sections of the serpentine flow channel (85) are evenly spaced apart along the width direction of the upper cold plate (2); The number of the multiple groups of heat dissipation fins (86) is the same as the number of the multiple straight pipe sections, and a corresponding group of heat dissipation fins (86) is located in a corresponding straight pipe section.

5. The blade card according to claim 3, characterized in that: The multiple heat dissipation fins (86) in each group of the heat dissipation fins (86) are evenly spaced apart along the length direction of the upper cold plate (2).

6. The blade card according to claim 1, characterized in that: A portion of the top surface of the upper cold plate (2) is recessed to form the water cooling channel (81).

7. The blade card according to claim 6, characterized in that: Also includes: Cold plate cover (1); The cold plate cover plate (1) is used to seal the top surface of the upper cold plate (2), and the cold plate cover plate (1) and the top surface of the upper cold plate (2) are sealed by means of stir friction welding.

8. The blade card according to claim 1, characterized in that: The interface thermal conductive material is thermal conductive silicone grease; And / or, the upper cold plate (2) is made of 6063 aluminum alloy.

9. The blade card according to claim 1, characterized in that: Also includes: A water cooling head (6) comprising a first water cooling head (61) and a second water cooling head (62); The first water cooling head (61) is detachably connected to the first joint (82), and the second water cooling head (62) is detachably connected to the second joint (83).

10. The blade card according to any one of claims 1 to 9, characterized in that: Also includes: Lower cold plate (5), side plate (3) and VPX connector (7); The lower cold plate (5) fixes the PCB board (4) on the bottom surface of the upper cold plate (2), the side plate (3) and the VPX connector (7) are respectively assembled on the opposite sides of the upper cold plate (2), and the VPX connector (7) is arranged between the first connector (82) and the second connector (83).

11. An electronic device, characterized in that: include: A blade card as claimed in any one of claims 1 to 10.

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