Welding fixture

Abstract

The utility model provides a welding clamp, which is used for clamping a power semiconductor module and comprises a base plate, a clamping part, a clamping part and a clamping part, the base plate is provided with an accommodating part, and the accommodating part is used for accommodating pin fins of a bottom plate of the power semiconductor module so that the lower surface of the bottom plate is in contact fit with the upper surface of the base plate; the clamping piece is detachably arranged on the substrate in a covering mode so that the power semiconductor module can be clamped between the lower surface of the clamping piece and the upper surface of the substrate, a terminal avoiding part is arranged on the clamping piece, and a terminal of the power semiconductor module penetrates through the terminal avoiding part. Through the technical scheme provided by the invention, the problems that the heating efficiency of the heating plate on the bottom plate is low and the heating time is long due to the fact that the pin fins of the bottom plate are in direct contact with the heating plate in the related technology can be solved, and the problem that the welding quality of a welding layer above the bottom plate is influenced due to the fact that the temperature of the bottom plate is not uniform due to direct heating of the pin fins can be solved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor welding, and particularly to a welding fixture. Background Art

[0002] In recent years, with the accelerating pace of "carbon peak" and "carbon neutrality", China has been continuously promoting the adjustment of industrial structure and energy structure. The demand for power semiconductor modules has been increasing continuously because they can improve the efficiency of electric energy conversion and transmission. Among them, power semiconductor modules are also widely used in fields such as new energy vehicles, industrial control, and locomotive traction and play a great role as an indispensable main role.

[0003] In the related art, a power semiconductor module includes a base plate, a lining plate and terminals. The terminals are arranged on the lining plate. When the lining plate is welded to the base plate, solder needs to be filled between the base plate and the lining plate, and the base plate is heated. Since the lower surface of the base plate is provided with pin fins, the lower surface of the pin fins is directly contacted and heated by a heating plate, so that the solder is melted and then cooled to ensure the connection between the lining plate and the base plate.

[0004] However, the pin fins of the base plate in the related art directly contact the heating plate, which will result in problems such as low heating efficiency of the heating plate for the base plate and long heating time. In addition, direct heating through the pin fins will also cause uneven temperature of the base plate, thereby affecting the welding quality of the solder layer above the base plate. Summary of the Utility Model

[0005] The utility model provides a welding fixture to solve the problems in the related art that when the pin fins of the base plate directly contact the heating plate, the heating efficiency of the heating plate for the base plate is low and the heating time is long, and in addition, direct heating through the pin fins will also cause uneven temperature of the base plate, thereby affecting the welding quality of the solder layer above the base plate.

[0006] The utility model provides a welding fixture for clamping a power semiconductor module. The welding fixture includes: a substrate having a receiving portion for receiving the pin fins of the base plate of the power semiconductor module so that the lower surface of the base plate is in contact and cooperation with the upper surface of the substrate; a clamping member removably covering the substrate so that the power semiconductor module is clamped between the lower surface of the clamping member and the upper surface of the substrate, and a terminal avoidance portion is provided on the clamping member, and the terminals of the power semiconductor module pass through the terminal avoidance portion.

[0007] Further, the clamping member includes a first clamping plate and a second clamping plate, the first clamping plate and the second clamping plate are spaced apart along the width direction of the substrate, and there is an avoidance gap between the first clamping plate and the second clamping plate.

[0008] Further, the first clamping plate includes a first groove and a second groove. The second groove is provided on the bottom of the first groove. The first groove can accommodate the liner plate of the power semiconductor module, and the second groove can accommodate the bottom plate. A first positioning step structure is formed between the inner side wall of the second groove and the lower surface of the first clamping plate to limit the bottom plate. The second clamping plate includes a third groove and a fourth groove. The fourth groove is provided on the bottom of the third groove. The third groove can accommodate the liner plate, and the fourth groove can accommodate the bottom plate. A second positioning step structure is formed between the inner side wall of the fourth groove and the lower surface of the second clamping plate to limit the bottom plate.

[0009] Further, a first limiting rib is provided on the lower surface of the first clamping plate. The first limiting rib is provided in the first groove and extends along the width direction of the substrate to separate two adjacent liner plates.

[0010] Further, a plurality of extending bosses are provided on the surface of the second clamping plate facing the first clamping plate. The plurality of extending bosses are arranged at intervals along the length direction of the second clamping plate. Each extending boss extends in a direction approaching the first clamping plate, and a terminal avoidance portion is provided on each extending boss.

[0011] Further, a second limiting rib is provided on the lower surface of the second clamping plate. The first end of the second limiting rib is provided in the third groove, and the second end of the second limiting rib is provided on the lower surface of the extending boss. The second limiting rib extends along the width direction of the substrate and is located above the bottom plate to separate two adjacent liner plates.

[0012] Further, the terminal avoidance portion includes a positioning through hole, and positioning through holes are provided on both the first clamping plate and the second clamping plate.

[0013] Further, there is a gap between the terminal and the hole wall of the positioning through hole.

[0014] Further, the accommodating portion includes a plurality of mounting holes. The plurality of mounting holes are arranged in an array on the substrate. The plurality of pin fins of the bottom plate are correspondingly arranged with the plurality of mounting holes, and the plurality of pin fins are correspondingly inserted into the plurality of mounting holes.

[0015] Further, both the clamping member and the substrate are made of graphite material.

[0016] Applying the technical solution of the present utility model, the welding fixture can clamp the power semiconductor module. The welding fixture includes a substrate and a clamping member. A receiving portion is provided on the substrate. The pin fins on the bottom plate of the power semiconductor module can extend into the receiving portion, so that the lower surface of the bottom plate contacts the upper surface of the substrate, and the pin fins contact the side wall of the receiving portion of the substrate. Moreover, the clamping member is removably covered on the substrate, which is convenient for the installation and disassembly of the welding fixture. When it is necessary to clamp the power semiconductor module, the clamping member is installed on the substrate, and the power semiconductor module can be clamped between the lower surface of the clamping member and the upper surface of the substrate, which can limit the installation of the power semiconductor module and play a role of limiting and fixing. Terminals are provided on the power semiconductor module, and corresponding terminal avoidance portions are provided on the clamping member. When the clamping member covers the power semiconductor module, the terminals pass through the terminal avoidance portions, which can not only play a role of avoidance but also play a role of limiting, avoiding the power module from shaking in the welding fixture. Through the above structure, a receiving portion is provided on the substrate, and the pin fins of the bottom plate extend into the receiving portion, so that the pin fins of the bottom plate contact the side wall of the receiving portion, and the lower surface of the bottom plate contacts the upper surface of the substrate. When heating the welding fixture, the substrate is heated first, and the heat is transferred through the substrate. The heat can not only be transferred to the pin fins, and the pin fins transfer to the corresponding bottom plate, but also the substrate can directly transfer the heat to the lower surface of the bottom plate. Furthermore, by contacting the lower surface of the bottom plate except the pin fins with the substrate, the heating area is increased, ensuring uniform heating of the bottom plate, and then ensuring uniform heating of the solder, and further ensuring firm connection between the bottom plate and the lining plate, so that the welding fixture of the present application can solve the problems in the related art that when the heating plate heats the pin fins of the bottom plate, the heating efficiency of the heating plate for the bottom plate is low and the heating time is long. In addition, direct heating through the pin fins will also cause uneven temperature of the bottom plate, thereby affecting the welding quality of the solder layer above the bottom plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings forming a part of this application are used to provide a further understanding of the present utility model. The schematic embodiments of the present utility model and their descriptions are used to explain the present utility model and do not constitute an improper limitation to the present utility model. In the drawings:

[0018] Figure 1 shows a schematic structural view of the welding fixture provided by an embodiment of the present utility model;

[0019] Figure 2 shows a top view of the substrate of the welding fixture provided by an embodiment of the present utility model;

[0020] Figure 3 shows a bottom view of the clamping member of the welding fixture provided by an embodiment of the present utility model;

[0021] Figure 4Shows a schematic diagram of a welding fixture clamping a power semiconductor module provided by an embodiment of the present invention;

[0022] Figure 5 Shows a schematic diagram of another perspective of a welding fixture clamping a power semiconductor module provided by an embodiment of the present invention;

[0023] Figure 6 Shows an exploded view of a welding fixture clamping a power semiconductor module provided by an embodiment of the present invention.

[0024] Among them, the above-mentioned drawings include the following reference numerals:

[0025] 10. Substrate; 11. Accommodating portion; 111. Mounting hole;

[0026] 20. Clamping member; 21. Terminal avoidance portion; 211. Positioning through hole; 22. First clamping plate; 221. First groove; 222. Second groove; 223. First positioning step structure; 224. First limiting rib; 23. Second clamping plate; 231. Third groove; 232. Fourth groove; 233. Second positioning step structure; 234. Extension boss; 235. Second limiting rib. Detailed implementation manners

[0027] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and in no way limits the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0028] As Figures 1 to 6 shown, an embodiment of the present invention provides a welding fixture for clamping a power semiconductor module. The welding fixture includes a substrate 10 and a clamping member 20. The substrate 10 has an accommodating portion 11 for accommodating the pin fins of the bottom plate of the power semiconductor module so that the lower surface of the bottom plate is in contact and cooperation with the upper surface of the substrate 10. The clamping member 20 is removably covered on the substrate 10 so that the power semiconductor module is clamped between the lower surface of the clamping member 20 and the upper surface of the substrate 10. A terminal avoidance portion 21 is provided on the clamping member 20, and the terminals of the power semiconductor module pass through the terminal avoidance portion 21.

[0029] Applying the welding fixture provided in this embodiment, the welding fixture can clamp the power semiconductor module. The welding fixture includes a substrate 10 and a clamping member 20. A receiving portion 11 is provided on the substrate 10. The pin fins on the bottom plate of the power semiconductor module can extend into the receiving portion 11, so that the lower surface of the bottom plate contacts the upper surface of the substrate 10, and the pin fins contact the side wall of the receiving portion 11 of the substrate 10. Moreover, the clamping member 20 is removably covered on the substrate 10, which is convenient for the installation and disassembly of the welding fixture. When it is necessary to clamp the power semiconductor module, the clamping member 20 is installed on the substrate 10, and the power semiconductor module can be clamped between the lower surface of the clamping member 20 and the upper surface of the substrate 10, which can position and fix the power semiconductor module. Terminals are provided on the power semiconductor module, and a terminal avoidance portion 21 is correspondingly provided on the clamping member 20. When the clamping member 20 covers the power semiconductor module, the terminals pass through the terminal avoidance portion 21, which can not only play a role in avoidance but also play a role in limiting, preventing the power module from shaking in the welding fixture. Through the above structure, the receiving portion 11 is provided on the substrate 10, and the pin fins of the bottom plate extend into the receiving portion 11, so that the pin fins of the bottom plate contact the side wall of the receiving portion 11, and the lower surface of the bottom plate contacts the upper surface of the substrate 10. When heating the welding fixture, the substrate 10 is heated first, and the heat is transferred through the substrate 10. The heat can be transferred to the pin fins, and the pin fins transfer it to the corresponding bottom plate. It can also directly transfer the heat from the substrate 10 to the lower surface of the bottom plate. Furthermore, by contacting the lower surface of the bottom plate except for the pin fins with the substrate 10, the heating area is increased, ensuring uniform heating of the bottom plate, and then ensuring uniform heating of the solder, thereby ensuring firm connection between the bottom plate and the lining plate. This enables the welding fixture of the present application to solve the problems in the related art that when the heating plate heats the pin fins of the bottom plate, the heating efficiency of the heating plate for the bottom plate is low and the heating time is long. In addition, direct heating by the pin fins will also cause uneven temperature of the bottom plate, thereby affecting the welding quality of the solder layer above the bottom plate.

[0030] As Figures 1 to 3As shown, the clamping member 20 includes a first clamping plate 22 and a second clamping plate 23. The first clamping plate 22 and the second clamping plate 23 are arranged at intervals in the width direction of the base plate 10, and there is an avoidance gap between the first clamping plate 22 and the second clamping plate 23. With the above structure, by providing the first clamping plate 22 and the second clamping plate 23 and arranging an avoidance gap between them, it is not only convenient to cover the base plate 10 with the first clamping plate 22 and the second clamping plate 23 for installing and limiting the power semiconductor module, but also convenient to observe the installation position of the power semiconductor module through the avoidance gap, thereby facilitating the determination of the installation position of the power semiconductor module. Moreover, it makes the disassembly of the first clamping plate 22 and the second clamping plate 23 convenient, and is conducive to the stable welding structure of the bottom plate and the lining plate after the power semiconductor module is heated and welded.

[0031] As Figure 1 and Figure 3 shown, the first clamping plate 22 includes a first groove 221 and a second groove 222. The second groove 222 is arranged on the bottom of the first groove 221. The first groove 221 can accommodate the lining plate of the power semiconductor module, and the second groove 222 can accommodate the bottom plate. A first positioning step structure 223 is formed between the inner side wall of the second groove 222 and the lower surface of the first clamping plate 22 to limit the bottom plate. With the first clamping plate 22 of the above structure, the first groove 221 is provided to accommodate the lining plate, and the second groove 222 accommodates the bottom plate, so as to ensure that the power semiconductor module is limited and clamped under the action of the first clamping plate 22 and the base plate 10. And a first positioning step structure 223 is formed between the inner side wall of the second groove 222 and the lower surface of the first clamping plate 22 for limiting and matching the bottom plate, so as to ensure that the power semiconductor module does not shake under the action of the first clamping plate 22 and the base plate 10 and play a limiting role on the bottom plate.

[0032] As Figure 1 and Figure 3As shown, the second clamping plate 23 includes a third groove 231 and a fourth groove 232. The fourth groove 232 is provided on the bottom of the third groove 231. The third groove 231 can accommodate the lining plate, and the fourth groove 232 can accommodate the bottom plate. A second positioning step structure 233 is formed between the inner side wall of the fourth groove 232 and the lower surface of the second clamping plate 23 to limit the bottom plate. With the second clamping plate 23 having the above structure, the third groove 231 is provided to accommodate the lining plate, and the fourth groove 232 accommodates the bottom plate. Thus, it can ensure that the power semiconductor module is limited and clamped under the action of the second clamping plate 23 and the substrate 10. Moreover, a second positioning step structure 233 is formed between the inner side wall of the fourth groove 232 and the lower surface of the second clamping plate 23 to perform limit fitting on the bottom plate, so as to ensure that the power semiconductor module does not shake under the action of the second clamping plate 23 and the substrate 10 and ensure that the bottom plate is limited.

[0033] It should be noted that both the first positioning step structure 223 and the second positioning step structure 233 can limit the upper surface and the side surface of the bottom plate. Both the first positioning step structure 223 and the second positioning step structure 233 include a step surface and a vertical surface, and the step surface can be used to fit the upper surface and the side surface of the bottom plate.

[0034] As Figure 3 shown, a first limiting rib 224 is provided on the lower surface of the first clamping plate 22. The first limiting rib 224 is provided in the first groove 221 and extends along the width direction of the substrate 10 to separate two adjacent lining plates. With the above structure, by arranging the first limiting rib 224 in the first groove 221, two adjacent lining plates can be separated, and the position accuracy of the lining plates on the bottom plate can be ensured, guaranteeing firm welding.

[0035] As Figure 1 and Figure 3 shown, a plurality of extending bosses 234 are provided on the surface of the second clamping plate 23 facing the first clamping plate 22. The plurality of extending bosses 234 are arranged at intervals along the length direction of the second clamping plate 23, and each extending boss 234 extends in the direction of approaching the first clamping plate 22. A terminal avoidance portion 21 is provided on each extending boss 234. With the above structure, by arranging a plurality of extending bosses 234 and providing a terminal avoidance portion 21 on each extending boss 234, the terminals can be avoided.

[0036] As Figure 3As shown in the figure, a second limiting rib 235 is provided on the lower surface of the second clamping plate 23. The first end of the second limiting rib 235 is arranged in the third groove 231, and the second end of the second limiting rib 235 is arranged on the lower surface of the extending boss 234. The second limiting rib 235 extends along the width direction of the substrate 10 and is located above the bottom plate to separate two adjacent lining plates. With the above structure, the second limiting rib 235 is provided on the lower surface of the second clamping plate 23. The first end of the second limiting rib 235 is arranged in the third groove 231, and the second end of the second limiting rib 235 is arranged on the lower surface of the extending boss 234, which can separate two adjacent lining plates and ensure the position accuracy of the lining plates on the bottom plate, ensuring firm welding.

[0037] As Figure 1 and Figure 3 shown in the figure, the terminal avoidance portion 21 includes a positioning through hole 211, and positioning through holes 211 are provided on both the first clamping plate 22 and the second clamping plate 23. With the terminal avoidance portion 21 having the above structure, the terminals on the lining plate can pass through the positioning through holes 211, which can play a role in avoiding the terminals and also play a role in positioning the power semiconductor module.

[0038] In this embodiment, there is a gap between the terminal and the hole wall of the positioning through hole 211. By having a gap between the terminal and the hole wall of the positioning through hole 211, it can ensure that the terminal can pass through the positioning through hole 211 and achieve the positioning effect.

[0039] As Figure 2 shown in the figure, the accommodating portion 11 includes a plurality of mounting holes 111. The plurality of mounting holes 111 are arranged in an array on the substrate 10. The plurality of pin fins on the bottom plate are correspondingly arranged with the plurality of mounting holes 111, and the plurality of pin fins are correspondingly inserted into the plurality of mounting holes 111. With the above structure, a plurality of mounting holes 111 are arranged in an array on the substrate 10, and the plurality of mounting holes 111 are correspondingly arranged with the plurality of pin fins, which can ensure that the pin fins can all be inserted into the mounting holes 111 and play a role in positioning and installing the bottom plate.

[0040] In this embodiment, both the clamping member 20 and the substrate 10 are made of graphite material. By setting both the clamping member 20 and the substrate 10 as graphite material, it can ensure the heat transfer efficiency, the substrate 10 heats the bottom plate evenly, and ensure that the substrate 10 is not easily deformed.

[0041] It should be noted that in other embodiments, the clamping member 20 and the substrate 10 can also be made of materials such as aluminum alloy and titanium alloy, which can not only facilitate the limiting and clamping of the power semiconductor module but also ensure the structural strength of the welding fixture.

[0042] It should be noted that the terms used herein are for the purpose of describing specific embodiments only and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly dictates otherwise, the singular forms are also intended to include the plural forms. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they specify the presence of the features, steps, operations, devices, components, and / or combinations thereof.

[0043] Unless otherwise specifically stated, the relative arrangements of the components and steps, numerical expressions, and values set forth in these embodiments do not limit the scope of the present invention. At the same time, it should be understood that, for the sake of convenience of description, the dimensions of the various parts shown in the drawings are not drawn in actual proportional relationships. Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the said technologies, methods, and devices should be regarded as part of the specification. In all the examples shown and discussed herein, any specific values should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, it will not be necessary to discuss it further in subsequent drawings.

[0044] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by orientation words such as "front, rear, upper, lower, left, right", "lateral, vertical, perpendicular, horizontal", and "top, bottom" are generally based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description. Without contrary description, these orientation words do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and thus should not be construed as limiting the protection scope of the present invention; the orientation words "inside, outside" refer to the inside and outside relative to the contour of each component itself.

[0045] For ease of description, spatial relative terms, such as "above", "over", "on the upper surface", "upper", etc., may be used herein to describe the spatial positional relationship of one device or feature to other devices or features as shown in the figures. It should be understood that the spatial relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is inverted, a device described as "above" or "over" other devices or structures will then be positioned "below" or "under" the other devices or structures. Thus, the exemplary term "above" can include both orientations of "above" and "below". The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the corresponding explanations for the spatial relative descriptions used herein will be made accordingly.

[0046] In addition, it should be noted that the use of terms such as "first", "second", etc. to define components is only for the convenience of differentiating the corresponding components. Without further statement, the above terms have no special meanings, and thus should not be construed as limiting the protection scope of the present utility model.

[0047] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. For those skilled in the art, the present utility model may have various modifications and changes. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A welding fixture for clamping a power semiconductor module, characterized in that: The welding fixture comprises: A substrate (10) having a receiving portion (11), wherein the receiving portion (11) is used to receive the pin fins of the bottom plate of the power semiconductor module so that the lower surface of the bottom plate is in contact with and fits with the upper surface of the substrate (10); A clamping member (20) is removably covered on the substrate (10) so that the power semiconductor module is clamped between the lower surface of the clamping member (20) and the upper surface of the substrate (10); a terminal avoidance portion (21) is provided on the clamping member (20), and the terminals of the power semiconductor module are inserted through the terminal avoidance portion (21).

2. The welding fixture according to claim 1, characterized in that: The clamping member (20) comprises a first clamping plate (22) and a second clamping plate (23), wherein the first clamping plate (22) and the second clamping plate (23) are arranged at intervals along the width direction of the substrate (10), and an avoidance gap is provided between the first clamping plate (22) and the second clamping plate (23).

3. The welding fixture according to claim 2, characterized in that: The first clamping plate (22) comprises a first groove (221) and a second groove (222), the second groove (222) being arranged on the groove bottom of the first groove (221), the first groove (221) being capable of accommodating a liner of the power semiconductor module, the second groove (222) being capable of accommodating the bottom plate, and a first positioning step structure (223) being formed between the inner side wall of the second groove (222) and the lower surface of the first clamping plate (22) to limit the bottom plate; The second clamping plate (23) includes a third groove (231) and a fourth groove (232), wherein the fourth groove (232) is arranged on the bottom of the third groove (231), the third groove (231) can accommodate the lining plate, and the fourth groove (232) can accommodate the bottom plate, and a second positioning step structure (233) is formed between the inner side wall of the fourth groove (232) and the lower surface of the second clamping plate (23) to limit the bottom plate.

4. The welding fixture according to claim 3, characterized in that: A first limiting rib (224) is provided on the lower surface of the first clamping plate (22), the first limiting rib (224) is arranged in the first groove (221), and the first limiting rib (224) extends along the width direction of the base plate (10) to separate two adjacent lining plates.

5. The welding fixture according to claim 3, characterized in that: A plurality of extension bosses (234) are arranged on the surface of the second clamping plate (23) facing the first clamping plate (22), and the plurality of extension bosses (234) are arranged at intervals along the length direction of the second clamping plate (23), and each of the extension bosses (234) is extended in a direction toward the first clamping plate (22), and each of the extension bosses (234) is provided with the terminal avoidance portion (21).

6. The welding fixture according to claim 5, characterized in that: A second limiting rib (235) is provided on the lower surface of the second clamping plate (23), the first end of the second limiting rib (235) is provided in the third groove (231), the second end of the second limiting rib (235) is provided on the lower surface of the extending boss (234), and the second limiting rib (235) extends along the width direction of the substrate (10) and is located above the bottom plate to separate two adjacent lining plates.

7. The welding fixture according to claim 3, characterized in that: The terminal avoidance portion (21) comprises a positioning through hole (211), and the positioning through hole (211) is provided on both the first clamping plate (22) and the second clamping plate (23).

8. The welding fixture according to claim 7, characterized in that: There is a gap between the terminal and the hole wall of the positioning through hole (211).

9. The welding fixture according to claim 1, characterized in that: The accommodating portion (11) comprises a plurality of mounting holes (111), the plurality of mounting holes (111) are arranged in an array on the substrate (10), the plurality of pin wings of the bottom plate are arranged in a one-to-one correspondence with the plurality of mounting holes (111), and the plurality of pin wings are correspondingly inserted into the plurality of mounting holes (111).

10. The welding fixture according to claim 1, characterized in that: The clamping piece (20) and the base plate (10) are both made of graphite.

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