Pressing mechanism for testing performance of high-linearity transimpedance amplifier chip

Abstract

The utility model discloses a pressing mechanism for testing the chip performance of a high-linearity transimpedance amplifier, which comprises a mounting plate, a clamping block is fixed on the mounting plate, a connecting plate is arranged on the mounting plate, a clamping groove matched with the clamping block is formed in the connecting plate, the mounting plate and the connecting plate are fixed under a fixing piece, a sliding groove is formed in the connecting plate, and the clamping groove is matched with the clamping block. The sliding groove is slidably connected with a sliding plate, and a pressing plate is fixed to the sliding plate. According to the utility model, under the elastic action of the spring, the sliding plate is matched with the pressing plate to press and fix the transimpedance amplifier on the mounting plate, the bending rod can be rotated under the elastic action of the torsion spring when the pulling force on the bending rod is released until the bending rod rotates to fix the connecting plate on the mounting plate, and at the moment, the connection between the transimpedance amplifier and the mounting plate is completed; and then the mounting plate is connected with the testing mechanism, so that the trans-impedance amplifier can be tested.

Description

Technical Field

[0001] The utility model relates to the technical field of transimpedance amplifiers, in particular to a pressing mechanism for testing the performance of a high-linearity transimpedance amplifier chip. Background Art

[0002] When testing the performance of a high-linearity transimpedance amplifier chip, it needs to be fixed. However, the traditional pressing and fixing method is rather cumbersome during the continuous disassembly and installation of the transimpedance amplifier. Since the transimpedance amplifier chip is relatively fragile, there is a certain probability of damaging the transimpedance amplifier chip once there is an operation error.

[0003] Therefore, the traditional pressing mechanism for testing the transimpedance amplifier chip can be improved to simplify the fixing process of the transimpedance amplifier chip. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a pressing mechanism for testing the performance of a high-linearity transimpedance amplifier chip in order to solve the above problems.

[0005] In order to achieve the above purpose, the utility model adopts the following technical scheme:

[0006] A pressing mechanism for testing the performance of a high-linearity transimpedance amplifier chip includes a mounting plate. A clamping block is fixed on the mounting plate, and a connecting plate is provided on the mounting plate. A clamping groove adapted to the clamping block is formed on the connecting plate, and the mounting plate and the connecting plate are fixed under a fixing member. A sliding groove is formed on the connecting plate, and a sliding plate is slidably connected to the sliding groove. A pressing plate is fixed on the sliding plate, and an adjusting member for adjusting the position of the sliding plate is provided on the connecting plate.

[0007] Preferably, the adjusting member includes a connecting rod fixed on the sliding plate. A through hole is formed on the connecting rod, and a vertical rod is fixed on the connecting plate. The vertical rod is slidably connected to the through hole of the connecting rod. A spring is sleeved on the vertical rod, and a handle is fixed at the end of the vertical rod.

[0008] Preferably, one end of the spring is fixedly connected to the upper surface of the connecting rod, and the other end is fixedly connected to the handle.

[0009] Preferably, the fixing member includes a bent rod rotatably connected to the mounting plate. A torsion spring is provided between the bent rod and the mounting plate, and the torsion spring pushes the bent rod to rotate until the bent rod presses on the connecting plate to fix the mounting plate and the connecting plate as a whole.

[0010] Preferably, an elastic rubber gasket is provided on the part of the connecting rod in contact with the connecting plate.

[0011] Preferably, the surface of the handle is provided with anti-slip lines.

[0012] In summary, due to the adoption of the above technical solution, the beneficial effects of the present utility model are as follows:

[0013] 1. In this application, under the elastic force of the spring, the skateboard and the pressure plate cooperate to press and fix the transimpedance amplifier on the mounting plate. When the pulling force on the bent rod is released, under the elastic force of the torsion spring, the bent rod can be caused to rotate until the bent rod rotates to fix the connecting plate on the mounting plate. At this time, the connection between the transimpedance amplifier and the mounting plate is completed. Subsequently, the mounting plate can be connected to the testing mechanism, and thus the testing of the transimpedance amplifier can be realized.

[0014] 2. In this application, by connecting the transimpedance amplifier chip to be tested with the mounting plate, and then only fixing the mounting plate to the testing mechanism, the transimpedance amplifier chip can be tested. This is relatively convenient, reducing the burden on the staff and avoiding accidental damage to the transimpedance amplifier chip. This pressing mechanism can not only fix the transimpedance amplifier but also protect it. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 Shows the overall structural schematic diagram of the pressing and fixing mechanism for the transimpedance amplifier chip provided by an embodiment of the present utility model;

[0016] Figure 2 Shows the partial structural schematic diagram of the pressing mechanism for the transimpedance amplifier chip provided by an embodiment of the present utility model;

[0017] Figure 3 Shows the structural schematic diagram of the mounting plate provided by an embodiment of the present utility model;

[0018] Figure 4 Shows the partial structural schematic diagram of the connecting plate provided by an embodiment of the present utility model;

[0019] Legend Explanation:

[0020] 1. Mounting plate; 2. Clamping block; 3. Bent rod; 4. Torsion spring; 5. Connecting plate; 6. Chute; 7. Card slot; 8. Skateboard; 9. Pressure plate; 10. Connecting rod; 11. Through hole; 12. Vertical rod; 13. Handle; 14. Spring. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0021] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present utility model.

[0022] Embodiment 1:

[0023] The present utility model provides a technical solution. Please refer to Figures 1-4 :

[0024] A pressing mechanism for testing the performance of a high-linearity transimpedance amplifier chip, including a mounting plate 1, a clamping block 2 is fixed on the mounting plate 1, a connecting plate 5 is provided on the mounting plate 1, a clamping groove 7 adapted to the clamping block 2 is opened on the connecting plate 5, the mounting plate 1 and the connecting plate 5 are fixed under a fixing member, a sliding groove 6 is opened on the connecting plate 5, a sliding plate 8 is slidably connected to the sliding groove 6, a pressing plate 9 is fixed on the sliding plate 8, and an adjusting member for adjusting the position of the sliding plate 8 is provided on the connecting plate 5.

[0025] Embodiment 2:

[0026] Basically the same as the technical solution of Embodiment 1, the difference is that, as Figure 3 shown, the adjusting member includes a connecting rod 10 fixed on the sliding plate 8, a through hole 11 is opened on the connecting rod 10, a vertical rod 12 is fixed on the connecting plate 5, and the vertical rod 12 is slidably connected to the through hole 11 of the connecting rod 10. A spring 14 is sleeved on the vertical rod 12, and a handle 13 is fixed at the end of the vertical rod 12. Anti-slip patterns are provided on the surface of the handle 13. One end of the spring 14 is fixedly connected to the upper surface of the connecting rod 10, and the other end is fixedly connected to the handle 13. An elastic rubber gasket is provided on the part of the connecting rod 10 in contact with the connecting plate 5. Under the elastic force of the spring 14, the connecting rod 10 can be moved downward, causing the sliding plate 8 and the pressing plate 9 to cooperate to fix the transimpedance amplifier on the mounting plate 1.

[0027] Embodiment 3:

[0028] Basically the same as the technical solution of Embodiment 1, the difference is that, as Figure 3 shown, the fixing member includes a bent rod 3 rotatably connected to the mounting plate 1, a torsion spring 4 is provided between the bent rod 3 and the mounting plate 1, and the torsion spring 4 pushes the bent rod 3 to rotate until the bent rod 3 presses on the connecting plate 5 to fix the mounting plate 1 and the connecting plate 5 together.

[0029] In summary, for the transimpedance amplifier provided in this embodiment, it can be placed on the mounting plate 1, and then the bent rod 3 can be rotated to make the bent rod 3 away from the upper surface of the mounting plate 1. Then the bottom of the connecting plate 5 can be abutted against the mounting plate 1, and under the elastic force of the spring 14, the sliding plate 8 and the pressing plate 9 cooperate to press and fix the transimpedance amplifier on the mounting plate 1.

[0030] At this time, the pulling force on the bent rod 3 can be released, and under the elastic force of the torsion spring 4, the bent rod 3 can be caused to rotate until the bent rod 3 rotates to fix the connecting plate 5 on the mounting plate 1. At this time, the connection between the transimpedance amplifier and the mounting plate 1 is completed.

[0031] The staff members successively connect the transimpedance amplifier chips to be tested with the mounting plate 1. Subsequently, only by fixing the mounting plate 1 to the testing mechanism can the transimpedance amplifier chips be tested, which is relatively convenient, reduces the burden on the staff, and avoids accidental damage to the transimpedance amplifier chips.

[0032] The above description of the embodiments enables those skilled in the art to implement or use the present utility model. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present utility model. Therefore, the present utility model will not be limited to these embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A pressing mechanism for testing the performance of a high linearity transimpedance amplifier chip, comprising a mounting plate (1), characterized in that: A clamping block (2) is fixed on the mounting plate (1), and a connecting plate (5) is provided on the mounting plate (1), and a clamping groove (7) matched with the clamping block (2) is provided on the connecting plate (5), and the mounting plate (1) and the connecting plate (5) are fixed under a fixing member, a sliding groove (6) is provided on the connecting plate (5), and a sliding plate (8) is slidably connected to the sliding groove (6), a pressing plate (9) is fixed on the sliding plate (8), and an adjusting member for adjusting the position of the sliding plate (8) is provided on the connecting plate (5).

2. The pressing mechanism for testing the performance of a high linearity transimpedance amplifier chip according to claim 1, characterized in that: The adjusting member comprises a connecting rod (10) fixed on a slide plate (8), and a through hole (11) is provided on the connecting rod (10); a vertical rod (12) is fixed on the connecting plate (5), and the vertical rod (12) is slidably connected to the through hole (11) of the connecting rod (10); a spring (14) is sleeved on the vertical rod (12), and a handle (13) is fixed at the end of the vertical rod (12).

3. The pressing mechanism for testing the performance of a high linearity transimpedance amplifier chip according to claim 2, characterized in that: One end of the spring (14) is fixedly connected to the upper surface of the connecting rod (10), and the other end is fixedly connected to the handle (13).

4. The pressing mechanism for testing the performance of a high linearity transimpedance amplifier chip according to claim 1, characterized in that: The fixing member comprises a bent rod (3) rotatably connected to the mounting plate (1), and a torsion spring (4) is provided between the bent rod (3) and the mounting plate (1), and the torsion spring (4) pushes the bent rod (3) to rotate until the bent rod (3) is pressed on the connecting plate (5), thereby fixing the mounting plate (1) and the connecting plate (5) as a whole.

5. The pressing mechanism for testing the performance of a high linearity transimpedance amplifier chip according to claim 2, characterized in that: An elastic rubber gasket is provided on the portion of the connecting rod (10) that contacts the connecting plate (5).

6. The pressing mechanism for testing the performance of a high linearity transimpedance amplifier chip according to claim 2, characterized in that: The surface of the handle (13) is provided with anti-slip grooves.

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