Encapsulated inductor shell structure and inverter

Abstract

The utility model provides a potting inductor shell structure and inverter, the potting inductor shell structure includes: inductor shell and two sealing baffle plate, the inner cavity of inductor shell is used for placing the inductor, the two end face and top surface of inductor shell are open, the periphery of the outer wall of inductor shell is provided with a plurality of heat dissipation teeth; the two sealing baffles are used for sealing the two end faces of the inductor shell respectively. According to the utility model, the shape and the size of the inductor can be adapted through the matched inductor shell and the sealing baffle plate, so that a basis is provided for reserving a proper preset gap, the consumption of heat-conducting glue is reduced as much as possible, and the heat dissipation effect of the inductor is improved; on the basis, a matched sealing groove is further reserved, the CNC machining amount can be effectively reduced, the production cost of a product is reduced, and the production cycle of the product is shortened.

Description

Technical Field

[0001] The utility model relates to a housing structure of an electronic component, in particular to a potting inductor housing structure; and further relates to an inverter including the potting inductor housing structure. Background Art

[0002] With the development of electronic devices towards miniaturization and high performance, as one of the key electronic components, inductors also play an increasingly important role in circuit design. The packaging technology of inductors directly affects their heat dissipation performance, mechanical strength and production cost. However, the existing inductor packaging has the following problems: First, the heat dissipation problem. Traditional inductor packaging requires adding more thermal conductive glue inside the inductor housing, and the thermal conductivity of the thermal conductive glue is low, which affects the heat dissipation effect of the product. Since the inductor is prone to overheating in high-power or high-frequency applications, it will also affect the performance and lifespan of the product. Second, the production cost. In the existing technology, due to the need to meet the sealing effect, the packaging of inductors usually requires more CNC machining, which not only increases the production cost of the product, but also extends its production cycle. Among them, CNC refers to Computer numerical control, that is, computer numerical control machine tools.

[0003] Therefore, in order to solve the above problems, a new type of potting inductor housing structure needs to be proposed to meet the requirements of improving heat dissipation efficiency and reducing production cost. Summary of the Invention

[0004] The technical problem to be solved by the utility model is how to provide a potting inductor housing structure, which can effectively improve the heat dissipation efficiency and further reduce the production cost of the product.

[0005] In response to this, the utility model provides a potting inductor housing structure, including:

[0006] An inductor housing, the inner cavity of the inductor housing is used to place the inductor, both end faces and the top face of the inductor housing are open, and a plurality of heat dissipation teeth are arranged around the outer wall of the inductor housing; and

[0007] Two sealing baffles, the two sealing baffles are respectively used to seal the two end faces of the inductor housing.

[0008] A further improvement of the utility model is that a first sealing groove is arranged on the inductor housing, a second sealing groove is arranged on the sealing baffle, and the position of the second sealing groove corresponds to the position of the first sealing groove.

[0009] A further improvement of the present utility model lies in that the first sealing groove is arranged on both sides of the top surface of the inductor housing. At one end of both sides of the first sealing groove close to the sealing baffle, there is a bent groove, and the second sealing groove is connected to the first sealing groove through the bent groove. A further improvement of the present utility model lies in that it further includes a sealing rubber strip, and the sealing rubber strip is arranged in the communication space enclosed by the first sealing groove and the second sealing groove.

[0010] A further improvement of the present utility model lies in that both sides of the opening on the top surface of the inductor housing respectively have a flanging structure facing the outside. The flanging structure is parallel to the first sealing groove, and a plurality of mounting holes are arranged on the flanging structure. The potted inductor housing structure is mounted on the inverter chassis through the mounting holes.

[0011] A further improvement of the present utility model lies in that the gap between the inner wall and the outer wall of the inductor housing is used to fill thermal conductive glue.

[0012] A further improvement of the present utility model lies in that the outer wall of the inductor housing is provided with a hook structure, and at least one hook is arranged on the hook structure.

[0013] A further improvement of the present utility model lies in that the height of the hook structure is higher than the height of the heat dissipation teeth.

[0014] The present utility model also provides an inverter, including:

[0015] An inverter chassis; and

[0016] The potted inductor housing structure as described above, and the flanging structure of the potted inductor housing structure is fitted and mounted on the back of the inverter chassis.

[0017] A further improvement of the present utility model lies in that it further includes a hanging frame back plate, and the inductor housing is connected to the hanging frame back plate through the hook structure.

[0018] Compared with the prior art, the beneficial effects of the present utility model are as follows: It includes an inductor housing and two sealing baffles. The inner cavity of the inductor housing is used to place the inductor. Both end faces and the top surface of the inductor housing are open, and a plurality of heat dissipation teeth are arranged around the outer wall of the inductor housing; and the two sealing baffles are respectively used to seal the two end faces of the inductor housing. Therefore, the present utility model can adapt to the shape and size of the inductor through the matching inductor housing and sealing baffle, providing a basis for retaining a suitable preset gap, so as to minimize the amount of thermal conductive glue used and increase the heat dissipation effect of the inductor; on this basis, a matching sealing groove is further reserved, which can effectively reduce the CNC processing amount, reduce the production cost of the product, and shorten the production cycle of the product. Description of the Drawings

[0019] Figure 1 Structural schematic diagram of an embodiment of the present utility model;

[0020] Figure 2 Exploded structural schematic diagram of an embodiment of the present utility model;

[0021] Figure 3 is Figure 2 Enlarged structural schematic diagram of A in

[0022] Figure 4 Stereoscopic structural schematic diagram of an embodiment of the present utility model;

[0023] Figure 5 Cross-sectional structural schematic diagram of an inductor housing of an embodiment of the present utility model;

[0024] Figure 6 Cross-sectional structural schematic diagram of an embodiment of the present utility model;

[0025] Figure 7 Top view structural schematic diagram of an embodiment of the present utility model;

[0026] Figure 8 Side view structural schematic diagram of an embodiment of the present utility model;

[0027] Figure 9 Structural schematic diagram after potting the inductor of an embodiment of the present utility model;

[0028] Figure 10 Assembly structural schematic diagram of an embodiment of the present utility model;

[0029] Figure 11 Exploded assembly structural schematic diagram of an embodiment of the present utility model.

[0030] Reference numerals in the drawings: 1 - inductor housing; 101 - first sealing groove; 102 - bending groove; 103 - heat dissipation teeth; 104 - hook structure; 105 - hook; 106 - flanging structure; 107 - mounting hole; 2 - sealing baffle; 201 - second sealing groove; 3 - connecting piece; 4 - inductor; 5 - hanger back plate; 6 - inverter chassis; 7 - thermal conductive adhesive. Detailed implementation manners

[0031] In the description of the present utility model, if orientation descriptions are involved, such as "upper", "lower", "front", "rear", "left", "right", etc., the orientation or positional relationship indicated is based on the orientation or positional relationship shown in the drawings. This is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model. If a technical feature is described as "arranged", "fixed", "connected", "installed" on another technical feature, it can be directly arranged, fixed, connected on another technical feature, or indirectly arranged, fixed, connected, installed on another technical feature.

[0032] In the description of the present utility model, if "several" is involved, its meaning is more than one; if "multiple" is involved, its meaning is more than two; if "greater than", "less than", "exceeding" are involved, they should all be understood as not including the base number; if "above", "below", "within" are involved, they should all be understood as including the base number. If "first", "second", etc. are involved, they should be understood as only used for the distinction of the same or similar technical feature names, and cannot be understood as implying / indicating the relative importance of the technical features, cannot be understood as implying / indicating the quantity of the technical features, nor can it be understood as implying / indicating the sequence relationship of the technical features.

[0033] The following further describes in detail the preferred embodiments of the present utility model with reference to the drawings.

[0034] As Figures 1 to 11 shown, this embodiment provides a potting inductor housing structure, including:

[0035] An inductor housing 1, the inner cavity of the inductor housing 1 is used to place an inductor 4, both end faces and the top surface of the inductor housing 1 are open, and a plurality of heat dissipation teeth 103 are arranged around the outer wall of the inductor housing 1; and

[0036] Two sealing baffles 2, and the two sealing baffles 2 are respectively used to seal the two end faces of the inductor housing 1.

[0037] As Figures 2 to 6As shown, the inductor housing 1 in this embodiment uses a heat dissipation housing, and a plurality of heat dissipation teeth 103 are evenly distributed around the inductor housing 1. Optionally, the heat dissipation housing is made of aluminum extrusion, such as an aluminum extrusion of AL6063-T5, with a thermal conductivity of 209 W / mK, to improve the thermal conductivity of the die-cast inductor housing 1; the heat dissipation teeth 103 are evenly distributed around the inductor housing 1 to increase the heat dissipation effect. In this embodiment, different models of inductors 4 can share the same mold, and only the inductor housing 1 with different lengths needs to be set according to the corresponding inductor 4, which is beneficial to reducing the investment in mold opening costs in the early stage and effectively reducing the production cost and cycle of the product.

[0038] This embodiment adopts the technical solution of using the inductor housing 1 and the sealing baffles 2 on both sides for supporting sealing. It can adapt to the shape and size of the inductor 4 through the supporting inductor housing 1 and sealing baffles 2, reserve a suitable preset gap according to the shape and size of the inductor 4 on the cross-section of the inductor housing 1, apply waterproof glue on the end face of the inductor housing 1, and then connect the inductor housing 1 and the sealing baffles 2 through the optional connecting piece 3 to achieve the sealing effect, and can minimize the amount of thermal conductive glue 7 used and increase the heat dissipation effect of the inductor.

[0039] Optionally, as Figure 6 shown, the shape of the sealing baffle 2 in this embodiment is two semi-circles with the same diameter on the left and right, and an isosceles trapezoid in the middle, where the two waists of the isosceles trapezoid are the diameter sides of the two semi-circles on the left and right respectively. In other embodiments, the shape of the sealing baffle 2 can also be other shapes, such as circular, oval, square, etc., which can be specifically determined according to the shape of the inductor 4 to be assembled or the combined shape of multiple inductors 4.

[0040] Optionally, the gap between the inner wall of the inductor housing 1 and the outer wall of the inductor 4 in this embodiment is used to fill the thermal conductive glue 7. The thermal conductive glue 7 can be optionally thermal conductive silicone.

[0041] As Figure 9As shown, optionally, the cross-sectional shape and size of the inductor housing 1 in this embodiment are respectively adapted to the shape and size of the inductor 4. Specifically, the bottom and top of the cross-section of the inductor housing 1 in this embodiment are respectively adapted to the bottom and top of the inductor 4. Optionally, a support plane is provided at the bottom of the cross-section of the inductor housing 1 for directly supporting the inductor 4; the height between the bottom and top of the cross-section of the inductor housing 1 is adapted to the thickness of the inductor 4, thereby reducing the thermal conductive adhesive 7 at the top of the inductor 4. The gap between the inner wall of the inductor housing 1 and the outer wall of the inductor 4 is a preset gap, and the preset gap can be optionally 2 mm, with the error controlled within ±1 mm; and the two sealing baffles 2 are respectively used to seal the two end faces of the inductor housing 1. Therefore, the cross-section of the inductor housing 1 in this embodiment can well adapt to the shape and size of the inductor 4, and an optional preset gap of 2 mm is reserved to reduce the thermal conductive adhesive 7 between the inductor housing 1 and the inductor 4, increase the heat dissipation effect of the inductor 4, and at the same time can effectively reduce the cost of potting glue.

[0042] As Figure 2 and Figure 3 shown, optionally, a first sealing groove 101 is provided on the inductor housing 1 in this embodiment, and a second sealing groove 201 is provided on the sealing baffle 2, and the position of the second sealing groove 201 corresponds to the position of the first sealing groove 101.

[0043] In this embodiment, by reserving a matching sealing groove, that is, reserving a matching first sealing groove 101 and second sealing groove 201, the overall sealing strip can be pasted, which can effectively reduce the CNC processing amount, reduce the production cost of the product, and shorten the production cycle of the product. The preset gap is also called the preset safety gap and can be adjusted according to actual situations and requirements, and the default setting is 2 mm; the inductor 4 refers to a bare inductor, that is, the inductor before assembling the inductor housing 1 and the sealing baffle 2; the connecting member 3 refers to a structural member for realizing fixed connection, including but not limited to screws and countersunk screws, etc.; CNC processing refers to computer numerical control machine tool processing.

[0044] As Figure 2 , Figure 3 and Figure 5 shown, the first sealing groove 101 in this embodiment is provided on both sides of the top surface of the inductor housing 1, and bending grooves 102 are provided at one end of the two first sealing grooves 101 close to the sealing baffle 2. The second sealing groove 201 is connected to the first sealing groove 101 through the bending grooves 102, so that after assembling the sealing baffle 2, the first sealing groove 101, the bending grooves 102 and the second sealing groove 201 form an integral sealing groove, as Figure 4 andFigure 7 as shown in the figure, to improve the assembly efficiency of the product and ensure its sealing effect.

[0045] Optionally, this embodiment further includes a sealing strip, which is arranged in the communication space surrounded by the first sealing groove 101 and the second sealing groove 201 to better ensure the sealing effect of the potted inductor housing structure.

[0046] Optionally, as Figure 2 and Figure 3 shown in the figure, on both sides of the top opening of the inductor housing 1 of this embodiment, there are respectively flanging structures 106 facing outward. The flanging structures 106 are parallel to the first sealing groove 101. A plurality of mounting holes 107 are arranged on the flanging structures 106. The potted inductor housing structure is mounted on the inverter chassis 6 through the mounting holes 107. It can be understood that the flanging structures 106 are basically flush with the sealing strip on the sealing groove. When the potted inductor housing structure is mounted on the back of the chassis through the mounting holes 107 on the flanging structures 106, the top opening of the potted inductor housing structure can be completely attached to the back of the chassis, further strengthening the sealing of the potted inductor housing structure while saving a top plate and improving the assembly efficiency of the potted inductor housing structure.

[0047] As Figures 2 to 6 shown in the figure, on the outer wall of the inductor housing 1 of this embodiment, there is a hook structure 104, and the hook structure 104 is arranged on the outer side of the inductor housing 1 away from the first sealing groove 101 so as to be able to achieve hook assembly away from the back of the chassis 8; as Figure 8 shown in the figure, at least one hook 105 is arranged on the hook structure 104 to improve the assembly efficiency of the product.

[0048] As Figure 5 、 Figure 6 and Figure 9 shown in the figure, the height of the hook structure 104 of this embodiment is higher than the height of the heat dissipation teeth 103, so that rapid assembly can be better achieved. The structure is simple and easy to implement, and no avoidance design is required.

[0049] Optionally, as Figure 10 and Figure 11 shown in the figure, this embodiment further provides an inverter, including: an inverter chassis 6; and the potted inductor housing structure as described above, and the flanging structure 106 of the potted inductor housing structure is attached and mounted to the back of the inverter chassis 6. Optionally, it further includes a hanging rack back plate 5, and the inductor housing 1 is connected to the hanging rack back plate 5 through the hook structure 104. In this embodiment, the inductor housing 1 is buckled on the bending installation part of the hanging rack back plate 5 through the hook structure 104, thereby achieving the effect of rapid installation and improving the degree of humanized design of the product.

[0050] The specific embodiments described above are the preferred embodiments of the present utility model, and do not limit the specific implementation scope of the present utility model. The scope of the present utility model includes but is not limited to these specific embodiments. Any equivalent changes made according to the shape and structure of the present utility model are within the protection scope of the present utility model.

Claims

1. A potted inductor shell structure, characterized in that: include: An inductor housing (1), wherein the inner cavity of the inductor housing (1) is used to place an inductor (4), two end surfaces and a top surface of the inductor housing (1) are open, and a plurality of heat dissipation teeth (103) are arranged around the outer wall of the inductor housing (1); and Two sealing baffles (2), the two sealing baffles (2) being used to seal the two end surfaces of the inductor housing (1) respectively.

2. The potted inductor shell structure according to claim 1, characterized in that: The inductor housing (1) is provided with a first sealing groove (101), and the sealing baffle (2) is provided with a second sealing groove (201), wherein the position of the second sealing groove (201) corresponds to the position of the first sealing groove (101).

3. The potted inductor shell structure according to claim 2, characterized in that: The first sealing groove (101) is arranged on both sides of the top surface of the inductor housing (1), and one end of the first sealing groove (101) on both sides close to the sealing baffle (2) is provided with a bending groove (102), and the second sealing groove (201) is connected to the first sealing groove (101) via the bending groove (102).

4. The potted inductor shell structure according to claim 3, characterized in that: It also includes a sealing strip, which is arranged in a communicating space enclosed by the first sealing groove (101) and the second sealing groove (201).

5. The potted inductor shell structure according to any one of claims 2 to 4, characterized in that: Both sides of the top opening of the inductor housing (1) are provided with flange structures (106) facing outwards, the flange structures (106) are parallel to the first sealing groove (101), a plurality of mounting holes (107) are provided on the flange structures (106), and the potted inductor housing structure is mounted on the inverter chassis (6) through the mounting holes (107).

6. The potted inductor shell structure according to claim 5, characterized in that: The gap between the inner wall of the inductor housing (1) and the outer wall of the inductor (4) is used to fill with thermal conductive glue.

7. The potted inductor shell structure according to claim 6, characterized in that: The outer wall of the inductor housing (1) is provided with a hook structure (104), and at least one hook (105) is provided on the hook structure (104).

8. The potted inductor shell structure according to claim 7, characterized in that: The height of the hook structure (104) is higher than the height of the heat dissipation teeth (103).

9. An inverter, characterized in that: include: Inverter chassis (6); and The potted inductor shell structure according to any one of claims 5 to 8, wherein the flange structure (106) of the potted inductor shell structure is fitted onto the back of the inverter chassis (6).

10. The inverter according to claim 9, characterized in that: It also comprises a rack back plate (5), and the inductor housing (1) is connected to the rack back plate (5) via a hook structure (104).

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