Electrostatic chuck

Abstract

The electrostatic chuck comprises an electrostatic chuck body and a water channel assembly, the electrostatic chuck body comprises a chuck body, a heating layer is arranged on the upper surface of the chuck body, and a supporting plate is installed at the lower end of the chuck body; the water channel assembly comprises a water channel groove body, the water channel groove body is formed in the side wall of the bottom of the suction cup body, the water channel groove body is arranged to be in a spiral shape, and the water channel groove body is formed from the outer side wall close to the suction cup body to the center of the suction cup body. According to the utility model, the water channel is spiral, and the width of the water channel is gradually increased from the water inlet to the water outlet, so that the closer the water channel is to the water outlet, the faster the water flow speed is, the better the cooling effect at the water outlet is, and the problem that the heat dissipation performance is reduced due to the rise of the water temperature in the heat dissipation process of the water channel is solved; therefore, under the condition of not increasing additional structures and processing procedures, the heat exchange capability of different water channel positions is changed, and the heat dissipation uniformity and the temperature uniformity of the electrostatic chuck are improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductors, and particularly relates to an electrostatic chuck. Background Art

[0002] When a semiconductor process equipment performs a wafer processing process flow, the wafer is generally placed on an electrostatic chuck, and the electrostatic chuck is placed in a cavity with a certain vacuum degree.

[0003] A water channel is arranged on the electrostatic chuck. Due to heat transfer, there is a temperature difference in the water in the existing water channel of the electrostatic chuck. From the water inlet to the water outlet, the water temperature continuously rises, and the heat exchange effect of the water continuously decreases. The closer to the water outlet position, the worse the heat dissipation effect, which affects the temperature uniformity of the electrostatic chuck.

[0004] The information disclosed in this background art section is only intended to enhance the overall understanding of the present utility model and should not be regarded as an admission or any form of implication that this information constitutes prior art already known to those of ordinary skill in the art. Summary of the Utility Model

[0005] The purpose of the present utility model is to provide an electrostatic chuck, which can solve the problem that the temperature difference in the water channel on the electrostatic chuck affects the temperature uniformity of the electrostatic chuck.

[0006] In order to achieve the above purpose, the technical solution provided by a specific embodiment of the present utility model is as follows:

[0007] An electrostatic chuck, comprising:

[0008] The electrostatic chuck includes a chuck body. A heating layer is arranged on the upper surface of the chuck body, and a support plate is installed at the lower end of the chuck body. The chuck body is a component for adsorbing and fixing a wafer in a semiconductor processing process. The heating layer arranged on the chuck body is used for heating in the processing process, and the support plate is used for supporting and fixing the chuck body and installing accessory components. At the same time, when the support plate is installed at the bottom of the chuck body, there is good sealing between the chuck body and the support plate.

[0009] Water channel assembly, including a water channel housing, which is opened on the bottom side wall of the suction cup body. The water channel housing is arranged in a spiral shape and is formed by opening from the outer side wall close to the suction cup body to the center of the suction cup body. One end of the water channel housing close to the outer side wall of the suction cup body is set as the water inlet, and one end of the water channel housing close to the center of the suction cup body is set as the water outlet. By opening a water channel housing on the bottom side wall of the suction cup body, water can flow on the water channel housing, so as to improve the heat transfer efficiency. The water channel housing is arranged in a spiral shape, so that water flows on the water channel housing in a spiral form, which increases the flow time and area of water on the water channel housing, thereby increasing the heat transfer efficiency. Due to the good sealing performance between the suction cup body and the support plate, water will not leak when flowing in the water channel housing. The water inlet and the water outlet enable water to enter from the outer side wall of the suction cup body and flow along the water channel housing to the center of the suction cup body.

[0010] In one or more embodiments of the present invention, a first mounting ring is integrally formed on the side wall of the support plate away from the heating layer, and a support frame is installed in the first mounting ring. The support frame installed in the first mounting ring can fit well with the lower side wall of the support plate, and there is good sealing performance between the support frame and the first mounting ring after installation.

[0011] In one or more embodiments of the present invention, the interior of the support frame is set as a hollow structure, and a second mounting ring is arranged on the bottom wall plate of the support frame.

[0012] In one or more embodiments of the present invention, the width of the spiral line of the water channel housing from the water inlet to the water outlet is set in a gradually increasing manner. The width of the spiral line continuously and uniformly increases from the water inlet to the water outlet, improving the cooling effect at the water outlet, and thus solving the problem of the decline in heat dissipation caused by the increase in water temperature during the water channel heat dissipation process.

[0013] In one or more embodiments of the present invention, a socket hole is opened at the position of the support plate corresponding to the water outlet, and a first water outlet pipe is installed in the socket hole. The first water outlet pipe is installed on the water outlet for leading out the water in the water channel housing, and a socket hole is opened on the support plate for installing the first water outlet pipe.

[0014] In one or more embodiments of the present invention, the lower end of the first water outlet pipe is placed in the support frame, and a second water outlet pipe is arranged on the bottom wall plate of the support frame. The second water outlet pipe is installed in the second mounting ring. After the first water outlet pipe leads out the water in the water channel housing, the water flows into the support frame and is then led out through the second water outlet pipe arranged on the bottom wall plate of the support frame.

[0015] In one or more embodiments of the present utility model, an installation hole is provided at a position corresponding to the water inlet on the support plate, and a water inlet pipe is installed in the installation hole. The water inlet pipe is installed on the water inlet for delivering water into the water channel tank body. By providing the installation hole on the support plate, it is convenient to install the water inlet pipe.

[0016] In one or more embodiments of the present utility model, the lower end of the second water outlet pipe is placed outside the support frame, and the lower end of the water inlet pipe is placed outside the support plate. The lower end of the second water outlet pipe is used to communicate with the return water pipeline, and the lower end of the water inlet pipe is used to communicate with the water delivery pipeline.

[0017] Compared with the prior art, by setting the water channel in a spiral shape and gradually increasing the width of the water channel from the water inlet to the water outlet, the present utility model improves the cooling effect at the water outlet, and thus solves the problem of the decrease in heat dissipation caused by the increase in water temperature during the heat dissipation process of the water channel. Therefore, without adding additional structures and processing procedures, the heat exchange capacity at different positions of the water channel is changed, and the uniformity of heat dissipation and the uniform temperature of the electrostatic chuck are improved. Description of the Drawings

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings described below are only some embodiments recorded in the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0019] Figure 1 Front view of an electrostatic chuck in an embodiment of the present utility model;

[0020] Figure 2 Stereogram of an electrostatic chuck in an embodiment of the present utility model;

[0021] Figure 3 Cross-sectional view of an electrostatic chuck in an embodiment of the present utility model;

[0022] Figure 4 In an embodiment of the present utility model Figure 3 Enlarged view of part A;

[0023] Figure 5 Schematic diagram of the water channel on the electrostatic chuck in an embodiment of the present utility model;

[0024] Figure 6 Schematic diagram of the support plate in an embodiment of the present utility model.

[0025] Main reference numeral description:

[0026] 1 - Electrostatic chuck, 11 - Chuck body, 12 - Heating layer, 13 - Support plate, 14 - First mounting ring, 15 - Support frame, 16 - Second mounting ring, 17 - Mounting hole, 2 - Water channel assembly, 21 - Water channel tank body, 22 - Water inlet, 23 - Water outlet, 24 - First water outlet pipe, 25 - Second water outlet pipe, 26 - Water inlet pipe. Detailed implementation manner

[0027] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0028] As Figures 1 to 3 shown, an electrostatic chuck in an embodiment of the present invention includes an electrostatic chuck 1 and a water channel assembly 2.

[0029] As Figures 1 to 3 shown, the electrostatic chuck 1 includes a chuck body 11. A heating layer 12 is provided on the upper surface of the chuck body 11, and a support plate 13 is installed at the lower end of the chuck body 11. The chuck body 11 is a component for adsorbing and fixing a wafer in a semiconductor processing technology. The heating layer 12 provided on the chuck body 11 is used for heating in the processing technology, and the support plate 13 is used for supporting and fixing the chuck body 11 and installing accessory components. At the same time, when the support plate 13 is installed at the bottom of the chuck body 11, there is good sealing between the chuck body 11 and the support plate 13.

[0030] As Figures 3 to 5As shown in the figure, the water channel assembly 2 includes a water channel housing 21. The water channel housing 21 is formed on the bottom side wall of the suction cup body 11. The water channel housing 21 is arranged in a spiral shape and is formed from the outer side wall of the suction cup body 11 close to the center of the suction cup body 11. One end of the water channel housing 21 close to the outer side wall of the suction cup body 11 is set as the water inlet 22, and one end of the water channel housing 21 close to the center of the suction cup body 11 is set as the water outlet 23. By providing the water channel housing 21 on the bottom side wall of the suction cup body 11, water can flow on the water channel housing 21, facilitating the improvement of the heat transfer efficiency. The water channel housing 21 is arranged in a spiral shape, enabling water to flow in a spiral form on the water channel housing 21, increasing the flow time and area of water on the water channel housing 21, thereby enhancing the heat transfer efficiency. Due to the good sealing performance between the suction cup body 11 and the support plate 13, water will not leak when flowing in the water channel housing 21. The water inlet 22 and the water outlet 23 allow water to enter from the outer side wall of the suction cup body 11 and flow along the water channel housing 21 to the center of the suction cup body 11.

[0031] As Figures 1 to 3 shown, a first mounting ring 14 is integrally formed on the side wall of the support plate 13 away from the heating layer 12, and a support frame 15 is installed inside the first mounting ring 14. The support frame 15 installed inside the first mounting ring 14 can fit well with the lower side wall of the support plate 13, and there is good sealing performance between the support frame 15 and the first mounting ring 14 after installation.

[0032] As Figure 3 shown, the interior of the support frame 15 is arranged as a hollow structure, and a second mounting ring 16 is provided on the bottom wall plate of the support frame 15.

[0033] As Figure 3 Combined Figure 4 shown, the width of the spiral line of the water channel housing 21 from the water inlet 22 to the water outlet 23 is set in a gradually increasing manner. The width of the spiral line continuously and uniformly increases from the water inlet 22 to the water outlet 23, improving the cooling effect at the water outlet 23, and thus solving the problem of the decline in heat dissipation caused by the increase in water temperature during the water channel heat dissipation process.

[0034] As Figure 3 Combined Figure 4 and Figure 6 shown, a socket hole is formed at the position of the support plate 13 corresponding to the water outlet 23, and a first water outlet pipe 24 is installed in the socket hole. The first water outlet pipe 24 is installed on the water outlet 23 for leading out the water in the water channel housing 21. A socket hole is formed on the support plate 13 for the installation of the first water outlet pipe 24.

[0035] As Figure 3 Combined Figure 4As shown, the lower end of the first water outlet pipe 24 is placed inside the support frame 15. A second water outlet pipe 25 is provided on the bottom wall plate of the support frame 15, and the second water outlet pipe 25 is installed inside the second mounting ring 16. After the water in the water channel groove body 21 is led out by the first water outlet pipe 24, it flows into the support frame 15, and then is led out through the second water outlet pipe 25 provided on the bottom wall plate of the support frame 15.

[0036] As Figure 3 and Figure 6 shown, a mounting hole 17 is opened at the position of the support plate 13 corresponding to the water inlet 22, and a water inlet pipe 26 is installed in the mounting hole 17. The water inlet pipe 26 is installed on the water inlet 22 and is used to convey water into the water channel groove body 21. By opening the mounting hole 17 on the support plate 13, it is convenient to install the water inlet pipe 26.

[0037] As Figures 1 to 3 shown, the lower end of the second water outlet pipe 25 is placed outside the support frame 15, and the lower end of the water inlet pipe 26 is placed outside the support plate 13. The lower end of the second water outlet pipe 25 is used to communicate with the return water pipeline, and the lower end of the water inlet pipe 26 is used to communicate with the water delivery pipeline.

[0038] During use, the water in the water delivery pipe is conveyed into the water inlet 22 through the water inlet pipe 26, so that the water flows in the water channel groove body 21. When the water flows in the water channel groove body 21, it can flow in a spiral form at the bottom of the suction cup body 11. When the water flows to the water outlet 23, it will flow into the support frame 15 through the first water outlet pipe 24, and then the water flows into the return pipe through the second water outlet pipe 25; since the width of the spiral line continuously and uniformly increases from the water inlet 22 to the water outlet 23, the cooling effect at the water outlet 23 is improved, and thus the problem of the decrease in heat dissipation caused by the increase in water temperature during the water channel heat dissipation process is solved. Therefore, without adding additional structures and processing procedures, the heat exchange capacity at different water channel positions is changed, and the uniformity of heat dissipation and the temperature uniformity of the electrostatic chuck are improved.

[0039] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present invention. Any reference signs in the claims should not be regarded as limiting the claims involved.

[0040] In addition, it should be understood that although this specification is described according to embodiments, not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. An electrostatic chuck, characterized in that: include: The electrostatic chuck comprises a chuck body, the upper surface of which is provided with a heating layer, and the lower end of which is provided with a support plate; A water channel assembly comprises a water channel trough body, wherein the water channel trough body is opened on the bottom side wall of the suction cup body, the water channel trough body is arranged in a spiral shape, the width of the spiral line of the water channel trough body from the water inlet to the water outlet is arranged in a manner of gradually and evenly increasing, the water channel trough body is opened from the outer wall close to the suction cup body to the center of the suction cup body, one end of the water channel trough body close to the outer wall of the suction cup body is arranged as the water inlet, and one end of the water channel trough body close to the center of the suction cup body is arranged as the water outlet.

2. An electrostatic chuck according to claim 1, characterized in that: A first mounting ring is integrally formed on the side wall of the support plate away from the heating layer, and a support frame is installed in the first mounting ring.

3. An electrostatic chuck according to claim 2, characterized in that: The interior of the support frame is arranged as a hollow structure, and a second mounting ring is arranged on the bottom wall plate of the support frame.

4. An electrostatic chuck according to claim 3, characterized in that: A sleeve hole is provided at a position of the support plate corresponding to the water outlet, and a first water outlet pipe is installed in the sleeve hole.

5. An electrostatic chuck according to claim 4, characterized in that: The lower end of the first water outlet pipe is placed in the support frame, and a second water outlet pipe is arranged on the bottom wall plate of the support frame. The second water outlet pipe is installed in a second installation ring.

6. An electrostatic chuck according to claim 5, characterized in that: A mounting hole is provided at a position of the support plate corresponding to the water inlet, and a water inlet pipe is installed in the mounting hole.

7. An electrostatic chuck according to claim 6, characterized in that: The lower end of the second water outlet pipe is placed outside the support frame, and the lower end of the water inlet pipe is placed outside the support plate.

Images