Industrial network switch
By adopting a combined structure of cover plate and support plate in industrial network switches, built-in heat conductor sheet and external fan, short circuits and poor contact problems caused by dust accumulation in harsh environments are solved, effective heat dissipation and dust protection are achieved, and the service life of the equipment is extended.
Patent Information
- Application Number
- CN202422237453.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-11
- Publication Date
- 2025-06-24
- Estimated Expiration
- 2034-09-11
AI Technical Summary
Existing network switches use natural ventilation and heat dissipation in harsh environments, which are prone to dust accumulation and internal short circuits and poor contact problems.
An industrial network switch is designed, adopting a combined structure of a covering plate and a support plate, with built-in heat conductor sheet and an outer fan, and effectively heat dissipation and dust protection through passive hydrogel film and the temperature difference between day and night.
Effectively prevent dust accumulation, extend the service life of electronic components, and improve the stability and reliability of the equipment in harsh environments.
Smart Images

Figure CN223024436U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of network switches, in particular to an industrial network switch. Background Art
[0002] Industrial switches usually need to work in harsh environments, such as high temperature, humidity, vibration, etc. If the device does not have sufficient environmental adaptability, it may lead to failures or shortened lifespan. Improving the environmental adaptability of the device is the key to ensuring the stable operation of industrial equipment in harsh environments. For example, using effective heat dissipation designs, such as heat sinks, fans, etc., to keep the device within a suitable temperature range.
[0003] Conventional heat dissipation settings are to open holes in the inner cavity, dissipate heat through a fan, and cooperate with through holes to achieve air circulation. However, in a harsh environment, once there are many dust particles, the use of this method will have a great impact on the lifespan of internal components. Moreover, since most electronic components are in a bare state, the adhesion of dust will also cause short circuits of components and affect the signal transmission speed. Based on this, it is necessary to improve it. Summary of the Utility Model
[0004] Aiming at the deficiencies of the prior art, the utility model provides an industrial network switch, which solves the problems that in the existing network switch, the internal heat dissipation measures adopt the natural ventilation method, and in a harsh environment, dust is likely to accumulate, causing internal short circuits and poor contacts.
[0005] The industrial network switch of the utility model includes:
[0006] A housing, a data exchange area is arranged inside the housing to form an inner cavity. A network cable interface is installed at the data exchange area and extends to the outside of the housing;
[0007] Fasteners are also arranged on the outside of the housing for fixing the housing;
[0008] Industrial power supplies are arranged on both sides of the inner wall of the inner cavity. A support plate is arranged between the two industrial power supplies, and a circuit board is installed on the top of the support plate;
[0009] A cover plate is arranged on the top of the support plate. A heat conduction sheet is arranged on the bottom of the cover plate, and the heat conduction sheet is attached to the circuit board on the support plate.
[0010] As a further improvement of the utility model, the cover plate includes a top plate. Positioning holes are arranged at the diagonal corners of the four surrounding frames on the top of the top plate, and the positioning holes and the support plate are installed by bolts.
[0011] As a further improvement of the present utility model, ventilation holes are provided at both ends of the top plate at equal intervals for assisting the heat dissipation fins in heat dissipation.
[0012] As a further improvement of the present utility model, mounting holes are provided at the top of the top plate, and the mounting holes extend downward to the ventilation holes to form a wind guiding area.
[0013] As a further improvement of the present utility model, an outer area fan is installed at the mounting holes for accelerating air circulation in cooperation with the wind guiding area.
[0014] As a further improvement of the present utility model, two convex strips are integrally formed below the top plate. The two convex strips are arranged in mirror symmetry and are erected on both sides of the supporting plate.
[0015] As a further improvement of the present utility model, hanging ears are provided on both sides of the housing, and through holes are provided at the front end of the housing and are hermetically adapted to the network cable structure.
[0016] As a further improvement of the present utility model, through holes are provided in the middle of the top of the housing and are adapted to the outer area fan.
[0017] As a further improvement of the present utility model, one or more heat dissipation holes are provided on both the left and right sides of the housing, and the heat dissipation holes are adapted to the air outlet of the industrial power supply.
[0018] As a further improvement of the present utility model, power interfaces are provided at the tails of the industrial power supplies. The power interfaces extend to the housing of the housing and are located on the back of the network cable interface.
[0019] Compared with the prior art, the beneficial effects of the present utility model are as follows:
[0020] Through the combination of the covering plate and the supporting plate provided by the present utility model, the circuit board is protected, thereby avoiding the influence of the exposure of circuit components. Moreover, when the covering plates are combined, the heat dissipation fins on the inner side can adsorb the generated heat by using a passive hydrogel film, and by utilizing the day-night temperature difference, the moisture in the outside world is automatically absorbed, and the heat can be continuously absorbed, ensuring the use stability of the switch. At the same time, the covering method improves the sealing effect. Only the outer side is provided with a fan, which will not cause the problem of dust accumulation inside, and prolongs the service life of the electronic components of the switch. Description of the Drawings
[0021] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments and descriptions thereof of the present application are used to explain the present application and do not constitute an improper limitation of the present application. In the drawings:
[0022] Figure 1 Schematic diagram of the three-dimensional structure of the network switch of the present utility model;
[0023] Figure 2 Schematic diagram of the top view structure of the network switch of the present utility model;
[0024] Figure 3 Schematic diagram of the bottom view structure of the network switch of the present utility model;
[0025] Figure 4 Schematic diagram of the front view structure of the network switch of the present utility model;
[0026] Figure 5 Schematic diagram of the inner cavity inner side structure of the network switch of the present utility model;
[0027] Figure 6 Schematic diagram of the three-dimensional structure of the cover plate of the present utility model;
[0028] Figure 7 Schematic diagram of the top view structure of the cover plate of the present utility model;
[0029] Figure 8 Schematic diagram of the combined structure of the cover plate and the heat conducting sheet of the present utility model;
[0030] Figure 9 of the present utility model Figure 7 Schematic diagram of the A-A sectional structure.
[0031] In the figure: 1. housing; 2. outer area fan; 3. cover plate; 4. supporting plate; 5. heat conducting sheet;
[0032] 12. fastener; 13. hanging ear; 14. network cable interface; 15. heat dissipation hole; 16. data exchange area; 17. inner cavity; 18. power interface; 19. industrial power supply;
[0033] 31. positioning hole; 32. top plate; 33. rib; 34. ventilation hole; 35. air guiding area; 36. mounting hole. Detailed implementation manners
[0034] The following will disclose multiple implementation manners of the present utility model with illustrations. For the sake of clear description, many physical details will be described together in the following narration. However, it should be understood that these physical details are not used to limit the present utility model. That is to say, in some implementation manners of the present utility model, these physical details are unnecessary. In addition, for the purpose of simplifying the illustrations, some well-known and commonly used structures and components will be shown in a simple schematic manner in the illustrations.
[0035] In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by this utility model.
[0036] Please refer to Figures 1-9 , industrial switches usually need to work in harsh environments, such as high temperature, humidity, vibration, etc. If the device does not have sufficient environmental adaptability, it may lead to failures or shortened lifespan. Improving the environmental adaptability of the device is the key to ensuring the stable operation of industrial equipment in harsh environments. For example, using effective heat dissipation designs, such as heat sinks, fans, etc., to keep the device within an appropriate temperature range.
[0037] Conventional heat dissipation settings usually have openings in the inner cavity 17, dissipate heat through a fan, and cooperate with through holes to achieve air circulation. However, in a harsh environment, once there are a large number of dust particles, the use of this method will have a great impact on the lifespan of internal components. Moreover, since most electronic components are in a bare state, the attachment of dust will also cause short circuits in the components and affect the signal transmission speed. Based on this, this application provides an industrial network switch, including:
[0038] A housing 1, with a data exchange area 16 arranged inside the housing 1, forming an inner cavity 17. A network cable interface 14 is installed at the data exchange area 16 and extends to the outside of the housing 1;
[0039] A fastener 12 is also arranged on the outside of the housing 1 for fixing the housing 1
[0040] Industrial power supplies 19 are arranged on both sides of the inner wall of the inner cavity 17. A support plate 4 is arranged between the two industrial power supplies 19. A circuit board is installed on the top of the support plate 4;
[0041] A cover plate 3 is arranged on the top of the support plate 4. A heat conducting sheet 5 is arranged on the bottom of the cover plate 3, and the heat conducting sheet 5 is attached to the circuit board on the support plate 4.
[0042] The enclosed space inside the network switch is used to accommodate the internal components of the device. This inner cavity 17 is protected by the housing 1 and fixed by the fastener 12 to ensure its stability and sealing performance.
[0043] Data exchange area 16: The main functional area in the inner cavity 17, equipped with a network cable interface 14, enabling external network signals to be accessed and transmitted.
[0044] Power supply and support plate 4:
[0045] Industrial power supply 19: The power supply module arranged on both sides of the inner cavity 17, providing power support for the device. A support plate 4 is installed between the two power supplies.
[0046] Support plate 4: The support plate 4 serves as the support foundation for the circuit board, and the circuit board and other electronic components are installed on the top.
[0047] Cover plate 3 and heat sink 5:
[0048] Cover plate 3: It is placed on the top of the support plate 4 to cover and protect the circuit board and electronic components. The design of the cover plate 3 can enhance the sealing effect of the device and prevent dust and moisture from entering.
[0049] Heat sink 5: A heat sink 5 is provided at the bottom of the cover plate 3, and the heat sink 5 is attached to the circuit board and electronic components on the support plate 4. The function of the heat sink 5 is to improve the heat dissipation efficiency and ensure that the electronic components operate within an appropriate temperature range.
[0050] Heat dissipation mechanism:
[0051] Function of heat sink 5: The heat sink 5 conducts the heat generated by the electronic components effectively to the housing 1 through heat conduction, thereby preventing the device from overheating.
[0052] Function of housing 1: The housing 1 not only provides mechanical protection but also plays an auxiliary role in heat dissipation. It cooperates with the heat sink 5 to maintain the stability of the internal temperature.
[0053] The cooperation between the heat sink 5 and the cover plate 3 effectively manages the heat generated by the device, prevents performance degradation or failures caused by overheating, and thus improves the stability and reliability of the device.
[0054] The design of the cover plate 3 and the fastener 12 enhances the sealing of the inner cavity 17, prevents the intrusion of dust and moisture, and protects the internal components.
[0055] The heat is conducted to the housing 1 through the heat sink 5, maintaining the normal operating temperature of the circuit board and electronic components, thereby reducing the losses caused by overheating and extending the service life of the device.
[0056] The cover plate 3 and the good sealing design prevent the damage of dust and moisture to the internal components, further extending the life of the device.
[0057] The good heat dissipation and protection design reduce the failures caused by environmental factors, improving the normal operating time and working efficiency of the device.
[0058] This design enables the device to operate stably under a wider range of environmental conditions, including industrial environments with high temperature and high humidity.
[0059] Through a reasonable internal structure and protection design, the device can be conveniently inspected and its components replaced when maintenance is required, while reducing the impact of the external environment on the device.
[0060] The heat-conducting sheet 5 uses a hydrogel film heat-dissipating material to adhere to the surface of the circuit board, which can effectively conduct heat from the circuit board to the cover plate 3. In this way, the heat generated by the electronic components is more effectively managed and dissipated through the hydrogel material.
[0061] The flexibility of the hydrogel film enables it to closely adhere to the surfaces of various-shaped electronic components, thereby improving the heat conduction efficiency.
[0062] Since the hydrogel film is usually enclosed between the cover plate 3 and the heat-conducting sheet 5, it can effectively prevent direct contact of dust and moisture with the circuit board and electronic components.
[0063] The heat-dissipating performance of the hydrogel film is not significantly affected by environmental temperature fluctuations, thus ensuring the stable operation of the device under various environmental conditions.
[0064] Through effective heat management, the hydrogel film reduces the overheating phenomenon of electronic components, thereby reducing the thermal fatigue and aging of the components and extending the overall service life of the device.
[0065] The hydrogel material can smooth out temperature fluctuations and reduce the impact of temperature changes on electronic components.
[0066] The cover plate 3 includes a top plate 32. Positioning holes 31 are provided at the diagonal corners of the top four-sided frame of the top plate 32, and the positioning holes 31 are installed with the support plate 4 through bolts.
[0067] Ventilation holes 34 are provided at equal distances at both ends of the top plate 32 for assisting the heat-conducting sheet 5 in heat dissipation.
[0068] Mounting holes 36 are provided on the top of the top plate 32, and the mounting holes 36 extend downward to the ventilation holes 34 to form a wind-guiding area 35.
[0069] An outer-zone fan 2 is installed at the mounting holes 36 for cooperating with the wind-guiding area 35 to accelerate air circulation.
[0070] Structure of the cover plate 3:
[0071] Top plate 32: As the main part of the cover plate 3, the top plate 32 is responsible for protecting the internal electronic components and is also a key component for heat dissipation and ventilation.
[0072] Frame and positioning holes 31: Positioning holes 31 are provided at the diagonal corners of the four-sided frame of the top plate 32. These positioning holes 31 are connected to the support plate 4 through bolts to ensure that the top plate 32 is firmly fixed and enhance the stability of the overall structure.
[0073] Ventilation holes 34: Ventilation holes 34 at equal distances are provided at both ends of the top plate 32, aiming to provide an additional heat dissipation channel for the heat-conducting sheet 5 to help effectively discharge heat.
[0074] Design of the air guiding area 35:
[0075] Mounting hole 36: The mounting hole 36 provided at the top of the top plate 32 extends downward to the ventilation hole 34, forming an air guiding area 35. This design allows an external fan to be installed in this area, forming a good air flow path.
[0076] Outer area fan 2: The outer area fan 2 is installed in the mounting hole 36, and its function is to promote air flow. Combined with the air guiding area 35, it further accelerates the air circulation and heat dissipation efficiency.
[0077] Heat dissipation and air circulation:
[0078] Auxiliary heat dissipation: The air flow of the outer area fan 2 enters the ventilation hole 34 of the top plate 32 through the air guiding area 35, which can effectively take away the heat generated inside and prevent the performance of the device from decreasing due to overheating.
[0079] Air flow management: Through the precise layout of the ventilation holes 34 and the cooperative design of the fans, it is ensured that the air circulation inside the device is smooth, effectively maintaining the temperature stability of the electronic components.
[0080] Through the design of the ventilation holes 34 and the air guiding area 35, the fan can effectively introduce external air into the device and quickly take away the heat, thereby improving the heat dissipation efficiency.
[0081] The cooperation between the ventilation hole 34 and the heat conducting fin 5 forms a good heat dissipation path, enabling the heat of the electronic components to be quickly conducted and discharged, preventing the device from overheating.
[0082] Continuous air circulation enables the device to maintain a stable temperature during long-term operation, reducing the risk of failures caused by temperature fluctuations.
[0083] The temperature stability reduces the thermal fatigue of the electronic components, extends their service life, and ensures the long-term stable operation of the device.
[0084] Through the bolt connection of the positioning hole 31 and the supporting plate 4, the stability of the top plate 32 during operation is ensured, preventing displacement or loosening caused by vibration or external forces.
[0085] The design of the top plate 32 enhances the structural integrity of the entire device, enabling it to maintain a good working state even in harsh environments.
[0086] The design of the cover plate 3 enables maintenance personnel to easily disassemble and clean the internal components, especially the fan and the ventilation holes 34, ensuring that the device always maintains the best working state.
[0087] The design of the fan and the air guiding area 35 facilitates an intuitive understanding of the air circulation situation and helps to quickly locate the problem area during maintenance.
[0088] The design of the outer zone fan 2 can select a low-noise and efficient fan, which not only ensures the heat dissipation effect but also improves the user experience when the device is in use.
[0089] Below the top plate 32, two convex strips 33 are integrally formed. The two convex strips 33 are arranged in mirror symmetry and are mounted on both sides of the support plate 4. The function of these convex strips 33 is to provide additional support and stability, help maintain the position of the top plate 32 on the support plate 4, and enhance the stability of the overall structure.
[0090] On both sides of the housing 1, hanging ears 13 are provided. A through hole is opened at the front end of the housing 1 and is hermetically adapted to the network cable structure.
[0091] A through hole is opened in the middle of the top of the housing 1 and is adapted to the outer zone fan 2.
[0092] One or more heat dissipation holes 15 are opened on both the left and right sides of the housing 1, and the heat dissipation holes 15 are adapted to the air outlet of the industrial power supply 19.
[0093] At the tail of the industrial power supply 19, power interfaces 18 are provided. The power interfaces 18 extend to the outside of the housing 1 of the housing 1 and are located on the back of the network cable interface 14.
[0094] The hanging ears 13 are used to fix the housing 1 in the installation position and enhance the stability of the device.
[0095] A through hole is opened at the front end of the housing 1 and is hermetically adapted to the network cable interface 14, ensuring the firmness of the network cable connection and preventing dust and other external substances from entering the interior of the device.
[0096] The through hole opened in the middle of the top of the housing 1 is adapted to the outer zone fan 2, which enables the fan to effectively send air into the interior of the device and promote heat dissipation.
[0097] One or more heat dissipation holes 15 are opened on both the left and right sides of the housing 1 and are adapted to the air outlet of the industrial power supply 19, helping to discharge the heat generated by the power supply and further improving the heat dissipation capacity of the device.
[0098] At the tail of the industrial power supply 19, power interfaces 18 are provided. These interfaces extend to the outside of the housing 1 and are located on the back of the network cable interface 14. This design ensures a good connection between the power interfaces 18 and the outside of the device and avoids interference with the network cable interface 14.
[0099] The convex strips 33 below the top plate 32 provide additional support, prevent the top plate 32 from shifting or loosening during use, and enhance the stability and durability of the overall structure.
[0100] The design of the ear hook 13 enables the housing 1 to be stably installed at a predetermined position, reducing the impact of vibration and external forces on the device and improving the stability of the device.
[0101] The cooperation between the through hole at the top of the housing 1 and the outer area fan 2 enables the fan to effectively guide the air flow and enhance the heat dissipation effect inside the device.
[0102] The heat dissipation holes 15 on the left and right sides cooperate with the air outlet of the power supply to ensure that the heat generated by the power supply can be discharged in time, preventing the negative impact on the device caused by overheating of the power supply.
[0103] The through hole at the front end is hermetically adapted to the network cable interface 14, preventing dust and moisture from entering the device and protecting the internal electronic components from the environmental impact.
[0104] The power interface 18 is located on the back of the network cable interface 14, effectively avoiding the cross interference between the power cord and the network cable and improving the overall operation and maintenance convenience of the device.
[0105] The design of the ear hook 13 and the power interface 18 makes the installation and maintenance of the device more convenient and reduces the complexity of operation.
[0106] The optimized heat dissipation design not only improves the performance of the device, but also reduces the device failures caused by overheating and enhances the user experience.
[0107] Through effective air circulation and heat emission, the internal temperature of the device is maintained within a suitable range, thereby extending the service life of the device and its components.
[0108] The good sealing design and the layout of the power interface 18 improve the reliability of the device in harsh environments and reduce the impact of environmental factors on the device.
[0109] The above are only the embodiments of the present utility model and are not used to limit the present utility model. For those skilled in the art, various changes and modifications can be made to the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the scope of the claims of the present utility model.
Claims
1. An industrial network switch, characterized in that: A housing (1), wherein a data exchange area (16) is arranged inside the housing (1) to form an inner cavity (17), and a network cable interface (14) is installed at the data exchange area (16) and extends to the outside of the housing (1); A fastener (12) is also provided on the outer side of the housing (1) for fixing the housing (1); Industrial power supplies (19) are arranged on both sides of the inner wall of the inner cavity (17), a supporting plate (4) is arranged between the two industrial power supplies (19), and a circuit board is installed on the top of the supporting plate (4); A cover plate (3) is arranged on the top of the support plate (4), a heat conducting sheet (5) is arranged on the bottom of the cover plate (3), and the heat conducting sheet (5) is bonded to the circuit board on the support plate (4).
2. An industrial network switch according to claim 1, characterized in that: The cover plate (3) comprises a top plate (32), and positioning holes (31) are provided at diagonal positions of the frame around the top of the top plate (32), and the positioning holes (31) and the supporting plate (4) are mounted by bolts.
3. An industrial network switch according to claim 2, characterized in that: Both ends of the top plate (32) are provided with ventilation holes (34) arranged at equal distances, for assisting the heat conducting plate (5) in heat dissipation.
4. An industrial network switch according to claim 2, characterized in that: A mounting hole (36) is provided at the top of the top plate (32), and the mounting hole (36) extends downward to the ventilation hole (34) to form a wind guide area (35).
5. An industrial network switch according to claim 4, characterized in that: An external zone fan (2) is installed at the installation hole (36) to cooperate with the air guide area (35) to accelerate air circulation.
6. An industrial network switch according to claim 2, characterized in that: Two convex strips (33) are integrally formed below the top plate (32), and the two convex strips (33) are arranged in a mirror-symmetrical manner and are mounted on both sides of the supporting plate (4).
7. The industrial network switch according to claim 1, characterized in that: Hanging ears (13) are provided on both sides of the shell (1), and a through hole is opened at the front end of the shell (1) and is sealed and adapted to the network cable structure.
8. The industrial network switch according to claim 1, characterized in that: A through hole is provided in the middle of the top of the shell (1) and is adapted to fit the outer zone fan (2).
9. The industrial network switch according to claim 1, characterized in that: One or more heat dissipation holes (15) are provided on both the left and right sides of the shell (1), and the heat dissipation holes (15) are adapted to the air outlet of the industrial power supply (19).
10. The industrial network switch according to claim 1, characterized in that: The tail of the industrial power supply (19) is provided with a power interface (18), and the power interface (18) extends to the shell (1) of the shell (1) and is located on the back of the network cable interface (14).