Shielding cover and circuit board assembly

Abstract

The utility model discloses a shielding case and a circuit board assembly, and relates to the technical field of integrated circuit heat dissipation, the shielding case comprises a case body and a vapor chamber, the case body is used for covering a circuit board main body, and the case body is provided with a high-heat area corresponding to a chip on the circuit board main body. And the vapor chamber is arranged in the high-heat area of the cover body so as to be in heat conduction connection with the chip. According to the technical scheme of the utility model, the cover body is covered on the circuit board main body, so that the electromagnetic protection effect on the circuit board main body can be realized, the external electromagnetic interference can be reduced, and meanwhile, the soaking plate is arranged in the high-heat area, namely the area, corresponding to the chip, of the cover body, so that the heat exchange efficiency can be improved. The heat dissipation of the chip is carried out through the vapor chamber, so that the vapor chamber is only arranged at the local part of the shielding cover, a better heat dissipation effect can be ensured, and meanwhile, the cost is lower.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit heat dissipation, and particularly relates to a shielding cover and a circuit board assembly. Background Art

[0002] With the further development of display technology, consumers have higher and higher requirements for display experience. To meet the needs of consumers, display screens are developing in the direction of high resolution and high refresh rate. With the popularization of high resolution and high refresh rate, it is required that the control board driving IC processes more and more data per unit time, and the power consumption is also increasing. To ensure the reliable operation of the IC chip, it is necessary to further improve the heat dissipation capacity to ensure that the IC temperature is within the permitted temperature range, and avoid damage to the driving IC caused by poor heat dissipation, which affects the display effect and service life of the display screen.

[0003] In related technologies, usually a single shielding cover is covered on the circuit board, and the heat dissipation effect is poor, which is difficult to meet the heat dissipation requirements of high resolution and high refresh rate. And setting a vapor chamber with good heat dissipation effect as a whole will lead to higher costs. Summary of the Utility Model

[0004] The main purpose of the utility model is to provide a shielding cover and a circuit board assembly, aiming to at least solve the technical problem of incompatibility between heat dissipation effect and cost in related technologies.

[0005] To achieve the above purpose, a shielding cover proposed by the utility model includes:

[0006] A cover body for covering on the main body of the circuit board, and the cover body has a high heat region corresponding to the chip on the main body of the circuit board; and,

[0007] A vapor chamber is arranged in the high heat region of the cover body to conduct heat connection with the chip.

[0008] In an embodiment, the cover body has a first side for attaching to the chip and a second side opposite to the first side, and an avoidance hole communicating the first side and the second side is arranged on the high heat region of the cover body;

[0009] The vapor chamber penetrates through the first side and the second side of the cover body through the avoidance hole.

[0010] In an embodiment, the vapor chamber includes:

[0011] A main body portion that penetrates through the first side and the second side of the cover body through the avoidance hole; and,

[0012] A connecting portion is arranged on the periphery of the main body portion, and the main body portion is fixedly connected to the first side of the cover body.

[0013] In one embodiment, a positioning groove adapted to the connecting portion is provided on the first side of the cover body.

[0014] In one embodiment, the cover body is recessed from the first side toward the second side to form the positioning groove.

[0015] In one embodiment, a supporting portion is provided on the cover body, and the cover body is used to support on the main circuit board through the supporting portion.

[0016] In one embodiment, the opposite ends of the cover body are bent to form the supporting portion.

[0017] In one embodiment, a plurality of heat dissipation holes are provided on the cover body.

[0018] The present utility model further provides a circuit board assembly, including a main circuit board and a shielding cover. A chip is provided on the main circuit board. The shielding cover includes:

[0019] A cover body for covering the main circuit board, and the cover body has a high heat region corresponding to the chip on the main circuit board; and,

[0020] A heat pipe, provided in the high heat region of the cover body to be thermally conductively connected to the chip.

[0021] In one embodiment, the cover body has a first side attached to the chip and a second side opposite to the first side. An avoidance hole communicating the first side and the second side is provided in the high heat region of the cover body;

[0022] The heat pipe passes through the first side and the second side of the cover body through the avoidance hole;

[0023] The circuit board assembly further includes a flexible heat conductive pad provided between the heat pipe and the chip.

[0024] In the technical solution of the present utility model, by covering the cover body on the main circuit board, the electromagnetic protection effect on the main circuit board can be achieved, reducing the external electromagnetic interference. At the same time, in the high heat region, that is, the region on the cover body corresponding to the chip, a heat pipe is provided to dissipate heat from the chip. In this way, only a heat pipe is provided locally on the shielding cover, which can ensure a good heat dissipation effect while having a low cost. Description of the Drawings

[0025] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0026] Figure 1 Schematic diagram of the three-dimensional exploded structure of an embodiment of the circuit board assembly provided by the present invention;

[0027] Figure 2 Schematic diagram of the three-dimensional structure of an embodiment of the shielding cover provided by the present invention;

[0028] Figure 3 For Figure 2 Schematic diagram of the A-A cross-sectional structure in

[0029] Figure 4 For Figure 2 Schematic diagram of the three-dimensional structure of the heat sink plate in

[0030] Figure 5 For Figure 4 Schematic diagram of the B-B cross-sectional structure in

[0031] Explanation of the reference numerals in the drawings:

[0032] 1000, circuit board assembly; 100, shielding cover; 1, cover body; 11, avoidance hole; 12, positioning groove; 13, support part; 14, heat dissipation hole; 101, first side; 102, second side; 2, heat sink plate; 21, main body part; 22, connecting part; 3, circuit board main body; 31, chip; 4, flexible heat conduction pad.

[0033] The realization, functional characteristics and advantages of the object of the present invention will be further described in conjunction with the embodiments with reference to the drawings. Specific embodiments

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0035] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) involved in the embodiments of the present utility model, then such directional indications are only used to explain the relative positional relationship, movement conditions, etc. between components in a certain specific posture. If this specific posture changes, then the directional indications will also change accordingly.

[0036] In addition, if there are descriptions such as "first", "second", etc. involved in the embodiments of the present utility model, then such descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first", "second" may explicitly or implicitly include at least one such feature. In addition, if "and / or" or "and / or" appears throughout the text, its meaning includes three parallel scenarios. Taking "A and / or B" as an example, it includes Scenario A, or Scenario B, or the scenario where both A and B are satisfied simultaneously. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the fact that those skilled in the art can implement it. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present utility model.

[0037] With the further development of display technology, consumers have higher and higher requirements for display experience. To meet the needs of consumers, display screens are developing in the direction of high resolution and high refresh rate. With the popularization of high resolution and high refresh rate, this requires the control board driving IC to process more and more data per unit time, and the power consumption is also getting larger. To ensure the reliable operation of the IC chip, it is necessary to further improve the heat dissipation ability to ensure that the IC temperature is within the permitted temperature range and avoid damage to the driving IC caused by poor heat dissipation, which affects the display effect and lifespan of the display screen.

[0038] In the related art, usually a single shielding cover is covered on the circuit board, and the heat dissipation effect is poor, making it difficult to meet the heat dissipation requirements of high resolution and high refresh rate. And setting a vapor chamber with good heat dissipation effect as a whole will result in a higher cost.

[0039] The main purpose of the present utility model is to propose a shielding cover and a circuit board assembly, aiming to at least solve the technical problem in the related art that it is difficult to be compatible with heat dissipation effect and cost.

[0040] Please refer to Figure 1 and Figure 2 , in an embodiment of the present utility model, the shielding cover includes a cover body and a vapor chamber. The cover body is used to cover the circuit board main body. The cover body has a high heat region corresponding to the chip on the circuit board main body. The vapor chamber is arranged in the high heat region of the cover body to conduct heat connection with the chip.

[0041] In the technical solution of the utility model, by setting the cover body on the circuit board body, it can play an electromagnetic protection role for the circuit board body and reduce external electromagnetic interference. At the same time, a heat spreader is set in the high-temperature area, that is, the area on the cover body corresponding to the chip, and the chip is cooled by the heat spreader. In this way, only the heat spreader is set locally on the shielding cover, which can ensure a better heat dissipation effect and reduce the cost.

[0042] The cover body mainly plays the role of electromagnetic shielding, and its material is various. Although for the circuit board body, the chip generates the highest heat, other components will still generate heat and need to be dissipated. Therefore, the material of the cover body is preferably an electromagnetic shielding material with good thermal conductivity, such as galvanized sheet, tinplate, aluminum plate, etc.

[0043] There are many ways to set the heat spreader on the cover. For example, the heat spreader can be in direct contact with the chip. However, this will cause the heat spreader to be set between the cover and the chip. The heat spreader is not in direct contact with the external low-temperature air environment, and the heat dissipation effect is poor. The heat spreader can also be thermally connected to the chip through the cover, that is, the cover is in direct contact with the chip, and the heat spreader is set on the side of the cover away from the chip. In this way, although the heat spreader is in direct contact with the low-temperature air environment, the heat spreader is not in contact with the chip, and heat is transferred through the cover, which will reduce the heat dissipation effect. In the embodiments of the present utility model, please refer to Figure 1 , Figure 2 and Figure 3 The cover body has a first side for attaching the chip and a second side opposite to the first side. The high-temperature area of ​​the cover body is provided with an avoidance hole connecting the first side and the second side thereof, and the heat spreader penetrates the first side and the second side of the cover body through the avoidance hole. In this way, through the setting of the avoidance hole, the heat spreader can contact the chip and directly contact the external low-temperature air environment at the same time, thereby ensuring its heat dissipation effect.

[0044] It is understandable that if the heat spreader can completely pass through the avoidance hole, when the heat spreader is actually fixed to the cover, the fixing process will be more troublesome due to the lack of effective support. Figure 4 and Figure 5The heat spreader includes a main body and a connecting part. The main body passes through the first side and the second side of the cover through the avoidance hole. The connecting part is arranged on the peripheral side of the main body. The main body is fixedly connected to the first side of the cover. In this way, by arranging the connecting part on the peripheral side of the main body, the heat spreader as a whole is in the shape of a boss. When the heat spreader is fixed to the cover, the connecting part can be pressed against the cover, the main body passes through the avoidance hole, and then the connecting part is fixed to the cover, so that the heat spreader is fixed to the cover, and the fixing is more convenient.

[0045] The present design does not limit the specific fixing method of the connecting portion and the heat spreader, for example, it may be fixing with thermal conductive adhesive, self-rivet fixing, countersunk rivet fixing or screw locking fixing.

[0046] In order to make the fixing of the connecting part and the heat spreader more convenient and quick, in the present embodiment, a positioning groove matched with the connecting part is provided on the first side of the cover body, and the connecting part can be quickly positioned by the setting of the positioning groove, thereby completing the positioning of the heat spreader and the cover body.

[0047] Of course, the method of positioning the connection part and the cover body is not limited to the positioning groove. For example, positioning holes and positioning columns can be set on the connection part and the cover body. However, the setting of the positioning groove can make the side of the heat spreader attached to the chip flush with the first side of the cover body, so as to prevent the heat spreader protruding from the first side ear of the cover body from interfering with other components of the circuit board body and causing a short circuit; therefore, in the embodiment of the utility model, the preferred method for positioning the connection part is to set the positioning groove on the first side of the cover body.

[0048] There are many ways to form the positioning groove, for example, the first side can be directly grooved by a groove cutting device. It is understandable that the connection portion needs to have a certain thickness to ensure the connection effect, and the positioning groove of a corresponding depth needs to be opened on the cover body. The required thickness of the cover body is relatively large, which will affect the heat dissipation of the circuit board body. At the same time, the cover body is usually formed by stamping, and an additional groove cutting process will make the processing more troublesome. In the embodiments of the utility model, please refer to Figure 3 Part of the cover body is recessed from the first side toward the second side to form the positioning groove; with this arrangement, the cover body does not need to be thicker, and can be directly stamped and formed by stamping equipment, making the production of the cover body as a whole more convenient.

[0049] It can be understood that the cover body needs to be fixed to the main circuit board body. Due to the arrangement of the chips and other components on the main circuit board body, the cover body does not directly contact the main circuit board body but is in a suspended state relative to the main circuit board body. When fixing with screws, it is easy to damage the main circuit board body. Therefore, in this embodiment, a support portion is provided on the cover body, and the cover body is used to support on the main circuit board body through the support portion. In this way, through the arrangement of the support portion, the cover body can directly contact the main circuit board body, facilitating the fixation of the cover body and the main circuit board body while improving the stability of the cover body.

[0050] There are various forms of the support portion. For example, support columns can be provided on the cover body to support on the main circuit board body. However, usually, the support columns need to be processed separately from the cover body first and then fixed, that is, it is difficult to be formed by an integral molding method, and the production is relatively troublesome. In this embodiment, the opposite ends of the cover body are bent to form the support portion; the cover body is usually formed by stamping. In this way, the support portion formed by bending can also be formed by stamping, that is, the support portion and the cover body can be integrally stamped, which is more convenient for processing.

[0051] To improve the heat dissipation ability, a plurality of heat dissipation holes are provided on the cover body. The arrangement of the heat dissipation holes is conducive to the circulation of the air between the cover body and the main circuit board body and the outside air, improving the heat dissipation ability of the overall main circuit board body.

[0052] The present utility model also proposes a circuit board assembly, which includes a main circuit board body and a shielding cover. The specific structure of the shielding cover refers to the above embodiment. Since this circuit board assembly adopts all the technical solutions of the above all embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be elaborated one by one here.

[0053] In the technical solution of the present utility model, by covering the cover body on the main circuit board body, it can play an electromagnetic protection role for the main circuit board body, reducing external electromagnetic interference. At the same time, in the high-heat area, that is, the area on the cover body corresponding to the chip, a heat spreader is provided, and the heat spreader is used to dissipate heat from the chip. In this way, only by locally arranging the heat spreader on the shielding cover can a good heat dissipation effect be ensured while the cost is relatively low.

[0054] It can be understood that during the production process of the cover body and the heat spreader, errors are inevitable, resulting in a gap in the heat spreader finally and being unable to fit well with the chip, that is, the contact area between the heat spreader and the chip becomes smaller, resulting in a weakened heat dissipation effect. Therefore, in this embodiment, please refer toFigure 1 , Figure 2 and Figure 3 , the cover body has a first side attached to the chip and a second side opposite to the first side, and an avoidance hole communicating the first side and the second side is provided on the high-heat area of the cover body; the heat sink passes through the first side and the second side of the cover body through the avoidance hole; the circuit board assembly further includes a flexible heat-conducting pad disposed between the heat sink and the chip. Thus, a flexible heat-conducting pad is disposed between the heat sink and the chip, and the gap between the heat sink and the chip is adjusted through the flexible heat-conducting pad to make up for the manufacturing errors of the cover body and the heat sink, thereby ensuring the contact area and the heat dissipation effect.

[0055] There are various types of the flexible heat-conducting pads. For example, they can be composite PI film heat-conducting gaskets, high-heat-conducting silica gel pads, etc.

[0056] The above is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structural transformation made under the technical concept of the present invention by using the content of the specification and drawings of the present invention, or direct / indirect application in other related technical fields is included in the patent protection scope of the present invention.

Claims

1. A shielding cover, characterized in that: include: A cover body, used for covering the circuit board body, wherein the cover body has a high-heat area corresponding to the chip on the circuit board body; as well as, A heat spreader is arranged in the high-temperature area of ​​the cover body to be thermally connected to the chip.

2. The shielding cover according to claim 1, wherein: The cover body has a first side for attaching the chip and a second side opposite to the first side, and a evacuation hole connecting the first side and the second side is arranged on the high-heat area of ​​the cover body; The vapor chamber penetrates the first side and the second side of the cover body through the avoidance hole.

3. The shielding cover according to claim 2, characterized in that: The heat sink comprises: a main body portion, which passes through the first side and the second side of the cover body through the avoidance hole; and The connecting portion is arranged on the peripheral side of the main body, and the main body is fixedly connected to the first side of the cover body.

4. The shielding cover according to claim 3, characterized in that: The first side of the cover body is provided with a positioning groove matched with the connecting portion.

5. The shielding cover according to claim 4, characterized in that: A portion of the cover body is recessed from the first side toward the second side to form the positioning groove.

6. The shielding cover according to claim 1, wherein: The cover body is provided with a supporting portion, and the cover body is used to be supported on the circuit board body through the supporting portion.

7. The shielding cover according to claim 6, characterized in that: The two opposite ends of the cover body are bent to form the supporting portion.

8. The shielding cover according to claim 1, wherein: The cover body is provided with a plurality of heat dissipation holes.

9. A circuit board assembly, characterized in that: include: A circuit board body, on which a chip is arranged; A shielding cover comprising the shielding cover as claimed in any one of claims 1 to 8.

10. The circuit board assembly according to claim 9, wherein: The cover body has a first side attached to the chip and a second side opposite to the first side, and a evacuation hole connecting the first side and the second side is arranged on the high-heat area of ​​the cover body; The heat sink passes through the first side and the second side of the cover body through the avoidance hole; The circuit board assembly also includes a flexible thermal pad disposed between the heat spreader and the chip.

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