Heating unit for semiconductor wafer etching

Abstract

The utility model relates to a heating unit for semiconductor wafer etching, which is applied to the field of wafer etching processing and comprises a shell, a fixing ring fixedly connected to the inner bottom wall of the shell, a plurality of arc-shaped blocks fixed at the upper end of the fixing ring, a mounting ring fixedly connected to the upper ends of the arc-shaped blocks, and a heat insulation plate fixedly connected to the inner ring surface of the mounting ring. An electric heating plate is placed in the heat insulation plate, a glass ceramic table top is arranged at the upper end of the electric heating plate, a positioning ring is fixedly connected to the outer ring face of the glass ceramic table top, a plurality of positioning assemblies fixedly penetrate through the upper end of the positioning ring, and each positioning assembly comprises a mounting pipe fixedly penetrating through the positioning ring; the lower end of the adjusting rod is fixedly connected with an adjusting plate, and the ceramic table top can be fixed to the upper end of the electric heating plate through the fixing assembly, so that the electric heating plate makes contact with the ceramic table top in the heating process, meanwhile, the ceramic table top is convenient to disassemble and assemble, and the electric heating plate is convenient to maintain or replace.

Description

Technical Field

[0001] The utility model relates to a wafer heating unit, in particular to a heating unit for semiconductor wafer etching applied to the field of wafer etching processing. Background Technique

[0002] A wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits, and its raw material is silicon. High-purity polysilicon is dissolved and doped with a silicon crystal seed, and then slowly pulled out to form a cylindrical single-crystal silicon. After the silicon ingot is ground, polished, and sliced, a silicon wafer is formed, that is, a wafer.

[0003] When etching a wafer, it is necessary to heat the wafer first. Most of the existing wafer heating devices heat through an electric hot plate, and at the same time, a ceramic tabletop is installed on the surface of the electric hot plate to conduct heat through the ceramic tabletop, thereby effectively avoiding the phenomena of local overheating and overcooling of the wafer during the heating process.

[0004] However, most of the ceramic tabletops are fixedly installed on the electric hot plate. After long-term use, when the electric hot plate is damaged, it is not convenient to disassemble and assemble the ceramic tabletop, and even the ceramic tabletop is easily damaged during the disassembly and assembly process, resulting in an increase in the maintenance cost of the overall equipment. Content of the Utility Model

[0005] Aiming at the above-mentioned prior art, the technical problem to be solved by the utility model is that most of the existing ceramic tabletops are directly fixedly installed on the electric hot plate, which is not convenient for disassembly and assembly when the electric hot plate fails, and is easy to damage the ceramic tabletop, resulting in an increase in the maintenance cost of the overall equipment.

[0006] To solve the above problems, the utility model provides a heating unit for semiconductor wafer etching, which includes a housing. A fixing ring is fixedly connected to the inner bottom wall of the housing. A plurality of arc-shaped blocks are fixedly connected to the upper end of the fixing ring. An installation ring is fixedly connected to the upper end of the arc-shaped block. A heat insulation plate is fixedly connected to the inner ring surface of the installation ring. An electric hot plate is placed inside the heat insulation plate. A glass ceramic tabletop is arranged at the upper end of the electric hot plate. A positioning ring is fixedly connected to the outer ring surface of the glass ceramic tabletop. A plurality of positioning components are fixedly penetrated through the upper end of the positioning ring. The positioning component includes an installation tube fixedly penetrated through the positioning ring. An adjusting rod is rotatably penetrated through the upper end of the installation tube. An adjusting plate is fixedly connected to the lower end of the adjusting rod. Four spiral grooves are dug on the upper end of the adjusting plate. A cross plate is fixedly connected to the inner cavity of the installation tube. Four sliding grooves are dug on the upper end of the cross plate. Four sliding rods corresponding to the four spiral grooves respectively are arranged at the upper end of the adjusting plate. The lower end of the sliding rod movably penetrates through the adjacent spiral groove and sliding groove and is fixedly connected with a limiting plate. A fixing plate is fixedly connected to the upper end of the adjusting rod. A fixing block is arranged inside the fixing plate. A plurality of rubber pistons are fixedly connected to the lower end of the fixing block. The lower ends of the rubber pistons sequentially movably penetrate through the fixing plate and the installation tube.

[0007] In the above heating unit for semiconductor wafer etching, through the fixing component, the ceramic tabletop can be fixed at the upper end of the electric hot plate, so that the electric hot plate is in contact with the ceramic tabletop during the heating process, and at the same time, the ceramic tabletop is convenient for disassembly and assembly, facilitating the maintenance or replacement of the electric hot plate.

[0008] As a further improvement of the present application, a bottom plate is fixedly connected to the inner ring surface of the fixing ring, and a plurality of support rods are fixedly connected to the upper end of the bottom plate, and the upper ends of the support rods are in contact with the lower end of the electric hot plate.

[0009] As a further improvement of the present application, a plurality of mounting holes respectively cooperating with a plurality of mounting pipes are formed on the surface of the mounting ring, and the plurality of mounting holes and the plurality of positioning components are both distributed in a circular array around the central axis of the housing.

[0010] As a further improvement of the present application, the fixing ring includes a circular ring and a plurality of arc-shaped plates fixedly mounted on the upper end of the circular ring, the plurality of arc-shaped plates and the plurality of arc-shaped blocks are distributed alternately, and the height of the arc-shaped plate is less than the height of the arc-shaped block.

[0011] As a supplement to the further improvement of the present application, both the fixing plate and the fixing block are cross-shaped, a handle is fixedly connected to the upper end of the fixing block, the upper end of the limiting plate is flush with the lower end of the mounting ring, and the limiting plate is located above the arc-shaped plate.

[0012] As another improvement of the present application, a plurality of limiting rings are fixedly connected to the upper end of the glass ceramic tabletop, and a plurality of elastic blocks distributed in a circular array around the central axis of the limiting ring are fixedly connected to the inner ring surface of the limiting ring, and the elastic blocks are made of silicone rubber material.

[0013] As another improvement of the present application, a warning lamp and a temperature sensor are fixedly connected to the upper end of the positioning ring, and the electric hot plate, the warning lamp and the temperature sensor are all in signal connection with an external controller.

[0014] In summary, during the actual application process, when the electric hot plate needs to be maintained, the fixing block can be pulled out, the fixing plate is rotated, the adjusting rod rotates, the adjusting rod drives the adjusting plate to rotate, so that the sliding rod moves along the arc of the spiral groove, and the sliding groove forces the sliding rod to move linearly, so that the limiting plate moves towards the direction of the adjusting rod, the limiting plate is separated from the mounting ring, and then the positioning ring can be taken out, and the glass ceramic tabletop is separated from the electric hot plate, thus facilitating the maintenance or replacement of the electric hot plate, effectively avoiding damage to the glass ceramic tabletop during the disassembly and assembly process, and facilitating the use of the staff. Brief Description of the Drawings

[0015] Figure 1 It is a three-dimensional structural schematic diagram of the first embodiment of the present application;

[0016] Figure 2Structural sectional view of the first embodiment of the present application;

[0017] Figure 3 Schematic structural diagram of the heat insulation plate of the first embodiment of the present application;

[0018] Figure 4 Schematic structural diagram of the fixing ring of the first embodiment of the present application;

[0019] Figure 5 Exploded view of the fixing component structure of the first embodiment of the present application;

[0020] Figure 6 Bottom view of the adjusting plate structure of the first embodiment of the present application;

[0021] Figure 7 Top view of the structure of the second embodiment of the present application.

[0022] Explanation of the reference numerals in the figure:

[0023] 1. Outer shell, 2. Fixing ring, 3. Arc-shaped block, 4. Mounting ring, 5. Heat insulation plate, 6. Electric heating plate, 7. Glass ceramic tabletop, 8. Positioning ring, 9. Mounting pipe, 10. Adjusting rod, 11. Adjusting plate, 12. Spiral groove, 13. Cross plate, 14. Sliding groove, 15. Slide bar, 16. Limiting plate, 17. Fixed plate, 18. Fixed block, 19. Rubber piston, 20. Limiting ring, 21. Warning lamp, 22. Temperature sensor. Specific embodiments

[0024] The following will describe in detail the two embodiments of the present application with reference to the accompanying drawings.

[0025] The first embodiment:

[0026] Figure 1 Shown: A heating unit for semiconductor wafer etching, including an outer shell 1. A positioning ring 8 is fixedly connected to the outer ring surface of the glass ceramic tabletop 7. The upper end of the positioning ring 8 is fixedly penetrated by a plurality of positioning components. A plurality of limiting rings 20 are fixedly connected to the upper end of the glass ceramic tabletop 7. A plurality of elastic blocks distributed in a ring array around the central axis of the limiting ring 20 are fixedly connected to the inner ring surface of the limiting ring 20. The elastic blocks are made of silicone rubber material. The wafer can be placed in the limiting ring 20, and the wafer is limited by the limiting ring 20, so that the wafer fits more stably with the glass ceramic tabletop 7, thereby effectively improving the uniformity of the wafer heating. The elastic blocks can limit wafers of different sizes to improve the practicability of the equipment.

[0027] Figure 2 、 Figure 3 and Figure 4It is shown that a fixing ring 2 is fixedly connected to the inner bottom wall of the outer shell 1. A plurality of arc-shaped blocks 3 are fixedly connected to the upper end of the fixing ring 2. An installation ring 4 is fixedly connected to the upper end of the arc-shaped block 3. A heat insulation plate 5 is fixedly connected to the inner ring surface of the installation ring 4. An electric heating plate 6 is placed inside the heat insulation plate 5. Those skilled in the art can select a suitable model of the electric heating plate 6 according to actual needs. For example: DB-XAB. The heat insulation plate 5 can stably place the electric heating plate 6, and at the same time effectively prevent the electric heating plate 6 from damaging the fixing component due to excessive temperature. A glass-ceramic tabletop 7 is provided at the upper end of the electric heating plate 6. The glass-ceramic tabletop 7 is in close contact with the electric heating plate 6, and heat is conducted through the glass-ceramic tabletop 7, thereby effectively preventing local overheating and overcooling of the wafer during the heating process. A bottom plate is fixedly connected to the inner ring surface of the fixing ring 2. A plurality of support rods are fixedly connected to the upper end of the bottom plate. The upper end of the support rod is in contact with the lower end of the electric heating plate 6. The plurality of support rods can stably support the electric heating plate 6 and improve the stability of the electric heating plate 6. A plurality of installation holes respectively cooperating with a plurality of installation pipes 9 are formed in the surface of the installation ring 4, which is convenient for inserting the installation pipes 9. The plurality of installation holes and the plurality of positioning components are both distributed in an annular array around the central axis of the outer shell 1. The fixing ring 2 includes a circular ring and a plurality of arc-shaped plates fixedly installed at the upper end of the circular ring. The plurality of arc-shaped plates and the plurality of arc-shaped blocks 3 are staggered, and the height of the arc-shaped plate is less than the height of the arc-shaped block 3. The limiting plate 16 is located above the arc-shaped plate, which is convenient for the movement and reset of the limiting plate 16.

[0028] Figure 5It is shown that the positioning component includes an installation pipe 9 fixedly penetrating through a positioning ring 8. The upper end of the installation pipe 9 rotatably penetrates through an adjusting rod 10. The lower end of the adjusting rod 10 is fixedly connected to an adjusting plate 11. Four spiral grooves 12 are drilled in the upper end of the adjusting plate 11. The rotation of the adjusting rod 10 can drive the adjusting plate 11 to rotate, so that the spiral grooves 12 drive a slide rod 15 to move. A cross plate 13 is fixedly connected to the inner cavity of the installation pipe 9. Four sliding grooves 14 are drilled in the upper end of the cross plate 13. Four slide rods 15 corresponding to the four spiral grooves 12 respectively are arranged at the upper end of the adjusting plate 11. The lower end of the slide rod 15 movably penetrates through the adjacent spiral groove 12 and sliding groove 14 and is fixedly connected to a limiting plate 16. The upper end of the limiting plate 16 is flush with the lower end of the installation ring 4. The sliding groove 14 can force the slide rod 15 to perform a linear motion, thereby driving the limiting plate 16 to move, so that the upper end of the limiting plate 16 fits with the installation ring 4, so that the positioning ring 8 is fixed to the installation ring 4, so that the glass-ceramic tabletop 7 is stably attached to the electric heating plate 6. The upper end of the adjusting rod 10 is fixedly connected to a fixing plate 17. A fixing block 18 is arranged in the fixing plate 17. The lower end of the fixing block 18 is fixedly connected to a plurality of rubber pistons 19. The lower ends of the rubber pistons 19 sequentially movably penetrate through the fixing plate 17 and the installation pipe 9. The plurality of rubber pistons 19 can fix the fixing plate 17 and the installation pipe 9, so as to effectively prevent the fixing plate 17 from being accidentally touched and rotated, improving the stability of the device. Both the fixing plate 17 and the fixing block 18 are cross-shaped. The upper end of the fixing block 18 is fixedly connected to a handle. The handle is convenient for taking out the fixing block 18 and then rotating the fixing plate 17, so as to facilitate the disassembly and assembly of the positioning ring 8.

[0029] During use, when the electric heating plate 6 needs to be maintained, the fixing block 18 can be pulled out, and the fixing plate 17 is rotated to make the adjusting rod 10 rotate. The adjusting rod 10 drives the adjusting plate 11 to rotate, so that the slide rod 15 moves along the arc of the spiral groove 12. The sliding groove 14 can force the slide rod 15 to perform a linear movement, so that the limiting plate 16 moves towards the direction of the adjusting rod 10, separating the limiting plate 16 from the installation ring 4, and then the positioning ring 8 can be taken out, separating the glass-ceramic tabletop 7 from the electric heating plate 6, so as to facilitate the repair or replacement of the electric heating plate 6, effectively avoiding damage to the glass-ceramic tabletop 7 during the disassembly and assembly process, and facilitating the use of the staff.

[0030] The second implementation mode:

[0031] Based on the first implementation mode, a warning lamp 21 and a temperature sensor 22 are newly added in this implementation mode, and the rest is the same as the first implementation mode.

[0032] Figure 7It is shown that a warning light 21 and a temperature sensor 22 are fixedly connected to the upper end of the positioning ring 8. Those skilled in the art can select a warning light 21 of a suitable model according to actual needs, such as LTE-5107. Those skilled in the art can select a temperature sensor 22 of a suitable model according to actual needs, such as WZP-231. The electric hot plate 6, the warning light 21 and the temperature sensor 22 are all signal-connected to an external controller.

[0033] During use, the temperature sensor 22 is used to monitor the temperature of the surface of the glass-ceramic tabletop 7 in real time. When the temperature is too high, the warning light 21 lights up, which can effectively prevent the staff from being scalded and improve the safety of the equipment.

[0034] Combined with the current actual needs, the above-mentioned implementation method adopted in this application, the protection scope is not limited to this. Within the knowledge scope of those skilled in the art, various changes made without departing from the concept of this application still fall within the protection scope of this utility model.

Claims

1. A heating unit for etching a semiconductor wafer, comprising a housing (1), characterized in that: The inner bottom wall of the housing (1) is fixedly connected to a fixing ring (2), a plurality of arc-shaped blocks (3) are fixedly connected to the upper end of the fixing ring (2), a mounting ring (4) is fixedly connected to the upper end of the arc-shaped blocks (3), a heat insulation board (5) is fixedly connected to the inner ring surface of the mounting ring (4), an electric heating board (6) is placed inside the heat insulation board (5), a glass ceramic table top (7) is provided at the upper end of the electric heating board (6), a positioning ring (8) is fixedly connected to the outer ring surface of the glass ceramic table top (7), and a plurality of positioning components are fixedly passed through the upper end of the positioning ring (8); The positioning assembly comprises a mounting tube (9) fixedly passing through the positioning ring (8); an adjusting rod (10) is rotatably passed through the upper end of the mounting tube (9); an adjusting plate (11) is fixedly connected to the lower end of the adjusting rod (10); four vortex grooves (12) are cut out at the upper end of the adjusting plate (11); a cross plate (13) is fixedly connected to the inner cavity of the mounting tube (9); four slide grooves (14) are cut out at the upper end of the cross plate (13); and four vortex grooves (14) are respectively provided at the upper end of the adjusting plate (11). A slide rod (15) corresponding to the groove (12) is provided, and the lower end of the slide rod (15) moves and penetrates the adjacent vortex groove (12) and the slide groove (14) and is fixedly connected to the limit plate (16). The upper end of the adjusting rod (10) is fixedly connected to a fixing plate (17), and a fixing block (18) is provided in the fixing plate (17). The lower end of the fixing block (18) is fixedly connected to a plurality of rubber pistons (19), and the lower ends of the rubber pistons (19) are movable and penetrate the fixing plate (17) and the mounting tube (9) in sequence.

2. A heating unit for semiconductor wafer etching according to claim 1, characterized in that: The inner ring surface of the fixing ring (2) is fixedly connected to a bottom plate, the upper end of the bottom plate is fixedly connected to a plurality of support rods, and the upper ends of the support rods are in contact with the lower ends of the electric heating plates (6).

3. A semiconductor wafer etching heating unit according to claim 1, characterized in that: The surface of the mounting ring (4) is provided with a plurality of mounting holes respectively used in conjunction with a plurality of mounting tubes (9), and the plurality of mounting holes and the plurality of positioning components are distributed in a ring array around the central axis of the housing (1).

4. The semiconductor wafer etching heating unit according to claim 1, characterized in that: The fixing ring (2) comprises a circular ring and a plurality of arc-shaped plates fixedly mounted on the upper end of the circular ring, the plurality of arc-shaped plates and the plurality of arc-shaped blocks (3) being distributed in an alternating manner, and the height of the arc-shaped plates is less than the height of the arc-shaped blocks (3).

5. The semiconductor wafer etching heating unit according to claim 1, characterized in that: The fixing plate (17) and the fixing block (18) are both cross-shaped, the upper end of the fixing block (18) is fixedly connected to a handle, the upper end of the limiting plate (16) is flush with the lower end of the mounting ring (4), and the limiting plate (16) is located above the arc-shaped plate.

6. The semiconductor wafer etching heating unit according to claim 1, characterized in that: A plurality of limiting rings (20) are fixedly connected to the upper end of the glass ceramic tabletop (7), and a plurality of elastic blocks distributed in a ring array around the central axis of the limiting ring (20) are fixedly connected to the inner ring surface of the limiting ring (20), wherein the elastic blocks are made of silicone rubber material.

7. The semiconductor wafer etching heating unit according to claim 1, characterized in that: A warning light (21) and a temperature sensor (22) are fixedly connected to the upper end of the positioning ring (8), and the electric heating plate (6), the warning light (21) and the temperature sensor (22) are all connected to an external controller signal.

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