Pulse electroplating device of insoluble anode

Abstract

The utility model relates to the technical field of pulse electroplating, in particular to a pulse electroplating device for insoluble anodes, which comprises an electroplating bath body and an auxiliary device, two anode rods are mounted on the surface of the electroplating bath body, a plurality of insoluble anode bodies are arranged on the surfaces of the two anode rods, and the auxiliary device is arranged on the surface of the electroplating bath body. The auxiliary device comprises a pump body, the pump body is fixedly connected with the surface of the electroplating bath body, the output end of the pump body is fixedly connected with a first suction pipe, and one side of the electroplating bath body is fixedly connected with a second suction pipe. The accumulation of solid precipitates is avoided, so that the uniformity of the electroplating liquid is favorably kept, the influence of local concentration difference on the quality of a plating layer is reduced, and the conditions that the components of the electroplating liquid are changed and the quality and the stability of the electroplating liquid are reduced due to the fact that impurities are possibly dissolved or react with the electroplating liquid are reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of pulse electroplating, in particular to a pulse electroplating device with an insoluble anode. Background Art

[0002] An insoluble anode is an anode that does not dissolve itself during electrolysis or electroplating. In electroplating, common insoluble anode materials include platinum, titanium coated with precious metal oxides (such as titanium coated with ruthenium and iridium), graphite, etc.

[0003] A pulse electroplating device is an advanced electroplating equipment. It realizes the electroplating process by applying a pulse current to the electroplating bath. Mainly, the pulse power supply can generate a current with specific pulse parameters (such as pulse width, pulse interval, current density, etc.).

[0004] In the prior art, such as the utility model with the publication number CN219136979U, the utility model discloses a pulse electroplating device with an insoluble anode, including an electroplating bath body, an anode box, an anode rod, a cathode rod, and a rectifier; the anode rod and the cathode rod are installed on the top surface of the electroplating bath body; the anode box is electrically connected to the anode rod and is also electrically connected to the positive pole of the rectifier; the cathode rod is electrically connected to the negative pole of the rectifier; the anode box includes an arrangement structure composed of an insoluble anode, an anode diaphragm, and a stainless metal electrode; the anode diaphragm is arranged on one side of the insoluble anode to form an isolation structure; the stainless metal electrode is arranged on one side of the isolation structure; the anode rod includes an electrode anode rod and a protection anode rod; the insoluble anode is electrically connected to the electrode anode rod; the stainless metal electrode is electrically connected to the protection anode rod; by using the stainless metal electrode as the current-carrying and conducting electrode for the reverse current during pulse electroplating processing, it provides a good protection effect for the insoluble anode, prolongs the service life of the insoluble anode, reduces the consumption of additives, improves the electroplating quality, and solves the problems in the prior art that when using a copper ball as the anode for pulse electroplating, there is too much anode sludge, unstable electroplating, complex adjustment process, and when using an insoluble anode such as a titanium mesh as the anode for pulse electroplating, a hydrogen evolution reaction occurs, affecting the anode life and electroplating quality.

[0005] In daily work, it is found that when the existing pulse electroplating device with an insoluble anode is in use, it is not convenient to filter the electroplating liquid, especially not convenient to clean and filter the impurities at the bottom of the electroplating tank. The impurities may dissolve or react with the electroplating solution, changing the composition of the electroplating solution and reducing the quality and stability of the electroplating solution. Furthermore, it leads to the problem that the existing pulse electroplating device with an insoluble anode is not convenient to filter the impurities at the bottom of the electroplating tank and in the liquid. Summary of the Utility Model

[0006] The purpose of the present utility model is to solve the drawback in the prior art that it is inconvenient to filter the impurities at the bottom of the electroplating bath and in the liquid, and a pulsed electroplating device with an insoluble anode is proposed.

[0007] To achieve the above object, the present utility model adopts the following technical scheme: A pulsed electroplating device with an insoluble anode, including an electroplating bath body and an auxiliary device. Two anode rods are installed on the surface of the electroplating bath body. A plurality of insoluble anode bodies are arranged on the surfaces of the two anode rods. The auxiliary device is arranged on the surface of the electroplating bath body. The auxiliary device includes a pump body, which is fixedly connected to the surface of the electroplating bath body. A suction pipe one is fixedly connected to the output end of the pump body. A suction pipe two is fixedly connected to one side of the electroplating bath body. A filtering component is arranged between the suction pipe one and the suction pipe two. A water outlet pipe is fixedly connected to the output end of the pump body. One end of the water outlet pipe is fixedly connected to a three-way valve. The other two ends of the three-way valve are respectively fixedly connected to a drain pipe and an auxiliary pipe. One end of the auxiliary pipe extends into the electroplating bath body and is fixedly connected to a connecting pipe. A plurality of washing pipes are arranged on the surface of the connecting pipe. Through the above components, the pump body can cooperate with the suction pipe one and the suction pipe two to suck the liquid in the electroplating bath body, and the filtering component filters. The filtered liquid is discharged into the electroplating bath body through the drain pipe. When it is necessary to wash the bottom, the three-way valve can be rotated. Subsequently, the three-way valve is communicated with the auxiliary pipe. Then, the filtered liquid is discharged through the connecting pipe and the washing pipes to wash the bottom of the electroplating bath body, wash up the impurities and suck them through the suction pipe one and the suction pipe two, and the filtering component filters.

[0008] Preferably, the washing pipe includes a pipe body, which is fixedly connected to the surface of the connecting pipe. A plurality of nozzles are arranged on the surface of the pipe body. Through the above components, when the washing pipe is washing, water is supplied to the nozzles through the pipe body to wash the bottom of the electroplating bath body.

[0009] Preferably, the filtering component includes a filtering box, which is arranged between the suction pipe one and the suction pipe two and is communicated with the suction pipe one and the suction pipe two. A sealed filtering box is inserted into the inner wall of the filtering box. A handle is fixedly connected to one side surface of the sealed filtering box. Through the above components, when the suction pipe two conveys water to the filtering box, the sealed filtering box can intercept and filter the impurities, and the filtered liquid can be sucked away through the suction pipe one.

[0010] Preferably, the suction pipe one is fixedly connected to the lower side of one side of the filtering box, and the suction pipe two is fixedly connected to the upper side of the other side of the filtering box.

[0011] Preferably, a screw rod is rotatably connected to the inner wall of the handle, and the screw rod is threadedly connected to the inner wall of the filtering box. Through the above components, after the sealed filtering box is inserted into the filtering box, the screw rod can be rotated, and the screw rod is threadedly connected to the inner wall of the filtering box, thereby improving the overall stability.

[0012] Preferably, a plurality of support blocks are fixedly connected to the inner wall of the filter box at equal intervals, and the support blocks are arranged below the sealed filter box. Through the above components, the plurality of support blocks can support the sealed filter box and improve the impact resistance of the sealed filter box.

[0013] Compared with the prior art, the advantages and positive effects of the present utility model are as follows:

[0014] 1. In the present utility model, by setting the auxiliary device, impurities and particulate matters generated during the electroplating process can be effectively removed. At the same time, the bottom of the electroplating bath can be rinsed to avoid the accumulation of solid precipitates, which helps to maintain the uniformity of the electroplating solution, reduce the influence of local concentration differences on the coating quality, and reduce the situation where impurities may dissolve or react with the electroplating solution, causing changes in the composition of the electroplating solution and reducing the quality and stability of the electroplating solution. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a schematic three-dimensional structure diagram of a pulsed electroplating device with an insoluble anode proposed by the present utility model;

[0016] Figure 2 is a pulsed electroplating device with an insoluble anode proposed by the present utility model Figure 1 schematic diagram of the structure at A in;

[0017] Figure 3 is a partial structure diagram of a pulsed electroplating device with an insoluble anode proposed by the present utility model;

[0018] Figure 4 is a schematic cross-sectional structure diagram of a pulsed electroplating device with an insoluble anode proposed by the present utility model;

[0019] Figure 5 is a schematic cross-sectional structure diagram of a filter assembly of a pulsed electroplating device with an insoluble anode proposed by the present utility model.

[0020] LEGEND DESCRIPTION:

[0021] 1. Electroplating bath body; 2. Anode rod; 3. Insoluble anode body; 4. Auxiliary device; 41. Pump body; 42. First suction pipe; 43. Filter assembly; 431. Filter box; 432. Sealed filter box; 433. Support block; 434. Handle; 435. Screw rod; 44. Second suction pipe; 45. Drain pipe; 46. Flushing pipe; 461. Pipe body; 462. Nozzle; 47. Connecting pipe; 48. Auxiliary pipe; 49. Three-way valve; 410. Outlet pipe. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0022] Please refer to Figures 1-5, the present utility model provides a technical solution: a pulse electroplating device for an insoluble anode, including an electroplating tank body 1 and an auxiliary device 4. Two anode rods 2 are installed on the surface of the electroplating tank body 1, and a plurality of insoluble anode bodies 3 are arranged on the surfaces of the two anode rods 2. The auxiliary device 4 is arranged on the surface of the electroplating tank body 1.

[0023] Specifically, the auxiliary device 4 includes a pump body 41. The pump body 41 is fixedly connected to the surface of the electroplating tank body 1. A suction pipe 42 is fixedly connected to the output end of the pump body 41. A suction pipe 44 is fixedly connected to one side of the electroplating tank body 1. A filtering component 43 is arranged between the suction pipe 42 and the suction pipe 44. A water outlet pipe 410 is fixedly connected to the output end of the pump body 41. One end of the water outlet pipe 410 is fixedly connected to a three-way valve 49. The other two ends of the three-way valve 49 are respectively fixedly connected to a drain pipe 45 and an auxiliary pipe 48. One end of the auxiliary pipe 48 extends into the electroplating tank body 1 and is fixedly connected to a connecting pipe 47. A plurality of washing pipes 46 are arranged on the surface of the connecting pipe 47.

[0024] In this implementation scheme: the pump body 41 can cooperate with the suction pipe 42 and the suction pipe 44 to suck the liquid in the electroplating tank body 1. The filtering component 43 filters. The filtered liquid is discharged into the electroplating tank body 1 through the drain pipe 45. When it is necessary to wash the bottom, the three-way valve 49 can be rotated. Subsequently, the three-way valve 49 is communicated with the auxiliary pipe 48. Then the filtered liquid is discharged through the connecting pipe 47 and the washing pipes 46 to wash the bottom of the electroplating tank body 1, wash up the impurities and suck them through the suction pipe 42 and the suction pipe 44. The filtering component 43 filters.

[0025] Specifically, the washing pipe 46 includes a pipe body 461. The pipe body 461 is fixedly connected to the surface of the connecting pipe 47. A plurality of nozzles 462 are arranged on the surface of the pipe body 461. When the washing pipe 46 is washing, water is supplied to the nozzles 462 through the pipe body 461 to wash the bottom of the electroplating tank body 1.

[0026] Specifically, the filtering component 43 includes a filtering box 431. The filtering box 431 is arranged between the suction pipe 42 and the suction pipe 44. The filtering box 431 is communicated with the suction pipe 42 and the suction pipe 44. A sealed filtering box 432 is inserted into the inner wall of the filtering box 431. A handle 434 is fixedly connected to one side surface of the sealed filtering box 432.

[0027] In this implementation scheme: when the suction pipe 44 conveys water to the filtering box 431, the sealed filtering box 432 can intercept and filter the impurities. The filtered liquid can be sucked away through the suction pipe 42.

[0028] Specifically, the suction pipe 42 is fixedly connected to the lower part of one side of the filtering box 431, and the suction pipe 44 is fixedly connected to the upper part of the other side of the filtering box 431.

[0029] Specifically, the inner wall of the handle 434 is rotatably connected to a screw rod 435, and the screw rod 435 is threadedly connected to the inner wall of the filter box 431.

[0030] In this embodiment: After the sealed filter box 432 is inserted into the filter box 431, the screw rod 435 can be rotated. The screw rod 435 is threadedly connected to the inner wall of the filter box 431, thereby improving the overall stability.

[0031] Specifically, a plurality of support blocks 433 are fixedly connected to the inner wall of the filter box 431 at equal intervals. The support blocks 433 are arranged below the sealed filter box 432. The plurality of support blocks 433 can support the sealed filter box 432 and improve the anti-impact effect of the sealed filter box 432.

[0032] Working principle: When in use, the pump body 41 can be opened. The pump body 41 can cooperate with the first suction pipe 42 and the second suction pipe 44 to suck the liquid in the electroplating tank body 1. The sucked liquid can enter the filter box 431. The sealed filter box 432 can filter the liquid. The filtered liquid is discharged into the drain pipe 45 through the first suction pipe 42. The drain pipe 45 discharges the liquid into the electroplating tank body 1. When it is necessary to flush the bottom, the three-way valve 49 can be rotated to connect the three-way valve 49 with the auxiliary pipe 48. Subsequently, the filtered liquid is discharged into the auxiliary pipe 48 through the water outlet pipe 410. The auxiliary pipe 48 discharges the liquid into the connecting pipe 47 and the flushing pipe 46. When the flushing pipe 46 is flushing, water is supplied to the nozzle 462 through the pipe body 461 to flush the bottom of the electroplating tank body 1, washing up the impurities and sucking them through the first suction pipe 42 and the second suction pipe 44. After passing through the sealed filter box 432 in the filter box 431 for filtration, during cleaning, only the screw rod 435 needs to be rotated. The screw rod 435 loses its connection with the inner wall of the filter box 431, and then the sealed filter box 432 is taken out through the handle 434 for cleaning.

Claims

1. A pulse electroplating device for insoluble anodes, comprising an electroplating tank (1) and an auxiliary device (4), characterized in that: The surface of the electroplating tank (1) is provided with two anode rods (2), and the surfaces of the two anode rods (2) are provided with a plurality of insoluble anode bodies (3). The auxiliary device (4) is provided on the surface of the electroplating tank (1), and the auxiliary device (4) comprises a pump body (41), and the pump body (41) is fixedly connected to the surface of the electroplating tank (1), and a suction pipe (42) is fixedly connected to the output end of the pump body (41), and a suction pipe (44) is fixedly connected to one side of the electroplating tank (1), and the suction pipe (44) is fixedly connected to the output end of the pump body (41). A filter assembly (43) is arranged between the first suction pipe (42) and the second suction pipe (44); the output end of the pump body (41) is fixedly connected to a water outlet pipe (410); one end of the water outlet pipe (410) is fixedly connected to a three-way valve (49); the other two ends of the three-way valve (49) are respectively fixedly connected to a drain pipe (45) and an auxiliary pipe (48); one end of the auxiliary pipe (48) extends into the electroplating tank body (1) and is fixedly connected to a connecting pipe (47); a plurality of flushing pipes (46) are arranged on the surface of the connecting pipe (47).

2. The pulse electroplating device of an insoluble anode according to claim 1, characterized in that: The flushing pipe (46) comprises a pipe body (461), the pipe body (461) is fixedly connected to the surface of the connecting pipe (47), and a plurality of nozzles (462) are arranged on the surface of the pipe body (461).

3. The pulse electroplating device of an insoluble anode according to claim 1, characterized in that: The filter assembly (43) comprises a filter box (431), the filter box (431) being arranged between the first suction tube (42) and the second suction tube (44), the filter box (431) being connected to the first suction tube (42) and the second suction tube (44), a sealed filter box (432) being inserted into the inner wall of the filter box (431), and a handle (434) being fixedly connected to a side surface of the sealed filter box (432).

4. The pulse electroplating device of an insoluble anode according to claim 1, characterized in that: The first suction pipe (42) is fixedly connected to the lower side of one side of the filter box (431), and the second suction pipe (44) is fixedly connected to the upper side of the other side of the filter box (431).

5. The pulse electroplating device of an insoluble anode according to claim 3, characterized in that: The inner wall of the handle (434) is rotatably connected to a screw rod (435), and the screw rod (435) is threadedly connected to the inner wall of the filter box (431).

6. The pulse electroplating device of an insoluble anode according to claim 3, characterized in that: The inner wall of the filter box (431) is fixedly connected to a plurality of support blocks (433) arranged at equal intervals, and the support blocks (433) are arranged below the sealed filter box (432).

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