Heat dissipation module with local square heat pipe structure

Abstract

The utility model relates to a radiating module with a local square heat pipe structure, which belongs to the technical field of radiating modules with local square heat pipe structures and comprises two radiating fins, a heat pipe component is arranged on the front surfaces of the two radiating fins, and a radiating component is arranged on the back surface of the heat pipe component. The heat pipe assembly comprises two heating pipes fixed to the front faces of the cooling fins, connecting pipes are fixed to the left ends and the right ends of the heating pipes, cooling pipes are fixed to the ends, away from the heating pipes, of the connecting pipes, and copper powder is fixed to the inner walls of the heating pipes and the inner walls of the cooling pipes. According to the heat dissipation module of the local square heat pipe structure, when the heat dissipation module is used, the cooling fins make contact with the chip, heat generated by the chip is absorbed through the cooling fins and transmitted to the heat pipe assembly, the heat pipe assembly leads the heat to the two ends, heat dissipation is conducted through the heat dissipation assembly, and normal work of the chip is guaranteed; the heat conduction area can be effectively increased, so that the heat conduction efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation modules with a local square heat pipe structure, in particular to a heat dissipation module with a local square heat pipe structure. Background Art

[0002] Computer, commonly known as computer, is a modern electronic computing machine used for high-speed calculations. It can perform numerical calculations, logical calculations, and has storage and memory functions. When the computer is working, its chip will generate a lot of heat, which needs to be evacuated in time by a heat dissipation module to ensure the normal operation of the computer chip.

[0003] For example, a Chinese patent (publication number: CN207185079U) discloses a heat pipe type radiator module, including: a first fin, a second fin, a third fin, a substrate, a heat pipe, an air duct bracket, and a bottom plate; the air duct bracket is arranged with grooves on both sides, so that the grooves on both sides form air ducts on both sides, and the cold air on both sides can continue to cool and dissipate heat for adjacent fins, avoiding the problem that the wind passing through the adjacent fins arranged in parallel in the traditional way is hot air, resulting in poor heat dissipation effect.

[0004] However, the above-mentioned search patent still has some shortcomings. Its heat pipe is a cylindrical structure. Due to the limited internal space of the notebook, the width and height of the heat dissipation fins are limited, and thus the width and height of the connected heat pipes are also limited, which reduces the heat dissipation efficiency of the heat pipes and makes the heat dissipation module unsuitable for heat dissipation of laptop computers. It is inconvenient to use. Therefore, a heat dissipation module with a partial square heat pipe structure is proposed to solve the above problems. Utility Model Content

[0005] In view of the deficiencies in the prior art, the utility model provides a heat dissipation module with a partial square heat pipe structure, which has the advantages of high heat dissipation efficiency, etc., and solves the problem that the heat dissipation module disclosed in the above-mentioned search patent is not suitable for notebook computers and has low heat dissipation efficiency.

[0006] To achieve the above object, the utility model provides the following technical solutions: a heat dissipation module with a partial square heat pipe structure, comprising two heat sinks, a heat pipe assembly is arranged on the front of the two heat sinks, and a heat dissipation assembly is arranged on the back of the heat pipe assembly;

[0007] The heat pipe assembly includes two heating pipes fixed on the front side of the heat sink, connecting pipes are fixed on both ends of the heating pipe, a heat dissipation pipe is fixed on the end of the connecting pipe facing away from the heating pipe, copper powder is fixed on the inner walls of the heating pipe and the heat dissipation pipe, the heating pipe, the connecting pipe and the heat dissipation pipe are all square flat copper pipes, the heat dissipation pipe is staggered front and back with the heating pipe and the two are arranged in parallel.

[0008] Further, the two heat sinks are distributed left and right, the two heating tubes are distributed up and down, and the two heating tubes are both fixed to the two heat sinks.

[0009] Further, the connecting pipe is an S-shaped elbow pipe, and the end of the connecting pipe away from the heating pipe tilts forward.

[0010] Further, the copper powder is sintered on the inner walls of the heating pipe and the heat dissipation pipe, and the heating pipe is filled with evaporation liquid.

[0011] Further, the heat dissipation assembly includes a heat dissipation bottom plate fixed to the back of the heat dissipation pipe, and a plurality of heat dissipation fins are fixed to the back of the heat dissipation bottom plate.

[0012] Further, the two heat dissipation pipes on the left are fixed to the same heat dissipation bottom plate, and the two heat dissipation pipes on the right are fixed to the same heat dissipation bottom plate.

[0013] Further, the heat dissipation bottom plate and the heat dissipation fins are both copper sheets, and the plurality of heat dissipation fins are distributed equidistantly left and right.

[0014] Compared with the prior art, the technical solution of the present application has the following beneficial effects:

[0015] When the heat dissipation module with the local square heat pipe structure is in use, the heat sink contacts the chip, the heat generated by the chip is absorbed by the heat sink and transmitted to the heat pipe assembly, the heat pipe assembly conducts the heat to both ends and dissipates the heat through the heat dissipation assembly to ensure the normal operation of the chip. Both the heating pipe and the heat dissipation pipe are square pipes, which can effectively increase the heat conduction area and thus increase the heat conduction efficiency. At the same time, the heating pipe and the heat dissipation pipe are staggered front and back, which can increase the distance between the inner wall of the notebook and the back of the heat dissipation pipe, so that the heat dissipation fins have a larger installation space, and then it is convenient to increase the thickness of the heat dissipation fins to improve the heat dissipation efficiency of the heat dissipation pipe, with better practicability and more convenient for popularization and use. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a front view schematic diagram of the present utility model;

[0017] Figure 2 is a rear view schematic diagram of the present utility model;

[0018] Figure 3 is a three-dimensional schematic diagram of the heating pipe of the present utility model.

[0019] In the figure: 1 heat sink, 201 heating pipe, 202 connecting pipe, 203 heat dissipation pipe, 204 copper powder, 301 heat dissipation bottom plate, 302 heat dissipation fin. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts shall fall within the protection scope of the present utility model.

[0021] Please refer to Figure 1 , a heat dissipation module with a partial square heat pipe structure in this embodiment includes two heat sinks 1. A heat pipe assembly is provided on the front surface of the two heat sinks 1, and a heat dissipation assembly is provided on the back surface of the heat pipe assembly. During use, the heat sink 1 is in contact with the chip, and the heat generated by the chip is absorbed by the heat sink 1 and transmitted to the heat pipe assembly. The heat pipe assembly conducts the heat to both ends and dissipates the heat through the heat dissipation assembly to ensure the normal operation of the chip. By dissipating heat from both sides simultaneously, the heat dissipation efficiency of the heat dissipation module is effectively improved.

[0022] Please refer to Figures 1 to 3 , the heat pipe assembly includes two heating pipes 201 fixed to the front surface of the heat sink 1. The heating pipe 201 is filled with evaporation liquid. The two heat sinks 1 are distributed left and right, and the two heating pipes 201 are distributed up and down. Both heating pipes 201 are fixed to the two heat sinks 1. During use, the heat generated by the chip is conducted to the heat sink 1, and the heat sink 1 conducts the heat to the heating pipe 201. The heating pipe 201 heats the evaporation liquid inside it. The evaporation liquid is heated and evaporated to take away heat. Connecting pipes 202 are fixed to both the left and right ends of the heating pipe 201. One end of the connecting pipe 202 facing away from the heating pipe 201 is fixed with a heat dissipation pipe 203. Further, the hot steam enters the heat dissipation pipe 203 through the connecting pipe 202. After the hot steam conducts the heat to the heat dissipation pipe 203, it liquefies and flows back to the heating pipe 201 for cyclic heat conduction to achieve the heat dissipation effect of the chip. Copper powder 204 is fixed to the inner walls of both the heating pipe 201 and the heat dissipation pipe 203. The copper powder 204 is sintered on the inner walls of the heating pipe 201 and the heat dissipation pipe 203. The sintered copper powder 204 can effectively increase the surface area of the inner walls of the heat dissipation pipe 203 and the heating pipe 201, thereby increasing the heat conduction and dissipation area to improve the heat dissipation efficiency of the heat dissipation module.

[0023] The heating pipe 201, the connecting pipe 202, and the heat dissipation pipe 203 are all square flat copper pipes. The connecting pipe 202 is an S-shaped bent pipe. The heating pipe 201 and the heat dissipation pipe 203 are both square pipes, which can effectively increase the heat conduction contact area and thus increase the heat conduction efficiency.

[0024] Please refer to Figures 1 to 2, in this embodiment, the heat dissipation component includes a heat dissipation bottom plate 301 fixed to the back of the heat dissipation tube 203. A plurality of heat dissipation fins 302 are fixed to the back of the heat dissipation bottom plate 301. When heat is conducted to the heat dissipation tube 203, it will be further conducted to the heat dissipation bottom plate 301, and heat dissipation is carried out through the heat dissipation fins 302 on the heat dissipation bottom plate 301. It should be understood that the heat dissipation fan of the notebook computer should be installed directly below the heat dissipation component, and the air outlet direction of the heat dissipation fan should face upward and directly face the heat dissipation fins 302. In addition, the control circuit of the heat dissipation fan can be realized by simple programming by those skilled in the art, and the power supply also belongs to the common knowledge in the art. And this application is mainly used to protect mechanical devices, so this application will not explain in detail the control method and circuit connection of the heat dissipation fan.

[0025] The heat dissipation tube 203 is staggered front and back with the heating tube 201 and they are arranged in parallel. One end of the connecting tube 202 far from the heating tube 201 tilts forward. The heating tube 201 and the heat dissipation tube 203 are staggered front and back, so that the distance between the back of the heat dissipation tube 203 and the inner wall of the notebook computer housing is increased, which is convenient for installing thicker heat dissipation fins 302 to increase the contact area between the heat dissipation component and the air and further improve the heat dissipation efficiency.

[0026] The two heat dissipation tubes 203 on the left are fixed to the same heat dissipation bottom plate 301, and the two heat dissipation tubes 203 on the right are fixed to the same heat dissipation bottom plate 301. Both the heat dissipation bottom plate 301 and the heat dissipation fins 302 are copper sheets. A plurality of heat dissipation fins 302 are equidistantly distributed left and right. Such a structure facilitates the air blown by the heat dissipation fan to pass through between the plurality of heat dissipation fins 302, so that the heat on the heat dissipation fins 302 can achieve a heat dissipation effect.

[0027] The working principle of the above embodiment is as follows:

[0028] (1) During use, the heat generated by the chip is conducted to the heat dissipation fin 1, and the heat dissipation fin 1 conducts the heat to the heating tube 201. The heating tube 201 heats the evaporation liquid inside it. The evaporation liquid evaporates when heated and takes away heat. Further, the hot steam enters the heat dissipation tube 203 through the connecting tube 202. After the hot steam conducts the heat to the heat dissipation tube 203, it liquefies and flows back to the heating tube 201 for cyclic heat conduction to achieve the heat dissipation effect of the chip. Both the heating tube 201 and the heat dissipation tube 203 are square copper tube structures, and copper powder 204 is sintered inside them, which can effectively improve the heat conduction and heat dissipation efficiency;

[0029] (2) When heat is conducted to the heat dissipation pipe 203, it will be further conducted to the heat dissipation bottom plate 301, and dissipated through the heat dissipation fins 302 on the heat dissipation bottom plate 301. The heating pipe 201 and the heat dissipation pipe 203 are staggered front and back, so that the distance between the back of the heat dissipation pipe 203 and the inner wall of the notebook computer housing is increased, which facilitates the installation of thicker heat dissipation fins 302, so as to increase the contact area between the heat dissipation component and the air and further improve the heat dissipation efficiency.

[0030] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the presence of additional identical elements in the process, method, article or device including the said element.

[0031] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation module with a partial square heat pipe structure, comprising two heat sinks (1), characterized in that: A heat pipe assembly is provided on the front side of the two heat sinks (1), and a heat dissipation assembly is provided on the back side of the heat pipe assembly; The heat pipe assembly comprises two heating pipes (201) fixed on the front side of the heat sink (1); connecting pipes (202) are fixed on both left and right ends of the heating pipe (201); a heat dissipation pipe (203) is fixed on one end of the connecting pipe (202) away from the heating pipe (201); copper powder (204) is fixed on the inner walls of the heating pipe (201) and the heat dissipation pipe (203); the heating pipe (201), the connecting pipe (202) and the heat dissipation pipe (203) are all square flat copper pipes; the heat dissipation pipe (203) and the heating pipe (201) are staggered in front and back and are arranged in parallel.

2. The heat dissipation module with a partial square heat pipe structure according to claim 1, characterized in that: The two heat sinks (1) are distributed left and right, the two heating tubes (201) are distributed up and down, and the two heating tubes (201) are fixed to the two heat sinks (1).

3. The heat dissipation module with a partial square heat pipe structure according to claim 1, characterized in that: The connecting pipe (202) is an S-shaped curved pipe, and one end of the connecting pipe (202) away from the heating pipe (201) is tilted forward.

4. The heat dissipation module with a partial square heat pipe structure according to claim 1, characterized in that: The copper powder (204) is sintered on the inner walls of the heating tube (201) and the heat dissipation tube (203), and the heating tube (201) is filled with evaporative liquid.

5. The heat dissipation module with a partial square heat pipe structure according to claim 1, characterized in that: The heat dissipation assembly comprises a heat dissipation base plate (301) fixed on the back of the heat dissipation pipe (203), and a plurality of heat dissipation fins (302) are fixed on the back of the heat dissipation base plate (301).

6. The heat dissipation module with a partial square heat pipe structure according to claim 5, characterized in that: The two heat dissipation pipes (203) on the left are fixed to the same heat dissipation bottom plate (301), and the two heat dissipation pipes (203) on the right are fixed to the same heat dissipation bottom plate (301).

7. The heat dissipation module with a partial square heat pipe structure according to claim 5, characterized in that: The heat dissipation base plate (301) and the heat dissipation fins (302) are both copper sheets, and a plurality of the heat dissipation fins (302) are distributed equidistantly from left to right.

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