Conductive film, pole piece, energy storage device and electric equipment

Abstract

The utility model discloses a conducting film, a pole piece, an energy storage device and electric equipment, the conducting film comprises a conducting film main body, the conducting film main body comprises at least two first areas and at least one second area which are adjacent to each other along a first direction, the at least two first areas are located on the two opposite sides of the at least one second area in the first direction respectively; wherein at least one side, along the second direction, of the second area is provided with an isolating layer, the sheet resistance of the second area is higher than that of the first area, and the isolating layer is used for isolating two opposite surfaces, along the second direction, of the conductive film main body in the winding state. According to the utility model, the problem that the metal layers on the surfaces of the two sides of the base film are easily adhered to each other is solved.

Description

Technical Field

[0001] This application relates to the technical field of batteries, and more particularly, to a conductive film, a pole piece, an energy storage device, and an electrical device. Background Art

[0002] Currently, the preparation processes of composite current collector materials generally include the following methods:

[0003] 1) A metal layer such as a copper layer (Cu) is deposited on the surface of a polymer base film by means of vacuum magnetron sputtering or thermal evaporation coating, and a composite current collector is obtained in one step.

[0004] 2) A two-step forming method of vacuum magnetron sputtering or thermal evaporation + electroplating coating is adopted to deposit a copper layer on the surface of a polymer base film to obtain a composite current collector.

[0005] 3) A three-step forming method of magnetron sputtering coating + thermal evaporation coating + electroplating coating is adopted to deposit a copper layer on the surface of a polymer base film to obtain a composite current collector.

[0006] After the coating is completed, the obtained composite current collector needs to be wound in a roll-to-roll manner. In the wound film roll, the metal layers on both sides of the base film are prone to stick to each other, resulting in adhesion failure of the film layer during the unwinding process of the film roll, causing delamination defects, that is, local or sporadic peeling of the copper layer on the surface of the base film. Utility Model Content

[0007] The main purpose of this application is to provide a conductive film, a pole piece, an energy storage device, and an electrical device to solve the problem that the metal layers on both sides of the base film are prone to stick to each other as mentioned in the background art.

[0008] According to one aspect of this application, a conductive film is provided, including:

[0009] A conductive film body, along a first direction, the conductive film body includes an adjacent first region and a second region, the first region includes at least two, the second region includes at least one, and at least two of the first regions are respectively located on opposite sides of at least one of the second regions along the first direction;

[0010] Wherein, at least one side of the second region along a second direction is provided with an isolation layer, and the sheet resistance of the second region is higher than that of the first region, and the isolation layer is used to isolate the opposite two surfaces of the conductive film body in a wound state along the second direction.

[0011] Furthermore, the sheet resistance of the first region is between 500 mΩ and 1500 mΩ; and / or, the sheet resistance of the second region is between 530 mΩ and 5000 mΩ.

[0012] Further, along the first direction, the conductive film body has a first width, and the second region has a second width, and the second width accounts for 70% to 95% of the first width.

[0013] Further, the conductive film body includes:

[0014] A substrate layer, along the second direction, the substrate layer includes a first surface and a second surface;

[0015] A conductive main body layer, the conductive main body layer includes a first metal layer and a second metal layer, the first metal layer is disposed on the first surface, the second metal layer is disposed on the second surface, and at least one of the first metal layer and the second metal layer includes a first reserved portion located within the second region, and the isolation layer is disposed on a surface of the first reserved portion away from the substrate layer.

[0016] Further, the isolation layer includes a third metal layer or a non-metal layer whose material is different from that of the conductive main body layer.

[0017] Further, the isolation layer includes a structural layer whose melting point is lower than that of the conductive main body layer.

[0018] Further, the isolation layer includes a structural layer whose melting point is not higher than 800 °C.

[0019] Further, the third metal layer includes at least one of a single-element metal layer and an alloy metal layer.

[0020] Further, the single-element metal layer includes at least one of a zinc layer, a tin layer, a magnesium layer, a lead layer, a cadmium layer, a silver layer, a nickel layer, a cobalt layer, and a chromium layer; and / or, the alloy metal layer includes at least one of a zinc alloy layer, a tin alloy layer, a lead alloy layer, a cadmium alloy layer, a magnesium alloy layer, a silver alloy layer, a nickel alloy layer, a cobalt alloy layer, and a chromium alloy layer.

[0021] Further, the first metal layer and the second metal layer include a copper layer or an aluminum layer, and / or,

[0022] The substrate layer includes at least one of a polypropylene layer, a polyethylene terephthalate layer, a polyethylene layer, a polyamide layer, a polyimide layer, a polyphenylene ether layer, a polyvinyl chloride layer, an ABS plastic layer, a poly(p-phenylene terephthalamide) layer, a polyoxymethylene layer, a polytetrafluoroethylene layer, a polyvinylidene fluoride layer, a polycarbonate layer, a polyvinyl alcohol layer, a polyethylene glycol layer, and a cellulose layer.

[0023] Further, the non-metal layer includes at least one of a boron oxide layer and a copper oxide layer.

[0024] Further, the conductive film body further includes:

[0025] An adhesion enhancing layer, wherein the adhesion enhancing layer comprises at least two layers, and the at least two adhesion enhancing layers are respectively disposed on opposite surfaces of the substrate layer along the second direction.

[0026] According to another aspect of the present application, there is provided a pole piece, which comprises a current collector, and the current collector comprises the conductive film as described above, or the current collector comprises a conductive film obtained by the preparation method of the conductive film as described above.

[0027] According to another aspect of the present application, there is provided an energy storage device, which comprises the pole piece as described above.

[0028] According to another aspect of the present application, there is provided an electrical equipment, which comprises the energy storage device as described above.

[0029] The conductive film body of the conductive film provided in the present application includes a first region and a second region along the first direction. The first direction is the width direction of the conductive film body. An isolation layer is disposed on one side of the second region along the second direction. Thus, when the conductive film is wound up, opposite surfaces of the conductive film body along the second direction can be isolated by the isolation layer, so that the opposite surfaces of the conductive film body along the second direction will not stick to each other. When the wound-up conductive film is unwound, the metal layers on the opposite surfaces of the conductive film body along the second direction will not detach from the conductive film body, that is, delamination defects will not appear on the surface of the conductive film body, improving the finished product quality of the conductive film. At the same time, since the isolation layer is provided in the second region, the sheet resistance of the second region is higher than that of the first regions on the opposite sides of the second region along the first direction, thereby forming a conductive film body having different conductive properties along the first direction. Such a structure solves the problem of sticking of the two film layers and is more suitable for the electroplating coating method through the two end portions of the conductive film body along the first direction. Thus, in the electroplating coating stage, the electroplating clip can be disposed in the first region where the sheet resistance of the conductive film body is lower and the conductive performance is better, so as to conduct the electroplating current through the two ends of the first region of the conductive film body not covered by the isolation layer along the first direction, thereby improving the electroplating efficiency of the conductive film body while achieving the anti-sticking effect through the isolation layer of the second region of the conductive film body. Description of the Drawings

[0030] The drawings described herein are used to provide a further understanding of the present application, and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation to the present application. In the drawings:

[0031] Figure 1 is a schematic structural diagram of the conductive film body provided by the present invention;

[0032] Figure 2Schematic diagram of the structure with an isolation layer provided on the first metal layer and the second metal layer of the conductive film body provided by the present utility model;

[0033] Figure 3 For Figure 2 Schematic diagram of the film layer structure of the conductive film body when a metal thickening layer is provided on the basis of;

[0034] Figure 4 Schematic diagram of the structure of the method for preparing the conductive film provided by the present utility model.

[0035] Among them, the above-mentioned drawings include the following reference numerals:

[0036] 10. Conductive film body; 11. First region; 12. Second region; 13. Isolation layer;

[0037] 14. Substrate layer; 141. First surface; 142. Second surface; 15. First metal layer; 16. Second metal layer; 561. First reserved part;

[0038] 17. Metal thickening layer;

[0039] 18. Adhesion enhancement layer. Specific embodiments

[0040] It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the drawings and in combination with the embodiments.

[0041] It should be noted that the terms used here are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used here, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should also be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0042] Unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present application. At the same time, it should be understood that for ease of description, the dimensions of the various parts shown in the drawings are not drawn in actual proportional relationships. Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and devices should be regarded as part of the authorization specification. In all the examples shown and discussed here, any specific value should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0043] Currently, during the preparation of the current collector, after depositing or magnetron sputtering a metal layer on both sides of the substrate layer 14, it is sometimes necessary to enter a hydroplating device to thicken the metal layer. Before the current collector enters the hydroplating device, the current collector needs to be wound and then unwound to the hydroplating device. However, during the winding and unwinding of the current collector, the metal layers on both sides of the substrate layer 14 will adhere to each other, and it is easy for the metal layer to peel off from the substrate layer 14. The essence of this situation is that the interfacial bonding force F1 between the metal layer and the polymer base film is less than the bonding force F2 between the metal layers on both sides of the wound polymer substrate (such as between copper films), resulting in the phenomenon of film layer peeling. To address the problem that the metal layers on both sides of the surface of the substrate layer 14 are prone to adhesion to each other, the first embodiment of the present utility model provides a conductive film.

[0044] Please refer to Figures 1 to 3 , the conductive film includes a conductive film body 10. As Figure 1 shown, along the first direction (the first direction is the direction indicated by the arrow X in Figure 1 , that is, the width direction of the conductive film), the conductive film body 10 includes an adjacent first region 11 and a second region 12. The first region 11 includes at least two, and the second region 12 includes at least one. The at least two first regions 11 are respectively located on opposite sides of the at least one second region 12 along the first direction. As Figure 1 shown, the conductive film body 10 includes one second region 12, and the opposite sides of the second region 12 along the first direction are respectively the first regions 11. Among them, at least one side of the second region 12 along the second direction is provided with an isolation layer 13, and the isolation layer 13 is used to isolate the opposite two sides of the wound conductive film body 10 along the second direction. The second direction is the direction indicated by the arrow Y in Figure 1 , that is, the thickness direction of the conductive film.

[0045] After the conductive film body 10 is wound up in this embodiment, the isolation layer 13 in the second region 12 can isolate the metal layers on the opposite two sides of the conductive film body 10. During the unwinding process of the conductive film body 10, since the metal layers on the opposite two sides of the conductive film body 10 do not adhere to each other, not only is it easy to pull and unwind the conductive film, but also no delamination defect will appear on the surface of the conductive film body 10.

[0046] In addition to covering the isolation layer 13 on the second region 12 in this embodiment, the isolation layer 13 can also be covered on the first region 11. However, this will result in a relatively large sheet resistance of the conductive film body 10 in the first direction, which is not conducive to subsequent electroplating thickening. Since only the isolation layer 13 is provided in the second region 12 in this embodiment, the sheet resistance of the second region 12 is higher than that of the first region 11. The sheet resistance of the first region 11 is smaller and the electrical conductivity is better. The conductive film body 10 of this embodiment further includes a metal thickening layer 17, and the metal thickening layer 17 is covered on the outermost surface of the conductive film. Thus, when the conductive film body 10 is unwound to the electroplating equipment for electroplating thickening, the electroplating clips of the electroplating equipment can be set on the first regions 11 at the opposite two ends of the conductive film body 10 in the first direction. Since the sheet resistance of the first region 11 is relatively low, it is beneficial to the conduction of the electroplating current on the conductive film body 10. Thus, while ensuring that the opposite two sides of the conductive film body 10 do not adhere to each other after being wound up, the electroplating efficiency and effect of the conductive film body 10 can also be improved. Finally, a metal thickening layer 17 is electroplated on the surface of the first region 11 of the conductive film body 10 and the isolation layer 13, so that the thickness of the conductive film body 10 meets the usage requirements.

[0047] It can be seen that the conductive film body 10 of the conductive film provided in this embodiment includes a first region 11 and a second region 12 along a first direction. The first direction is the width direction of the conductive film body 10. An isolation layer 13 is provided on at least one side of the second region 12 along a second direction. Thus, when the conductive film is wound up, the opposite two sides of the conductive film body 10 along the second direction can be isolated by the isolation layer 13, so that the opposite two sides of the conductive film body 10 along the second direction will not stick to each other. When the wound-up conductive film is unwound, the metal layers on the opposite two sides of the conductive film body 10 along the second direction will not detach from the conductive film body 10, that is, no delamination defect will appear on the surface of the conductive film body 10, improving the finished product quality of the conductive film. At the same time, since the isolation layer 13 is provided in the second region 12, the sheet resistance of the second region 12 is higher than that of the first regions 11 on the opposite two sides of the second region 12 along the first direction, thereby forming a conductive film body 10 with different conductive properties along the first direction. Such a structure of the conductive film body 10 is particularly suitable for the electroplating coating method. Thus, in the electroplating coating stage, the electroplating clamp can be arranged in the first region 11 where the sheet resistance of the conductive film body 10 is lower and the conductive performance is better, so as to conduct the electroplating current through both ends of the first region 11 where the conductive film body 10 is not covered by the isolation layer 13 along the first direction, thereby improving the electroplating efficiency of the conductive film body 10 while achieving the anti-sticking effect through the isolation layer 13 of the second region 12 of the conductive film body 10.

[0048] Among them, the sheet resistance of the first region 11 is between 500 mΩ and 2000 mΩ. The sheet resistance of the first region 11 may specifically include: one of 500 mΩ, 510 mΩ, 530 mΩ, 550 mΩ, 580 mΩ, 600 mΩ, 630 mΩ, 650 mΩ, 680 mΩ, 700 mΩ, 720 mΩ, 740 mΩ, 770 mΩ, 790 mΩ, 800 mΩ, 830 mΩ, 850 mΩ, 870 mΩ, 890 mΩ, 900 mΩ, 910 mΩ, 930 mΩ, 950 mΩ, 980 mΩ, 1000 mΩ, 1050 mΩ, 1100 mΩ, 1200 mΩ, 1300 mΩ, 1400 mΩ, 1500 mΩ, 1600 mΩ, 1700 mΩ, 1800 mΩ, 1900 mΩ, 2000 mΩ, etc. When the conductive film body 10 is unwound to an electroplating device for electroplating and thickening, arranging the electroplating clamp in the first region 11 is beneficial to improving the electroplating efficiency of the conductive film body 10.

[0049] The sheet resistance of the second region 12 provided with the isolation layer 13 is between 530 mΩ and 5000 mΩ. The sheet resistance of the second region 12 may specifically include one of the following: 530 mΩ, 550 mΩ, 580 mΩ, 600 mΩ, 630 mΩ, 650 mΩ, 680 mΩ, 700 mΩ, 720 mΩ, 740 mΩ, 770 mΩ, 790 mΩ, 800 mΩ, 830 mΩ, 850 mΩ, 870 mΩ, 890 mΩ, 900 mΩ, 910 mΩ, 930 mΩ, 950 mΩ, 980 mΩ, 1000 mΩ, 1100 mΩ, 1200 mΩ, 1300 mΩ, 1500 mΩ, 1700 mΩ, 1800 mΩ, 2000 mΩ, 2100 mΩ, 2300 mΩ, 2600 mΩ, 2800 mΩ, 3000 mΩ, 3200 mΩ, 3400 mΩ, 3700 mΩ, 3900 mΩ, 4000 mΩ, 4100 mΩ, 4300 mΩ, 4500 mΩ, 4700 mΩ, 4800 mΩ, 5000 mΩ, etc. Thus, the isolation layer 13 on the second region 12 within the above sheet resistance range is used to prevent the rolled conductive film body 10 from sticking to each other on opposite sides in the second direction, improving the quality of the conductive film product. The sheet resistance of the second region 12 is preferably controlled to be between 530 mΩ and 2000 mΩ, and is characterized in that the sheet resistance is 30 mΩ to 500 mΩ higher than that of the first region 11. Thereby, the overall sheet resistance of the conductive film body 10 is lower, improving the conductivity of the conductive film and the electroplating effect of subsequent electroplating thickening. The sheet resistance of the second region 12 may specifically include one of the following: 530 mΩ, 600 mΩ, 700 mΩ, 800 mΩ, 900 mΩ, 1000 mΩ, 1100 mΩ, 1200 mΩ, 1300 mΩ, 1400 mΩ, 1500 mΩ, 1600 mΩ, 1700 mΩ, 1800 mΩ, 1900 mΩ, 2000 mΩ, etc.

[0050] Specifically, please refer to Figure 2, in this embodiment, the conductive film body 10 includes a substrate layer 14 and a conductive main body layer. Along the second direction, the substrate layer 14 includes a first surface 141 and a second surface 142. The conductive main body layer includes a first metal layer 15 and a second metal layer 16. The first metal layer 15 is disposed on the first surface 141, and the second metal layer 16 is disposed on the second surface 142. An adhesion enhancement layer 18 is further provided between the first metal layer 15 and the second metal layer 16 and the substrate layer. At least one of the first metal layer 15 and the second metal layer 16 includes a first reserved portion 561 located in the second region 12. The isolation layer 13 is disposed on the surface of the first reserved portion 561 away from the substrate layer 14. Specifically, the isolation layer 13 can be provided on the first reserved portions 561 of both the first metal layer 15 and the second metal layer 16, or the isolation layer 13 can be provided only on the first reserved portion 561 of the first metal layer 15 or the second metal layer 16. The first metal layer 15 and the second metal layer 16 are separated by the isolation layer 13 provided through the first reserved portion 561. When the isolation layer 13 is provided on the first reserved portions 561 of both the first metal layer 15 and the second metal layer 16, the two isolation layers 13 separate the first metal layer 15 and the second metal layer 16, and the anti-adhesion effect is better. It can be seen that in this embodiment, since the isolation layer 13 is provided on the surface of the first reserved portion 561 of the first metal layer 15 located in the second region 12, when the conductive film body 10 is wound up, the first metal layer 15 and the second metal layer 16 can be isolated by the isolation layer 13, so that the first metal layer 15 and the second metal layer 16 will not stick to each other. When the wound conductive film is unwound, the first metal layer 15 or the second metal layer 16 will not peel off from the substrate layer 14, that is, no delamination defect will appear on the surface of the conductive film body 10, and the finished product quality of the conductive film is improved.

[0051] Moreover, since the portion of the first metal layer 15 misaligned with the first reserved portion 561 is not provided with the isolation layer 13, the conductive film body 10 has different conductive properties along the first direction. Among them, the conductive property of the first region 11 of the conductive film body 10 misaligned with the first reserved portion 561 is better. Such a structure of the conductive film body 10 is particularly suitable for the electroplating coating method. In the electroplating coating stage, the electroplating clip can be disposed in the first region 11 where the sheet resistance of the conductive film body 10 is lower and the conductive property is better, so as to conduct the electroplating current through both ends of the first region 11 of the conductive film body 10 not covered by the isolation layer 13 along the first direction. Thus, while achieving the anti-adhesion effect through the isolation layer 13 in the second region 12 of the conductive film body 10, the electroplating efficiency of the conductive film body 10 is improved. In addition, by providing the isolation layer 13 on the first reserved portion 561 of the first metal layer 15 located in the second region 12, the processing is convenient and the anti-adhesion effect is good.

[0052] The isolation layer 13 in this embodiment includes a third metal layer or a non-metal layer whose material is different from that of the conductive main body layer. That is to say, the isolation layer 13 is a third metal layer or a non-metal layer whose material is different from that of the first metal layer 15 and the second metal layer 16. Thus, one side or both sides of the first metal layer 15 and the second metal layer 16 are deposited with the isolation layer 13, thereby isolating the first metal layer 15 and the second metal layer 16, solving the adhesion problem between the first metal layer 15 and the second metal layer 16, and preventing delamination defects from occurring in the conductive film main body 10 due to adhesion between the first metal layer 15 and the second metal layer 16, such as local or sporadic peeling of the first metal layer 15 and / or the second metal layer 16.

[0053] In the actual process of preparing the conductive film main body 10, generally, the adhesion enhancing layer 18 is first deposited on both sides (the first surface 141 and the second surface 142) of the substrate layer 14 by magnetron sputtering or evaporation coating. The first metal layer 15 and the second metal layer 16 can be deposited on the surface of the adhesion enhancing layer 18 by vacuum magnetron sputtering coating or thermal evaporation coating. The isolation layer 13 can also be deposited on the first reserved part 561 or the second reserved part 143 of the first metal layer 15 by vacuum magnetron sputtering coating or thermal evaporation coating. When the isolation layer 13 in this embodiment includes a third metal layer, the third metal layer may specifically include an aluminum layer, an aluminum alloy layer or a nickel-chromium alloy layer, or an iron-based alloy layer containing aluminum element, chromium element or titanium element, or a cobalt-based alloy layer containing aluminum element, chromium element or titanium element. When the isolation layer 13 includes a non-metal layer, the non-metal layer may specifically include a metal oxide layer, such as an aluminum oxide layer (chemical formula: Al2O3). When the isolation layer 13 selects structural layers such as an aluminum layer and an aluminum oxide layer, since materials such as an aluminum layer and an aluminum oxide layer have a low price, the production cost of the conductive film main body 10 can be reduced.

[0054] The isolation layer 13 in this embodiment includes a structural layer with a melting point lower than that of the conductive main body layer. Thus, when depositing the isolation layer 13 by thermal evaporation coating, the waste heat generated during the deposition of the first metal layer 15 and / or the second metal layer 16 by thermal evaporation coating can be utilized to heat and evaporate the target material of the isolation layer 13. Generally, the evaporation temperatures of the first metal layer 15 and the second metal layer 16 are relatively high. For example, the effective evaporation temperature of Cu material is at least above 1100°C. Then, a metal structural layer with a low melting point is placed in the same or adjacent area where Cu material is evaporated. The low melting point metal structural layer can be melted and evaporated by utilizing the waste heat accompanying the evaporation of Cu material, so as to deposit the isolation layer 13 on the first reserved part 561 or the second reserved part 143. Therefore, the evaporation deposition of the isolation layer 13 can be realized without adding an evaporation source, reducing the energy consumption generated during the preparation of the conductive film. At the same time, because the melting point of the isolation layer 13 is relatively low, the target material of the isolation layer 13 can be quickly melted and evaporated or sputtered on the first reserved part 561 or the second reserved part 143, and the isolation layer 13 is also easy to be quickly condensed and fixed on the surface of the first reserved part 561 or the second reserved part 143, which can reduce the preparation time of the isolation layer 13 in this embodiment to a certain extent and improve the production efficiency of the conductive film.

[0055] Preferably, the isolation layer 13 in this embodiment includes a structural layer with a melting point not higher than 800°C. For example, the isolation layer 13 specifically includes structural layers with melting points of 800°C, 700°C, 600°C, 500°C, 400°C, 450°C, 300°C, 200°C, etc. Thus, because the melting points of the target materials of the first metal layer 15 and the second metal layer 16 are higher, the temperature generated during the heating and evaporation of the target materials of the first metal layer 15 and / or the second metal layer 16 by using existing coating equipment (such as evaporation coating equipment) is often relatively high. For example, when both the first metal layer 15 and the second metal layer 16 are copper layers with melting points higher than that of the isolation layer 13, the temperature at least reaches 1100°C and above when heating the copper layer to form a certain effective evaporation. Therefore, when using the waste heat generated by heating and evaporating the first metal layer 15 and / or the second metal layer 16 to heat and evaporate the target material of the isolation layer 13, it can ensure that the target material of the isolation layer 13 can be fully heated and evaporated, reducing energy consumption, and enabling the target material of the isolation layer 13 to be quickly melted and deposited on the first reserved part 561 or the second reserved part 143 mentioned above. Moreover, the isolation layer 13 with a melting point not higher than 800°C is more convenient for quickly condensing and fixing on the surface of the first reserved part 561 or the second reserved part 143, improving the production efficiency of the conductive film.

[0056] When the isolation layer 13 includes a third metal layer, the third metal layer includes at least one of a single-element metal layer and an alloy metal layer. Among them, the single-element metal layer includes at least one of a zinc layer, a tin layer, a magnesium layer, a lead layer, a cadmium layer, a silver layer, a nickel layer, a cobalt layer, and a chromium layer. The alloy metal layer includes at least one of a zinc alloy layer, a tin alloy layer, a lead alloy layer, a cadmium alloy layer, a magnesium alloy layer, a silver alloy layer, a nickel alloy layer, a cobalt alloy layer, and a chromium alloy layer. For example, the zinc alloy layer may include at least one of a zinc-aluminum alloy layer, a zinc-copper alloy layer, and a zinc-magnesium alloy layer, and the tin alloy layer includes at least one of a tin-zinc alloy layer, a tin-silver alloy layer, and a tin-lead alloy layer. The alloy metal layer may also include at least one of nickel-chromium alloy, nickel-cadmium alloy, or nickel-copper alloy. As long as the material of the isolation layer 13 is in other deformation modes under the concept of the present utility model, it is within the protection scope of the present utility model. Other more low-melting-point metals can be added, such as magnesium, lead, and low-temperature rare-earth element metal materials.

[0057] In this embodiment, the zinc layer and the tin layer are preferably used for the single-element metal layer. When the zinc layer is preferably used for the isolation layer 13, the melting point of zinc is relatively low (419.5 °C), and it has good evaporation performance under suitable evaporation conditions, can be quickly converted into steam and deposited as a thin film after condensation. Moreover, the deposition of the zinc layer can be realized by using the waste heat generated by heating and evaporating the target of the first metal layer 15 and / or the second metal layer 16, reducing the energy consumption in the process of preparing the conductive film. It can be seen that whether it is magnetron sputtering or evaporation process, zinc shows good deposition performance and application prospects, especially having significant advantages in new energy batteries, thin-film electronic devices, optical coatings, and anti-corrosion coatings.

[0058] When the tin layer is preferably used for the isolation layer 13, since the sputtering rate of tin (Sn) is relatively fast compared with some high-melting-point metals, a uniform thin film layer can be formed within a reasonable sputtering time. Since the melting point of tin is relatively low (about 232 °C), the deposition of the tin layer can be realized by using the waste heat generated during the deposition of the conductive main body layer, thereby reducing the energy consumption of the coating equipment, allowing the thin film deposition to be completed at a lower temperature, and reducing the potential damage to the substrate material. Tin (Sn) has strong evaporation performance at an appropriate temperature and can form a continuous and uniform vapor flow to deposit a continuous and thickness-controlled thin film. In short, as a soft metal, when preparing thin film materials, tin is easy to be coated on the first reserved part 561 or the second reserved part 143 of the conductive film in this embodiment due to its good deposition performance, thin film quality, and process controllability.

[0059] In this embodiment, the first metal layer 15 and the second metal layer 16 include copper layers. Copper has extremely high electrical conductivity, second only to silver. When the conductive film is used as a current collector, copper can effectively transmit and collect the current generated by the electrode material, reduce resistance, improve the charge and discharge efficiency and overall performance of the battery. Copper has sufficient ductility and flexibility, and is easy to be processed into foil materials to meet the requirements of different battery manufacturing processes such as winding and laminating. This ensures good contact and firm bonding between the current collector and the electrode active material. In addition, compared with other precious metals with similar electrical conductivity, the price of copper is more reasonable. Using a conductive film including a copper layer as a current collector in large-scale battery production can greatly reduce costs.

[0060] When the first metal layer 15 and the second metal layer 16 include copper layers, the isolation layer 13 in this embodiment can preferably be a zinc layer or a zinc alloy layer. The zinc layer itself has a certain electrical conductivity and is not likely to increase the sheet resistance of the conductive film. Moreover, since zinc and copper can form a brass structure in a certain proportion and brass has good electrical conductivity, plating a zinc layer on the surface of the copper layer will not only not make the sheet resistance of the conductive film larger, but also enable the conductive film to obtain good electrical conductivity. In addition, when the first metal layer 15 and the second metal layer 16 include copper layers, since the electrode potential of copper is +0.337V. If the isolation layer 13 is a tin layer (Sn) or a zinc layer (Zn), the electrode potential of Sn is -0.136V and the electrode potential of Zn is -0.763V. The electrode potentials of tin and zinc are both less than that of copper. Since the isolation layer 13 remains in the conductive film, the copper layer can be cathodically protected by the isolation layer 13, thereby preventing the main body 10 layer of the conductive film from reducing the electrical conductivity of the conductive film due to oxidation corrosion. Moreover, even if the isolation layer 13 is oxidized and corroded due to contact with a corrosive medium, since the material of the oxidized and corroded isolation layer 13 is different from that of the copper layer, it can still play an anti-sticking effect.

[0061] Of course, in other embodiments of the present invention, the first metal layer 15 and the second metal layer 16 can also be aluminum layers, etc. As long as it is other deformation methods under the concept of the present invention, they are all within the protection scope of the present invention.

[0062] The substrate layer 14 includes at least one of a polypropylene layer, a polyethylene terephthalate layer, a polyethylene layer, a polyamide layer, a polyimide layer, a polyphenylene ether layer, a polyvinyl chloride layer, an ABS plastic layer, a poly(p-phenyleneterephthalamide) layer, a polyoxymethylene layer, a polytetrafluoroethylene layer, a polyvinylidene fluoride layer, a polycarbonate layer, a polyvinyl alcohol layer, a polyethylene glycol layer, and a cellulose layer. That is to say, in this embodiment, different material combinations can be selected as the base material of the substrate layer 14. Among them, the polypropylene layer has chemical resistance, heat resistance, electrical insulation, high-strength mechanical properties, and good high-abrasion processing performance. The polyethylene terephthalate layer has excellent physical and mechanical properties in a wide temperature range and excellent electrical insulation. The polyethylene layer has excellent low-temperature resistance and chemical stability. The polyamide layer has good wear resistance and strong structural strength. The polyimide layer can withstand extremely low temperatures and has excellent mechanical properties and high radiation resistance. The polyphenylene ether layer has the advantages of high heat resistance, good flame retardancy, and high strength. The polyvinyl chloride layer has good mechanical properties and excellent dielectric properties. The ABS plastic layer has good chemical corrosion resistance and heat resistance. The poly(p-phenyleneterephthalamide) layer has high heat resistance and high heat resistance and chemical corrosion resistance. The polyoxymethylene layer has high mechanical properties and excellent electrical insulation. The polytetrafluoroethylene layer has the characteristics of being acid and alkali resistant, resistant to various organic solvents, and high temperature resistant. The polyvinylidene fluoride layer has good chemical resistance, weather resistance, and ultraviolet radiation resistance. The polycarbonate layer has good mechanical properties and good impact resistance. The polyvinyl alcohol layer has high strength. The polyethylene glycol layer has good acid and alkali resistance. The cellulose layer has a strong polar effect.

[0063] Furthermore, the substrate layer 14 of this embodiment preferably uses a polypropylene layer. The reason is that the polypropylene layer has a strong corrosion resistance. Only carbon-carbon bonds exist in its molecular chain. Except for being eroded by concentrated sulfuric acid and concentrated nitric acid, the polypropylene layer can adapt to various other chemical reagents and has relatively stable chemical properties. Especially when the conductive film in the present utility model is used as a current collector in a battery, choosing a polypropylene layer is not easily corroded by the electrolyte, thereby being able to extend the battery life.

[0064] When the isolation layer 13 is a non-metal layer, the non-metal layer includes a boron oxide layer (chemical formula: B2O3). The boron oxide layer has strong thermal stability. The vapor pressure of the boron oxide layer can increase significantly with the increase of temperature, which is beneficial to form a stable vapor flow during the vacuum evaporation or magnetron sputtering process. During the evaporation or magnetron sputtering process, the boron oxide layer can maintain a high purity. The vacuum environment reduces the chance of the boron oxide layer reacting with impurities in the air, which helps to generate a pure and uniform borate film. In addition, the melting point of the boron oxide layer is relatively low (about 450 °C) and it is easy to evaporate under appropriate heating conditions. That is to say, in this embodiment, the waste heat generated by the coating equipment that heats and evaporates the target of the conductive main body layer can be utilized to realize the evaporation coating of the boron oxide layer target, reducing the energy consumption generated by the existing coating equipment. Moreover, the high volatility of the boron oxide layer means that a high vapor pressure can be obtained at a lower evaporation temperature, which is beneficial to further reduce the energy consumption during the evaporation process and reduce the thermal stress impact on the substrate and the equipment. In addition, the low melting point is also beneficial to alternately evaporate with other high melting point materials in the preparation of the multi-layer structure, avoiding the increase in process complexity caused by too large a temperature difference. During the actual preparation of the isolation layer 13, the thickness and composition distribution of the boron oxide layer can be precisely controlled by controlling the temperature of the evaporation source, the evaporation rate, and the distance between the substrate and the evaporation source, etc., which is convenient to isolate the first metal layer 15 and the second metal layer 16 during the winding process of the conductive film and prevent the delamination of the conductive film.

[0065] In some other embodiments of the present invention, the non-metal layer further includes a copper oxide layer to isolate the first metal layer 15 and the second metal layer 16 through the copper oxide layer.

[0066] Along the first direction, the conductive film body 10 has a first width (such as Figure 1 the width indicated by the symbol d1), and the second region 12 has a second width (such as Figure 1The width indicated by symbol d2 in the figure), the second width accounts for 70% to 98% of the first width. The second width is the width of the isolation layer 13 along the first direction. In this embodiment, by making the width of the isolation layer 13 along the first direction account for 70% to 98% of the first width, it can not only ensure that the isolation layer 13 can achieve the isolation of the first metal layer 15 and the second metal layer 16, achieving the anti-sticking effect, but also ensure that the conductivity of the conductive film will not be affected due to the over-wide isolation layer 13. That is, the second width accounts for 70% to 98% of the first width, which can enable the isolation layer 13 to achieve a good anti-sticking effect while not having an adverse impact on the conductivity of the conductive film, ensuring the conductivity of the conductive film. The main purpose of regulating the covering width of the isolation layer 13 in this embodiment is to simultaneously meet the effect of isolation and anti-mucosa, and at the same time avoid the good conductivity at both ends of the first width, especially without mucosa. Specifically, the second width accounts for 70%, 72%, 73%, 75%, 77%, 78%, 79%, 80%, 81%, 82%, 83%, 84%, 85%, 86%, 87%, 88%, 89%, 90%, 91%, 92%, 93%, 94%, 95%, 96%, 97%, 98% or the like of the first width. Further optimization is that the second width accounts for 90%-98% of the first width. Specifically, the second width accounts for 90%, 91%, 92%, 93%, 94%, 95%, 96%, 97%, 98% or the like of the first width. The first width d1 therein refers to the effective coating width after depositing the first metal layer 15 or the second metal layer 16 by evaporation coating.

[0067] As Figure 2 and Figure 3 shown, the conductive film body 10 in this embodiment may further include an adhesion enhancing layer 18. The adhesion enhancing layer 18 includes at least two layers, and the at least two adhesion enhancing layers 18 are respectively disposed on opposite sides of the substrate layer 14 along the second direction. That is, the first surface 141 and the second surface 142 of the substrate layer 14 can both be provided with the adhesion enhancing layer 18. Specifically, the adhesion enhancing layer 18 is located between the substrate layer 14 and the first metal layer 15 and between the substrate layer 14 and the second metal layer 16 (as Figure 2 shown), or the adhesion enhancing layer 18 is located between the substrate layer 14, the first metal layer 15 and the isolation layer 13 (as Figure 3as shown), and the adhesion enhancing layer 18 is located between the substrate layer 14 and the second metal layer 16, etc. The adhesion enhancing layer 18 can improve the adhesion of the first metal layer 15 and the second metal layer 16 to the substrate layer 14, that is, enhance the interfacial bonding force F1 between the metal layer and the substrate layer 14, so that the interfacial bonding force F1 between the metal layer and the substrate layer 14 is greater than the bonding force F2 between the first metal layer 15 and the second metal layer 16, preventing the film layer on one side of the conductive film body 10 from being pulled off by the other side. In addition, the first metal layer 15 and the second metal layer 16 are separated by the isolation layer 13, greatly weakening the bonding force F2, making the adhesion between the first metal layer 15 and the second metal layer 16 smaller during the process of unrolling the conductive film, and preventing the first metal layer 15 and the second metal layer 16 from sticking to each other.

[0068] The adhesion enhancing layer 18 in this embodiment may include any one of a copper alloy layer, a nickel alloy layer, a titanium alloy layer, an aluminum alloy layer, an aluminum oxide layer, a silicon nitride layer, a silicon carbide layer, a polyethylene glycol layer, etc., as well as nitride layers (such as a copper nitride layer, a titanium nitride layer), oxynitride layers, and oxide layers of the aforementioned elemental metal / alloy materials.

[0069] The sticking or mucosal condition of the two opposite sides of the conductive film is specifically manifested as the presence or absence of light-transmitting points and the number of light-transmitting points when observing the surface of the conductive film after unrolling the wound conductive film. The method for measuring the mucosal tension of the film rolls of different conductive films in this embodiment is as follows: when the roll length of the film rolls of different conductive films is fixed, for example, when unrolling a film roll of a conductive film with a width of 1600 mm, the film roll of the conductive film is set on the unrolling shaft, and after pulling the film horizontally, the distribution of the light-transmitting points on the conductive film is observed. The so-called light-transmitting points are the light-transmitting phenomena generated at the positions where the film layer sticks, causing partial or sporadic peeling of the first metal layer 15 and / or the second metal layer 16. That is, the fewer the light-transmitting points, the less likely the conductive film is to produce a mucosal condition. To verify the anti-sticking condition of the two opposite sides of the conductive film after setting the isolation layer 13, the following table shows the test results of the mucosal test on the conductive film without the isolation layer 13 and the conductive film with different thicknesses of the isolation layer 13 and the film pulling test on different conductive films:

[0070]

[0071]

[0072] Table 1

[0073] In Table 1, MD is the tensile strength data obtained when performing tensile or elongation tests along the length direction of the conductive film during winding and unwinding, such as the tensile strength MD in the 1MD direction of the conductive film 1 is MD = 105 Mpa. TD is the tensile strength data obtained when performing tensile or elongation tests in the width direction of the conductive film, such as the tensile strength TD in the TD direction of the conductive film 1 is TD = 89 Mpa. It can be seen from Table 1 that the tensile strengths of the conductive film 1 without the isolation layer 13 are all lower than those of the conductive films 2 to 6 with the isolation layer 13. Evidently, setting the isolation layer 13 can also improve the tensile strength of the conductive film. The types of the isolation layer 13 of the conductive film 2 and the conductive film 3 are the same but the thicknesses are different. When the thickness of the conductive film 3 is thicker, the tensile strength of the conductive film 3 is higher than that of the thinner conductive film 2.

[0074] It can be seen from Table 1 that the number of light-transmitting points per unit area of the conductive film 1 without the isolation layer 13 is the largest, reaching as high as 857. The number of light-transmitting points per unit area of the conductive films 2 to 5 with the isolation layer 13 is significantly smaller than that of the conductive film 1. Evidently, the opposite two sides of the conductive film body along the second direction can be isolated by the isolation layer 13 so that the opposite two sides of the conductive film body along the second direction will not stick. When unwinding the wound conductive film, the metal layers on the opposite two sides of the conductive film body along the second direction will not detach from the conductive film body, that is, no delamination defect will appear on the surface of the conductive film body, improving the finished product quality of the conductive films 2 to 5. Moreover, since the second region 12 of the conductive films 2 to 5 is provided with the isolation layer 13, the sheet resistance of the second region 12 of the conductive films 2 to 5 is greater than that of the first region 11. During the electroplating and coating stage, the electroplating clamp can be set in the first region 11 of the conductive film body with a lower sheet resistance and better conductivity to conduct the electroplating current through both ends where the first region 11 of the conductive film body is not covered by the isolation layer 13 along the first direction, thereby improving the electroplating efficiency of the conductive film body while achieving the anti-sticking effect through the isolation layer 13 in the second region 12 of the conductive film body.

[0075] In addition, the total mass of the elements in the conductive film body 10 is a first value, the total mass of the elements in the isolation layer 13 is a second value, and the percentage between the second value and the first value is between 0.003% and 2.2%. The percentage between the second value and the first value may specifically include 0.003%, 0.005%, 0.008%, 0.01%, 0.013%, 0.015%, 0.018%, 0.02%, 0.03%, 0.04%, 0.06%, 0.08%, 0.1%, 0.13%, 0.14%, 0.16%, 0.18%, 0.2%, 0.22%, 0.25%, 0.3%, 0.4%, 0.8%, 0.9%, 1%, 1.3%, 1.5%, 1.8%, 2%, 2.1%, 2.2%, etc. In this embodiment, the isolation layer 13 with the total mass of elements at the above content can not only effectively isolate the first metal layer 15 and the second metal layer 16, but also reduce the influence of the isolation layer 13 on the conductive properties of the conductive film, thereby avoiding the reduction of the conductivity of the conductive film due to the isolation layer 13 being too thick, or the failure to achieve the anti-sticking effect due to the isolation layer 13 being too little, thereby improving the quality of the conductive film product.

[0076] The first value and the second value detected in the conductive film in this embodiment can be obtained by EDS, XPS or ICP. EDS is the abbreviation of Energy Dispersive Spectrometer (full name in foreign language), which is used to analyze the types and contents of the elements in the micro-region of the material, in conjunction with the use of scanning electron microscope and transmission electron microscope. The analysis results of EDS will contain data of percentage (atomic%) and element ratio (that is, mass ratio, weight%). ICP Inductively coupled plasma (ICP) is a spectral light source used for atomic emission spectroscopy, which can detect the existence, content and properties of elements. In this embodiment, ICP is used to detect the coating on both sides of the substrate layer 10 including the isolation layer 13 (that is, the conductive film body 10) to obtain the content of the isolation layer 13 elements in the entire coating. The percentage content obtained by the inspection is the mass ratio of the metal element or the equivalent metal element. For example, in the special case where the doped isolation layer 13 is a film structure such as a boron oxide layer or a cadmium oxide layer, the mass of the boron element is equivalently measured and the mass of the cadmium element is equivalently measured. XPS is the abbreviation of X-ray Photoelectron Spectroscopy (full name in foreign language) and is a surface analysis method. In this embodiment, XPS can be used to detect the content of the isolation layer 13 on the surface of the first metal layer 15 and / or the second metal layer 16.

[0077] Specifically, in this embodiment, ICP is used to detect the first value and the second value in the conductive film, and it is detected that the percentage between the second value and the first value is between 0.003% and 2.2%. Specifically, in this embodiment, a metal thickening layer 17 is usually plated on the outermost surface of the conductive film to make the coating thickness of the conductive film meet the usage requirements. Therefore, the content of the isolation layer 13 before and after plating the metal thickening layer 17 on the conductive film will be different.

[0078] In an embodiment of the present utility model, when the isolation layer 13 includes a zinc layer, before plating the metal thickening layer 17 on the conductive film, the percentage between the second value and the first value is between 0.03% and 2.2%. At this time, the percentage between the second value and the first value may include one of 0.03%, 0.04%, 0.06%, 0.08%, 0.1%, 0.13%, 0.14%, 0.16%, 0.18%, 0.2%, 0.22%, 0.25%, 0.3%, 0.4%, 0.8%, 0.9%, 1%, 1.3%, 1.5%, 1.8%, 2%, 2.1%, 2.2%, etc.

[0079] After plating the metal thickening layer 17 on the conductive film, at this time, the first value further includes the mass of the metal elements in the metal thickening layer 17, and the percentage between the second value and the first value is between 0.003% and 0.22%. At this time, the percentage between the second value and the first value may include one of 0.003%, 0.005%, 0.008%, 0.01%, 0.013%, 0.015%, 0.018%, 0.02%, 0.03%, 0.04%, 0.06%, 0.08%, 0.1%, 0.13%, 0.14%, 0.16%, 0.18%, 0.2%, 0.22%, etc.

[0080] Specifically, when this embodiment uses ICP to detect the first value and the second value, it mainly examines the metal elements in the conductive film. When the isolation layer 13 includes a boron oxide layer, the detected second value is the total mass of boron elements. At this time, the first value includes not only the total mass of the metal elements in the first metal layer 15, the second metal layer 16, and the adhesion enhancement layer 40, but also the total mass of boron elements.

[0081] When the isolation layer 13 in this embodiment includes a metal oxide layer, such as at least one of a lead oxide layer, a copper oxide layer, an antimony oxide layer, a cadmium oxide layer, etc., at this time, the first value includes not only the total mass of the metal elements in the first metal layer 15, the second metal layer 16, and the adhesion enhancement layer 40, but also the total mass of the metal elements in the metal oxide particles (such as the total mass of cadmium elements), and the second value is specifically the total mass of the metal elements in the metal oxide particles (such as the total mass of cadmium elements).

[0082] The second embodiment of the present utility model provides a method for preparing a conductive film. The method for preparing the conductive film is used to prepare the conductive film. For the specific structure of the obtained conductive film, please refer to the content provided in the first embodiment of the present utility model. Specifically, as Figure 4 shown, the method provided in this embodiment includes the following steps:

[0083] Step S11: After preparing the isolation layer 13 on at least one side along the second direction of the second region 12 of the conductive film body 10 by using the first preparation process, the conductive film body 10 is wound up. The isolation layer 13 can isolate the metal layers on the opposite sides of the conductive film body 10 along the second direction in the wound state, thereby avoiding the adhesion phenomenon on the opposite two sides of the conductive film body 10 along the second direction. The first preparation process may include vacuum magnetron sputtering coating or thermal evaporation coating process. The equipment for performing the thermal evaporation coating process and the vacuum magnetron sputtering coating process are the equipment for thermal evaporation coating or vacuum magnetron sputtering coating on the market at present, and no specific introduction is made in this embodiment.

[0084] Step S12: Unwind the wound conductive film body 10 to an electroplating device for electroplating thickening, and clamp at least two electroplating clips of the electroplating device to at least two first regions 11 of the conductive film body 10 respectively, so as to prepare a metal thickening layer 17 on the surfaces of the first region 11, the second region 12 and the isolation layer 13. The metal thickening layer 17 may include at least one of a copper layer, an aluminum layer, etc. That is to say, in this embodiment, generally, before electroplating coating, the semi-finished conductive film after forming the isolation layer 13 by evaporation coating needs to be edge-trimmed to form a width matching with the electroplating coating production line for conductive layer thickening. The production line equipment for electroplating thickening coating has a full-width conductive mode coating and a method of only clamping and conducting electroplating through the two ends of the film. The method of electroplating and clamping coating at the edges of the electroplating device can be preferably used, and two first regions 11 on both sides of the width of the conductive film body 10 are respectively clamped, so as to prepare a metal thickening layer 17 on the surfaces of the first region 11, the second region 12 and the isolation layer 13. The metal thickening layer 17 may include at least one of a copper layer, an aluminum layer, etc., and actually preferably a copper coating. The aforementioned first width d1 is the same as the width of the electroplating clamping coating method, and the second width is d2, and d2 accounts for 90% to 98% of d1.

[0085] When electroplating and thickening the conductive film body 10 through the above step S12 in this embodiment, the electroplating clip can be arranged in the first region 11 where the conductive film body 10 has a lower sheet resistance and better conductivity, so as to conduct the electroplating current through the two ends of the first region 11 where the isolation layer 13 is not covered along the first direction of the conductive film body 10, thereby improving the electroplating efficiency of the conductive film body 10 while realizing the anti-adhesion effect through the isolation layer 13 of the second region 12 of the conductive film body 10.

[0086] In step S11, the step of preparing the isolation layer 13 on at least one side of the second region 12 along the second direction includes: preparing a first metal layer 15 and a second metal layer 16 of the conductive main body layer on the first surface 141 and the second surface 142 of the substrate layer 14 respectively by using a second preparation process, and preparing the isolation layer 13 on at least one of the first reserved parts 561 of the first metal layer 15 and the second metal layer 16 by using a first preparation process. The second preparation process may also include a vacuum magnetron sputtering coating process or a thermal evaporation coating process. When the isolation layer 13 includes a structural layer with a melting point lower than that of the first metal layer 15 and the second metal layer 16, the residual heat generated during the heating and evaporation of the first metal layer 15 and the second metal layer 16 can be used to heat and evaporate the target of the isolation layer 13, so as to realize the preparation of the isolation layer 13 on the first reserved part 561, reducing the energy consumption generated during the preparation process of the conductive film. A bonding strength enhancing layer 18 may also be provided between the conductive main body layer and the substrate layer 14, so as to improve the adhesion of the first metal layer 15 and the second metal layer 16 to the substrate layer 14 through the bonding strength enhancing layer 18, that is, to enhance the interfacial bonding force F1 between the metal layer and the substrate layer 14, making the interfacial bonding force F1 between the metal layer and the substrate layer 14 greater than the bonding force F2 between the first metal layer 15 and the second metal layer 16, and preventing the film layer on one side of the conductive film main body 10 from being pulled off by the other side.

[0087] The substrate layer 14 is selected from at least one of a polypropylene layer, a polyethylene terephthalate layer, a polyethylene layer, a polyamide layer, a polyimide layer, a polyphenylene ether layer, a polyvinyl chloride layer, an ABS plastic layer, a poly(p-phenylene terephthalamide) layer, a polyoxymethylene layer, a polytetrafluoroethylene layer, a polyvinylidene fluoride layer, a polycarbonate layer, a polyvinyl alcohol layer, a polyethylene glycol layer, and a cellulose layer.

[0088] In this embodiment, when the isolation layer 13 prepared includes a structural layer with a melting point lower than that of the first metal layer 15 and the second metal layer 16, when the second preparation process is a thermal evaporation coating process, the first preparation process is also preferably a thermal evaporation coating process. Thus, the heat generated during the evaporation coating of the first metal layer 15 and the second metal layer 16 by the thermal evaporation coating process can be used to heat and evaporate the target of the isolation layer 13, so as to prepare the isolation layer 13 on the first reserved part 561 or the second reserved part 143, reducing the energy consumption during the preparation process of the conductive film. The target of the isolation layer 13 with a relatively low melting point has good evaporation performance under suitable evaporation conditions, can be quickly converted into steam and deposited as a thin film after condensation, thereby also improving the production efficiency of the conductive film.

[0089] The third embodiment of the present utility model provides a pole piece. The pole piece includes a current collector, and the current collector includes a conductive film, or the current collector includes a conductive film prepared by the conductive film preparation method provided in the second embodiment of the present utility model. For the specific structure of the conductive film, please refer to the content provided in the first embodiment of the present utility model, and for the conductive film preparation method, please refer to the content provided in the second embodiment of the present utility model. This embodiment will not be elaborated herein.

[0090] The fourth embodiment of the present utility model provides an energy storage device. The energy storage device includes, but is not limited to, a battery, a battery pack, etc., and the energy storage device includes the pole piece provided in the third embodiment of the present utility model.

[0091] The fifth embodiment of the present utility model provides an electrical device. The electrical device includes, but is not limited to, a computer, an electric vehicle, etc., and the electrical device includes the energy storage device provided in the fourth embodiment of the present utility model.

[0092] For the sake of convenience of description, spatial relative terms such as "above", "over", "on the upper surface", "upper" can be used here to describe the spatial position relationship between a device or feature shown in the figure and other devices or features. It should be understood that the spatial relative terms are intended to cover different orientations in use or operation in addition to the orientation described in the figure for the device. For example, if the device in the figure is inverted, the device described as "above other devices or structures" or "over other devices or structures" will then be positioned "below other devices or structures" or "under other devices or structures". Thus, the exemplary term "above" can include both the orientations of "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the corresponding explanations are made for the spatial relative descriptions used here.

[0093] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of differentiating the corresponding components. Without additional statements, the above terms have no special meanings, so they cannot be understood as limiting the protection scope of the present application.

[0094] The above are only the preferred embodiments of the present application and are not used to limit the present application. For those skilled in the art, various changes and modifications can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.

Claims

1. A conductive film, characterized in that: include: A conductive film body (10), along a first direction, the conductive film body (10) comprises a first region (11) and a second region (12) adjacent to each other, the first region (11) comprises at least two, the second region (12) comprises at least one, and the at least two first regions (11) are respectively located on opposite sides of at least one second region (12) along the first direction; An isolation layer (13) is provided on at least one side of the second region (12) along the second direction, and the square resistance of the second region (12) is higher than the square resistance of the first region (11), and the isolation layer (13) is used to isolate the two opposite sides of the conductive film body (10) in a wound state along the second direction.

2. The conductive film according to claim 1, characterized in that The square resistance of the first region (11) is between 500 mΩ and 2000 mΩ; and / or the square resistance of the second region (12) is between 530 mΩ and 5000 mΩ.

3. The conductive film according to claim 1 or 2, characterized in that: Along a first direction, the conductive film body (10) has a first width, and the second region (12) has a second width, and the second width accounts for 70% to 98% of the first width.

4. The conductive film according to claim 1, characterized in that The conductive film body (10) comprises: A substrate layer (14), along the second direction, the substrate layer (14) comprises a first surface (141) and a second surface (142); A conductive main layer, the conductive main layer comprising a first metal layer (15) and a second metal layer (16), the first metal layer (15) being arranged on the first surface (141), the second metal layer (16) being arranged on the second surface (142), at least one of the first metal layer (15) and the second metal layer (16) comprising a first reserved portion (561) located within the second region (12), and the isolation layer (13) being arranged on a surface of the first reserved portion (561) away from the substrate layer (14).

5. The conductive film according to claim 4, characterized in that The isolation layer (13) comprises a third metal layer or a non-metal layer whose material is different from that of the conductive main layer.

6. The conductive film according to claim 5, characterized in that The isolation layer (13) comprises a structural layer having a melting point lower than that of the conductive main layer.

7. The conductive film according to claim 6, characterized in that: The isolation layer (13) comprises a structural layer having a melting point not higher than 800°C.

8. The conductive film according to claim 5, characterized in that: The third metal layer includes at least one of a single metal layer and an alloy metal layer, and the single metal layer includes at least one of a zinc layer, a tin layer, a magnesium layer, a lead layer, a cadmium layer, a silver layer, a nickel layer, a cobalt layer, and a chromium layer; and / or, The alloy metal layer includes at least one of a zinc alloy layer, a tin alloy layer, a lead alloy layer, a cadmium alloy layer, a magnesium alloy layer, a silver alloy layer, a nickel alloy layer, a cobalt alloy layer, and a chromium alloy layer.

9. The conductive film according to any one of claims 4 to 8, characterized in that: The first metal layer (15) and the second metal layer (16) include a copper layer or an aluminum layer, and / or, The substrate layer (14) comprises at least one of a polypropylene layer, a polyethylene terephthalate layer, a polyethylene layer, a polyamide layer, a polyimide layer, a polyphenylene ether layer, a polyvinyl chloride layer, an ABS plastic layer, a poly(p-phenylene terephthalamide) layer, a polyoxymethylene layer, a polytetrafluoroethylene layer, a polyvinylidene fluoride layer, a polycarbonate layer, a polyvinyl alcohol layer, a polyethylene glycol layer and a cellulose layer.

10. The conductive film according to any one of claims 5 to 8, characterized in that: The non-metal layer includes at least one of a boron oxide layer and a copper oxide layer.

11. The conductive film according to any one of claims 4 to 8, characterized in that: The conductive film body (10) further comprises: An adhesion enhancing layer (18), the adhesion enhancing layer (18) comprising at least two layers, the at least two layers of the adhesion enhancing layer (18) being respectively arranged on two opposite sides of the substrate layer (14) along the second direction.

12. A pole piece, characterized in that: The pole piece includes a current collector, and the current collector includes the conductive film according to any one of claims 1 to 11.

13. An energy storage device, characterized in that: The energy storage device comprises the pole piece as claimed in claim 12.

14. An electrical device, characterized in that: The electrical equipment includes the energy storage device according to claim 13.

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