Anti-tracking copper-clad plate

Abstract

The utility model discloses an anti-tracking copper-clad plate, which relates to the technical field of copper-clad plate processing and manufacturing and comprises a base layer, a pair of heat conducting layers, a pair of insulating layers, a pair of anti-tracking layers, a pair of conductive layers and a pair of anti-oxidation layers, the heat conducting layers are symmetrically arranged on two sides of the base layer, and the insulating layers are symmetrically arranged on two sides of the base layer. The insulating layers are symmetrically arranged on the heat conduction layer, the anti-creepage tracking layers are symmetrically arranged on the insulating layers, the conductive layers are symmetrically arranged on the anti-creepage tracking layers, the conductive layers are attached to the anti-creepage tracking layers, the conductive layers are coated with the anti-oxidation layers, and the anti-creepage tracking layers are coated with the anti-oxidation layers. And the base layer, the heat conduction layer, the insulating layer and the anti-creepage tracking layer are fixedly connected by adopting a pressing process, so that the problem that normal operation of equipment is influenced by a creepage tracking phenomenon easily occurring in a traditional copper-clad plate at high temperature in the prior art is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of copper clad laminate processing and manufacturing, in particular to an anti-tracking copper clad laminate. Background Art

[0002] In existing electronic devices, copper clad laminates are one of the key materials for forming circuit boards. When an excessive current passes through the copper clad laminate, a resistive heating effect will occur, causing the surface temperature of the copper clad laminate to rise. If the operating environment temperature of the electronic device is relatively high, it will also affect the heat dissipation effect of the copper clad laminate, thereby exacerbating the high-temperature phenomenon of the copper clad laminate. At high temperatures, traditional copper clad laminates are prone to tracking phenomena, resulting in electrical failures and affecting the normal operation and service life of the device. Therefore, it is of great practical significance to develop an anti-tracking copper clad laminate. Summary of the Utility Model

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. For this purpose, the utility model provides an anti-tracking copper clad laminate, which solves the problem that traditional copper clad laminates are prone to tracking phenomena at high temperatures, affecting the normal operation of the device in the prior art.

[0004] To achieve the above object, the utility model provides an anti-tracking copper clad laminate, which includes a base layer, a heat conduction layer, an insulating layer, an anti-tracking layer, a conductive layer, and an antioxidant layer. There are a pair of each of the heat conduction layer, the insulating layer, the anti-tracking layer, the conductive layer, and the antioxidant layer. The heat conduction layers are symmetrically arranged on both sides of the base layer. The insulating layers are symmetrically arranged on the heat conduction layers. The anti-tracking layers are symmetrically arranged on the insulating layers. The conductive layers are symmetrically arranged on the anti-tracking layers. The conductive layers are attached to the anti-tracking layers. The antioxidant layer is coated on the conductive layers. The base layer, the heat conduction layer, the insulating layer, and the anti-tracking layer are fixedly connected by a pressing process.

[0005] As a further scheme of the utility model: the heat conduction layer is composed of a copper substrate.

[0006] As a further scheme of the utility model: the insulating layer is made of epoxy resin.

[0007] As a further scheme of the utility model: the anti-tracking layer includes an epoxy resin layer, a brominated epoxy resin layer, an amine curing agent, and an imidazole accelerator.

[0008] As a further scheme of the utility model: longitudinally arranged holes with a circular cross-section are equidistantly opened on the heat conduction layer, and a number of laterally arranged holes with a semi-circular cross-section are equidistantly opened on the side of the heat conduction layer.

[0009] As a further scheme of the utility model: the laterally arranged holes communicate with the longitudinally arranged holes.

[0010] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0011] 1. By providing an anti-tracking layer, the anti-tracking performance of the overall copper plate is increased, thereby enhancing the high-temperature resistance of the copper clad laminate and improving the overall stability and functionality.

[0012] 2. By providing a heat-conducting layer, longitudinal holes with a circular cross-section are equidistantly arranged on the heat-conducting layer, and a number of transverse holes with a semi-circular cross-section are equidistantly arranged on the side of the heat-conducting layer. The heat-conducting layer is communicated with the longitudinal holes. The arrangement of the heat-conducting layer and the longitudinal holes is conducive to the discharge of heat, making the heat distribution and heat dissipation effect more uniform, and maintaining the overall temperature stability. Among them, the longitudinal holes are arranged with a semi-circular cross-section, which is beneficial to reducing stress concentration and increasing the structural stability. Description of the Drawings

[0013] Figure 1 is a cross-sectional view of an anti-tracking copper clad laminate of the present utility model;

[0014] Figure 2 is a top view of the heat-conducting layer of an anti-tracking copper clad laminate of the present utility model;

[0015] Figure 3 is an anti-tracking copper clad laminate of the present utility model Figure 1 enlarged view of part A.

[0016] In the figure: 1. Base layer; 2. Heat-conducting layer; 3. Insulating layer; 4. Anti-tracking layer; 5. Conductive layer; 6. Anti-oxidation layer; 7. Longitudinal hole; 8. Transverse hole. Detailed Embodiment

[0017] The technical solutions of the present utility model will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts fall within the protection scope of the present utility model.

[0018] Such as Figures 1 - 3As shown in the figure, an anti-tracking copper clad laminate includes a base layer 1, a heat-conducting layer 2, an insulating layer 3, an anti-tracking layer 4, a conductive layer 5, and an antioxidant layer 6. There are a pair of the heat-conducting layer 2, the insulating layer 3, the anti-tracking layer 4, the conductive layer 5, and the antioxidant layer 6. The heat-conducting layer 2 is symmetrically arranged on both sides of the base layer 1 and is made of a copper substrate for conducting heat. The insulating layer 3 is symmetrically arranged on the heat-conducting layer 2 and is made of epoxy resin as the raw material for isolating the base layer 1 from the conductive layer 5. The anti-tracking layer 4 is symmetrically arranged on the insulating layer 3 for improving the anti-tracking performance of the copper clad laminate. The conductive layer 5 is symmetrically arranged on the anti-tracking layer 4. The conductive layer 5 is a copper foil attached to the anti-tracking layer 4 for providing electrical conductivity. The antioxidant layer 6 is a protective film formed by coating with alumina. The antioxidant layer 6 is coated on the conductive layer 5 to prevent the conductive layer 5 from being oxidized and affecting the electrical conductivity and stability, and to extend the service life of the copper plate;

[0019] As an implementation mode in this embodiment, longitudinally arranged holes 7 with a circular cross-section are equidistantly opened on the heat-conducting layer 2, and a number of laterally arranged holes 8 with a semi-circular cross-section are equidistantly opened on the side of the heat-conducting layer 2. The heat-conducting layer 2 is communicated with the longitudinally arranged holes 7. The arrangement of the heat-conducting layer 2 and the longitudinally arranged holes 7 is beneficial to the discharge of heat, making the heat distribution and heat dissipation effect more uniform and maintaining the overall temperature stability. Among them, the longitudinally arranged holes 7 are set with a semi-circular cross-section to reduce stress concentration and increase the structural stability;

[0020] As an implementation mode in this embodiment, the base layer 1, the heat-conducting layer 2, the insulating layer 3, and the anti-tracking layer 4 are fixedly connected by a pressing process. The conductive layer 5 is attached to the surface of the anti-tracking layer 4, and the antioxidant layer 6 is coated on the surface of the conductive layer 5;

[0021] As an implementation mode in this embodiment, the production and pressing process of the anti-tracking layer 4 is as follows: Weigh an organic solvent and add it to a stirring tank, then add an amine curing agent and an imidazole accelerator, and fully dissolve for 10 to 12 hours. Then add a number of anti-tracking special epoxy resins and brominated epoxy resins, and after curing for 8 hours, add an appropriate amount of special inorganic fillers for increasing the anti-tracking performance. After curing for 24 hours, pump it to a sizing machine for impregnation, drying, slicing, laminating combination, plate copper foil lamination, and then press at high temperature and high pressure for 3 hours, and then pull it to a cold press for cooling; thereby increasing the overall anti-tracking performance of the copper plate.

[0022] Working principle:

[0023] The current is conducted through the conductive layer 5. An insulating layer 3 is provided between a pair of conductive layers 5 and the base layer 1, which has the effect of isolating the current and reducing the influence of the current on the substrate 1. At the same time, the heat generated during operation is evenly dissipated through the transverse holes 8 and longitudinal holes 2 interconnected on the heat-conducting layer 2 to maintain the overall temperature stability. By coating the antioxidant layer 6 on the conductive layer 5, it is used to prevent the conductive layer 5 from being oxidized and affecting the electrical conductivity and stability, and to extend the service life of the copper plate; by providing the anti-tracking layer 4, the overall anti-tracking performance of the copper plate is increased.

[0024] In the description of the present invention, it should be understood that the terms "upper", "lower", "left", "right", etc. indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, as well as a specific orientation structure and operation. Therefore, it cannot be understood as a limitation to the present invention. In addition, "first" and "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more.

[0025] In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0026] The above has described in detail an embodiment of the present invention, but the content described is only the preferred embodiment of the present invention and cannot be considered as used to limit the scope of implementation of the present invention. All equivalent changes and improvements made according to the scope of the application of the present invention should still fall within the scope covered by the patent of the present invention.

Claims

1. A tracking resistant copper clad laminate, characterized in that: The invention comprises a base layer (1), a heat conductive layer (2), an insulating layer (3), an anti-tracking layer (4), a conductive layer (5), and an anti-oxidation layer (6); the heat conductive layer (2), the insulating layer (3), the anti-tracking layer (4), the conductive layer (5), and the anti-oxidation layer (6) are each provided in a pair; the heat conductive layer (2) is symmetrically arranged on both sides of the base layer (1); the insulating layer (3) is symmetrically arranged on the heat conductive layer (2); the anti-tracking layer (4) is symmetrically arranged on the insulating layer (3); the conductive layer (5) is symmetrically arranged on the anti-tracking layer (4); the conductive layer (5) is adhered to the anti-tracking layer (4); the anti-oxidation layer (6) is coated on the conductive layer (5); and the base layer (1), the heat conductive layer (2), the insulating layer (3), and the anti-tracking layer (4) are fixedly connected by a pressing process.

2. The anti-tracking copper clad laminate according to claim 1, characterized in that: The heat conducting layer (2) is composed of a copper substrate.

3. The anti-tracking copper clad laminate according to claim 1, characterized in that: The insulating layer (3) is made of epoxy resin.

4. The anti-tracking copper clad laminate according to claim 1, characterized in that: The anti-tracking layer (4) comprises an epoxy resin layer, a brominated epoxy resin layer, an amine curing agent and an imidazole accelerator.

5. The anti-tracking copper clad laminate according to claim 1, characterized in that: The heat-conducting layer (2) is provided with longitudinal holes (7) with circular cross sections at equal intervals, and the side edge of the heat-conducting layer (2) is provided with a plurality of transverse holes (8) with semicircular cross sections at equal intervals.

6. The anti-tracking copper clad laminate according to claim 5, characterized in that: The transverse hole (8) is communicated with the longitudinal hole (7).

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