Key sensing film capable of preventing circuit from being damaged

Abstract

The utility model discloses a key sensing film capable of preventing circuit damage, which comprises a key sensing film main body, a lead fixedly connected to the bottom of the key sensing film main body, an insert connector fixedly connected to the bottom of the lead, a surface adhesive layer fixedly connected to the outer surface of the key sensing film main body, and an upper protective layer fixedly connected to the back surface of the surface adhesive layer. The back of the upper protective layer is fixedly connected with an upper circuit induction layer, the back of the upper circuit induction layer is fixedly connected with an isolation layer, the back of the isolation layer is fixedly connected with a lower circuit induction layer, the back of the lower circuit induction layer is fixedly connected with a substrate, the back of the substrate is fixedly connected with a shielding layer, and the back of the shielding layer is fixedly connected with a lower protective layer. Through the arrangement of the upper protection layer and the lower protection layer, it is avoided that material performance of a circuit of the key induction film is reduced due to high temperature, normal operation of the circuit is affected, and therefore circuit damage is prevented. And by arranging the shielding layer, the influence of external electromagnetic interference on the induction signal is reduced, and the normal use of the key induction film is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of key induction films, and particularly relates to a key induction film for preventing circuit damage. Background Technique

[0002] The key induction film, also known as the metal shrapnel conductive film, is a PET thin sheet containing metal shrapnel (dome sheet), which is used as a switch on circuit boards such as PCBs or FPCs, and plays an important role as a tactile switch between users and instruments.

[0003] After retrieval, Chinese Patent Publication No. CN202364196U discloses a film touch key, which includes a key module part, a module control circuit part and the connection part between the two. The key module part includes a key, indium tin oxide of the key part, and a soft substrate board. The indium tin oxide of the key part is plated on the soft substrate board, and the surrounding wires are plated with silver paste on the indium tin oxide, and an insulating protective film is also plated on the surface. The module control circuit part includes a flexible circuit board, a touch chip, a communication interface for communicating with the main board, and an indium tin oxide transparent conductive film. The touch chip is welded on the flexible circuit board, conductive silver paste is plated on the indium tin oxide transparent conductive film and pressed together with the flexible circuit board through conductive hot melt adhesive. The channels on the touch chip are connected to the conductive silver paste, and one key of the key part corresponds to one channel in the touch chip. The number of keys of the utility model can be increased or decreased at will, the key patterns and the number have strong universality, the cost of key modification is low, and the stability is good.

[0004] However, in the process of using the existing key induction film, when the human body touches it, it will cause a change in capacitance, thus playing an induction role. However, due to the reasons of the use time and temperature environment, because the circuit has no heat insulation effect, the material performance of the circuit will decline, thus affecting the normal operation of the circuit. And due to the installation position, because the key induction film cannot play the role of shielding electromagnetic interference, the electromagnetic interference will affect the induction signal, thus affecting the use of the key induction film. Therefore, it is necessary to design a key induction film for preventing circuit damage. Content of the Utility Model

[0005] The main purpose of the utility model is to provide a key induction film for preventing circuit damage, which can effectively solve the problems in the background technique that due to the reasons of the use time and temperature environment, because the circuit has no heat insulation effect, the material performance of the circuit will decline, thus affecting the normal operation of the circuit, and due to the installation position, because the key induction film cannot play the role of shielding electromagnetic interference, the electromagnetic interference will affect the induction signal, thus affecting the use of the key induction film.

[0006] To achieve the above purpose, the technical solution adopted by the utility model is as follows:

[0007] A key sensing film for preventing circuit damage, comprising a key sensing film body. A lead is fixedly connected to the bottom of the key sensing film body. A plug connector is fixedly connected to the bottom of the lead. An adhesive layer is fixedly connected to the outer surface of the key sensing film body. An upper protective layer is fixedly connected to the back of the adhesive layer. An upper circuit sensing layer is fixedly connected to the back of the upper protective layer. An isolation layer is fixedly connected to the back of the upper circuit sensing layer. A lower circuit sensing layer is fixedly connected to the back of the isolation layer. A substrate is fixedly connected to the back of the lower circuit sensing layer. A shielding layer is fixedly connected to the back of the substrate. A lower protective layer is fixedly connected to the back of the shielding layer. A back adhesive layer is fixedly connected to the back of the lower protective layer.

[0008] In order to enable the key sensing film to transmit capacitance signals, as a key sensing film for preventing circuit damage of the present utility model, an upper sensing key and an upper circuit are respectively fixedly connected to the front of the upper circuit sensing layer. An upper connector is fixedly connected to the bottom of the upper circuit sensing layer.

[0009] In order to enable the key sensing film to transmit capacitance signals, as a key sensing film for preventing circuit damage of the present utility model, a lower sensing key and a lower circuit are respectively fixedly connected to the front of the lower circuit sensing layer. A lower connector is fixedly connected to the bottom of the lower circuit sensing layer.

[0010] In order to enable the key sensing film to have a heat insulation effect, as a key sensing film for preventing circuit damage of the present utility model, both the upper protective layer and the lower protective layer are made of Teflon material, and the outer surfaces of the upper protective layer and the lower protective layer are smooth.

[0011] In order to enable the key sensing film to have an electromagnetic interference shielding effect, as a key sensing film for preventing circuit damage of the present utility model, the shielding layer is made of ferrite material, and the shielding layer is located between the substrate and the lower protective layer.

[0012] In order to enable the key sensing film to be produced with a suitable thickness according to the usage requirements, as a key sensing film for preventing circuit damage of the present utility model, the thickness of the key sensing film body is 0.3 to 1 millimeter.

[0013] Compared with the prior art, the present utility model has the following beneficial effects:

[0014] 1. In the present utility model, through the upper protective layer and the lower protective layer provided, when using the key induction film, since the upper protective layer and the lower protective layer are located on the outer surface of the key induction film, and the upper protective layer and the lower protective layer are processed from Teflon materials, which themselves have the functions of wear resistance and heat insulation. When the key induction film is used in a high-temperature environment, the upper protective layer and the lower protective layer can play a heat insulation role, preventing the circuit of the key induction film from having a decline in material performance due to high temperature and affecting the normal operation of the circuit. Therefore, the circuit damage is prevented.

[0015] 2. In the present utility model, through the shielding layer provided, a shielding layer is installed in the key induction film, and the shielding layer is processed from ferrite materials, which itself has the function of shielding electromagnetic signals, thereby reducing the influence of external electromagnetic interference on the induction signal and ensuring the normal use of the key induction film. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic diagram of the overall structure of the present utility model;

[0017] Figure 2 is a cross-sectional view of the main body of the key induction film of the present utility model;

[0018] Figure 3 is a schematic diagram of the partial structural decomposition of the main body of the key induction film of the present utility model;

[0019] Figure 4 is a schematic diagram of the partial structure of the upper circuit induction layer of the present utility model;

[0020] Figure 5 is a schematic diagram of the partial structure of the lower circuit induction layer of the present utility model.

[0021] In the figure: 1, main body of the key induction film; 2, lead wire; 3, plug-in joint; 4, surface adhesive layer; 5, upper protective layer; 6, upper circuit induction layer; 601, upper induction key; 602, upper circuit; 603, upper joint; 7, isolation layer; 8, lower circuit induction layer; 801, lower induction key; 802, lower circuit; 803, lower joint; 9, substrate; 10, shielding layer; 11, lower protective layer; 12, back adhesive layer. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0022] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0023] Embodiment

[0024] As shown Figures 1-5 As shown, a key induction film for preventing circuit damage includes a key induction film body 1. A lead 2 is fixedly connected to the bottom of the key induction film body 1. A plug connector 3 is fixedly connected to the bottom of the lead 2. An adhesive layer 4 is fixedly connected to the outer surface of the key induction film body 1. An upper protective layer 5 is fixedly connected to the back of the adhesive layer 4. An upper circuit induction layer 6 is fixedly connected to the back of the upper protective layer 5. An isolation layer 7 is fixedly connected to the back of the upper circuit induction layer 6. A lower circuit induction layer 8 is fixedly connected to the back of the isolation layer 7. A substrate 9 is fixedly connected to the back of the lower circuit induction layer 8. A shielding layer 10 is fixedly connected to the back of the substrate 9. A lower protective layer 11 is fixedly connected to the back of the shielding layer 10. An adhesive layer 12 is fixedly connected to the back of the lower protective layer 11.

[0025] During specific use, the upper protective layer 5 and the lower protective layer 11 have the functions of wear resistance and heat insulation. When the key induction film is used in a high-temperature environment, the upper protective layer 5 and the lower protective layer 11 can play a heat insulation role, preventing the circuit of the key induction film from having a decrease in material performance due to high temperature and affecting the normal operation of the circuit, thus preventing circuit damage.

[0026] In this embodiment, an upper induction key 601 and an upper circuit 602 are respectively fixedly connected to the front of the upper circuit induction layer 6. An upper connector 603 is fixedly connected to the bottom of the upper circuit induction layer 6.

[0027] During specific use, when the upper induction key 601 is touched, a capacitor will be formed between the upper induction key 601 and the lower induction key 801, and the generated capacitor can be transmitted through the lower circuit 802.

[0028] In this embodiment, a lower induction key 801 and a lower circuit 802 are respectively fixedly connected to the front of the lower circuit induction layer 8. A lower connector 803 is fixedly connected to the bottom of the lower circuit induction layer 8.

[0029] During specific use, when the upper induction key 601 is touched, a capacitor will be formed between the upper induction key 601 and the lower induction key 801, and the generated capacitor can be transmitted through the lower circuit 802.

[0030] In this embodiment, both the upper protective layer 5 and the lower protective layer 11 are processed from Teflon materials, and the outer surfaces of the upper protective layer 5 and the lower protective layer 11 are smooth.

[0031] During specific use, when the key induction film is used in a high-temperature environment, the upper protective layer 5 and the lower protective layer 11 can play a heat insulation role, preventing the circuit of the key induction film from having a decrease in material performance due to high temperature and affecting the normal operation of the circuit.

[0032] In this embodiment, the shielding layer 10 is processed from ferrite materials, and the shielding layer 10 is located between the substrate 9 and the lower protective layer 11.

[0033] During specific use, the shielding layer 10 functions to shield electromagnetic signals, thereby reducing the influence of external electromagnetic interference on the induction signal and ensuring the normal use of the key induction film.

[0034] In this embodiment, the thickness of the key induction film body 1 is 0.3 to 1 millimeter.

[0035] During specific use, the key induction film body 1 can be manufactured according to the usage requirements.

[0036] Working principle: When using the key induction film, since the upper protective layer 5 and the lower protective layer 11 are located on the outer surface of the key induction film, and the upper protective layer 5 and the lower protective layer 11 are made of Teflon material, which itself has the functions of wear resistance and heat insulation. When the key induction film is used in a high-temperature environment, the upper protective layer 5 and the lower protective layer 11 can play a heat insulation role. And a shielding layer 10 is installed in the key induction film, and the shielding layer 10 is made of ferrite material, which itself has the function of shielding electromagnetic signals, thereby reducing the influence of external electromagnetic interference on the induction signal and ensuring the normal use of the key induction film.

[0037] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principle of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A key induction film for preventing circuit damage, comprising a key induction film main body (1), characterized in that: The bottom of the key induction film body (1) is fixedly connected with a lead wire (2), the bottom of the lead wire (2) is fixedly connected with a plug connector (3), the outer surface of the key induction film body (1) is fixedly connected with an adhesive layer (4), the back of the adhesive layer (4) is fixedly connected with an upper protective layer (5), the back of the upper protective layer (5) is fixedly connected with an upper circuit induction layer (6), the back of the upper circuit induction layer (6) is fixedly connected with an isolation layer (7), the back of the isolation layer (7) is fixedly connected with a lower circuit induction layer (8), the back of the lower circuit induction layer (8) is fixedly connected with a substrate (9), the back of the substrate (9) is fixedly connected with a shielding layer (10), the back of the shielding layer (10) is fixedly connected with a lower protective layer (11), and the back of the lower protective layer (11) is fixedly connected with an adhesive layer (12).

2. The key induction film for preventing circuit damage according to claim 1, wherein: The front of the upper circuit induction layer (6) is respectively fixedly connected with an upper induction key (601) and an upper circuit (602), and the bottom of the upper circuit induction layer (6) is fixedly connected with an upper connector (603).

3. The key induction film for preventing circuit damage according to claim 1, characterized in that: The front of the lower circuit induction layer (8) is respectively fixedly connected with a lower induction key (801) and a lower circuit (802), and the bottom of the lower circuit induction layer (8) is fixedly connected with a lower connector (803).

4. The key induction film for preventing circuit damage according to claim 1, characterized in that: Both the upper protective layer (5) and the lower protective layer (11) are processed from Teflon materials, and the outer surfaces of the upper protective layer (5) and the lower protective layer (11) are smooth.

5. The button induction film for preventing circuit damage according to claim 1, characterized in that: The shielding layer (10) is processed from a ferrite material, and the shielding layer (10) is located between the substrate (9) and the lower protective layer (11).

6. The key induction film for preventing circuit damage according to claim 1, wherein: The thickness of the key induction film body (1) is 0.3 to 1 millimeter.

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