Outer circle grinding beveling combined grinding wheel for wafer

Abstract

The utility model relates to the technical field of grinding wheels for wafer processing, in particular to an outer circle grinding and beveling combined grinding wheel for wafers, which comprises an outer circle grinding resin binder grinding wheel for grinding the edges of the wafers and a beveling resin binder grinding wheel for beveling the wafers. A first grinding material layer is arranged outside the first base body, and center holes of the same specification are formed in the center of the outer circle grinding resin binder grinding wheel and the center of the beveling resin binder grinding wheel. According to the utility model, the wafer can be ground and chamfered through the cylindrical grinding resin binder grinding wheel and the chamfered edge resin binder grinding wheel which are integrally connected, and the use is convenient.

Description

Technical Field

[0001] The utility model relates to the technical field of grinding wheels for wafer processing, in particular to an external cylindrical grinding chamfering combined grinding wheel for wafers. Background Technique

[0002] Wafer chamfering is to process the edge through a chamfering grinding wheel to prevent edge cracking and lattice defects, increase mechanical strength, reduce particle contamination, improve processing quality, and avoid and reduce chamfering problems in subsequent processes, ensuring the reliability and stability of the wafer.

[0003] At present, wafer chamfering processing is directly carried out through a chamfering grinding wheel. On the one hand, the wafer diameter is reduced to a specified size, and on the other hand, the wafer is chamfered. However, this processing method is not economical. The chamfering grinding wheel is expensive and the grinding wheel wears quickly, requiring frequent replacement of the grinding wheel, resulting in low processing efficiency. Therefore, the utility model proposes an external cylindrical grinding chamfering combined grinding wheel for wafers to solve the existing technical problems. Summary of the Utility Model

[0004] The purpose of the utility model is to provide an external cylindrical grinding chamfering combined grinding wheel for wafers to solve the problems raised in the above background technique.

[0005] The technical solution of the utility model is: an external cylindrical grinding chamfering combined grinding wheel for wafers, including an external cylindrical grinding resin bond grinding wheel for grinding the edge of the wafer and a chamfering resin bond grinding wheel for wafer chamfering. The external cylindrical grinding resin bond grinding wheel contains a first base body, and a first abrasive layer is arranged outside the first base body. The external cylindrical grinding resin bond grinding wheel and the chamfering resin bond grinding wheel are provided with central holes of the same specification at the center. The external cylindrical grinding resin bond grinding wheel is provided with a plurality of annularly distributed threaded blind holes. The chamfering resin bond grinding wheel includes a second base body, and a second abrasive layer is arranged on the outer side wall of the second base body. The chamfering resin bond grinding wheel is provided with counterbores adapted to the threaded blind holes, and the counterbores and the threaded blind holes are connected by bolts. Micro-grooves are arranged on the circumferential outer wall of the second abrasive layer.

[0006] Further, the overall outer diameter of the external cylindrical grinding resin bond grinding wheel is 300 - 350 mm, and the thickness is 20 - 50 mm. The first abrasive layer on the external cylindrical grinding resin bond grinding wheel is circular ring-shaped, and the ring width of the first abrasive layer is 5 - 10 mm.

[0007] Further, weight-reducing portions are provided on both the first base body and the second base body. The weight-reducing portions include a first weight-reducing groove and a second weight-reducing groove formed on both sides of the first base body, and a third weight-reducing groove and a fourth weight-reducing groove formed on the second base body. The total thickness of the first weight-reducing groove and the second weight-reducing groove is 1 / 3 - 1 / 2 of the thickness of the external cylindrical grinding resin-bonded grinding wheel, and the total thickness of the third weight-reducing groove and the fourth weight-reducing groove is 1 / 3 - 1 / 2 of the thickness of the chamfered resin-bonded grinding wheel.

[0008] Further, the overall outer diameter of the chamfered resin-bonded grinding wheel is 250 - 300 mm, and the thickness is 15 - 30 mm.

[0009] Further, the second abrasive layer on the chamfered resin-bonded grinding wheel is annular, with a thickness of 15 - 20 mm and an annular width of 5 - 10 mm.

[0010] Further, the cross-section of the micro-groove is single R-shaped, double R-shaped or T-shaped.

[0011] The present utility model provides an external cylindrical grinding and chamfering combined grinding wheel for wafers through improvement. Compared with the prior art, it has the following improvements and advantages:

[0012] In the present utility model, the external cylindrical grinding resin-bonded grinding wheel has a lower price and is used to reduce the diameter of the wafer. The chamfered resin-bonded grinding wheel is directly used for wafer chamfering, without the need to reduce the diameter of the wafer, improving the utilization rate and reducing the frequency of grinding wheel replacement. Description of the Drawings

[0013] The following further explains the present utility model in conjunction with the drawings and embodiments:

[0014] Figure 1 is a schematic cross-sectional structure diagram of the present utility model;

[0015] Figure 2 is a schematic structure diagram of the micro-groove in the present utility model.

[0016] Explanation of the Reference Numerals in the Drawings:

[0017] 1. External cylindrical grinding resin-bonded grinding wheel; 11. First base body; 12. Second base body; 2. First abrasive layer; 3. Central hole; 4. Weight-reducing portion; 41. First weight-reducing groove; 42. Second weight-reducing groove; 43. Third weight-reducing groove; 44. Fourth weight-reducing groove; 5. Threaded blind hole; 6. Counterbore; 7. Second abrasive layer; 8. Micro-groove; 9. Chamfered resin-bonded grinding wheel. Detailed Embodiment

[0018] The following provides a detailed description of the present utility model. The technical solutions in the embodiments of the present utility model are clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts belong to the scope of protection of the present utility model.

[0019] The present utility model provides an external cylindrical grinding and chamfering combined grinding wheel for wafers through improvement. The technical solution of the present utility model is as follows:

[0020] In the embodiment of the present utility model, as Figure 1 - Figure 2 shown, an external cylindrical grinding and chamfering combined grinding wheel for wafers includes an external cylindrical grinding resin bond grinding wheel 1 for grinding the edge of the wafer and a chamfering resin bond grinding wheel 9 for chamfering the wafer. The external cylindrical grinding resin bond grinding wheel 1 includes a first base body 11, and a first abrasive layer 2 is arranged outside the first base body 11. The overall outer diameter of the external cylindrical grinding resin bond grinding wheel 1 is 300 - 350 mm, and the thickness is 20 - 50 mm. The first abrasive layer 2 on the external cylindrical grinding resin bond grinding wheel 1 is annular, and the width of the ring of the first abrasive layer 2 is 5 - 10 mm. The first abrasive layer 2 can perform grinding work on the side of the wafer. A central hole 3 of the same specification is provided at the center of the external cylindrical grinding resin bond grinding wheel 1 and the chamfering resin bond grinding wheel 9. The central hole 3 can facilitate the operator to position and assemble the device on the equipment spindle, which is convenient for assembly. A plurality of annularly distributed threaded blind holes are provided on the external cylindrical grinding resin bond grinding wheel 1. The chamfering resin bond grinding wheel 9 includes a second base body 12, and a second abrasive layer 7 is arranged on the outer side wall of the second base body 12. The overall outer diameter of the chamfering resin bond grinding wheel 9 is 250 - 300 mm, and the thickness is 15 - 30 mm. The second abrasive layer 7 on the chamfering resin bond grinding wheel 9 is annular, the thickness is 15 - 20 mm, and the width of the ring is 5 - 10 mm. A counterbore 6 adapted to the threaded blind hole is provided on the chamfering resin bond grinding wheel 9. The counterbore 6 and the threaded blind hole 5 are connected by bolts. Micro-grooves 8 are provided on the circumferential outer wall of the second abrasive layer 7. The cross-section of the micro-groove 8 is single R-shaped or double R-shaped or T-shaped. By the micro-grooves 8 with different cross-sections, chamfering work on wafers of different specifications can be adapted.

[0021] In an embodiment of the present utility model, weight-reducing portions 4 are provided on both the first base body 11 and the second base body 12. The weight-reducing portion 4 includes a first weight-reducing groove 41 and a second weight-reducing groove 42 opened on both sides of the first base body 11, and a third weight-reducing groove 43 and a fourth weight-reducing groove 44 opened on the second base body 12. The total thickness of the first weight-reducing groove 41 and the second weight-reducing groove 42 is 1 / 3 - 1 / 2 of the thickness of the resin-bonded external cylindrical grinding wheel 1, and the total thickness of the third weight-reducing groove 43 and the fourth weight-reducing groove 44 is 1 / 3 - 1 / 2 of the thickness of the resin-bonded chamfering grinding wheel 9. Through the first weight-reducing groove 41, the second weight-reducing groove 42, the third weight-reducing groove 43 and the fourth weight-reducing groove 44, the overall structural weight of the first base body 11 and the second base body 12 can be reduced, the raw material cost can be reduced, and it is more convenient to use.

[0022] The working principle of a resin-bonded external cylindrical grinding and chamfering combined grinding wheel for wafers provided by the present utility model is as follows: First, the resin-bonded external cylindrical grinding wheel 1 for wafers and the resin-bonded chamfering grinding wheel 9 are installed on the equipment spindle by using the center hole 3. The wafer is moved to the resin-bonded external cylindrical grinding wheel 1 and abuts against the side of the first abrasive layer 2, and the edge of the wafer is ground to a certain diameter. Then, the wafer is moved to the resin-bonded chamfering grinding wheel 9, so that the wafer abuts against the microgrooves 8 on the side wall of the second abrasive layer 7, and the wafer is chamfered.

[0023] Although the embodiments of the present utility model have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. An external cylindrical grinding and chamfering combined grinding wheel for wafers, comprising an external cylindrical grinding resin bond grinding wheel (1) for grinding the edges of wafers and a chamfering resin bond grinding wheel (9) for chamfering wafers, characterized in that, The external cylindrical grinding resin-bonded grinding wheel (1) contains a first base body (11), and a first abrasive layer (2) is arranged outside the first base body (11). The external cylindrical grinding resin-bonded grinding wheel (1) and the chamfered resin-bonded grinding wheel (9) are provided with central holes (3) of the same specification at the centers. The external cylindrical grinding resin-bonded grinding wheel (1) is provided with a plurality of annularly distributed threaded blind holes. The chamfered resin-bonded grinding wheel (9) includes a second base body (12), and a second abrasive layer (7) is arranged on the outer side wall of the second base body (12). The chamfered resin-bonded grinding wheel (9) is provided with counterbores (6) adapted to the threaded blind holes. The counterbores (6) and the threaded blind holes (5) are connected by bolts. Micro-grooves (8) are provided on the circumferential outer wall of the second abrasive layer (7).

2. The external cylindrical grinding and chamfering combined grinding wheel for wafers according to claim 1, wherein: The overall outer diameter of the external cylindrical grinding resin-bonded grinding wheel (1) is 300 - 350 mm, and the thickness is 20 - 50 mm. The first abrasive layer (2) on the external cylindrical grinding resin-bonded grinding wheel (1) is annular, and the ring width of the first abrasive layer (2) is 5 - 10 mm.

3. The external cylindrical grinding and chamfering combined grinding wheel for wafers according to claim 1, characterized in that: Weight-reducing parts (4) are arranged on both the first base body (11) and the second base body (12). The weight-reducing parts (4) include a first weight-reducing groove (41) and a second weight-reducing groove (42) opened on both sides of the first base body (11) and a third weight-reducing groove (43) and a fourth weight-reducing groove (44) opened on the second base body (12). The total thickness of the first weight-reducing groove (41) and the second weight-reducing groove (42) is 1 / 3 - 1 / 2 of the thickness of the external cylindrical grinding resin-bonded grinding wheel (1), and the total thickness of the third weight-reducing groove (43) and the fourth weight-reducing groove (44) is 1 / 3 - 1 / 2 of the thickness of the chamfered resin-bonded grinding wheel (9).

4. The external cylindrical grinding and chamfering combined grinding wheel for wafers according to claim 1, characterized in that: The overall outer diameter of the chamfered resin-bonded grinding wheel (9) is 250 - 300 mm, and the thickness is 15 - 30 mm.

5. The external cylindrical grinding and chamfering combined grinding wheel for wafers according to claim 1, wherein: The second abrasive layer (7) on the chamfered resin-bonded grinding wheel (9) is annular, the thickness is 15 - 20 mm, and the ring width is 5 - 10 mm.

6. The external cylindrical grinding and chamfering combined grinding wheel for wafers according to claim 1, wherein: The cross-section of the micro-groove (8) is single-R-shaped or double-R-shaped or T-shaped.

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