Splitting mechanism and wafer cleavage machine

Abstract

The utility model discloses a splitting mechanism and a wafer cleavage machine, and relates to the technical field of semiconductor manufacturing, and the splitting mechanism comprises a supporting mechanism, a driving mechanism, a splitting piece, a pressing piece and an elastic assembly. The supporting mechanism is used for bearing a wafer; the driving mechanism is connected with the splitting piece and is used for driving the splitting piece to press and abut against a to-be-cleaved part, located on one side of the cutting opening, of the wafer, so that splitting is completed; the pressing piece is elastically and slidably installed on the pressing piece through an elastic assembly. The elastic assembly is used for providing elastic acting force for the pressing piece to press against a main body part on the other side of the cutting opening on the wafer; and when the driving mechanism drives the splitting piece to move towards the direction of pressing the to-be-cleaved part, the pressing piece is contacted with the wafer before the splitting piece. The technical problems that the cleavage yield is unstable, wafers are prone to being scratched and the quality of the cleavage surface is poor in the design of an existing roller type wafer arranging mechanism are solved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and particularly to a dicing mechanism and a wafer cleavage machine. Background Art

[0002] When a crystalline mineral is stressed, due to its own structural reasons, the property that the crystal cracks along a certain crystallization direction to form a smooth plane is called cleavage. The cracked smooth plane is called a cleavage plane. Because the cleavage plane is very smooth, it is widely used in the semiconductor manufacturing industry.

[0003] Currently, a cleavage device is used to obtain the required cleavage plane. The cleavage device includes a dicing device and a dicing mechanism. First, the dicing device is used to make a scratch with a certain depth on the wafer, and then the dicing mechanism applies pressure to the wafer to cause the wafer to crack along the scratch, thereby obtaining the required cross-section (cleavage plane); among them, the dicing mechanism is a key mechanism of the wafer cleavage device, which affects the quality of the wafer after cleavage.

[0004] As Figure 1 shown, the existing dicing mechanism mainly uses a roller (102) with a flange (101) to apply pressure to the wafer (103) and roll along the scratch (104), so that the wafer (103) is stressed and cracks along the scratch (103). This kind of dicing mechanism has the following deficiencies:

[0005] 1. Since the pressures of the two flanges (101) of the roller (102) on the wafer (103) are the same, when the applied force is too large, it is easy to cause the wafer (103) to break, resulting in the scrapping of the wafer (103); and when the applied force is too small, the success rate of wafer (103) dicing will decrease, affecting the yield of wafer (103) cleavage.

[0006] 2. During the rolling process of the roller (102) on the wafer (103), there is relative movement between the roller (102) and the wafer (103), which is easy to scratch and abrade the surface of the wafer (103), affecting the quality of wafer (103) cleavage.

[0007] 3. During the dicing process, the roller (102) rolls on the wafer (103), and it is possible to drive the wafer (103) to move in the advancing direction of the roller (102), causing friction between the wafer (103) and the support seat (105) and scratching the wafer (103).

[0008] 4. During the rolling process of the roller (102), the stress situation of the wafer (103) will change slightly, which is easy to cause the problem that the cleavage plane is not smooth and straight after the wafer (103) is cleaved.

[0009] Therefore, it is urgent to propose a new solution to solve the above problems. Utility Model Content

[0010] In view of this, the purpose of the present application is to provide a cleavage mechanism and a wafer dicing machine, so as to solve the technical problems of unstable cleavage yield, easy scratching of the wafer, and poor quality of the cleavage surface existing in the design of the existing roller-type wafer slicing mechanism.

[0011] To achieve the above technical purpose, the present application provides a cleavage mechanism, including a support mechanism, a driving mechanism, a cleavage member, a pressing member, and an elastic component;

[0012] The support mechanism is used to carry the wafer;

[0013] The driving mechanism is connected to the cleavage member and is used to drive the cleavage member to press against the to-be-cleaved part on one side of the scribe line on the wafer, so as to complete cleavage;

[0014] The pressing member is elastically slidably mounted on the cleavage member through the elastic component;

[0015] The elastic component is used to provide an elastic acting force for the pressing member to press against the main body part on the other side of the scribe line on the wafer;

[0016] When the driving mechanism drives the cleavage member to move in the direction of pressing down the to-be-cleaved part, the pressing member contacts the wafer prior to the cleavage member.

[0017] Further, the pressing member is slidably mounted on the cleavage member, and one end is used to press against the wafer, and the other end is connected to the cleavage member through the elastic component.

[0018] Further, a first sliding structure is mounted on the cleavage member;

[0019] The pressing member is provided with a limiting groove for the first sliding structure to extend into and used to limit the sliding displacement of the pressing member relative to the first sliding structure;

[0020] A second sliding structure slidably matched with the first sliding structure is provided in the limiting groove.

[0021] Further, the elastic component includes an adjusting member, an elastic member, and a fixing member;

[0022] The fixing member is fixed on the cleavage member and is located on one side of the other end of the pressing member away from one end;

[0023] The adjusting member is mounted on the fixing member;

[0024] The elastic member is arranged between the adjusting member and the pressing member;

[0025] The position of the adjusting member relative to the pressing member is adjustable to adjust the pressing acting force on the elastic member.

[0026] Furthermore, the elastic member is a compression spring;

[0027] On the other end of the pressing member, there is a receiving groove for receiving the compression spring;

[0028] One end of the adjusting member is provided with a convex portion that is snapped into one end of the compression spring.

[0029] Furthermore, the adjusting member has an external thread structure;

[0030] The fixing member is provided with an internal thread hole through which the adjusting member movably passes and is in threaded cooperation with the external thread structure.

[0031] Furthermore, one end of the pressing member for pressing against the wafer is provided with a rubber pad.

[0032] Furthermore, the driving mechanism includes a telescopic driver and a connecting member;

[0033] The telescopic end of the telescopic driver is connected to the chip separating member through the connecting member.

[0034] Furthermore, the supporting mechanism includes a base and a supporting platform fixed on the base.

[0035] The present application also discloses a wafer dicing machine, including the chip separating mechanism described above.

[0036] It can be seen from the above technical solutions that the chip separating mechanism designed in the present application has the following beneficial effects:

[0037] 1. During dicing, the pressing member first presses the main body portion of the wafer on the other side of the scribe line, and then the chip separating member applies a force to the portion to be diced on one side of the scribe line on the wafer to complete dicing; since the pressing member is elastically slidably connected to the chip separating member through an elastic component, when the chip separating member applies a large force, the elastic component can buffer part of the acting force to prevent the pressing member from excessively squeezing the wafer and causing the wafer to break; the elastic component can normally provide a pressing force to ensure that the pressing member presses the wafer tightly, thereby increasing the success rate of wafer dicing and ensuring a stable dicing yield.

[0038] 2. During dicing, the main body portion of the wafer is pressed tightly by the pressing member, and there is no relative movement between the wafer and the supporting mechanism, thereby reducing the situation of wafer abrasion and improving the quality of wafer dicing.

[0039] 3. During dicing, the chip separating member presses against the portion to be diced of the wafer to complete dicing, and it will not slide or roll on the wafer, reducing the risk of the wafer being scratched by the chip separating member.

[0040] 4. The chip splitting member presses against the cleavage portion of the wafer to complete chip splitting, and the force on the cleavage portion of the wafer is uniform, so that the cleavage surface after chip splitting is smooth and does not delaminate. Description of the Drawings

[0041] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0042] Figure 1 Structural schematic diagram of the existing chip splitting mechanism provided in the present application without a support mechanism;

[0043] Figure 2 Stereogram of a chip splitting mechanism provided in the present application;

[0044] Figure 3 Cross-sectional view of a chip splitting mechanism provided in the present application;

[0045] Figure 2 / Figure 3 In the figure: 1. Mounting plate; 2. Driving mechanism; 21. Telescopic driver; 22. Connecting member; 3. Chip splitting member; 31. First sliding structure; 4. Pressing member; 41. Second sliding structure; 42. Rubber pad; 43. Accommodating groove; 5. Elastic component; 51. Adjusting member; 511. Protruding portion; 52. Elastic member; 53. Fixing member; 6. Mounting plate; 7. Wafer; 71. Scoring line; 8. Support mechanism; 81. Support table; 82. Base; 811. Straight edge. Detailed Embodiments

[0046] The following will clearly and completely describe the technical solutions of the embodiments of the present application in conjunction with the drawings. Obviously, the described embodiments are some, rather than all, of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the embodiments of the present application.

[0047] In the description of the embodiments of the present application, it should be noted that the orientation or positional relationship indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation on the embodiments of the present application. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0048] In the description of the embodiments of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a replaceable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium. It can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific situations.

[0049] The embodiments of the present application disclose a dicing mechanism.

[0050] Please refer to Figure 2 and Figure 3 One embodiment of a dicing mechanism provided in the embodiments of the present application includes:

[0051] A support mechanism 8, a driving mechanism 2, a dicing member 3, a pressing member 4, and an elastic component 5.

[0052] The support mechanism 8 is used to carry the wafer 7.

[0053] The driving mechanism 2 is connected to the dicing member 3 and is used to drive the dicing member 3 to press against the to-be-cleaved portion on one side of the scribe line on the wafer 7 to complete dicing.

[0054] The pressing member 4 is elastically slidably mounted on the pressing member 4 through the elastic component 5. The elastic component 5 is used to provide an elastic acting force for the pressing member 4 to press against the main body portion on the other side of the scribe line on the wafer 7.

[0055] When the driving mechanism 2 drives the dicing member 3 to move in the direction of pressing down the to-be-cleaved portion, the pressing member 4 contacts the wafer 7 prior to the dicing member 3 to first clamp the wafer 7 tightly and then dice the wafer 7.

[0056] The dicing member 3 can be a plate structure. Correspondingly, the pressing member 4 can also be a plate structure. The sizes of the ends of each of them contacting the wafer 7 can be designed according to the size of the wafer 7, and no specific limitation is made.

[0057] Taking the example that the driving mechanism 2 drives the chip separating member 3 to move vertically downward to complete chip separation:

[0058] Then the bottom of the chip separating member 3 contacts the part to be cleaved of the wafer 7, the driving end of the driving mechanism 2 is connected to one side surface of the chip separating member 3, and the pressing member 4 is installed on the other side surface of the chip separating member 3.

[0059] The chip separating mechanism designed in this application has the following beneficial effects:

[0060] 1. During chip separation, the pressing member 4 first presses the main body part of the wafer 7 on the other side of the scribe line, and then the chip separating member 3 applies force to the part to be cleaved on one side of the scribe line on the wafer 7 to complete chip separation; since the pressing member 4 is elastically and slidably connected to the chip separating member 3 through the elastic component 5, when the chip separating member 3 applies a large force, the elastic component 5 can buffer part of the acting force to prevent the pressing member 4 from excessively squeezing the wafer 7 and causing the wafer 7 to break; the elastic component 5 can normally provide a pressing force to ensure that the pressing member 4 presses the wafer 7, thereby increasing the success rate of wafer 7 chip separation and ensuring a stable cleavage yield.

[0061] 2. During chip separation, the main body part of the wafer 7 is pressed by the pressing member 4, and there is no relative movement between the wafer 7 and the supporting mechanism 8, thereby reducing the situation of the wafer 7 being scratched and improving the chip separation quality of the wafer 7.

[0062] 3. During chip separation, the chip separating member 3 presses against the part to be cleaved of the wafer 7 to complete chip separation, and it will not slide or roll on the wafer 7, reducing the risk of the wafer 7 being scratched by the chip separating member 3.

[0063] 4. The chip separating member 3 presses against the part to be cleaved of the wafer 7 to complete chip separation, and the force on the part to be cleaved of the wafer 7 is uniform, making the cleavage surface smooth and non-stratified after chip separation.

[0064] The above is the first embodiment of a chip separating mechanism provided by this application embodiment. The following is the second embodiment of a chip separating mechanism provided by this application embodiment. For details, please refer to Figures 2 to 3 .

[0065] Based on the solution of the above-mentioned first embodiment:

[0066] Further, as Figure 2 shown, the pressing member 4 is slidably installed on the chip separating member 3, and one end is used to press against the wafer 7, and the other end is connected to the chip separating member 3 through the elastic component 5 to achieve elastic sliding connection and cooperation with the chip separating member 3.

[0067] Further, a first sliding structure 31 is installed on the chip separating member 3; a limiting groove for the first sliding structure 31 to extend into and for limiting the sliding displacement of the pressing member 4 relative to the first sliding structure 31 is provided on the pressing member 4; a second sliding structure 41 that slidably cooperates with the first sliding structure 31 is provided in the limiting groove.

[0068] The first sliding structure 31 can be a guide rail structure, which is detachably fixed to the chip piece 3 by fasteners such as screws, while the second sliding structure 41 can be a slider structure that slidably cooperates with the first sliding structure 31. The slider structure can also be detachably installed on the pressing piece 4 by fasteners such as screws, without specific limitations.

[0069] Further, as Figure 3 shown, for the design of the elastic component 5, it includes an adjusting member 51, an elastic member 52, and a fixing member 53.

[0070] The fixing member 53 is fixed to the chip piece 3 and is located on one side of the other end of the pressing piece 4 away from one end; the adjusting member 51 is installed on the fixing member 53; the elastic member 52 is arranged between the adjusting member 51 and the pressing piece 4; the position of the adjusting member 51 relative to the pressing piece 4 is adjustable to adjust the pressing force on the elastic member 52. By changing the position of the adjusting member 51, the compression amount of the elastic member 52 can be adjusted, and further the pressing force of the pressing piece 4 on the wafer 7 can be changed, making the adjustment operation more convenient.

[0071] Further, the elastic member 52 can be a compression spring. In order to better fix the compression spring, a receiving groove 43 for receiving the compression spring is provided at the other end of the pressing piece 4, which can also limit the telescopic direction of the spring; in order to better cooperate with the compression spring, a protrusion 511 that is snapped into one end of the compression spring is provided at one end of the adjusting member 51.

[0072] Further, the adjusting member 51 has an external thread structure, and an internal thread hole for the adjusting member 51 to pass through and threadedly cooperate with the external thread structure is provided on the fixing member 53. By rotating the adjusting member 51, the distance between the adjusting member 51 and the pressing piece 4 can be changed to adjust the compression amount of the elastic member 52, and further adjust the pressing force of the pressing piece 4 on the wafer 7. The adjusting member 51 can specifically be a bolt or a screw, and the fixing member 53 can be a nut or a fixing block structure provided with an internal thread hole. Those skilled in the art can make appropriate variations based on this.

[0073] Further, in order to reduce the situation where the pressing piece 4 directly contacts the wafer 7 and damages the wafer 7, a rubber pad 42 is provided at the end of the pressing piece 4 for pressing against the wafer 7. The rubber pad 42 can specifically be a rubber pad 42.

[0074] Further, as Figure 1 and Figure 2 shown, for the design of the driving mechanism 2, it includes a telescopic driver 21 and a connecting member 22.

[0075] The telescopic end of the telescopic actuator 21 is connected to the split piece 3 through the connecting piece 22; the driving mechanism 2 can be a slide cylinder, and correspondingly, the telescopic actuator 21 is a telescopic cylinder, and the connecting piece 22 is a slide piece. The telescopic actuator 21 is installed on the mounting plate 1 and fixed by the mounting plate 1. The telescopic actuator 21 drives the connecting piece 22 to move up and down, thereby driving the split piece 3 to move up and down. Taking the use of a telescopic cylinder as an example, a telescopic cylinder with a detection sensor (magnetic induction switch) can be selected for use to ensure that the telescopic stroke of the telescopic cylinder can be accurately controlled. Of course, an external infrared ranging sensor can also be used to detect the stroke of the telescopic cylinder, and there is no specific limitation.

[0076] Furthermore, the support mechanism 8 is designed to include a base 82 and a support platform 81 fixed on the base 82 .

[0077] Working principle:

[0078] When splitting, the cut on the wafer 7 after slicing is at the straight edge 811 position on one side of the support platform 81, and then the telescopic driver 21 is actuated, and the connecting member 22 connected thereto descends, driving the splitting member 3 and the pressing member 4 to descend; since the pressing member 4 is connected through the first sliding structure 31, the second sliding structure 41 and the elastic component 5, under the action of the elastic member 52 of the elastic component 5, the lower end face of the rubber pad 42 set at one end of the pressing member 4 is 1mm~3mm lower than the lower end face of the splitting member 3 (not limited to this range value). When the connecting member 22 continues to descend, the lower end face of the rubber pad 42 first contacts the wafer 7, and the elastic member 52 is compressed, so that the wafer 7 is pressed by the rubber pad 42, and the pressing force is equal to the elastic force of the elastic member 52. After the lower end surface of the rubber pad 42 contacts the wafer 7, the connecting part 22 continues to descend, the rubber pad 42 stops moving, the elastic part 52 continues to be compressed, and the splitting part 3 continues to descend until the lower end surface of the splitting part 3 contacts the part to be cleaved on the left side of the cut of the wafer 7 and causes it to be subjected to force, and the wafer 7 is split along the cut, and the splitting is completed.

[0079] The present application also discloses a wafer cleaving machine, including the wafer splitting mechanism of the above design.

[0080] The above is a detailed introduction to a splitting mechanism and a wafer cleaving machine provided by the present application. For a general technician in this field, according to the ideas of the embodiments of the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A splitting mechanism, characterized in that: It comprises a supporting mechanism (8), a driving mechanism (2), a split piece (3), a pressing piece (4) and an elastic component (5); The supporting mechanism (8) is used to support the wafer (7); The driving mechanism (2) is connected to the splitting member (3) and is used to drive the splitting member (3) to press against the portion to be cleaved on one side of the scribe cut of the wafer (7) so as to complete the splitting; The pressing piece (4) is elastically slidably mounted on the pressing piece (4) via an elastic component (5); The elastic component (5) is used to provide an elastic force for the pressing piece (4) to press against a main body portion of the wafer (7) located on the other side of the scribe cut; When the driving mechanism (2) drives the splitting member (3) to move in a direction of pressing down the portion to be cleaved, the pressing member (4) contacts the wafer (7) before the splitting member (3).

2. The chip splitting mechanism according to claim 1, wherein The pressing piece (4) is slidably mounted on the split piece (3), and one end of the pressing piece is used to press against the wafer (7), while the other end is connected to the split piece (3) via the elastic component (5).

3. The splitting mechanism according to claim 2, characterized in that: A first sliding structure (31) is installed on the split piece (3); The pressing piece (4) is provided with a limiting groove into which the first sliding structure (31) extends and which is used to limit the sliding displacement of the pressing piece (4) relative to the first sliding structure (31); The limiting groove is provided with a second sliding structure (41) which is slidably matched with the first sliding structure (31).

4. The chip splitting mechanism according to claim 2, wherein The elastic component (5) comprises an adjusting member (51), an elastic member (52) and a fixing member (53); The fixing member (53) is fixed on the split piece (3) and is located on a side of the other end of the pressing member (4) away from one end; The adjusting member (51) is mounted on the fixing member (53); The elastic member (52) is arranged between the adjusting member (51) and the pressing member (4); The position of the adjusting member (51) relative to the pressing member (4) is adjustable so as to adjust the pressing force on the elastic member (52).

5. The chip splitting mechanism according to claim 4, wherein The elastic member (52) is a compression spring; The other end of the pressing piece (4) is provided with a receiving groove (43) for receiving the compression spring; One end of the adjusting member (51) is provided with a protrusion (511) which is inserted into one end of the compression spring.

6. The lobe mechanism according to claim 4, wherein, The adjusting member (51) has an external thread structure; The fixing member (53) is provided with an internal thread hole for the adjusting member (51) to movably pass through and which is threadably matched with the external thread structure.

7. The chip breaking mechanism according to claim 1, wherein One end of the pressing piece (4) used for pressing against the wafer (7) is provided with a rubber pad (42).

8. The splitting mechanism according to claim 1, characterized in that: The driving mechanism (2) comprises a telescopic driver (21) and a connecting member (22); The telescopic end of the telescopic driver (21) is connected to the split piece (3) via the connecting piece (22).

9. The chip splitting mechanism according to claim 1, wherein The support mechanism (8) comprises a base (82) and a support platform (81) fixed on the base (82).

10. A wafer cleavage machine, characterized in that, Comprising a splitting mechanism as described in any one of claims 1 to 9.

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