Automatic wafer film tearing mechanism

Abstract

The utility model relates to the technical field of wafer manufacturing, in particular to an automatic wafer film tearing mechanism which comprises a base and a wafer body, a film is attached to the surface of the wafer body, an arch-shaped support is arranged on the top of the base, and the wafer body is arranged on the top of the base through a limiting assembly. The beneficial effects of the utility model are that the wafer body can be effectively limited only by a simple structure, so that when the film is subjected to tearing force, the wafer body and the film can be effectively separated, the film tearing effect is achieved, and the cost is effectively reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer manufacturing, and particularly relates to an automatic wafer film tearing mechanism. Background Art

[0002] When wafers come out of a wafer manufacturing factory, they are relatively thick. Due to requirements for packaging sizes, wafers are thinned during packaging to adapt to smaller packaging sizes. When thinning wafers, in order to protect the circuit layer of the wafer, a film is attached to the circuit layer of the wafer to protect the wafer from being scratched and contaminated during the thinning process.

[0003] The conventional method for tearing the film of a wafer is to vacuum-adsorb the wafer on a tabletop, stick the thinning film with an auxiliary tape, and pull the auxiliary tape to separate the thinning film from the wafer. However, the adsorption method requires structures such as a vacuum generation system, resulting in a relatively high cost for conventional automatic wafer film tearing equipment, which is not conducive to the economic benefits of manufacturers.

[0004] Therefore, it is necessary to invent an automatic wafer film tearing mechanism. Summary of the Utility Model

[0005] For this reason, the utility model provides an automatic wafer film tearing mechanism to solve the problem that the cost of conventional automatic wafer film tearing equipment is relatively high and is not conducive to the economic benefits of manufacturers.

[0006] To achieve the above object, the utility model provides the following technical solution: an automatic wafer film tearing mechanism, including a base and a wafer body, with a film attached to the surface of the wafer body. An arched bracket is arranged on the top of the base. The wafer body is arranged on the top of the base through a limiting component, and a film tearing component for tearing the film from the surface of the wafer body is arranged on the arched bracket.

[0007] Preferably, the limiting component includes a placement table, the bottom of the placement table is fixedly installed in the middle of the top of the base, a placement groove is opened in the middle of the top of the placement table, and the wafer body is placed in the placement groove.

[0008] Preferably, the limiting component further includes two vertically arranged electric push rods I. The bottoms of the two electric push rods I are symmetrically and fixedly installed on the left and right sides of the top of the base. The placement table is located between the two electric push rods I. The top ends of the output shafts of the two electric push rods I are horizontally and fixedly installed with a limiting plate, and the limiting plate is located above the wafer body and the film.

[0009] Preferably, a through hole is opened at the center of the limiting plate. The through hole is located directly above the wafer body, and the diameter of the through hole is smaller than the diameter of the wafer body. A plurality of installation grooves are formed in an array on the hole wall of the through hole, and rollers are rotatably connected in the installation grooves.

[0010] Preferably, the film tearing assembly includes an electric push rod two vertically arranged, the bottom of the electric push rod two is fixedly installed at the middle of the top of the arched bracket, the bottom end of the output shaft of the electric push rod two vertically penetrates the top of the arched bracket, and the bottom end of the output shaft of the electric push rod two is horizontally fixedly connected with a mounting plate.

[0011] Preferably, symmetrically vertically fixedly installed at the left and right ends of the bottom of the mounting plate are connecting plates, servo motors are fixedly installed at the rear ends of both connecting plates, a film tearing roller is fixedly installed at the front end of the output shaft of any one of the servo motors, a tape is wound on the surface of the film tearing roller, a winding roller is fixedly installed at the front end of the output shaft of the other servo motor, and one end of the tape away from the film tearing roller is wound on the surface of the winding roller.

[0012] Preferably, a guide block is fixedly installed at the middle of the bottom of the mounting plate, the bottom end of the guide block is set as an arc surface, the adhesive surface of the tape is arranged downward, and the smooth surface of the tape is attached to the arc surface at the bottom end of the guide block.

[0013] Preferably, when tearing the film attached to the surface of the wafer body, the lowermost ends of several rollers are all attached to the surface of the film, and the bottom end of the guide block vertically passes through the through hole, and the adhesive surface of the tape is bonded to the surface of the film.

[0014] The beneficial effect of the utility model is that through the combined use of the provided base, wafer body, film, arched bracket, limiting assembly and film tearing assembly, the wafer body can be effectively limited with a simple structure, so that when the film is subjected to a tearing force, the wafer body and the film can be effectively separated to achieve the film tearing effect and effectively reduce the cost. Description of the Drawings

[0015] Figure 1 It is a schematic structural diagram when placing the wafer body with a film attached provided by the utility model;

[0016] Figure 2 It is a schematic structural diagram when limiting the wafer body with a film attached provided by the utility model;

[0017] Figure 3 It is a schematic structural diagram when tearing the film of the wafer body with a film attached provided by the utility model;

[0018] Figure 4 It is a schematic structural diagram when tearing the film on the wafer body provided by the utility model;

[0019] Figure 5 It is a schematic structural diagram when the film tearing of the wafer body provided by the utility model ends;

[0020] Figure 6 It is a partial structural three-dimensional diagram of the limiting assembly provided by the utility model;

[0021] Figure 7 This is a perspective view of a partial structure of the film tearing assembly provided by the present utility model.

[0022] In the figure: 1, base; 2, wafer body; 3, thin film; 4, arched bracket; 5, placement table; 6, placement groove; 7, first electric push rod; 8, limit plate; 9, through hole; 10, installation groove; 11, roller; 12, second electric push rod; 13, mounting plate; 14, connecting plate; 15, servo motor; 16, film tearing roller; 17, adhesive tape; 18, winding roller; 19, guide block. Specific embodiments

[0023] The following is a description of the preferred embodiments of the present utility model with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present utility model, and are not used to limit the present utility model.

[0024] Please refer to the attached Figures 1-7 , an automatic wafer film tearing mechanism provided by the present utility model includes a base 1 and a wafer body 2. A thin film 3 is attached to the surface of the wafer body 2. An arched bracket 4 is provided on the top of the base 1. The wafer body 2 is arranged on the top of the base 1 through a limiting component. A film tearing component for tearing the thin film 3 from the surface of the wafer body 2 is provided on the arched bracket 4;

[0025] The limiting component includes a placement table 5. The bottom of the placement table 5 is fixedly installed at the middle of the top of the base 1. A placement groove 6 is opened at the middle of the top of the placement table 5. The wafer body 2 is placed in the placement groove 6. Therefore, the operator only needs to directly place the thinned wafer body 2 with the thin film into the placement groove 6, which is convenient for the loading operation (as Figure 1 shown). The limiting component also includes two vertically arranged first electric push rods 7. It should be noted that an electric push rod is a power-driven device that converts the rotational motion of a motor into the linear reciprocating motion of a push rod. The bottoms of the two first electric push rods 7 are symmetrically and fixedly installed on the left and right sides of the top of the base 1. The placement table 5 is located between the two first electric push rods 7. The top ends of the output shafts of the two first electric push rods 7 are horizontally and fixedly installed with a limit plate 8. The limit plate 8 is located above the wafer body 2 and the thin film 3. Therefore, when the first electric push rod 7 operates, it can drive the limit plate 8 to move downward (as Figure 2 shown);

[0026] A through hole 9 is opened at the center of the limit plate 8. The through hole 9 is located directly above the wafer body 2, and the diameter of the through hole 9 is smaller than the diameter of the wafer body 2. Therefore, when the limit plate 8 moves downward, it can block the edge of the wafer body 2. A plurality of installation grooves 10 are arranged in an array on the hole wall of the through hole 9. Rollers 11 are rotatably connected in the installation grooves 10 (as Figure 6As shown, when the limiting plate 8 blocks the edge of the wafer body 2, it will also block the edge of the thin film 3. Then, under the action of several rollers 11, even if the limiting plate 8 blocks the edge of the thin film 3, when the thin film 3 is subjected to an upward tearing force, the edge of the thin film 3 can be easily pulled out from below the limiting plate 8 (as Figure 4 shown). The structure is novel and simple, without the need for vacuum adsorption of the wafer body 2, thus eliminating the need for structures such as a vacuum generation system, effectively reducing costs;

[0027] The film tearing assembly includes a vertically arranged second electric push rod 12. The bottom of the second electric push rod 12 is fixedly installed at the middle of the top of the arched bracket 4. The bottom end of the output shaft of the second electric push rod 12 vertically penetrates the top of the arched bracket 4, and a mounting plate 13 is horizontally and fixedly connected to the bottom end of the output shaft of the second electric push rod 12. Therefore, the second electric push rod 12 can control the up and down movement of the mounting plate 13. Symmetrically and vertically fixed to the left and right ends of the bottom of the mounting plate 13 are connecting plates 14. A servo motor 15 is fixedly installed at the rear end of each of the two connecting plates 14. A film tearing roller 16 is fixedly installed at the front end of the output shaft of any one of the servo motors 15. When the servo motor 15 operates, it can drive the film tearing roller 16 to rotate. A tape 17 is wound around the surface of the film tearing roller 16. A winding roller 18 is fixedly installed at the front end of the output shaft of the other servo motor 15 (as Figure 7 shown). When the servo motor 15 operates, it can drive the winding roller 18 to rotate. One end of the tape 17 away from the film tearing roller 16 is wound around the surface of the winding roller 18. Therefore, when the servo motor 15 drives the winding roller 18 to rotate, it can wind up the used waste tape, and then pull out the tape 17 with stronger adhesion that has not been used from the film tearing roller 16. Therefore, when the second electric push rod 12 operates to drive the mounting plate 13 to move downward, it can drive the tape 17 with stronger adhesion that has not been used to move downward. A guide block 19 is fixedly installed at the middle of the bottom of the mounting plate 19. The bottom end of the guide block 19 is set as an arc surface. The adhesive surface of the tape 17 is arranged downward, and the smooth surface of the tape 17 is attached to the arc surface at the bottom end of the guide block 19, which can reduce the resistance when the tape 17 moves and effectively prevent the tape 17 from being worn and broken. Therefore, under the action of the guide block 19, the tape 17 with stronger adhesion that has not been used can be supported, and then when the second electric push rod 12 operates to drive the mounting plate 13 to move downward, it can drive the supported tape 17 with stronger adhesion that has not been used to move downward (as Figure 3 shown);

[0028] When tearing the film 3 attached to the surface of the wafer body 2, the lowermost ends of several rollers 11 are all in contact with the surface of the film 3, and the bottom end of the guide block 19 vertically passes through the through hole 9, and the adhesive surface of the tape 17 is adhered to the surface of the film 3 (as Figure 3As shown, the film 3 is bonded together by the unused tape 17 with strong adhesiveness. Then, when the second electric push rod 12 moves upward, it can drive the tape 17 to move upward, thereby applying an upward tearing force to the film 3. At this time, since both ends of the tape 17 are fixed by the film tearing roller 16 and the winding roller 18 controlled by the servo motor 15 respectively, the tape 17 will not move, that is, the upward tearing force applied to the film 3 is very stable, and the film 3 can be smoothly torn off, achieving the effect of automatic wafer film tearing. After the film tearing is completed, the staff can tear off the film 3 adhered to the surface of the tape 17, and then take the wafer body 2 after film tearing out of the placement groove 6 (as Figure 5 shown), which facilitates the blanking operation.

[0029] The using process of the present utility model is as follows: The staff first places the wafer body 2 with the film 3 on its surface into the placement groove 6, and then controls the limiting plate 8 to move downward through the first electric push rod 7, so that the bottom ends of several rollers 11 are in contact with the surface of the film 3, and the limiting operation of the wafer body 2 can be completed;

[0030] Then, the staff controls the unused tape 17 with strong adhesiveness to move downward through the second electric push rod 12, so that the part of the tape supported by the guide block 19 passes through the through hole 9 together with the guide block 19, and the unused tape 17 with strong adhesiveness is bonded to the surface of the film 3. Then, control the tape 17 to move upward, so that the tape 17 applies an upward pulling force to the film 3. Under the action of several rollers 11, even if the limiting plate 8 blocks the edge of the film 3, when the film 3 is subjected to an upward tearing force, the edge of the film 3 can be easily pulled out from below the limiting plate 8 (as Figure 4 shown). The structure is novel and simple, and the film 3 can be smoothly torn off, achieving the effect of automatic wafer film tearing;

[0031] After the film tearing is completed, the staff tears off the film 3 adhered to the surface of the tape 17, then takes the wafer body 2 after film tearing out of the placement groove 6, and controls the two servo motors 15 to wind up the used waste tape 17 by the winding roller 18, and then pull out the unused tape 17 with strong adhesiveness from the film tearing roller 16 to prepare for the next film tearing operation.

[0032] The above is only a preferred embodiment of the present utility model. Any person skilled in the art can modify the present utility model by using the technical solutions described above or modify it into an equivalent technical solution. Therefore, any simple modification or equivalent replacement made according to the technical solutions of the present utility model falls within the scope of protection required by the present utility model.

Claims

1. An automatic wafer film tearing mechanism, comprising a base (1) and a wafer body (2), a film (3) is attached to the surface of the wafer body (2), and an arched bracket (4) is arranged at the top of the base (1), characterized in that: The wafer body (2) is arranged on the top of the base (1) through a limiting component, and a film tearing component for tearing the film (3) from the surface of the wafer body (2) is arranged on the arched support (4).

2. The automatic wafer film tearing mechanism according to claim 1, wherein: The limiting component includes a placement table (5). The bottom of the placement table (5) is fixedly installed in the middle of the top of the base (1). A placement groove (6) is opened in the middle of the top of the placement table (5), and the wafer body (2) is placed in the placement groove (6).

3. The automatic wafer film tearing mechanism according to claim 2, characterized in that: The limiting component further includes two vertically arranged electric push rods I (7). The bottoms of the two electric push rods I (7) are symmetrically and fixedly installed on the left and right sides of the top of the base (1). The placement table (5) is located between the two electric push rods I (7). The top ends of the output shafts of the two electric push rods I (7) are horizontally and fixedly installed with a limiting plate (8), and the limiting plate (8) is located above the wafer body (2) and the film (3).

4. An automatic wafer film tearing mechanism according to claim 3, characterized in that: A through hole (9) is opened at the center of the limiting plate (8). The through hole (9) is located directly above the wafer body (2), and the diameter of the through hole (9) is smaller than the diameter of the wafer body (2). A plurality of installation grooves (10) are arranged in an array on the hole wall of the through hole (9), and rollers (11) are rotatably connected in the installation grooves (10).

5. An automatic wafer film tearing mechanism according to claim 4, characterized in that: The film tearing component includes a vertically arranged electric push rod II (12). The bottom of the electric push rod II (12) is fixedly installed in the middle of the top of the arched support (4). The bottom end of the output shaft of the electric push rod II (12) vertically penetrates through the top of the arched support (4), and the bottom end of the output shaft of the electric push rod II (12) is horizontally and fixedly connected with a mounting plate (13).

6. The automatic wafer film tearing mechanism according to claim 5, wherein: Two connecting plates (14) are symmetrically and vertically fixedly installed at the left and right ends of the bottom of the mounting plate (13). A servo motor (15) is fixedly installed at the rear end of each of the two connecting plates (14). A film tearing roller (16) is fixedly installed at the front end of the output shaft of any one of the servo motors (15). A tape (17) is wound on the surface of the film tearing roller (16). A winding roller (18) is fixedly installed at the front end of the output shaft of the other servo motor (15), and one end of the tape (17) away from the film tearing roller (16) is wound on the surface of the winding roller (18).

7. An automatic wafer film tearing mechanism according to claim 6, characterized in that: A guide block (19) is fixedly installed at the middle of the bottom of the mounting plate (13). The bottom end of the guide block (19) is set as an arc surface. The adhesive surface of the tape (17) is arranged downward, and the smooth surface of the tape (17) is attached to the arc surface at the bottom end of the guide block (19).

8. An automatic wafer film tearing mechanism according to claim 7, characterized in that: When tearing the film (3) attached to the surface of the wafer body (2), the lowermost ends of a plurality of the rollers (11) are all attached to the surface of the film (3), and the bottom end of the guide block (19) vertically passes through the through hole (9), and the adhesive surface of the tape (17) is adhered to the surface of the film (3).

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