Wafer lifting structure

Abstract

The utility model provides a wafer lifting structure, which comprises a base, a lifting assembly arranged on the base, and an adsorption assembly arranged on the lifting assembly and used for adsorbing and fixing the end surface of a wafer. The lifting assembly comprises three top pipes which are vertically arranged above the base in a circumferential array and a lifting assembly which is arranged on the base and controls the three top pipes to do lifting motion above the base, and the bottom ends of the top pipes are connected with the adsorption device; the adsorption assembly comprises an adsorption frame which is arranged above the top ends of the three top pipes and provided with a groove in the top end face, and a connecting piece which is arranged on the bottom end face of the adsorption frame and can be communicated with the interiors of the three top pipes; according to the wafer lifting device, the wafer can be conveniently and stably lifted, and the condition that the wafer jumps or deviates during lifting is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of wafers, in particular to a wafer lifting structure. Background Art

[0002] During the detection or wafer transfer process of wafers, a wafer lifting device is usually required. The wafer lifting device realizes the lifting of wafers according to the types of wafers, so as to facilitate the detection or wafer transfer of wafers.

[0003] Among them, the wafer lifting device includes a frame, a cylinder and a carrier. The cylinder is vertically arranged upward on the frame, and the carrier is horizontally fixedly connected to the piston rod of the cylinder. The carrier is used to carry wafers. Specifically, during the detection or wafer transfer process of wafers, the cylinder pushes the carrier up and down to drive the wafer to lift, so as to facilitate the detection or wafer transfer of wafers.

[0004] However, the wafer lifting device uses a cylinder to drive the carrier to lift. Since the piston rod of the cylinder may cause slight shaking of the carrier when driving the carrier to lift, it may cause problems such as wafer jumping or offset during the lifting of the wafer, which is not convenient for the stable lifting of the wafer. Summary of the Utility Model

[0005] In view of the above technical problems, the utility model provides a wafer lifting structure, which can conveniently and stably lift the wafer, and avoids the occurrence of wafer jumping or offset during the lifting of the wafer.

[0006] To achieve the above object, the utility model provides the following technical solution: A wafer lifting structure includes a base, a lifting assembly arranged on the base, and an adsorption assembly arranged on the lifting assembly and used for adsorbing and fixing the end face of the wafer. The lifting assembly includes three top pipes vertically arranged in a circumferential array above the base and a lifting assembly arranged on the base and used for controlling the three top pipes to lift above the base. The bottom end of the top pipe is connected to an adsorption device;

[0007] The adsorption assembly includes an adsorption frame arranged above the top ends of the three top pipes and having a groove body opened on the top end face, and a connecting piece arranged on the bottom end face of the adsorption frame and capable of being communicated with the inside of the three top pipes.

[0008] Preferably, the adsorption frame includes an adsorption ring arranged above the tops of the three top pipes, and a first adsorption groove with a ring structure is opened on the top end face of the adsorption ring.

[0009] Preferably, the connecting piece includes connecting rings arranged above the tops of the three top pipes and fixedly arranged on the bottom end face of the adsorption ring. The inner ring of the connecting ring can be movably sleeved on the top of the top pipe, and the inner ring of the connecting ring is communicated with a first through hole opened on the bottom wall of the first adsorption groove.

[0010] Preferably, the adsorption frame includes three adsorption rods which are arranged horizontally above the tops of three jacking pipes. One ends of the three adjacent adsorption rods are fixedly connected, and the other ends away from each other are respectively located above the tops of the three jacking pipes. A through second adsorption groove is formed on the top side surface of the three adsorption rods.

[0011] Preferably, the connecting piece includes connecting rings which are arranged in one-to-one correspondence above the tops of the three jacking pipes and are fixedly arranged at one ends of the bottoms of the three different adsorption rods. The inner ring of the connecting ring is movably sleeved on the top of the jacking pipe, and the inner ring of the connecting ring communicates with a second through hole formed in the bottom wall of the second adsorption groove; the second through hole is formed in the bottom wall of the second adsorption groove at the connecting position of the three adsorption rods.

[0012] Preferably, a plurality of clamping grooves are equidistantly formed in the bottom wall of the second adsorption groove along the length direction of the adsorption rod body, and a sealing block is hermetically penetrated in the second adsorption groove. A clamping block matched with the clamping groove is fixedly arranged on the bottom end face of the sealing block.

[0013] Preferably, the lifting assembly includes three sliding rods which are arranged in a circumferential array and the bottom ends of which are vertically arranged on the top end face of the base, three sliding rings movably sleeved on the rod bodies of the three sliding rods, a lifting block fixedly sleeved on the three sliding rings and parallel to the base above, a threaded block fixedly arranged at the middle position of the lifting block, a lifting screw rod vertically arranged on the base and threadedly connected and sleeved on the threaded block, and a control motor fixedly arranged on the bottom end face of the base and controlling the rotation of the lifting screw rod through an output end. Connecting blocks are arranged at the top ends of the three sliding rods, and the bottom end face of the connecting block is rotatably connected with the top end of the lifting screw rod. The bottom ends of the three jacking pipes are arranged on the top end face of the lifting block.

[0014] The beneficial effects of the present utility model are as follows: The wafer is directly placed on the adsorption frame, and the adsorption frame is connected with the adsorption device through the jacking pipe, so that the air in the tank body can be pumped out. When the wafer is placed on the adsorption frame, the air in the tank body is pumped out through the adsorption device, so that the position of the wafer on the adsorption frame can be adsorbed and fixed, ensuring the stability of the position of the wafer on the adsorption frame during the lifting of the wafer and avoiding the situation of wafer jumping or offset during the lifting. Description of the Drawings

[0015] The drawings are used to provide a further understanding of the present utility model and constitute a part of the specification. They are used together with the embodiments of the present utility model to explain the present utility model and do not constitute a limitation to the present utility model. In the drawings:

[0016] Figure 1 It is the first structural schematic diagram of the wafer lifting structure proposed by the present utility model.

[0017] Figure 2 It is the second structural schematic diagram of the wafer lifting structure proposed by the present utility model.

[0018] Figure 3 This is a schematic structural diagram of the adsorption rack of the present utility model.

[0019] Figure 4 This is a schematic structural diagram of the back of the adsorption rack of the present utility model.

[0020] Figure 5 This is a schematic structural diagram of the adsorption rod of the present utility model.

[0021] In the figure: 1, base; 2, slide bar; 3, slide ring; 4, lifting block; 5, connecting block; 6, lifting lead screw; 7, threaded block; 8, top pipe; 9, adsorption ring; 10, first adsorption groove; 11, buffer sleeve; 12, connecting ring; 13, control motor; 14, second adsorption groove; 15, sealing block; 16, first through hole; 17, second through hole; 18, card slot; 19, adsorption rod; 20, clamping block. Specific embodiments

[0022] In order to make the technical means, creative features, achieved purposes and functions of the present utility model easy to understand, the following combines specific embodiments and drawings to further elaborate the present utility model. However, the following embodiments are only the preferred embodiments of the present utility model, not all of them. Based on the embodiments in the embodiments, other embodiments obtained by those skilled in the art without creative efforts all belong to the protection scope of the present utility model.

[0023] Please refer to Figures 1-5 , a wafer lifting structure, including a base 1, a lifting assembly arranged on the base 1, and an adsorption assembly arranged on the lifting assembly and used for adsorbing and fixing the end face of the wafer. The lifting assembly includes three top pipes 8 arranged vertically in a circumferential array above the base 1 and a lifting assembly arranged on the base 1 and used for controlling the three top pipes 8 to perform lifting movements above the base 1. The bottom end of the top pipe 8 is connected to an adsorption device;

[0024] The adsorption assembly includes an adsorption rack arranged above the top ends of the three top pipes 8 and having a groove body opened on the top end face, and a connecting member arranged on the bottom end face of the adsorption rack and capable of being communicated with the interiors of the three top pipes 8.

[0025] As Figures 1-5 shown, the wafer is directly placed on the adsorption rack, and the air in the groove body opened on the adsorption rack is pumped out through the adsorption device, so as to facilitate adsorbing and fixing the position of the wafer on the adsorption rack, ensuring the stability of the position of the wafer placed on the adsorption rack. When the wafer is lifted and lowered, the situation of the wafer jumping or shifting is avoided, and the wafer can be conveniently lifted and lowered stably.

[0026] Among them, the adsorption device can adopt an air suction pump, and the air suction pump is connected to the inner walls of the three jacking pipes 8 through pipelines, so as to facilitate the extraction of air inside the inner pipes of the jacking pipes 8 by the air suction pump.

[0027] The adsorption frame includes an adsorption ring 9 arranged above the tops of the three jacking pipes 8, and a first adsorption groove 10 with an annular structure is formed on the top end face of the adsorption ring 9.

[0028] As Figures 1-3 shown, the wafer is directly placed on the top end face of the adsorption ring 9. The adsorption ring 9 facilitates the support of the wafer position, and the air in the first adsorption groove 10 is extracted through the adsorption device and the jacking pipe 8, so as to facilitate the adsorption and fixation of the wafer on the top end face of the adsorption ring 9, ensuring the stability of the subsequent lifting of the wafer.

[0029] The connecting piece includes a connecting ring 12 that is arranged above the tops of the three jacking pipes 8 in one-to-one correspondence and is fixedly arranged on the bottom end face of the adsorption ring 9. The inner ring of the connecting ring 12 can be movably sleeved on the top of the jacking pipe 8, and the inner ring of the connecting ring 12 communicates with a first through hole 16 formed on the bottom wall of the first adsorption groove 10.

[0030] As Figures 1-3 shown, it is convenient to directly sleeved the adsorption ring 9 on the top end of the jacking pipe 8 through the connecting ring 12 arranged on the bottom end face, so that the adsorption ring 9 can be installed between the three jacking pipes 8, and it is ensured that the inside of the jacking pipe 8 communicates with the first adsorption groove 10. Then, the air in the first adsorption groove 10 can be extracted through the adsorption device, facilitating the adsorption and fixation of the wafer placed on the top end face of the adsorption ring 9, and ensuring the stability of the wafer placed on the top end face of the adsorption ring 9.

[0031] The adsorption frame includes three horizontally arranged adsorption rods 19 arranged above the tops of the three jacking pipes 8. One adjacent end of the three adsorption rods 19 is fixedly connected, and the mutually separated ends are respectively located above the tops of the three jacking pipes 8. A through second adsorption groove 14 is formed on the top side surface of the three adsorption rods 19.

[0032] The connecting piece includes connecting rings that are arranged above the tops of the three jacking pipes 8 in one-to-one correspondence and are fixedly arranged at one end position on the bottom sides of the three different adsorption rods 19. The inner ring of the connecting ring 12 can be movably sleeved on the top of the jacking pipe 8, and the inner ring of the connecting ring 12 communicates with a second through hole 17 formed on the bottom wall of the second adsorption groove 14; the second through hole 17 is formed at the position of the bottom wall of the second adsorption groove 14 where the three adsorption rods 19 are connected to each other.

[0033] A plurality of card slots 18 are equidistantly formed on the bottom wall of the second adsorption groove 14 along the length direction of the rod body of the adsorption rod 19, and a sealing block 15 is hermetically penetrated in the second adsorption groove 14. A clamping block 20 that matches the card slot 18 is fixedly arranged on the bottom end face of the sealing block 15.

[0034] AsFigures 1-5 As shown, when lifting wafers of different sizes, first control the sealing block 15 to penetrate into the second adsorption groove 14, and control the clamping block 20 provided at the bottom end of the sealing block 15 to penetrate into the clamping groove 18, so as to facilitate the stable installation of the clamping block 20 in the second adsorption groove 14, so as to facilitate the adjustment of the positions between the three sealing blocks 15, so as to facilitate placing wafers of different sizes on the top rod bodies of the three adsorption rods 19. When the air in the second adsorption groove 14 is pumped out by the adsorption device, the wafers can be adsorbed and fixed on the three adsorption rods 19, and wafers of different sizes can be stably adsorbed and fixed on the rod bodies of the three adsorption rods 19, and the wafers can be lifted stably and conveniently, avoiding the situation of wafer jumping or offset during lifting.

[0035] A buffer sleeve 11 is sleeved on the top end of the adsorption ring 9, which is convenient for supporting and protecting the wafers placed on the adsorption ring 9, and avoiding the damage of the wafers caused by the friction between the wafers and the adsorption ring 9 when the wafers are placed on the adsorption ring 9.

[0036] The lifting assembly includes three sliding rods 2 arranged in a circumferential array with their bottom ends vertically arranged on the top end surface of the base 1, three sliding rings 3 movably sleeved on the rod bodies of the three sliding rods 2, a lifting block 4 fixedly sleeved on the three sliding rings 3 and parallel to the upper part of the base 1, a threaded block 7 fixedly arranged at the middle position of the lifting block 4, a lifting screw rod 6 vertically arranged on the base 1 and threadedly connected to the threaded block 7, and a control motor 13 fixedly arranged on the bottom end surface of the base 1 and controlling the rotation of the lifting screw rod 6 through the output end. Connecting blocks 5 are arranged at the top ends of the three sliding rods 2, and the bottom end surface of the connecting block 5 is rotatably connected to the top end of the lifting screw rod 6. The bottom ends of the three top pipes 8 are arranged on the top end surface of the lifting block 4.

[0037] As Figures 1-2 shown, the control motor 13 is convenient for driving the lifting screw rod 6 arranged on the base 1 to rotate. The lifting block 4 is movably sleeved on the rod body of the sliding rod 2 through the sliding ring 3, and the threaded block 7 arranged on the lifting block 4 is threadedly connected to the lifting screw rod 6. By rotating the lifting screw rod 6, the lifting block 4 can be controlled to lift on the sliding rod 2, and then drive the wafers placed on the adsorption frame at the top end of the top pipe 8 to lift. By setting the groove opened on the adsorption frame and pumping out the air in the groove, the wafers can be stably adsorbed on the adsorption frame, and the wafers can be lifted stably and conveniently, avoiding the situation of wafer jumping or offset during lifting.

[0038] The foregoing has shown and described the basic principles, main features and advantages of the present utility model. Those skilled in the art should understand that the present utility model is not limited by the above embodiments, and the above embodiments and the descriptions in the specification are only preferred examples of the present utility model and are not used to limit the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and all these changes and improvements fall within the scope of the present utility model claimed. The scope of protection claimed by the present utility model is defined by the appended claims and their equivalents.

Claims

1. A wafer lifting structure, comprising a base (1), a lifting component disposed on the base (1), and an adsorption component disposed on the lifting component and used for adsorbing and fixing the end face of the wafer, characterized in that, The lifting assembly includes three top pipes (8) vertically arranged in a circumferential array above the base (1), and a lifting assembly arranged on the base (1) to control the lifting movement of the three top pipes (8) above the base (1). The bottom end of the top pipe (8) is connected to an adsorption device; The adsorption assembly includes an adsorption frame arranged above the top ends of the three top pipes (8) with a groove on the top end face, and a connecting piece arranged on the bottom end face of the adsorption frame and communicating with the interiors of the three top pipes (8).

2. The wafer lifting structure according to claim 1, characterized in that: The adsorption frame includes an adsorption ring (9) arranged above the tops of the three top pipes (8), and a first adsorption groove (10) with a ring structure is formed on the top end face of the adsorption ring (9).

3. A wafer lifting structure according to claim 2, wherein: The connecting piece includes connecting rings (12) respectively arranged above the tops of the three top pipes (8) and fixedly arranged on the bottom end face of the adsorption ring (9). The inner ring of the connecting ring (12) is movably sleeved on the top of the top pipe (8), and the inner ring of the connecting ring (12) communicates with a first through hole (16) formed on the bottom wall of the first adsorption groove (10).

4. A wafer lifting structure according to claim 1, characterized in that: The adsorption frame includes three adsorption rods (19) arranged horizontally above the tops of the three top pipes (8). The adjacent ends of the three adsorption rods (19) are fixedly connected, and the mutually remote ends are respectively located above the tops of the three top pipes (8). A second adsorption groove (14) is formed through the top side side faces of the three adsorption rods (19).

5. A wafer lifting structure according to claim 4, characterized in that: The connecting piece includes connecting rings respectively arranged above the tops of the three top pipes (8) and fixedly arranged at one end positions of the bottom sides of the three different adsorption rods (19). The inner ring of the connecting ring (12) is movably sleeved on the top of the top pipe (8), and the inner ring of the connecting ring (12) communicates with a second through hole (17) formed on the bottom wall of the second adsorption groove (14); the second through hole (17) is formed at the position of the bottom wall of the second adsorption groove (14) formed at the connecting position of the three adsorption rods (19).

6. The wafer lifting structure according to claim 5, wherein: A plurality of clamping grooves (18) are equidistantly formed on the bottom wall of the second adsorption groove (14) along the length direction of the rod body of the adsorption rod (19). A sealing block (15) is hermetically inserted into the second adsorption groove (14), and a clamping block (20) matching the clamping groove (18) is fixedly arranged on the bottom end face of the sealing block (15).

7. A wafer lifting structure according to any one of claims 1 to 6, characterized in that: The lifting assembly includes three sliding rods (2) arranged in a circumferential array with their bottom ends vertically arranged on the top end face of the base (1), three sliding rings (3) movably sleeved on the rod bodies of the three sliding rods (2), a lifting block (4) fixedly sleeved on the three sliding rings (3) and parallel to the base (1) above, a threaded block (7) fixedly arranged at the middle position of the lifting block (4), a lifting screw rod (6) vertically arranged on the base (1) and threadedly sleeved on the threaded block (7), and a control motor (13) fixedly arranged on the bottom end face of the base (1) and controlling the rotation of the lifting screw rod (6) through the output end. Connecting blocks (5) are arranged at the top ends of the three sliding rods (2), and the bottom end face of the connecting block (5) is rotatably connected to the top end of the lifting screw rod (6). The bottom ends of the three top pipes (8) are arranged on the top end face of the lifting block (4).

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