Wafer cleaning device

Abstract

The utility model discloses a wafer cleaning device, which belongs to the technical field of semiconductors and at least comprises a first bearing arm, a second bearing arm and a third bearing arm, the plurality of leading-out pipes are arranged on the first bearing arm at intervals, the plurality of leading-out pipes are fixedly connected with the first bearing arm respectively, and outlets of the leading-out pipes face a wafer; the second bearing arm is arranged on one side of the first bearing arm; the at least one spray pipe is fixedly connected with the second bearing arm; the spray head is movably connected with one end, far away from the second bearing arm, of the spray pipe; and the angle adjusting structure is connected with the spray pipe and the spray head. Through the wafer cleaning device provided by the utility model, the wafer cleaning effect can be improved, the cleaning cost is saved, and the yield of semiconductor products is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductors, and particularly relates to a wafer cleaning device. Background Art

[0002] As an indispensable step in the semiconductor production process, the cleaning process is used to remove impurities and pollutants on the wafer surface, ensure the cleanliness of the wafer surface, and improve the yield of semiconductor products. In the current wafer cleaning process, due to the hydrophobicity of the wafer, particles will always remain on the edge of the wafer after cleaning, resulting in poor cleaning effect on the wafer edge, thus affecting the subsequent wafer manufacturing process and reducing the production yield of semiconductor products. Summary of the Utility Model

[0003] The purpose of the utility model is to provide a wafer cleaning device, which can improve the cleaning effect on the wafer, save the cleaning cost, and improve the yield of semiconductor products.

[0004] To solve the above technical problems, the utility model is realized through the following technical solutions:

[0005] The utility model provides a wafer cleaning device, which at least includes:

[0006] A first carrier arm;

[0007] A plurality of outlet pipes, which are arranged on the first carrier arm at intervals, and each of the plurality of outlet pipes is fixedly connected to the first carrier arm, and the outlet of the outlet pipe faces the wafer;

[0008] A second carrier arm, which is arranged on one side of the first carrier arm;

[0009] At least one spray pipe, which is fixedly connected to the second carrier arm;

[0010] A nozzle, which is movably connected to one end of the spray pipe far from the second carrier arm; and

[0011] An angle adjustment structure, which connects the spray pipe and the nozzle.

[0012] In an embodiment of the utility model, the diameter of the spray pipe is larger than the diameter of the nozzle.

[0013] In an embodiment of the utility model, there is a preset included angle between the spray pipe and the nozzle, and the preset included angle is adjusted by the angle adjustment structure.

[0014] In an embodiment of the utility model, the preset included angle is 90° - 180°.

[0015] In an embodiment of the present utility model, the wafer cleaning device further includes an inlet pipe, which is arranged inside the second carrier arm and is connected to one end of the spray pipe away from the spray head.

[0016] In an embodiment of the present utility model, the first carrier arm drives the outlet pipe to move, allowing the outlet of the outlet pipe to face the center of the wafer.

[0017] In an embodiment of the present utility model, there are two outlet pipes, namely a first outlet pipe and a second outlet pipe. A first liquid and a second liquid are successively conveyed in the first outlet pipe, and a third liquid is conveyed in the second outlet pipe.

[0018] In an embodiment of the present utility model, the spray head conveys the second liquid onto the wafer.

[0019] In an embodiment of the present utility model, the distance from the orthographic projection of the spray head on the wafer to the center of the wafer is one-half to four-fifths of the radius of the wafer.

[0020] In an embodiment of the present utility model, the angle adjustment structure is a spiral structure, a gear transmission structure, a slider structure, or a spring structure.

[0021] In summary, the present utility model provides a wafer cleaning device. By improving the structure of the wafer cleaning device, the unexpected technical effect of this application is that it can improve the cleaning effect of the wafer, enhance the cleaning ability of the wafer, effectively remove the particles on the edge of the wafer, and improve the yield of semiconductor products. Moreover, the wafer cleaning device provided by the present utility model can save the cleaning cost and improve the stability and production capacity of subsequent process technologies. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0023] Figure 1 It is a schematic diagram of a wafer cleaning device in an embodiment.

[0024] Figure 2 It is a schematic diagram of spraying a first liquid onto a wafer in an embodiment.

[0025] Figure 3 It is a schematic diagram of spraying a second liquid onto a wafer in an embodiment.

[0026] Figure 4Schematic diagram of simultaneously ejecting a second liquid and a third liquid onto a wafer in an embodiment.

[0027] Figure 5 Schematic diagram of changing the angle between a nozzle and a spray pipe in an embodiment.

[0028] Figure 6 Schematic diagram of ejecting a third liquid onto a wafer in an embodiment.

[0029] Label description:

[0030] 10. First carrier arm; 11. First outlet pipe; 12. Second outlet pipe; 13. Second carrier arm; 14. Inlet pipe; 15. Spray pipe; 16. Angle adjustment structure; 17. Nozzle; 18. Wafer; 19. First liquid; 20. Second liquid; 21. Third liquid; 22. Inner ring. Detailed implementation manners

[0031] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs. The terms used in the description of this application herein are only for the purpose of describing specific implementation manners, and are not intended to limit this application.

[0033] In the description of this specification, it should be understood that the orientation or positional relationship indicated by terms such as "center", "upper", "lower", "front", "rear", "left", "right", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this solution and simplifying the description, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to this solution. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0034] Please refer to Figure 1As shown in the figure, the present utility model provides a wafer cleaning device, which includes, for example, a first carrier arm 10, a plurality of outlet pipes, a second carrier arm 13, at least one nozzle 15, an angle adjustment structure 16, a nozzle head 17, etc. Among them, the plurality of outlet pipes are each fixedly connected to the first carrier arm 10. The second carrier arm 13 is disposed on one side of the first carrier arm 10 and fixedly connects at least one nozzle 15. The angle adjustment structure 16 movably connects the nozzle 15 and the nozzle head 17, and the outlets of the plurality of outlet pipes and the nozzle head 17 are arranged facing the wafer 18 to spray liquid onto the wafer 18. For the wafer cleaning device provided by the present utility model, by changing the angle of the liquid sprayed out by the nozzle head 17 through the angle adjustment structure 16, the liquid sprayed out by the nozzle head 17 and the outlet pipes is injected onto the surface of the wafer 18 at different angles, which can improve the cleaning ability of the wafer 18, improve the cleaning effect on the edge of the wafer 18, and improve the stability and production capacity of subsequent process technologies. Moreover, the wafer cleaning device provided by the present utility model can save the usage amount of the cleaning agent, reduce the cleaning cost, and thus reduce the preparation cost of semiconductor products. The wafer cleaning device provided by the present utility model can be applicable to cleaning the wafer 18 with various cleaning agents such as acidic cleaning agents and alkaline cleaning agents. In this embodiment, taking the cleaning of the wafer 18 with an acidic cleaning agent as an example, the wafer cleaning device will be described.

[0035] Please refer to Figure 1 As shown in the figure, in an embodiment of the present utility model, the first carrier arm 10 is used to support the subsequent arranged outlet pipes. Among them, the present utility model does not limit parameters such as the shape and size of the first carrier arm 10, which can be selected according to the actual needs of the cleaning device. In this embodiment, the first carrier arm 10 can move relative to the wafer 18, so as to change the relative position between the outlet pipe and the wafer 18.

[0036] Please refer to Figure 1 As shown in the figure, in an embodiment of the present utility model, the plurality of outlet pipes are each fixedly connected to the first carrier arm 10, and the plurality of outlet pipes are arranged at intervals. Among them, the plurality of outlet pipes each convey different types of cleaning agents, for example, to avoid the mixing of cleaning agents and affect the cleaning effect. And the first carrier arm 10 drives the plurality of outlet pipes to be able to move relative to the wafer 18, so as to change the relative position between different outlet pipes and the wafer 18, so that the outlets of different outlet pipes can be aligned with the center of the wafer 18 during use. In this embodiment, the number of outlet pipes is, for example, two. The two outlet pipes are, for example, a first outlet pipe 11 and a second outlet pipe 12 respectively. The first carrier arm 10 moves relative to the wafer 18 to drive the first outlet pipe 11 and the second outlet pipe 12 fixed on the first carrier arm 10 to move relative to the wafer 18, so that the liquid sprayed out by the first outlet pipe 11 and the second outlet pipe 12 can be vertically injected into the center of the wafer 18 and spread from the center of the wafer 18, thereby facilitating the liquid to quickly and evenly cover the surface of the wafer 18.

[0037] Please refer to Figures 1 to 6 As shown, in an embodiment of the present utility model, the first outlet pipe 11 conveys, for example, the first liquid 19 or the second liquid 20, and the second outlet pipe 12 conveys, for example, the third liquid 21. Among them, the first liquid 19 includes, for example, at least one of acid reagents such as hydrofluoric acid, hydrochloric acid, and sulfuric acid, the second liquid 20 is, for example, water, and the third liquid 21 includes, for example, at least one of alcohol reagents, and the alcohol reagents include, for example, absolute ethanol or isopropyl alcohol, etc. In this embodiment, the first outlet pipe 11 first conveys the first liquid 19, the first liquid 19 is, for example, hydrofluoric acid, and the outlet of the first outlet pipe 11 faces the center of the wafer 18 to remove the oxide layer on the surface of the wafer 18. After the first liquid 19 reacts with the oxide layer, the first outlet pipe 11 then conveys the second liquid 20, the second liquid 20 is, for example, deionized water, to remove the first liquid 19 on the surface of the wafer 18. After the second liquid 20 removes the first liquid 19 on the surface of the wafer 18, the position of the second outlet pipe 12 is adjusted so that the outlet of the second outlet pipe 12 faces the center of the crystal 18. The second outlet pipe 12 conveys, for example, the third liquid 21, and the third liquid 21 is, for example, isopropyl alcohol, etc., to remove the second liquid 20 on the surface of the wafer 18. Due to the hydrophobicity of the wafer 18, if only relying on the first outlet pipe 11 and the second outlet pipe 12 to spray the first liquid 19, the second liquid 20, and the third liquid 21 to clean the wafer 18, particles will always remain at the edge of the wafer 18 after the cleaning is completed, affecting the cleaning effect of the wafer 18 and damaging the cleanliness of the wafer 18.

[0038] Please refer to Figure 1 As shown, in an embodiment of the present utility model, the second carrier arm 13 is arranged on one side of the first carrier arm 10 and is used to support the subsequent spray pipe 15. Among them, the present utility model does not limit parameters such as the shape and size of the second carrier arm 13, and can be selected according to actual needs.

[0039] Please refer to Figure 1 As shown, in an embodiment of the present utility model, an inlet pipe 14 is further arranged inside the second carrier arm 13, and the inlet pipe 14 is used to transmit liquid into the spray pipe 15. In this embodiment, the spray pipe 15 is fixedly connected to the second carrier arm 13, and one end of the spray pipe 15 close to the second carrier arm 13 is communicated with the inlet pipe 14.

[0040] Please refer to Figure 1 As shown, in an embodiment of the present utility model, the spray head 17 is movably connected to one end of the spray pipe 15 away from the second carrier arm 13. Among them, the liquid in the inlet pipe 14 is transmitted to the spray head 17 through the spray pipe 15 and is ejected from the spray head 17 towards the wafer 18. In this embodiment, the diameter of the spray head 17 is, for example, smaller than the diameter of the spray pipe 15 to increase the flow rate of the liquid ejected from the spray head 17, so that the liquid can be ejected towards the wafer 18 at a relatively high speed, thereby improving the cleaning efficiency.

[0041] Please refer to Figure 1 and Figure 4 As shown, in an embodiment of the present utility model, the angle adjustment structure 16 connects the nozzle 17 and the spray pipe 15, so that the included angle between the nozzle 17 and the spray pipe 15 can vary within a preset included angle α. In this embodiment, the preset included angle α is, for example, 90° - 180°, excluding 90° and 180°, and for another example, 75° - 85°. The distance from the orthographic projection of the nozzle 17 on the wafer 18 to the center of the wafer 18 is one - half to four - fifths of the radius of the wafer 18. The nozzle 17, the spray pipe 15 and the inlet pipe 14, for example, convey the second liquid 20. The angle adjustment structure 16 is, for example, a spiral structure, a gear transmission structure, a slider structure or a spring structure, etc. Specifically, the second outlet pipe 12 sprays the third liquid 21 towards the center of the wafer 18, and the third liquid 21 diffuses from the center of the wafer 18 towards the edge of the wafer 18, forming an inner ring 22 at the center of the wafer 18. The third liquid 21 covers the inner ring 22. Due to the concentration difference between the inner ring 22 and the edge of the wafer 18, the molecules of the third liquid 21 will diffuse from the inner ring 22 towards the edge of the wafer 18. At the same time, the second liquid 20 is obliquely injected onto the edge of the inner ring 22 through the nozzle 17, and a stable mass transfer interface will be formed at the edge of the inner ring 22, enabling the molecules of the third liquid 21 in the inner ring 22 to stably diffuse towards the edge of the wafer 18. Since the surface tension of the third liquid 21 increases as the concentration of the third liquid 21 decreases, the molecules of the third liquid 21 at the edge of the wafer 18 generate a larger surface tension, while the molecules of the third liquid 21 in the inner ring 22 generate a smaller surface tension, thus generating a surface tension gradient. According to the Marangoni effect, the liquid with a higher surface tension pulls the surrounding more strongly than the liquid with a lower surface tension. Therefore, the edge of the wafer 18 will generate a pulling force on the inner ring 22, thereby pulling the third liquid 21 in the inner ring 22 towards the edge of the wafer 18 to drive the particles on the edge of the wafer 18 to break away from the wafer 18, achieving the purpose of removing the particles on the edge of the wafer 18 and realizing a better cleaning effect.

[0042] Please refer to Figure 1 As shown, in an embodiment of the present utility model, through the angle adjustment structure 16, the nozzle 17 can obliquely inject liquid onto the wafer 18. The obliquely injected liquid can be decomposed into two components perpendicular and parallel to the wafer 18, which can reduce the phenomenon of liquid splashing outside the wafer 18, thereby saving the amount of cleaning agent used in the cleaning process and improving the cleaning efficiency.

[0043] To further illustrate a wafer cleaning device provided by the present utility model, the following specifically describes the process of cleaning the wafer 18 using the wafer cleaning device. The specific process is as follows.

[0044] Please refer to Figure 2As shown, move the first carrier arm 10, the first outlet pipe 11 and the second outlet pipe 12 so that the outlet of the first outlet pipe 11 is aligned with the center of the wafer 18. After alignment, the first outlet pipe 11 sprays the first liquid 19 towards the center of the wafer 18. The first liquid 19 diffuses from the center of the wafer 18 towards the edge of the wafer 18, causing the first liquid 19 to cover the surface of the wafer 18, and then stop spraying the first liquid 19 onto the wafer 18.

[0045] Please refer to Figure 3 As shown, the first outlet pipe 11 sprays the second liquid 20 towards the center of the wafer 18. The second liquid 20 diffuses from the center of the wafer 18 towards the edge of the wafer 18, causing the second liquid 20 to cover the surface of the wafer 18, and then stop spraying the second liquid 20 onto the wafer 18.

[0046] Please refer to Figure 4 As shown, move the first carrier arm 10, the first outlet pipe 11 and the second outlet pipe 12 so that the outlet of the second outlet pipe 12 is aligned with the center of the wafer 18. After alignment, the second outlet pipe 12 sprays the third liquid 21 towards the center of the wafer 18. The third liquid 21 diffuses from the center of the wafer 18 towards the edge of the wafer 18, forming an inner circle 22 at the center of the wafer 18, and the third liquid 21 covers the inner circle 22. At the same time, adjust the angle adjustment structure 16 so that the nozzle 17 faces the edge of the inner circle 22, and injects the second liquid 20 obliquely onto the edge of the inner circle 22.

[0047] Please refer to Figures 4 to 6 As shown, during the cleaning process, the diameter of the inner circle 22 continuously expands. Adjust the angle adjustment structure 16 at any time so that the nozzle 17 can always face the edge of the inner circle 22, and inject the second liquid 20 obliquely onto the edge of the inner circle 22. As the inner circle 22 expands, the third liquid 21 completely covers the surface of the wafer 18, then stop the second outlet pipe 12 from spraying the third liquid 21 and stop the nozzle 17 from spraying the second liquid 20. Then, dry the wafer 18, for example, by steps such as mechanical spin-drying, heating or gas purging, to remove the third liquid 21 on the surface of the wafer 18 and complete the cleaning.

[0048] In summary, the present utility model provides a wafer cleaning device. By setting an angle adjustment structure, a nozzle and an outlet pipe, the liquids sprayed by the nozzle and the outlet pipe can be injected onto the surface of the wafer at different angles, thereby improving the cleaning ability of the wafer, improving the cleaning effect on the edge of the wafer, and improving the stability and production capacity of subsequent manufacturing processes. Moreover, the wafer cleaning device provided by the present utility model can save the amount of cleaning agent used, reduce the cleaning cost, and thus reduce the manufacturing cost of semiconductor products.

[0049] The embodiments of the present utility model disclosed above are only used to help illustrate the present utility model. The embodiments do not describe all the details in detail, nor do they limit the present utility model to the specific embodiments described. Obviously, many modifications and variations can be made according to the content of this specification. These embodiments are selected and specifically described in this specification in order to better explain the principle and practical application of the present utility model, so that those skilled in the relevant technical field can well understand and utilize the present utility model. The present utility model is only limited by the claims and their full scope and equivalents.

Claims

1. A wafer cleaning device, characterized in that, At least including: The first carrier arm; A plurality of outlet pipes, which are arranged at intervals on the first carrier arm, each of the plurality of outlet pipes is fixedly connected to the first carrier arm, and the outlet of the outlet pipe faces the wafer; The second carrier arm, which is arranged on one side of the first carrier arm; At least one nozzle pipe, which is fixedly connected to the second carrier arm; A nozzle head, which is movably connected to one end of the nozzle pipe far away from the second carrier arm; and An angle adjustment structure, which connects the nozzle pipe and the nozzle head.

2. The wafer cleaning device according to claim 1, wherein, The diameter of the nozzle pipe is larger than the diameter of the nozzle head.

3. The wafer cleaning device according to claim 1, wherein, A preset included angle exists between the nozzle pipe and the nozzle head, and the preset included angle is adjusted by the angle adjustment structure.

4. The wafer cleaning device according to claim 3, wherein, The preset included angle is 90°-180°.

5. The wafer cleaning device according to claim 1, wherein, The wafer cleaning device further includes an inlet pipe, which is arranged in the second carrier arm and is connected to one end of the nozzle pipe far away from the nozzle head.

6. The wafer cleaning device according to claim 1, wherein, The first carrier arm drives the outlet pipe to move, allowing the outlet of the outlet pipe to face the center of the wafer.

7. The wafer cleaning device according to claim 1, characterized in that, There are two outlet pipes, and the two outlet pipes are the first outlet pipe and the second outlet pipe. The first liquid and the second liquid are successively conveyed in the first outlet pipe, and the third liquid is conveyed in the second outlet pipe.

8. The wafer cleaning device according to claim 7, wherein, The nozzle head conveys the second liquid onto the wafer.

9. The wafer cleaning device according to claim 1, wherein, The distance from the orthographic projection of the nozzle head on the wafer to the center of the circle of the wafer is one-half to four-fifths of the radius of the wafer.

10. The wafer cleaning device according to claim 1, wherein, The angle adjustment structure is a spiral structure, a gear transmission structure, a slider structure or a spring structure.

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