Heating disc and chemical vapor deposition device
By introducing the heightening assembly and thread coordination into the heating plate, the stepless adjustment of the distance between the heating plate surface and the wafer is achieved, solving the problem of easy damage to sapphire or ceramic pins, and ensuring the stability and applicability of the heating plate.
Patent Information
- Application Number
- CN202422358149.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-25
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-09-25
AI Technical Summary
When the existing heating disk adjusts the distance between the wafer and the heating disk surface, the sapphire pin or ceramic pin is prone to breakage, making it difficult to achieve height adjustment while ensuring its stability.
A heating disk is designed, including a heating disk body, an insert and a height adjustment component. The insert adjusts the distance by adjusting the assembly up and down, avoiding the operation tool from directly contacting the insert, and using threaded fit to achieve stepless adjustment to protect the stability of the insert.
The stepless adjustment of the distance between the heating disk surface and the wafer is achieved, which protects the structural stability of sapphire or ceramic pins and avoids damage. It is suitable for a variety of process needs.
Smart Images
Figure CN223087915U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor equipment, in particular to a heating plate and a chemical vapor deposition device. Background Art
[0002] Chemical vapor deposition is a chemical technology. This technology mainly uses one or several gaseous compounds or simple substances containing thin film elements to generate a thin film on the surface of a substrate through a chemical reaction. Chemical vapor deposition equipment is mostly used for the preparation of semiconductor materials. During the chemical vapor deposition process, the thin film deposition is mainly completed through the diffusion of chemical source gas on the surface of the wafer and relying on the heat brought by the heating plate to the wafer.
[0003] It can be seen that the heating plate is the main component of the chemical vapor deposition equipment, which is used to carry the wafer and adjust the temperature of the wafer. A heating element is provided inside the heating plate to adjust the temperature of the surface of the heating plate. In a specific process, according to different requirements, the wafer needs to be placed at a certain distance from the surface of the heating plate. Therefore, when designing the structure, sapphire pins or ceramic pins need to be inlaid on the surface of the heating plate, and the wafer is lifted by the sapphire pins or ceramic pins so that the distance between the wafer and the surface of the heating plate meets the requirements. However, since the sapphire pins or ceramic pins are relatively brittle and easily break, there is an urgent need for a device that can adjust their height on the premise of ensuring that the sapphire pins or ceramic pins are not damaged. Summary of the Utility Model
[0004] An embodiment of the utility model provides a heating plate and a chemical vapor deposition device, which can adjust the height of a gem pin or a ceramic pin on the premise of ensuring that the gem pin or the ceramic pin is not damaged.
[0005] To solve the above problems, according to one aspect of the present application, the utility model provides a heating plate for carrying a wafer and adjusting the temperature of the wafer. The heating plate includes a heating plate body, an insert, and a height adjustment component. A fixing groove is formed on the surface of the heating plate body. The insert is arranged in the fixing groove and extends out of the surface of the heating plate body. The wafer is placed on the insert. The height adjustment component is arranged at the notch of the fixing groove. The insert is fixed in the height adjustment component and can move up and down with the height adjustment component to adjust the distance between the surface of the heating plate body and the wafer.
[0006] In some embodiments, the heating plate further includes a support component, which is arranged in the fixing groove and located below the insert to support the insert.
[0007] In some embodiments, the support assembly includes a bushing and an elastic member. The upper surface of the bushing has a groove, at least a part of the insert is located in the groove, one end of the elastic member abuts against the lower surface of the bushing, and the other end of the elastic member abuts against the bottom of the fixing groove.
[0008] In some embodiments, the bushing is in clearance fit with the fixing groove; and the elastic member is a spring.
[0009] In some embodiments, the insert is made of sapphire or ceramic.
[0010] In some embodiments, the height-adjusting assembly includes a pressing block. The outer peripheral surface of the pressing block has a first thread, and the inner wall of the fixing groove has a second thread, and the first thread matches the second thread; and a notch for adjusting the up and down movement of the height-adjusting assembly is provided in the circumferential direction of the pressing block.
[0011] In some embodiments, there are a plurality of fixing grooves, and each fixing groove is provided with a corresponding insert and height-adjusting assembly.
[0012] In some embodiments, the heating plate further includes a distance measuring assembly, which is located above the heating plate body and is used to measure the height of the insert extending out of the surface of the heating plate body.
[0013] In some embodiments, the distance measuring assembly includes a bracket and a detector. The bracket is arranged on the heating plate body, the detector is located on the bracket, and the probe of the detector can act on the heating plate body through the opening on the bracket.
[0014] According to another aspect of the present application, the present invention provides a chemical vapor deposition device, and the chemical vapor deposition device includes the above-mentioned heating plate.
[0015] Compared with the prior art, the heating plate of the present invention has the following beneficial effects:
[0016] The heating plate provided by the present invention is used to carry a wafer and adjust the temperature of the wafer. The heating plate includes a heating plate body, an insert and a height-adjusting assembly. The surface of the heating plate body is provided with a fixing groove. The insert is arranged in the fixing groove and extends out of the surface of the heating plate body. The wafer is placed on the insert. The height-adjusting assembly is arranged at the notch of the fixing groove. The insert is fixed in the height-adjusting assembly and can move up and down following the height-adjusting assembly to adjust the distance between the surface of the heating plate body and the wafer.
[0017] In the present utility model, due to the provision of the height adjustment assembly, only the top of the insert is exposed outside. When adjusting the height, the operating tool acts on the outer peripheral surface of the height adjustment assembly and does not contact the insert, so the insert is not affected, the structural stability thereof is protected, and damage is avoided.
[0018] The chemical vapor deposition device provided by the present utility model is designed based on the above-mentioned heating plate, and its beneficial effects can be referred to the beneficial effects of the above-mentioned heating plate, which will not be elaborated here one by one.
[0019] The above description is only an overview of the technical solution of the present utility model. In order to clearly understand the technical means of the present utility model and be implemented in accordance with the content of the description, the following describes in detail with reference to the preferred embodiments of the present utility model and the accompanying drawings. Brief Description of the Drawings
[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the accompanying drawings required for the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description are some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0021] Figure 1 It is a cross-sectional view of a heating plate provided by an embodiment of the present utility model at the fixing groove;
[0022] Figure 2 It is a schematic structural diagram of a height adjustment assembly in a heating plate provided by an embodiment of the present utility model;
[0023] Figure 3 It is a schematic structural diagram of a height adjustment assembly in a heating plate provided by an embodiment of the present utility model from another angle;
[0024] Figure 4 It is a schematic structural diagram of a heating plate provided by an embodiment of the present utility model;
[0025] Figure 5 It is a diagram showing the mating state of an operating tool and a height adjustment assembly in a heating plate provided by an embodiment of the present utility model;
[0026] Figure 6 It is a schematic structural diagram of the mutual cooperation of a height adjustment assembly, an insert and a support assembly in a heating plate provided by an embodiment of the present utility model;
[0027] Figure 7 It is a schematic structural diagram of a support assembly in a heating plate provided by an embodiment of the present utility model;
[0028] Figure 8It is a schematic structural diagram of a heating plate body in a heating plate provided by an embodiment of the present utility model;
[0029] Figure 9 It is a schematic structural diagram of a bracket in a heating plate provided by an embodiment of the present utility model;
[0030] Figure 10 It is a schematic diagram of a detector in a heating plate provided by an embodiment of the present utility model.
[0031] Reference numerals:
[0032] 1. Heating plate body; 11. Fixed groove; 2. Inlay; 3. Height-adjusting component; 31. Pressure block; 32. Notch; 33. Through hole; 4. Support component; 41. Bushing; 42. Elastic member; 43. Groove; 5. Distance-measuring component; 51. Bracket; 52. Detector; 511. Opening; 512. Support member; 513. Support surface; 521. Probe; 6. Operating tool; 61. Hexagonal nut; 62. Insert piece. Detailed implementation manners
[0033] To further elaborate on the technical means and effects adopted by the present utility model to achieve the predetermined utility model purpose, the following combines the drawings and preferred embodiments to describe in detail the specific implementation manners, structures, features and their effects of the application according to the present utility model. In the following description, different "one embodiment" or "embodiment" do not necessarily refer to the same embodiment. In addition, the specific features, structures, or characteristics in one or more embodiments can be combined in any suitable form.
[0034] In the description of the present utility model, it should be clear that the terms "first", "second", etc. in the specification and claims of the present utility model and the above drawings are used to distinguish similar objects and do not have to be used to describe a specific order or sequence; the terms "vertical", "horizontal", "longitudinal", "front", "rear", "left", "right", "upper", "lower", "horizontal", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present utility model, rather than meaning that the indicated device or element must have a specific orientation or position, so it cannot be understood as a limitation to the present utility model.
[0035] In the description of the present utility model, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.
[0036] Chemical Vapor Deposition (CVD) equipment is a key piece of equipment in semiconductor chip manufacturing. The core issue of CVD equipment is how to ensure the uniformity and repeatability of material growth. As an important component in CVD equipment, the heating plate adjusts the temperature of the heating plate surface through the internal heating elements. However, according to different process requirements, during specific use, the wafer needs to be placed at a certain distance from the heating plate surface. For this purpose, this embodiment provides a heating plate that can adjust the distance between the heating plate surface and the wafer.
[0037] Importantly, in order to achieve the adjustment of the distance between the heating plate surface and the wafer, the heating plate provided in this embodiment has considered the following two aspects: First, when adjusting the distance, stepless adjustment needs to be achieved so that the heating plate can meet more process requirements. Second, in order to adjust the distance between the heating plate surface and the wafer, an insert needs to be set inside the heating plate to lift the back surface of the wafer. Traditional inserts are generally sapphire or ceramic columns. Due to material limitations, sapphire and ceramic columns are relatively brittle. Therefore, it is necessary to consider ensuring that the sapphire and ceramic columns are not damaged during the adjustment process.
[0038] Regarding the above two aspects, first, the heating plate provided in this embodiment achieves stepless adjustment through the cooperation of threads, that is, within a certain working range, the insert can achieve basically continuous adjustment without obvious gears or jump changes. Second, during the adjustment process, avoid the operating tool 6 directly contacting the sapphire and ceramic columns to protect the sapphire and ceramic columns from being damaged.
[0039] To better understand the above technical solutions, the above technical solutions will be described in detail below in combination with the specification drawings and specific implementation manners.
[0040] Embodiment 1
[0041] An embodiment of the present utility model provides a heating plate, as Figures 1-10 shown, for carrying a wafer and adjusting the temperature of the wafer. The heating plate includes a heating plate body 1, an insert 2, and a height adjustment component 3. A fixing groove 11 is formed on the surface of the heating plate body 1. The insert 2 is arranged in the fixing groove 11 and extends out of the surface of the heating plate body 1. The wafer is placed on the insert 2. The height adjustment component 3 is arranged at the notch of the fixing groove 11. The insert 2 is fixed in the height adjustment component 3 and can move up and down following the height adjustment component 3 to adjust the distance between the surface of the heating plate body 1 and the wafer.
[0042] Specifically, as Figure 8As shown, the general outline of the heating plate body 1 is a circular structure with a certain thickness, and a heating element is arranged inside it, and the temperature of the surface of the heating plate body 1 can be adjusted by the contained heating element. The fixing groove 11 is a groove-like structure opened on the surface of the heating plate body 1. The groove-like structure does not penetrate the thickness of the heating plate body 1 and does not affect the heating element in the heating plate body 1. The fixing groove 11 is mainly used to fix the embedded part 2 and the height adjustment component 3. The embedded part 2 is arranged in the fixing groove 11, and it can move up and down along the fixing groove 11, and can extend out of the fixing groove 11, which is used to adjust the distance between the surface of the heating plate and the wafer, so that the heating plate provided in this embodiment can be applied to a variety of different processes. The height adjustment component 3 is mainly used to drive the embedded part 2 to move up and down, and protect the embedded part 2 at the same time. During the operation, the external operating tool 6 only contacts the height adjustment component 3, and has no contact with the embedded part 2.
[0043] In this embodiment, the embedded component 2 is fixed in the height adjustment component 3, and the height adjustment component 3 is set at the notch of the fixing groove 11. Although the embedded component 2 is fixed in the height adjustment component 3, its top extends out of the height adjustment component 3, so it will not affect the lifting of the wafer. In addition, due to the setting of the height adjustment component 3, only the top of the embedded component 2 is exposed to the outside. When adjusting the height, the operating tool 6 acts on the outer peripheral surface of the height adjustment component 3 and will not contact the embedded component 2, so it will not affect the embedded component 2, protecting its structural stability and avoiding damage.
[0044] In one embodiment, the embedded component 2 is a spherical structure, and the center of the height adjustment component 3 has a through hole, which is smaller than the diameter of the spherical structure. After the through hole and the spherical structure are matched, the height adjustment component 3 is just stuck on the upper end of the embedded component 2, so that when the height adjustment component 3 moves up and down, it can drive the embedded component 2 to move up and down to achieve height adjustment. Of course, when the embedded component 2 moves upward, how to ensure that it will not separate from the height adjustment component 3, there are many ways to solve this problem, such as fixing the embedded component 2 and the height adjustment component 3 together through a connecting structure, and for example, by setting an elastic member under the embedded component 2, using the restoring force of the elastic member to help it recover, etc. This part will be described in detail later.
[0045] The heating plate also includes a supporting assembly 4, such as Figure 1 As shown, the support assembly 4 is arranged in the fixing groove 11 and is located below the inner component 2 for supporting the inner component 2. That is to say, inside the fixing groove 11, from bottom to top, there are the support assembly 4, the inner component 2 and the height adjustment assembly 3. The support assembly 4 is used to support the inner component 2 to prevent it from falling. Of course, if the inner component 2 and the height adjustment assembly 3 are fixed together by a connecting structure, the support assembly 4 can be omitted, but in this case, the connecting structure will contact the inner component 2, which may cause damage to the relatively fragile inner component 2.
[0046] As shown Figure 1 in the figure, the support assembly 4 includes a bushing 41 and an elastic member 42. As shown Figure 7 in the figure, the upper surface of the bushing 41 has a groove 43, at least a part of the insert 2 is located in the groove 43, one end of the elastic member 42 abuts against the lower surface of the bushing 41, and the other end of the elastic member 42 abuts against the bottom of the fixing groove 11. The bushing 41 is a columnar structure with a certain thickness, and a groove structure is formed on the upper surface of the bushing 41. The groove structure is used to cooperate with the insert 2 to carry the insert 2, and the bottom of the groove structure matches the shape of the bottom of the insert 2. For example, when the insert 2 is spherical, the bottom of the groove structure is arc-shaped, so that the bottom of the insert 2 can just match the groove structure, achieving the purpose of protecting the insert 2. The elastic member 42 is disposed between the bottom of the fixing groove 11 and the bottom of the bushing 41, and is used to support the insert 2 through the bushing 41, and also has the function of helping the insert 2 to move up and reset.
[0047] Specifically, when it is necessary to reduce the distance between the surface of the heating plate and the wafer, an external operating tool 6 acts on the height adjustment assembly 3, so that the height adjustment assembly 3 and the insert 2 move downward together. At this time, the bushing 41 also moves downward, and the elastic member 42 is in a compressed state. Maintaining this state realizes the reduction of the distance between the surface of the heating plate and the wafer. When it is necessary to increase the distance between the surface of the heating plate and the wafer, an external operating tool 6 acts on the height adjustment assembly 3, so that the height adjustment assembly 3 moves upward. At this time, the height adjustment assembly 3 is briefly separated from the insert 2. Under the action of the restoring force of the elastic member 42, the bushing 41 moves up and down, and then pushes the insert 2 upward, so that the insert 2 is closely fitted with the height adjustment assembly 3 again. In this way, the distance between the surface of the heating plate and the wafer is increased.
[0048] In order to enable the bushing 41 to move downward under the action of the height adjustment assembly 3 or move upward under the action of the restoring force of the elastic member 42, the bushing 41 is in clearance fit with the fixing groove 11; that is to say, there is a gap between the outer wall of the bushing 41 and the inner wall of the fixing groove 11, or the gap is zero. This setting method avoids damage to the groove wall of the fixing groove 11 during the movement of the bushing 41, and also avoids the situation that the restoring force of the elastic member 42 is too small to push the insert 2 upward better through the bushing 41.
[0049] As shown Figure 1As shown, the elastic member 42 is a spring. The spring has the characteristics of being stretchable, is a relatively common and low-cost elastic member. In this embodiment, the spring is used to achieve the smooth and slow downward movement of the insert 2, and at the same time, without other connection structures, the insert 2 can move upward, improving the stability during the movement. In addition, in order to ensure that the restoring force of the spring can better act on the bottom of the bushing 41 and provide a more uniform damping effect for the downward movement of the bushing 41, when the spring is in a compressed state, its diameter can cover the width of the fixed groove 11.
[0050] Due to the limitations of the environment in the reaction chamber, the insert 2 is a sapphire or a ceramic pin.
[0051] As Figure 1 , Figure 2 and Figure 3 shown, the height adjustment assembly 3 includes a pressing block 31. The outer peripheral surface of the pressing block 31 has a first thread, and the inner wall of the fixed groove 11 has a second thread, and the first thread matches the second thread; and the circumferential direction of the pressing block 31 has a notch 32 for adjusting the up and down movement of the height adjustment assembly 3, and the notch 32 extends to the surface of the heating plate body 1. The pressing block 31 is a columnar structure with a through hole 33 at the center. The through hole matches the shape of the insert 2. For example, when the insert 2 is a spherical sapphire, the inner diameter of the through hole 33 increases from top to bottom, and the hole wall of the through hole 33 is arc-shaped. However, it should be noted that the inner diameter of the through hole 33 at the largest diameter cannot exceed the diameter of the insert 2 to prevent the pressing block 31 from detaching from the insert 2 and being unable to push the insert 2 to move. In addition, the outer peripheral surface of the pressing block 31 has a first thread, and the inner wall of the fixed groove 11 has a second thread, and the first thread matches the second thread. In this way, by applying an external operating tool 6 to the pressing block 31 and applying it in different directions to the pressing block 31, the pressing block 31 can be moved up and down along the groove wall of the fixed groove 11. In addition, in order to facilitate the intervention of the external operating tool 6, a notch 32 is provided in the circumferential direction of the pressing block 31, and the notch 32 extends to the surface of the heating plate body 1. In this way, the operating tool 6 can operate through the notch 32. And, in order for the operating tool 6 to apply an external force evenly, at least two notches 32 are provided, and at least two of the notches 32 are evenly distributed along the circumferential direction of the pressing block 31.
[0052] The operating tool 6 can have various structures. As Figure 4 and Figure 5 shown, for example, the operating tool 6 includes a hexagonal nut 61. At least two inserts 62 extend from the bottom of the hexagonal nut 61. The number of inserts 62 is the same as the number of notches 32 and corresponds one by one. During operation, the inserts 62 are inserted into the corresponding notches 32, and by using a wrench or other tools to turn the hexagonal nut 61, the rotation of the pressing block 31 can be achieved, and then the pressing block 31 can be moved up and down through the cooperation of the first thread and the second thread.
[0053] There are multiple fixing grooves 11, as Figure 8 shown, and each fixing groove 11 is provided with a corresponding insert 2 and height adjustment component 3. In order to ensure better flatness of the whole wafer after it is lifted by the insert 2, multiple fixing grooves 11 are provided and evenly distributed; there are many ways of even distribution. For example, at least two circles of fixing grooves 11 are evenly distributed along the radial direction first, and then each circle of fixing grooves is evenly distributed along the circumferential direction.
[0054] The heating plate further includes a ranging component 5, as Figure 4 shown. The ranging component 5 is located above the heating plate body 1 and is used to measure the height of the insert 2 extending out of the surface of the heating plate body 1. The ranging component is mainly used to ensure that the height of the insert 2 extending out of the surface of the heating plate body 1 meets the requirements. Generally, this height requirement is 0.04 mm. Of course, it can also be adjusted according to specific process requirements.
[0055] The ranging component 5 includes a bracket 51 and a detector 52. The bracket 51 is arranged on the heating plate body 1, the detector 52 is located on the bracket 51, and the probe 521 of the detector 52 can act on the heating plate body 1 through the opening 511 on the bracket 51. As Figure 9 shown, the bracket 51 includes multiple support members 512. The upper end of the support member 512 has a support surface 513. There is an opening 511 on the support surface 513, and the top of the support member 512 extends out of the support surface 513. In this way, when the detector 52 is placed on the support surface 513, the extended part can provide a limit for the detector 52 to prevent the detector 52 from moving on the support surface 513 and affecting the detection result. In addition, the light emitted by the probe 521 passes through the opening 511 on the support surface 513, and the probe 521 needs to be exactly above the insert 2.
[0056] The heating plate provided in this embodiment realizes the substantially continuous adjustment of the insert 2 through the cooperation of the first thread and the second thread, making the heating plate suitable for more process requirements; and, by pressing the block 31 to include the circumference of the insert 2 and operating the tool 6 on the notch 32 on the outer periphery of the pressing block 31, it is avoided that the operating tool 6 directly contacts the sapphire and the ceramic column, protecting the sapphire and the ceramic column from being damaged.
[0057] Embodiment 2
[0058] This embodiment provides a chemical vapor deposition device, and the chemical vapor deposition device includes the heating plate described in Embodiment 1.
[0059] The chemical vapor deposition apparatus provided in this embodiment is used for the preparation of semiconductor materials. During the chemical vapor deposition process, the heat brought by the heating plate in Embodiment 1 is relied on to complete the film deposition on the wafer.
[0060] In summary, it is easy for those skilled in the art to understand that, on the premise of no conflict, the above-mentioned advantageous technical features can be freely combined and superimposed.
[0061] The above are only the preferred embodiments of the present invention, and do not impose any form of limitation on the present invention. Any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention still fall within the scope of the technical solution of the present invention.
Claims
1. A heating plate for carrying a wafer and adjusting the temperature of the wafer, characterized in that The heating plate includes a heating plate body, an insert, and a height adjustment component. A fixing groove is formed on the surface of the heating plate body. The insert is disposed in the fixing groove and extends out of the surface of the heating plate body. The wafer is placed on the insert. The height adjustment component is disposed at the notch of the fixing groove. The insert is fixed in the height adjustment component and can move up and down following the height adjustment component to adjust the distance between the surface of the heating plate body and the wafer.
2. The heating plate according to claim 1, characterized in that, The heating plate further includes a support component. The support component is disposed in the fixing groove and is located below the insert for supporting the insert.
3. The heating plate according to claim 2, wherein The support component includes a bushing and an elastic member. A groove is formed on the upper surface of the bushing. A part of the insert is located in the groove. One end of the elastic member abuts against the lower surface of the bushing, and the other end of the elastic member abuts against the bottom of the fixing groove.
4. The heating plate according to claim 3, characterized in that, The bushing is in clearance fit with the fixing groove, and the elastic member is a spring.
5. The heating plate according to claim 1, wherein The insert is made of sapphire or ceramic.
6. The heating plate according to claim 1, characterized in that, The height adjustment component includes a pressing block. A first thread is formed on the outer peripheral surface of the pressing block, and a second thread is formed on the inner wall of the fixing groove. The first thread matches the second thread. And a notch for adjusting the up and down movement of the height adjustment component is formed in the circumferential direction of the pressing block.
7. The heating plate according to claim 1, characterized in that, There are multiple fixing grooves, and each fixing groove is provided with a corresponding insert and height adjustment component.
8. The heating plate according to any one of claims 1-7, characterized in that, The heating plate further includes a distance measuring component. The distance measuring component is located above the heating plate body for measuring the height of the insert extending out of the surface of the heating plate body.
9. The heating plate according to claim 8, characterized in that, The distance measuring component includes a bracket and a detector. The bracket is disposed on the heating plate body. The detector is located on the bracket, and the probe of the detector can act on the heating plate body through an opening on the bracket.
10. A chemical vapor deposition device, characterized in that, The chemical vapor deposition device includes the heating plate according to any one of claims 1-9.