Wafer photoresist removing equipment and system
By using limit components and multi-through-hole lifting components in wafer debonding equipment, the problem of wafer offset on the carrier table is solved, and stable fixation and efficient debonding of wafer position are achieved.
Patent Information
- Application Number
- CN202422286599.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-18
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-09-18
AI Technical Summary
During semiconductor manufacturing, the wafer is offset on the carrier stage, making it difficult for the robotic arm to grasp, affecting the efficiency and accuracy of processing.
The limiting module is used to conflict with the wafer along the circumference of the wafer, forming a clamping space, fixing the position of the wafer on the carrier stage, and ensuring stable lifting and lowering of the wafer through the cooperation of multiple through holes and lifting components.
It effectively avoids the wafer's offset on the carrier stage, improves the accuracy of robotic arm grip and the efficiency of glue removal, and reduces the difficulties caused by position deviation.
Smart Images
Figure CN223092822U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of semiconductor manufacturing technologies, and particularly to a wafer degumming device and system. Background Art
[0002] In the semiconductor integrated circuit manufacturing process, when a wafer is transferred into a process chamber, the wafer needs to be placed on a working platform (such as a carrier) to process the wafer (such as degumming). After the processing is completed, the wafer is removed from the process chamber.
[0003] During the processing, the wafer will shift. Thus, after the process ends, due to the deviation between the position where the wafer is located and the initial position, it is difficult for the robotic arm to grasp the wafer. Against this background, how to provide a technical solution to fix the position of the wafer on the carrier has become a technical problem that those skilled in the art urgently need to solve. Summary of the Utility Model
[0004] In view of this, embodiments of the present disclosure provide a wafer degumming device and system, which can fix the position of the wafer on the carrier.
[0005] Embodiments of the present disclosure provide a wafer degumming device, including:
[0006] An ionization chamber that generates plasma;
[0007] A carrier chamber that communicates with the ionization chamber and carries the wafer, where the carrier chamber includes: a carrier and a lifting assembly; wherein, the carrier has a carrying surface, and through holes are formed on the carrying surface; the lifting assembly moves along the through holes to receive and lift the wafer;
[0008] A limiting assembly that is located between the ionization chamber and the carrier chamber and is fixed on the carrying surface, and the limiting assembly exposes the lifting assembly; when the carrier carries the wafer, the limiting assembly abuts against the wafer along the circumference of the wafer.
[0009] Optionally, the limiting assembly includes: a limiting table, and a limiting hole for accommodating the wafer is formed in the limiting table; wherein, the inner diameter of the limiting hole is adapted to the outer diameter of the wafer.
[0010] Optionally, the limiting table includes:
[0011] A first limiting member fixed on the carrying surface;
[0012] A second limiting member coaxially arranged with the first limiting member, and the second limiting member is located on the first limiting member;
[0013] Among them, the limiting hole penetrates through the first limiting member and the second limiting member.
[0014] Optionally, the outer diameter of the first limiting member is smaller than the outer diameter of the second limiting member.
[0015] Optionally, the limiting component includes a plurality of third limiting members; when the carrier stage carries the wafer, the plurality of third limiting members abut against the wafer along the circumferential direction of the wafer.
[0016] Optionally, when the carrier stage carries the wafer, the plurality of third limiting members are evenly distributed along the circumferential direction of the wafer.
[0017] Optionally, the number of the through holes is multiple, and the multiple through holes are concentrically arranged along the circumferential direction of the carrier stage;
[0018] The number of the lifting components is multiple, and one lifting component corresponds to one through hole.
[0019] Optionally, the ionization chamber includes a plasma generator.
[0020] Optionally, the bottom of the carrier chamber has air outlet holes;
[0021] The wafer degumming device further includes: a pipeline connected to the air outlet holes for discharging the particulate matters generated during the wafer degumming process.
[0022] Correspondingly, an embodiment of the present disclosure further provides a wafer degumming system, including:
[0023] The wafer degumming device according to any one of the foregoing embodiments;
[0024] A robotic arm for transferring the wafer to the wafer degumming device and taking out the wafer from the wafer degumming device.
[0025] By using the wafer degumming device provided by the embodiment of the present disclosure, when carrying the wafer, the limiting component can abut against the wafer along the circumferential direction of the wafer to limit the wafer within the clamping space formed by the limiting component; and the limiting component is fixedly arranged on the bearing surface of the carrier stage, and the carrier stage can stably carry the wafer to avoid the wafer from shifting, so that the position of the wafer on the carrier stage can be fixed. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following will briefly introduce the drawings required to be used in the description of the embodiments of the present disclosure or the prior art. Obviously, the following described drawings are only some embodiments of the present disclosure. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0027] Figure 1 The structural schematic diagram of a wafer degumming device according to an embodiment of the present disclosure is shown;
[0028] Figure 2 The structural schematic diagram of a loading chamber according to an embodiment of the present disclosure is shown;
[0029] Figure 3 is shown Figure 1 The cross-sectional view of the limiting component in Detailed implementation manners
[0030] As described in the background art, during the process of processing a wafer placed on a loading platform (such as degumming treatment), the wafer will shift, which will cause the robotic arm to be difficult to grasp the wafer after the processing process is completed.
[0031] After analyzing the reasons for the above phenomena, the inventors found that when the wafer is placed on the loading platform, the friction force between the wafer and the loading platform is small. When the loading platform is in a rotating state or affected by other conditions (such as excessive instantaneous air flow on the surface of the loading platform), it will cause the wafer to slide, and then the position of the wafer will change.
[0032] The inventors further found that during the process of degumming the wafer, when the wafer is transferred into the process chamber, if the cylinder control ability and debugging stability in the wafer degumming device are insufficient or the wafer degumming device does not have an electrostatic chuck ESC, the wafer is also likely to slide during the degumming process.
[0033] To solve the above technical problems, an embodiment of the present disclosure provides a wafer degumming device. The limiting component can be in contact with the wafer along the circumference of the wafer to limit the wafer within the clamping space formed by the limiting component; and the limiting component is fixedly arranged on the loading surface of the loading platform, and the loading platform can stably carry the wafer to avoid the wafer from shifting, so as to fix the position of the wafer on the loading platform.
[0034] To enable those skilled in the art to have a clearer understanding of the technical concepts, technical principles, advantages, etc. included in the embodiments of the present disclosure, the following will be introduced in detail with reference to the accompanying drawings, through specific embodiments, and in combination with specific application scenarios, etc.
[0035] See Figure 1 and Figure 2 , wherein, Figure 1 is the structural schematic diagram of a wafer degumming device according to an embodiment of the present disclosure, Figure 2 is the structural schematic diagram of a loading chamber according to an embodiment of the present disclosure.
[0036] As shown in Figure 1 and Figure 2As shown, the wafer degumming equipment may include:
[0037] An ionization chamber 10 for generating plasma;
[0038] A loading chamber 20 connected to the ionization chamber 10 and for carrying the wafer W. The loading chamber 20 includes: a loading stage 21 and a lifting assembly 22; wherein, the loading stage 21 has a loading surface F, and a through hole G is provided on the loading surface F; the lifting assembly 22 moves along the through hole G to receive and lift the wafer W.
[0039] A limiting assembly 30 located between the ionization chamber 10 and the loading chamber 20 and fixed on the loading surface F, and the limiting assembly 30 exposes the lifting assembly 22; when the loading stage 21 carries the wafer W, the limiting assembly 30 abuts against the wafer W along the circumferential direction of the wafer W.
[0040] Specifically, a through hole G is provided on the loading surface F, and the lifting assembly 22 can move along the through hole G to place the wafer W on the loading surface F or remove the wafer W from the loading surface F.
[0041] For example, when the lifting assembly 22 moves in the direction pointing to the loading stage 21, the lifting assembly 22 can drive the wafer W to move towards the side close to the loading stage 21, so that the wafer W can be placed on the loading surface F; also for example, when the lifting assembly 120 moves in the direction away from the loading stage 21, the lifting assembly 22 can drive the wafer W to move towards the side away from the loading stage 21, so that the wafer W can be removed from the loading surface F. That is, by controlling the movement direction of the lifting assembly 22, the relative position relationship between the wafer W and the loading surface F can be changed.
[0042] During the process of the lifting assembly 22 driving the wafer W to move along the through hole G, since the limiting assembly 30 can expose the lifting assembly 22, that is, the lifting assembly 22 can move freely within the accommodation space formed by the limiting assembly 30. When the lifting assembly 22 drives the wafer W to move towards the side close to the loading stage 21, the wafer W can first contact the limiting assembly 30, and then the limiting assembly 30 can abut against the wafer along the circumferential direction of the wafer, and the wafer W is restricted within the clamping space formed by the limiting assembly 30.
[0043] And the limiting assembly 30 is fixed on the loading surface F of the loading stage 21, and the position of the limiting assembly 30 relative to the loading stage 21 is relatively fixed. Furthermore, the position of the wafer W relative to the loading stage 21 is relatively fixed, so that the loading stage 21 can stably carry the wafer W, avoiding the wafer W from shifting, and thus the position of the wafer W on the loading stage 21 can be fixed.
[0044] It should be noted that, first, Figure 1 and Figure 2The shapes and relative positions of the schematic ionization chamber 10, the carrier chamber 20, the carrier stage 21, the lifting assembly 22, the wafer W, and the limiting assembly 30 are only for illustrative purposes; for example, the shapes of the limiting assembly 30 and the carrier stage 21 only need to be adapted to the shape of the wafer W; also for example, Figure 2 In the illustration, the shape of the lifting assembly 22 is cylindrical. In other examples, the shape of the lifting assembly 22 can also be square; second, the sizes of the limiting assembly 30 and the carrier stage 21 are only for illustrative purposes, Figure 1 In the illustration where the radial dimension of the carrier stage 21 is greater than the radial dimension of the limiting assembly 30, it is used to illustrate that the limiting assembly 30 can be stably fixed on the carrier stage 21, and it should not be construed as a limitation of the present invention.
[0045] In some embodiments of the present disclosure, considering that during the lifting process, the position of the wafer relative to the lifting assembly will shift, which will further cause the position of the wafer placed on the carrier stage to shift, further increasing the position deviation.
[0046] Based on this, to improve the stability of the wafer during the lifting process, continue to refer to Figure 2 , the number of through holes G is multiple, and the multiple through holes G are concentrically arranged along the circumferential direction of the carrier stage 21.
[0047] In some embodiments of the present disclosure, when the number of through holes G is multiple, the number of lifting assemblies 22 is also multiple, and one lifting assembly 22 corresponds to one through hole G, that is, the number of lifting assemblies 22 is the same as the number of through holes G.
[0048] By making the number of through holes G and the lifting assemblies 22 multiple, during the process of lifting the wafer W, the lifting assemblies 22 and the wafer W have multiple contact points. Therefore, when some of the lifting assemblies 22 cannot work, the remaining lifting assemblies 22 can still lift the wafer W normally, thereby improving the fault tolerance and stability of the wafer W during the lifting process.
[0049] It should be noted that, first, Figure 2 The number of the illustrated 3 through holes G is only for illustrative purposes, and the number of through holes G can be set according to the size of the wafer W and actual requirements. For example, there are 2 or more than 3 through holes on the carrier stage 21; second, the through holes G can be evenly arranged on the carrier stage 21 or randomly arranged on the carrier stage 21, and the present disclosure does not limit this; third, Figure 2 The number of the illustrated through holes G is the same as the number of the lifting assemblies 22. In some other embodiments, the number of through holes G can be greater than the number of the lifting assemblies 22.
[0050] In some embodiments of the present disclosure, considering that relative movement may occur between the wafer and the lifting structure, resulting in scratches on the back of the wafer, reducing the yield of the subsequent formed devices.
[0051] In some alternative examples, the wafer degumming device may further include an annular gasket disposed at the contact position between the lifting assembly and the wafer.
[0052] As an alternative implementation, the annular gasket may be made of an elastic material, where the elastic material may include one or more of rubber, latex, polyurethane, or other elastic materials.
[0053] In some embodiments of the present disclosure, in conjunction with Figure 1 , referring to Figure 3 the cross-sectional structural schematic diagram of a limiting assembly shown in Figure 1 and Figure 3 , as shown in Figure 3 and Figure 3 , the limiting assembly 30 may include a limiting platform ( Figure 3 not labeled), and the limiting platform is provided with a limiting hole ( Figure 3 not labeled) for accommodating the wafer; wherein, the inner diameter d1 of the limiting hole is adapted to the outer diameter of the wafer W.
[0054] That is to say, when the wafer W is placed on the carrier table 21, the shape of the side of the limiting assembly 30 in contact with the wafer W is adapted to the shape of the wafer W, so that the limiting assembly 30 can better fit the wafer W and can provide a more uniform contact pressure, reducing the problem of local pressure concentration.
[0055] Furthermore, referring to Figure 1 and Figure 3 again, the limiting platform may include a first limiting member 31 fixedly disposed on the bearing surface F; a second limiting member 32 coaxially disposed with the first limiting member 31, and the second limiting member 32 is located on the first limiting member 31.
[0056] In this case, the limiting hole penetrates through the first limiting member 31 and the second limiting member 32, that is, the second limiting member 32 allows the wafer W to pass through, and the first limiting member 31 is used to limit the movement of the wafer W.
[0057] In some examples, the outer diameter d1 of the first limiting member 31 is smaller than the outer diameter d2 of the second limiting member 32.
[0058] In some other examples, the outer diameter d1 of the first limiting member 31 may also be equal to the outer diameter d2 of the second limiting member 32.
[0059] It should be noted that, first, Figure 1 and Figure 3 the structure of the limiting assembly 30 shown is only for illustrative purposes, to illustrate that a limiting structure adapted to the outer diameter of the wafer W can be used to limit the wafer W; second, Figure 1 and Figure 3The schematic first limiting member 31 and second limiting member 32 both have through holes. In this way, when placing the wafer W, the wafer W can be in direct contact with the carrier 21, facilitating other operations on the wafer W; Third, Figure 3 The limiting component 30 having the first limiting member 31 and the second limiting member 32 is schematically illustrated. In some other examples, the limiting component 30 may include only one limiting member, and when including only one limiting member, the inner diameter of the limiting member is adapted to the outer diameter of the wafer.
[0060] In some embodiments of the present disclosure, other structures with limiting functions may also be used to prevent the wafer on the carrier from shifting.
[0061] As an example, the limiting component includes a plurality of third limiting members, and the plurality of third limiting members are located on the bearing surface of the carrier; when the carrier bears the wafer, the plurality of third limiting members abut against the wafer along the circumference of the wafer.
[0062] Specifically, when placing the wafer on the carrier, the wafer can be limited within the area surrounded by the third limiting members, thereby reducing or avoiding the sliding phenomenon between the wafer and the bearing part.
[0063] In some alternative examples, when arranging the third limiting members on the carrier, the shape of the side of the carrier limiting member in contact with the wafer is adapted to the shape of the wafer.
[0064] For example, the shape of the side of the carrier limiting member in contact with the wafer can be arc-shaped, so that the limiting member can better fit the wafer and can provide a more uniform contact pressure, reducing the problem of local pressure concentration.
[0065] In some embodiments of the present disclosure, when the carrier bears the wafer, the plurality of third limiting members are evenly distributed along the circumference of the wafer, thereby improving the installation accuracy of the third component.
[0066] In some embodiments, to meet the diverse wafer size requirements, at least one of the plurality of third limiting members can move along the surface of the carrier, thereby changing the clamping space formed between the plurality of third limiting members to limit the movement of wafers with different sizes along the surface of the carrier.
[0067] That is, according to the size of the wafer to be lifted or lowered, by moving the third limiting member, a bearing space adapted to the wafer size can be formed on the surface of the carrier, without replacing the carrier, which has strong flexibility and universality, saving the design cost and manufacturing cost.
[0068] In addition, by reducing the number of times of replacing the carrier stage, the usage efficiency can be improved, and the random errors caused by frequent replacement of the carrier stage can be avoided, which facilitates the wafer degumming operation to be carried out faster and improves the production efficiency.
[0069] In some embodiments of the present disclosure, as Figure 1 shown, the ionization chamber 10 includes a plasma generator 11, which is used to ionize the input gas to generate plasma for wafer degumming.
[0070] In some optional examples, the bottom of the carrier chamber has air outlet holes. Correspondingly, the wafer degumming device further includes: a pipeline connected to the air outlet holes to discharge the particulate matter generated during the wafer degumming process.
[0071] Among them, the number of air outlet holes is equal to the number of pipelines. The first ends of the pipelines are respectively communicated with the carrier chamber through an air outlet hole, and the second ends of the pipelines are respectively communicated with a suction pump. Through the air outlet holes, the particles and part of the gas in the carrier chamber can be pumped away to remove the particulate matter generated during the wafer degumming process, so as to improve the cleanliness of the carrier chamber.
[0072] It should be noted that the wafer degumming device may actually further include other components, such as a fixing bracket, etc. For the convenience of describing the technical solutions of the present disclosure and highlighting the innovative parts of the present disclosure, in the present disclosure, the components that can be realized by the prior art in the wafer degumming device are omitted.
[0073] For example, air inlet holes, a first gas filling branch and a second gas filling branch communicating with the air inlet holes are formed on the side wall of the carrier chamber. Through the first gas filling branch and the second gas filling branch, gas (such as nitrogen) can be introduced into the air inlet holes to perform a vacuum breaking operation; for another example, then refer to Figure 1 , the wafer degumming device may further include a driving assembly 40 located below the carrier stage for driving the carrier stage to rotate.
[0074] It can be understood that the above examples are only for illustrative purposes. In actual applications, those skilled in the art can adaptively select and / or modify the wafer degumming device provided by the embodiments of the present disclosure according to actual needs and application scenarios. For example, changing the number of some components in the wafer degumming device; for another example, making equivalent replacements for some components in the wafer degumming device, etc. Based on this, more implementation schemes of the wafer degumming device can be extended, and the embodiments of the present disclosure do not limit these extended schemes.
[0075] The present disclosure also provides a wafer degumming system corresponding to the wafer degumming device described in any of the above embodiments, which will be introduced below.
[0076] It should be noted that the content of the wafer degumming system described below can be correspondingly referred to the content of the wafer degumming equipment described above.
[0077] In a specific implementation, the wafer degumming system provided by the embodiments of the present disclosure may include:
[0078] The wafer degumming equipment described in any of the foregoing embodiments;
[0079] A robotic arm for transferring the wafer to the wafer degumming equipment and removing the wafer from the wafer degumming equipment.
[0080] Among them, the specific contents such as the structure, connection relationship, function, working principle, etc. of the wafer degumming equipment can be referred to the description and drawings of the above relevant parts, and will not be elaborated here.
[0081] By adopting the wafer degumming system in the embodiments of the present disclosure, when the wafer is placed on the wafer degumming equipment, the wafer is restricted within the clamping space formed by the limiting component, so that the position of the wafer on the carrier table can be fixed. Furthermore, after the degumming process, the position of the wafer is basically the same as the initial position, which can reduce the difficulty of the robotic arm grasping the wafer and thus improve the removal efficiency.
[0082] Although the embodiments of the present disclosure are disclosed as above, the utility model is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present utility model. Therefore, the protection scope of the present utility model should be subject to the scope defined by the claims.
Claims
1. A wafer degumming device, characterized in that, Comprising: An ionization chamber for generating plasma; A loading chamber communicating with the ionization chamber and for loading a wafer, the loading chamber comprising: a loading stage and a lifting assembly; wherein, the loading stage has a loading surface, and through holes are formed on the loading surface; the lifting assembly moves along the through holes to receive and lift the wafer; A limiting assembly located between the ionization chamber and the loading chamber and fixedly provided on the loading surface, and the limiting assembly exposes the lifting assembly; when the loading stage loads the wafer, the limiting assembly abuts against the wafer along the circumferential direction of the wafer.
2. The wafer degumming device according to claim 1, characterized in that, The limiting assembly comprises: A limiting stage, the limiting stage is provided with a limiting hole for accommodating the wafer; wherein, the inner diameter of the limiting hole is adapted to the outer diameter of the wafer.
3. The wafer degumming device according to claim 2, characterized in that, The limiting stage comprises: A first limiting member fixedly provided on the loading surface; A second limiting member coaxially arranged with the first limiting member, the second limiting member is located on the first limiting member; Wherein, the limiting hole penetrates through the first limiting member and the second limiting member.
4. The wafer degumming device according to claim 3, characterized in that, The outer diameter of the first limiting member is smaller than the outer diameter of the second limiting member.
5. The wafer degumming device according to claim 1, characterized in that, The limiting assembly comprises a plurality of third limiting members; when the loading stage loads the wafer, the plurality of third limiting members abut against the wafer along the circumferential direction of the wafer.
6. The wafer degumming device according to claim 5, characterized in that, When the loading stage loads the wafer, the plurality of third limiting members are evenly arranged along the circumferential direction of the wafer.
7. The wafer degumming device according to claim 1, characterized in that, The number of the through holes is multiple, and the multiple through holes are concentrically arranged along the circumferential direction of the loading stage; The number of the lifting assemblies is multiple, and one lifting assembly corresponds to one through hole.
8. The wafer degumming device according to claim 1, characterized in that, The ionization chamber comprises a plasma generator.
9. The wafer degumming device according to claim 1, characterized in that, The bottom of the loading chamber has air outlet holes; The wafer degumming device further comprises: a pipeline connected to the air outlet holes for discharging particulate matters generated during the wafer degumming process.
10. A wafer degumming system, characterized in that, Comprising: The wafer degumming device according to any one of claims 1 to 9; A robotic arm for transferring the wafer to the wafer degumming device and taking out the wafer from the wafer degumming device.